CN102384988A - 测试ic元件的防粘方法及其防粘ic元件测试座 - Google Patents
测试ic元件的防粘方法及其防粘ic元件测试座 Download PDFInfo
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- CN102384988A CN102384988A CN2011102314832A CN201110231483A CN102384988A CN 102384988 A CN102384988 A CN 102384988A CN 2011102314832 A CN2011102314832 A CN 2011102314832A CN 201110231483 A CN201110231483 A CN 201110231483A CN 102384988 A CN102384988 A CN 102384988A
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- 238000012360 testing method Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000009434 installation Methods 0.000 claims abstract description 8
- 239000000523 sample Substances 0.000 claims abstract description 6
- 230000006837 decompression Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000008676 import Effects 0.000 claims description 2
- 238000007664 blowing Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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CN201110231483.2A CN102384988B (zh) | 2011-08-11 | 2011-08-11 | 测试ic元件的防粘方法及其防粘ic元件测试座 |
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CN102384988A true CN102384988A (zh) | 2012-03-21 |
CN102384988B CN102384988B (zh) | 2015-03-25 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103439539A (zh) * | 2013-09-03 | 2013-12-11 | 苏州创瑞机电科技有限公司 | 百万像素级cmos光学芯片模组自动测试插座 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10223692A (ja) * | 1997-02-06 | 1998-08-21 | Pfu Ltd | フリップチップ実装装置並びに該装置に装着するチップ吸着ツール及びベアチップの実装方法 |
CN2480985Y (zh) * | 2001-02-26 | 2002-03-06 | 矽统科技股份有限公司 | 半导体元件测试的工具 |
JP2002373919A (ja) * | 2001-06-15 | 2002-12-26 | Matsushita Electric Works Ltd | チップ実装装置及びチップ実装方法 |
CN1740797A (zh) * | 2004-08-27 | 2006-03-01 | 京元电子股份有限公司 | 取放待测电子元件的方法与装置 |
CN101154611A (zh) * | 2006-09-29 | 2008-04-02 | 京元电子股份有限公司 | 具推顶机构的电子元件取放装置 |
CN202230103U (zh) * | 2011-08-11 | 2012-05-23 | 嘉兴景焱智能装备技术有限公司 | 防粘ic元件测试座 |
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2011
- 2011-08-11 CN CN201110231483.2A patent/CN102384988B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10223692A (ja) * | 1997-02-06 | 1998-08-21 | Pfu Ltd | フリップチップ実装装置並びに該装置に装着するチップ吸着ツール及びベアチップの実装方法 |
CN2480985Y (zh) * | 2001-02-26 | 2002-03-06 | 矽统科技股份有限公司 | 半导体元件测试的工具 |
JP2002373919A (ja) * | 2001-06-15 | 2002-12-26 | Matsushita Electric Works Ltd | チップ実装装置及びチップ実装方法 |
CN1740797A (zh) * | 2004-08-27 | 2006-03-01 | 京元电子股份有限公司 | 取放待测电子元件的方法与装置 |
CN101154611A (zh) * | 2006-09-29 | 2008-04-02 | 京元电子股份有限公司 | 具推顶机构的电子元件取放装置 |
CN202230103U (zh) * | 2011-08-11 | 2012-05-23 | 嘉兴景焱智能装备技术有限公司 | 防粘ic元件测试座 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103439539A (zh) * | 2013-09-03 | 2013-12-11 | 苏州创瑞机电科技有限公司 | 百万像素级cmos光学芯片模组自动测试插座 |
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CN102384988B (zh) | 2015-03-25 |
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Addressee: Liu Qiang Document name: Notification of an Office Action |
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Address after: 314100 Zhejiang County of Jiashan province to the Valley Park two street Luoxing Road No. 33 Applicant after: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Address before: Room 2188, building 3, 1D 1E 314100, Zhejiang County of Jiashan Province town of Jiashan Dayun Road Applicant before: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. |
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Denomination of invention: Anti stick Method for Testing IC Components and Its Anti stick IC Component Test Stand Effective date of registration: 20230526 Granted publication date: 20150325 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2023980041808 |
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Granted publication date: 20150325 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2023980041808 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Anti stick methods for testing IC components and their anti stick IC component test bases Granted publication date: 20150325 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2024980018023 |