CN102376372A - 壳体组件及该壳体组件的组装方法 - Google Patents
壳体组件及该壳体组件的组装方法 Download PDFInfo
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- CN102376372A CN102376372A CN201010256603XA CN201010256603A CN102376372A CN 102376372 A CN102376372 A CN 102376372A CN 201010256603X A CN201010256603X A CN 201010256603XA CN 201010256603 A CN201010256603 A CN 201010256603A CN 102376372 A CN102376372 A CN 102376372A
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- housing
- hot melt
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- shell
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000012943 hotmelt Substances 0.000 claims description 68
- 239000003292 glue Substances 0.000 claims description 10
- 238000002844 melting Methods 0.000 abstract description 4
- 230000008018 melting Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
- B29C65/4815—Hot melt adhesives, e.g. thermoplastic adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
- H04M1/0252—Details of the mechanical connection between the housing parts or relating to the method of assembly by means of a snap-on mechanism
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
- B29C66/126—Tenon and mortise joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Connection Of Plates (AREA)
- Casings For Electric Apparatus (AREA)
- Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
- Telephone Set Structure (AREA)
Abstract
一种壳体组件,包括一第一壳体及一第二壳体,该第二壳体粘合于该第一壳体上,该第一壳体及该第二壳体的一方分别设有若干热熔柱,另一方设有若干热熔孔;每一所述热熔柱热熔于其中一所述热熔孔内。本发明还提供一种用以组装上述壳体组件的组装方法。
Description
技术领域
本发明是关于一种壳体组件及该壳体组件的组装方法。
背景技术
现有技术中,将二壳体组装成一体的方法有机械组装、粘接及热熔等,其中,在铁件壳体和塑件壳体的组装过程中经常会使用粘结配合将二者固接。然而,如果所述二壳体之间的叠加面积很小,则很难将所述二壳体粘合在一起,即使能将所述壳体粘合也不能保证二壳体之间能粘结牢固。
发明内容
鉴于上述内容,有必要提供一种组装牢固的壳体组件。
此外,还有必要提供一种组装上述壳体组件的组装方法。
一种壳体组件,包括一第一壳体及一第二壳体,该第二壳体粘合于该第一壳体上,该第一壳体及该第二壳体的一方分别设有若干热熔柱,另一方设有若干热熔孔;每一所述热熔柱热熔于其中一所述热熔孔内。
一种壳体组件的组装方法,该组装方法用以组装一壳体组件,包括如下步骤:
提供一第一壳体及一第二壳体,该第一壳体及该第二壳体的一方分别设有若干热熔柱,另一方设有若干热熔孔;
将该第二壳体粘合于第一壳体上,同时使每一所述热熔柱穿设于其中一所述热熔孔内;
将所述热熔柱热熔于所述热熔孔内。
相较于现有技术,本发明的壳体组件,在组装的过程中,先通过粘结的方式使第一壳体和第二壳体相互固接,然后再通过第一壳体或第二壳体上的热熔柱热熔便可使第一壳体和第二壳体之间的固接更牢固。
附图说明
图1是本发明较佳实施例的壳体组件的立体分解图;
图2是图1所示壳体组件另一角度的立体分解图;
图3是图1所示壳体组件的立体组装图;
图4是图3所示壳体组件的另一视角的立体组装图。
主要元件符号说明
壳体组件 100
第一壳体 10
第二壳体 20
第一粘接面 12
第一热熔孔 14
第二热熔孔 16
第二粘接面 22
第一热熔柱 24
第二热熔柱 26
具体实施方式
请参阅图1及图2,本发明的壳体组件100包括一第一壳体10及一第二壳体20,该第一壳体10包括一第一粘接面12和设置于第一粘接面12上的点胶区F,该第二壳体20包括一第二粘接面22,该第一粘接面12与该第二粘接面22相对设置并通过设置于点胶区F的胶水粘结。
该第一壳体10上还开设有至少一第一热熔孔14及至少一第二热熔孔16,该第二壳体20上还设有至少一第一热熔柱24及至少一第二热熔柱26。所述第一热熔柱24的数量与所述第一热熔孔14的数量相当,且所述第二热熔柱26的数量与第二热熔孔16的数量相当,所述第一热熔柱24及第二热熔柱26分别穿设于所述第一热熔孔14及第二热熔孔16内以将该第一壳体10固接于该第二壳体20上。
请一并参阅图3及图4,组装壳体组件100时,可按如下工序进行:
第一步:在第一壳体10的第一粘接面12的点胶区F进行点胶,然后将第二壳体20的第二粘接面22粘合于第一壳体10的第一粘接面12上。在第二粘接面22粘合于第一粘接面12上的同时,第二壳体20上的第一热熔柱24及第二热熔柱26分别穿设于第一壳体10上的所述第一热熔孔14及第二热熔孔16内。本实施例中,点胶时所使用的胶水为慢干胶。
第二步:将上述第一壳体10和第二壳体20置于压合治具上,然后通过压合治具将第一壳体10和第二壳体20紧紧地压合在一起。待慢干胶凝固后,该第二壳体20便粘合于第一壳体10上。
第三步:将第二壳体20上第一热熔柱24及第二热熔柱26伸出第一壳体10的部分进行热熔,使第一热熔柱24及第二热熔柱26融化的后分别填充于第一壳体10的第一热熔孔14及第二热熔孔16内。壳体组件100便组装完毕。
可以理解,所述热熔孔不局限于开设于第一壳体10上,也可开设于第二壳体20上,相应地,所述热熔柱设于第一壳体10上。
本发明的壳体组件100,在组装的过程中,先通过粘结的方式使第一壳体10和第二壳体20相互固接,然后再通过热熔的方式使第一壳体10和第二壳体20之间的固接更牢固。
Claims (8)
1.一种壳体组件,包括一第一壳体及一第二壳体,该第二壳体粘合于该第一壳体上,其特征在于:该第一壳体及该第二壳体的一方分别设有若干热熔柱,另一方设有若干热熔孔;每一所述热熔柱热熔于其中一所述热熔孔内。
2.如权利要求1所述的壳体组件,其特征在于:所述热熔柱设于该第一壳体上,所述热熔孔开设于该第二壳体上,且所述热熔柱和所述热熔孔的数量相当。
3.如权利要求1所述的壳体组件,其特征在于:所述热熔柱设于该第二壳体上,所述热熔孔开设于该第一壳体上,且所述热熔柱和所述热熔孔的数量相当。
4.一种壳体组件的组装方法,该组装方法用以组装一壳体组件,包括如下步骤:
提供一第一壳体及一第二壳体,该第一壳体及该第二壳体的一方分别设有若干热熔柱,另一方设有若干热熔孔;
将该第二壳体粘合于第一壳体上,同时使每一所述热熔柱穿设于其中一所述热熔孔内;
将所述热熔柱热熔于所述热熔孔内。
5.如权利要求4所述的组装方法,其特征在于:当该第二壳体粘合于该第一壳体上后,将第二壳体压合于该第一壳体上以使该第一壳体与该第二壳体粘合紧密。
6.如权利要求4所述的组装方法,其特征在于:该第二壳体与该第一壳体粘合过程中使用到的胶水为慢干胶。
7.如权利要求4所述的组装方法,其特征在于:所述热熔柱设于该第一壳体上,所述热熔孔开设于该第二壳体上,且所述热熔柱和所述热熔孔的数量相当。
8.如权利要求4所述的组装方法,其特征在于:所述热熔柱设于该第二壳体上,所述热熔孔开设于该第一壳体上,且所述热熔柱和所述热熔孔的数量相当。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010256603XA CN102376372A (zh) | 2010-08-18 | 2010-08-18 | 壳体组件及该壳体组件的组装方法 |
US12/880,249 US20120043319A1 (en) | 2010-08-18 | 2010-09-13 | Housing assembly and method for manufacturing same |
JP2011178333A JP2012042053A (ja) | 2010-08-18 | 2011-08-17 | ハウジングアセンブリ及びその組立方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201010256603XA CN102376372A (zh) | 2010-08-18 | 2010-08-18 | 壳体组件及该壳体组件的组装方法 |
Publications (1)
Publication Number | Publication Date |
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CN102376372A true CN102376372A (zh) | 2012-03-14 |
Family
ID=45593258
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CN201010256603XA Pending CN102376372A (zh) | 2010-08-18 | 2010-08-18 | 壳体组件及该壳体组件的组装方法 |
Country Status (3)
Country | Link |
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US (1) | US20120043319A1 (zh) |
JP (1) | JP2012042053A (zh) |
CN (1) | CN102376372A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110170959B (zh) * | 2019-04-24 | 2021-06-15 | Oppo广东移动通信有限公司 | 电子设备组装装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201251979Y (zh) * | 2008-07-22 | 2009-06-03 | 英业达股份有限公司 | 磁铁固定结构及具有其的笔记本电脑 |
US20100054493A1 (en) * | 2008-09-03 | 2010-03-04 | Wey-Jiun Lin | Accessory controller for electronic devices |
CN201523509U (zh) * | 2009-11-06 | 2010-07-07 | 徐州云浩电子有限公司 | 汽车调节器用散热板固定结构 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4590449A (en) * | 1984-08-13 | 1986-05-20 | Vantielen Willem R | Solenoid switch |
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2010
- 2010-08-18 CN CN201010256603XA patent/CN102376372A/zh active Pending
- 2010-09-13 US US12/880,249 patent/US20120043319A1/en not_active Abandoned
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2011
- 2011-08-17 JP JP2011178333A patent/JP2012042053A/ja not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201251979Y (zh) * | 2008-07-22 | 2009-06-03 | 英业达股份有限公司 | 磁铁固定结构及具有其的笔记本电脑 |
US20100054493A1 (en) * | 2008-09-03 | 2010-03-04 | Wey-Jiun Lin | Accessory controller for electronic devices |
CN201523509U (zh) * | 2009-11-06 | 2010-07-07 | 徐州云浩电子有限公司 | 汽车调节器用散热板固定结构 |
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JP2012042053A (ja) | 2012-03-01 |
US20120043319A1 (en) | 2012-02-23 |
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Application publication date: 20120314 |