CN102361021A - 一种嵌入式闪存的制作方法 - Google Patents
一种嵌入式闪存的制作方法 Download PDFInfo
- Publication number
- CN102361021A CN102361021A CN2011103012562A CN201110301256A CN102361021A CN 102361021 A CN102361021 A CN 102361021A CN 2011103012562 A CN2011103012562 A CN 2011103012562A CN 201110301256 A CN201110301256 A CN 201110301256A CN 102361021 A CN102361021 A CN 102361021A
- Authority
- CN
- China
- Prior art keywords
- silicon nitride
- nitride layer
- flash memory
- layer
- shallow trench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110301256.2A CN102361021B (zh) | 2011-09-28 | 2011-09-28 | 一种嵌入式闪存的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110301256.2A CN102361021B (zh) | 2011-09-28 | 2011-09-28 | 一种嵌入式闪存的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102361021A true CN102361021A (zh) | 2012-02-22 |
CN102361021B CN102361021B (zh) | 2016-10-19 |
Family
ID=45586302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110301256.2A Active CN102361021B (zh) | 2011-09-28 | 2011-09-28 | 一种嵌入式闪存的制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102361021B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102610508A (zh) * | 2012-03-31 | 2012-07-25 | 上海宏力半导体制造有限公司 | 浮栅的制作方法 |
CN104979172A (zh) * | 2014-04-01 | 2015-10-14 | 北京兆易创新科技股份有限公司 | 一种etox结构的闪存的浮栅及其制作方法 |
CN106409833A (zh) * | 2016-10-19 | 2017-02-15 | 武汉新芯集成电路制造有限公司 | 嵌入式闪存的隔离方法和制备方法 |
CN107369688A (zh) * | 2017-07-07 | 2017-11-21 | 上海华虹宏力半导体制造有限公司 | 闪存的制备方法 |
CN112382635A (zh) * | 2020-11-12 | 2021-02-19 | 上海华虹宏力半导体制造有限公司 | 半导体器件的制造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1518090A (zh) * | 2003-01-23 | 2004-08-04 | ��ʿͨ��ʽ���� | 半导体器件的制造方法 |
TW200507162A (en) * | 2003-08-01 | 2005-02-16 | Taiwan Semiconductor Mfg Co Ltd | Method to etch periphery and cell floating gate polysilicon layer separably |
CN1719599A (zh) * | 2004-07-06 | 2006-01-11 | 三洋电机株式会社 | 半导体装置的制造方法 |
KR20090080276A (ko) * | 2008-01-21 | 2009-07-24 | 주식회사 하이닉스반도체 | 비휘발성 메모리 소자의 제조 방법 |
KR20100006388A (ko) * | 2008-07-09 | 2010-01-19 | 주식회사 하이닉스반도체 | 비휘발성 메모리 장치 및 그 제조 방법 |
-
2011
- 2011-09-28 CN CN201110301256.2A patent/CN102361021B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1518090A (zh) * | 2003-01-23 | 2004-08-04 | ��ʿͨ��ʽ���� | 半导体器件的制造方法 |
TW200507162A (en) * | 2003-08-01 | 2005-02-16 | Taiwan Semiconductor Mfg Co Ltd | Method to etch periphery and cell floating gate polysilicon layer separably |
CN1719599A (zh) * | 2004-07-06 | 2006-01-11 | 三洋电机株式会社 | 半导体装置的制造方法 |
KR20090080276A (ko) * | 2008-01-21 | 2009-07-24 | 주식회사 하이닉스반도체 | 비휘발성 메모리 소자의 제조 방법 |
KR20100006388A (ko) * | 2008-07-09 | 2010-01-19 | 주식회사 하이닉스반도체 | 비휘발성 메모리 장치 및 그 제조 방법 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102610508A (zh) * | 2012-03-31 | 2012-07-25 | 上海宏力半导体制造有限公司 | 浮栅的制作方法 |
CN104979172A (zh) * | 2014-04-01 | 2015-10-14 | 北京兆易创新科技股份有限公司 | 一种etox结构的闪存的浮栅及其制作方法 |
CN106409833A (zh) * | 2016-10-19 | 2017-02-15 | 武汉新芯集成电路制造有限公司 | 嵌入式闪存的隔离方法和制备方法 |
CN106409833B (zh) * | 2016-10-19 | 2019-01-22 | 武汉新芯集成电路制造有限公司 | 嵌入式闪存的隔离方法和制备方法 |
CN107369688A (zh) * | 2017-07-07 | 2017-11-21 | 上海华虹宏力半导体制造有限公司 | 闪存的制备方法 |
CN107369688B (zh) * | 2017-07-07 | 2020-10-16 | 上海华虹宏力半导体制造有限公司 | 闪存的制备方法 |
CN112382635A (zh) * | 2020-11-12 | 2021-02-19 | 上海华虹宏力半导体制造有限公司 | 半导体器件的制造方法 |
CN112382635B (zh) * | 2020-11-12 | 2023-11-10 | 上海华虹宏力半导体制造有限公司 | 半导体器件的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102361021B (zh) | 2016-10-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5730772B2 (ja) | スプリットゲート・メモリセルの形成方法 | |
US8901632B1 (en) | Non-volatile memory (NVM) and high-K and metal gate integration using gate-last methodology | |
US9831354B2 (en) | Split-gate flash memory having mirror structure and method for forming the same | |
US10453849B2 (en) | Dynamic random access memory structure and method for forming the same | |
CN105655286A (zh) | 半导体结构的形成方法 | |
US10269823B2 (en) | Flash memory semiconductor device | |
US9129855B2 (en) | Non-volatile memory (NVM) and high-k and metal gate integration using gate-first methodology | |
CN102361021A (zh) | 一种嵌入式闪存的制作方法 | |
CN108091562B (zh) | Sonos存储器的ono刻蚀方法 | |
CN110785845B (zh) | 嵌入式非易失性存储器器件及其制造方法 | |
CN107658222B (zh) | 一种3d nand闪存沟道孔的平坦化工艺 | |
US10199227B2 (en) | Method for fabricating a metal high-k gate stack for a buried recessed access device | |
CN102361022A (zh) | 一种嵌入式闪存的制作方法 | |
US9117695B1 (en) | Method for fabricating semiconductor device | |
US11854823B2 (en) | Integrated circuit device | |
US11424255B2 (en) | Semiconductor device and manufacturing method thereof | |
CN102332432B (zh) | 半导体集成器件制造方法 | |
US8728886B2 (en) | Integrating formation of a replacement gate transistor and a non-volatile memory cell using a high-k dielectric | |
US9620368B2 (en) | Method for fabricating non-volatile memory with ONO stack | |
US20070262476A1 (en) | Method for providing STI structures with high coupling ratio in integrated circuit manufacturing | |
CN110797341B (zh) | 闪存器件及其制作方法 | |
CN114335004B (zh) | 一种1.5t sonos器件及其制备方法 | |
US8574987B1 (en) | Integrating formation of a replacement gate transistor and a non-volatile memory cell using an interlayer dielectric | |
CN115084013A (zh) | 半导体器件插塞形成方法及其半导体器件 | |
KR101580172B1 (ko) | 임베디드 플래쉬 메모리 소자의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140508 |
|
C10 | Entry into substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20140508 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |