CN102348338A - Plate-explosion-preventing air vent structure for aligned and laminated six-layer circuit board - Google Patents
Plate-explosion-preventing air vent structure for aligned and laminated six-layer circuit board Download PDFInfo
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- CN102348338A CN102348338A CN201010242225XA CN201010242225A CN102348338A CN 102348338 A CN102348338 A CN 102348338A CN 201010242225X A CN201010242225X A CN 201010242225XA CN 201010242225 A CN201010242225 A CN 201010242225A CN 102348338 A CN102348338 A CN 102348338A
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Abstract
The invention discloses a plate-explosion-preventing air vent structure for an aligned and laminated six-layer circuit board. The aligned and laminated six-layer circuit board is formed by overlapping and laminating two double-faced core plates, three insulating layers and two copper foils, wherein one insulating layer is arranged between the two double-faced core plate; one faces, deviating from each other, of the two double-faced core plates are respectively covered with one insulating layer; after being aligned and overlapped, the two double-faced core plate and the three insulating layers are fixed by rivets to form an inner fixed plate; the two surfaces of the inner fixed plate are respectively covered with one copper foil; and a plurality of air vents are drilled at the periphery, corresponding to the rivet parts of the inner fixed plate, of the laminated six-layer circuit board, so that when the six-layer circuit board is subjected to later-stage high-temperature operation, the air in the rivets is expanded and then flows out through the air vents conveniently, thereby preventing the air generated due to high temperature from swelling out polyester (PET) sheets and further causing plate explosion. By utilizing the air vent structure provided by the invention, the drill point cost can be relatively lowered, the drilling efficiency can be improved, and simultaneously the torque force of a main shaft of a drilling machine can be reduced so as to prevent the main shaft from being damaged.
Description
Technical field
The present invention relates to the anti-plate air-vent structure of exposing to the sun after six layers of wiring board contraposition pressing, plate exposes to the sun in the time of can effectively preventing six layers of wiring board later stage high-temperature operation after the pressing.
Background technology
Six layers and above multilayer circuit board before lamination, need with core material and insulating barrier contraposition stack back by rivet fixing when preventing lamination circuit fault position between each core material; Carry out laminating technology after then covering outer copper foil again; Right owing to adopt fixedly internal layer circuit of rivet; The expansion and the plate that causes exposing to the sun finally causes multilayer circuit board to be scrapped in the high-temperature operation (high-temperature baking operation after like anti-welding technology) that the later stage wiring board is made of air in the rivet; Traditional anti-plate way of exposing to the sun is directly whole rivet to be bored with the 5.5mm drill point at corresponding pressing rivet place behind the lamination, but the cost of this kind way drill point is bigger, and drilling efficiency is lower, and drilling machine main shaft torsion makes the drilling machine main shaft impaired than Da Yi during the drill point operation.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides the anti-plate air-vent structure of exposing to the sun after a kind of six layers of wiring board contraposition pressing, when guaranteeing effective bursting diaphragm, can effectively reduce the air-vent cost of manufacture and increase work efficiency.
The present invention for the technical scheme that solves its technical problem and adopt is:
The anti-plate air-vent structure of exposing to the sun after a kind of six layers of wiring board contraposition pressing; Six layers of wiring board after the said contraposition pressing are formed by two two-sided central layers, three insulating barriers and two copper foil layer stack pressings; Wherein be provided with a slice insulating barrier between two two-sided central layers; The one side that two two-sided central layers deviate from each other respectively covers a slice insulating barrier; Between these two two-sided central layers and three insulating barriers each other contraposition stack back by the fixing internal fixation plate that forms of rivet; These internal fixation plate two surfaces respectively cover a slice copper foil layer, and the periphery at each position, rivet place of corresponding its internal fixation plate of six layers of wiring board after the said pressing is drilled with some air-vents.
As further improvement of the present invention, said insulating barrier is mylar (prepreg).
As further improvement of the present invention, the periphery at each position, rivet place of corresponding its internal fixation plate of six layers of wiring board after the said pressing is drilled with seven air-vents.
As further improvement of the present invention, the aperture of said air-vent is 0.7mm～1.5mm.
As further improvement of the present invention, the aperture of said air-vent is 0.7mm～0.95mm.
As further improvement of the present invention, the aperture of said air-vent is 1.05mm～1.5mm.
As further improvement of the present invention, the aperture of said air-vent is 1.0mm.
The invention has the beneficial effects as follows: the periphery at the six layer wiring board corresponding rivet position of the drill point of model after the contraposition pressing bores some air-vents in the utilization; Be convenient to six layers of wiring board when the later stage high-temperature operation in the rivet behind the air expansion through air-vent flow out do outside, avoid air that high temperature produces with the mylar spreading and the plate that causes exposing to the sun; Because middle model drill point is a drill point commonly used in the technology of conventional line twist drill hole, adopt this kind structure after, air-vent can adopt among a kind of in the bore process of making these six layers of wiring boards makings of holing of model drill point, has reduced the tool change time when holing; For the structure that original employing 5.5mm drill point directly bores whole rivet formation one big air-vent; Adopt air-vent structure of the present invention can reduce the drill point cost relatively; Promote drilling efficiency, the while can reduce drilling machine main shaft torsion and avoid its main shaft impaired.
Description of drawings
Fig. 1 is an air-vent structural representation of the present invention;
Fig. 2 is ventilating structure sketch map in original technology that the present invention contrasted;
Fig. 3 is the interlayer structure sketch map of six layers of wiring board after the contraposition pressing according to the invention;
Fig. 4 is the rivet position interlayer structure sketch map of the internal fixation plate of six layers of wiring board behind the contraposition lamination according to the invention.
Embodiment
Embodiment: the anti-plate air-vent structure of exposing to the sun after a kind of six layers of wiring board contraposition pressing; Six layers of wiring board 1 after the said contraposition pressing are formed by two two-sided central layers 11, three insulating barriers 12 and two copper foil layer 13 stack pressings; Wherein be provided with a slice insulating barrier 12 between two two-sided central layers 11; The one side that two two-sided central layers 11 deviate from each other respectively covers a slice insulating barrier 12; Between these two two-sided central layers 11 and three insulating barriers 12 each other contraposition stack back by the rivet 3 fixing internal fixation plates 2 that form; 2 liang of surfaces of this internal fixation plate respectively cover a slice copper foil layer 13, and the periphery at each position, rivet 3 place of six layers of wiring board, 1 corresponding its internal fixation plate 2 after the said pressing is drilled with some air-vents 4.
Said insulating barrier 12 is mylar (prepreg).
The periphery at each position, rivet 3 place of six layers of wiring board, 1 corresponding its internal fixation plate 1 after the said pressing is drilled with seven air-vents 4.
The aperture of said air-vent 4 is 0.7mm～1.5mm.
The aperture of said air-vent 4 is 0.7mm～0.95mm.
The aperture of said air-vent 4 is 1.05mm～1.5mm.
The aperture of said air-vent 4 is 1.0mm.
The present invention is not limited to six layers of wiring board; Wiring board adopts that similar air-vent structure belongs to that those of ordinary skills expect extremely easily more than six layers is equal to the replacement structure, so the present invention's scope of requiring to protect should comprise the air-vent structure of the multilayer circuit board more than six layers and six layers.
Claims (7)
1. the anti-plate air-vent structure of exposing to the sun after one kind six layers wiring board contraposition pressing; Six layers of wiring board (1) after the said contraposition pressing are formed by two two-sided central layers (11), three insulating barriers (12) and two copper foil layers (13) stack pressing; Wherein be provided with a slice insulating barrier (12) between two two-sided central layers (11); The one side that two two-sided central layers (11) deviate from each other respectively covers a slice insulating barrier (12); Mutual contraposition stack back is by the fixing internal fixation plate (2) that forms of rivet (3) between these two two-sided central layers (11) and three insulating barriers (12); These internal fixation plate (2) two surfaces respectively cover a slice copper foil layer (13), it is characterized in that: the periphery that each rivet (3) of corresponding its internal fixation plate (2) of the six layers of wiring board (1) after the said pressing is located the position is drilled with some air-vents (4).
2. the anti-plate air-vent structure of exposing to the sun after six layers of wiring board contraposition pressing according to claim 1, it is characterized in that: said insulating barrier (12) is a mylar.
3. the anti-plate air-vent structure of exposing to the sun after six layers of wiring board contraposition pressing according to claim 1 is characterized in that: the periphery that each rivet (3) of corresponding its internal fixation plate (1) of the six layers of wiring board (1) after the said pressing is located the position is drilled with seven air-vents (4).
4. according to the anti-plate air-vent structure of exposing to the sun after claim 1 or the 3 described six layers of wiring board contraposition pressing, it is characterized in that: the aperture of said air-vent (4) is 0.7mm～1.5mm.
5. the anti-plate air-vent structure of exposing to the sun after six layers of wiring board contraposition pressing according to claim 4, it is characterized in that: the aperture of said air-vent (4) is 0.7mm～0.95mm.
6. the anti-plate air-vent structure of exposing to the sun after six layers of wiring board contraposition pressing according to claim 5, it is characterized in that: the aperture of said air-vent (4) is 1.05mm～1.5mm.
7. the anti-plate air-vent structure of exposing to the sun after six layers of wiring board contraposition pressing according to claim 5, it is characterized in that: the aperture of said air-vent (4) is 1.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010242225XA CN102348338A (en) | 2010-07-30 | 2010-07-30 | Plate-explosion-preventing air vent structure for aligned and laminated six-layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010242225XA CN102348338A (en) | 2010-07-30 | 2010-07-30 | Plate-explosion-preventing air vent structure for aligned and laminated six-layer circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN102348338A true CN102348338A (en) | 2012-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010242225XA Pending CN102348338A (en) | 2010-07-30 | 2010-07-30 | Plate-explosion-preventing air vent structure for aligned and laminated six-layer circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104378932A (en) * | 2013-08-14 | 2015-02-25 | 北大方正集团有限公司 | Manufacturing method of multi-layer PCB and multi-layer PCB |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1913753A (en) * | 2006-08-24 | 2007-02-14 | 华为技术有限公司 | Manufacturing method of printed circuit board |
| US20080105455A1 (en) * | 2006-10-10 | 2008-05-08 | Tir Systems Ltd. | Circuit board with regional flexibility |
| CN101494957A (en) * | 2008-01-23 | 2009-07-29 | 富葵精密组件(深圳)有限公司 | Method and substrate for producing multi-layer circuit board |
| CN201797658U (en) * | 2010-07-30 | 2011-04-13 | 竞陆电子(昆山)有限公司 | Ventilation hole structure for preventing board explosion for six-layered circuit board after aligned lamination |
-
2010
- 2010-07-30 CN CN201010242225XA patent/CN102348338A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1913753A (en) * | 2006-08-24 | 2007-02-14 | 华为技术有限公司 | Manufacturing method of printed circuit board |
| US20080105455A1 (en) * | 2006-10-10 | 2008-05-08 | Tir Systems Ltd. | Circuit board with regional flexibility |
| CN101494957A (en) * | 2008-01-23 | 2009-07-29 | 富葵精密组件(深圳)有限公司 | Method and substrate for producing multi-layer circuit board |
| CN201797658U (en) * | 2010-07-30 | 2011-04-13 | 竞陆电子(昆山)有限公司 | Ventilation hole structure for preventing board explosion for six-layered circuit board after aligned lamination |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104378932A (en) * | 2013-08-14 | 2015-02-25 | 北大方正集团有限公司 | Manufacturing method of multi-layer PCB and multi-layer PCB |
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Application publication date: 20120208 |