CN102338950B - 基板组装设备以及使用基板组装设备的基板处理方法 - Google Patents

基板组装设备以及使用基板组装设备的基板处理方法 Download PDF

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Publication number
CN102338950B
CN102338950B CN201110199635.5A CN201110199635A CN102338950B CN 102338950 B CN102338950 B CN 102338950B CN 201110199635 A CN201110199635 A CN 201110199635A CN 102338950 B CN102338950 B CN 102338950B
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CN
China
Prior art keywords
substrate
diffusion barrier
infrabasal plate
chuck
supporting unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110199635.5A
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English (en)
Chinese (zh)
Other versions
CN102338950A (zh
Inventor
辛在爀
尹青龙
文成哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AP Cells Inc
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AP Cells Inc
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Publication date
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Publication of CN102338950A publication Critical patent/CN102338950A/zh
Application granted granted Critical
Publication of CN102338950B publication Critical patent/CN102338950B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
CN201110199635.5A 2010-07-15 2011-07-15 基板组装设备以及使用基板组装设备的基板处理方法 Expired - Fee Related CN102338950B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0068512 2010-07-15
KR1020100068512A KR101152232B1 (ko) 2010-07-15 2010-07-15 기판 접합 장치 및 이를 이용한 기판 처리 방법

Publications (2)

Publication Number Publication Date
CN102338950A CN102338950A (zh) 2012-02-01
CN102338950B true CN102338950B (zh) 2014-07-16

Family

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CN201110199635.5A Expired - Fee Related CN102338950B (zh) 2010-07-15 2011-07-15 基板组装设备以及使用基板组装设备的基板处理方法

Country Status (2)

Country Link
KR (1) KR101152232B1 (ko)
CN (1) CN102338950B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102164855B1 (ko) * 2013-05-29 2020-10-14 에베 그룹 에. 탈너 게엠베하 기판을 결합하기 위한 방법 및 장치
CN104614879B (zh) * 2013-11-04 2018-03-27 苏州璨宇光学有限公司 显示装置的固定结构
CN104570419B (zh) * 2014-12-26 2018-01-30 深圳市华星光电技术有限公司 吸附式载台及其吸附方法
CN105118803B (zh) * 2015-08-21 2019-01-22 京东方科技集团股份有限公司 顶针机构及支撑装置
KR20180053473A (ko) * 2016-11-11 2018-05-23 주식회사 탑 엔지니어링 다이렉트 본딩장치
KR20180053474A (ko) * 2016-11-11 2018-05-23 주식회사 탑 엔지니어링 다이렉트 본딩장치
KR20180053488A (ko) * 2016-11-11 2018-05-23 주식회사 탑 엔지니어링 패널 합착 장치 및 방법
KR20180053487A (ko) * 2016-11-11 2018-05-23 주식회사 탑 엔지니어링 패널 합착 장치 및 방법
KR102605121B1 (ko) * 2018-10-19 2023-11-23 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치 및 기판 처리 방법
JP7128534B2 (ja) * 2020-05-26 2022-08-31 Ａｉメカテック株式会社 基板組立装置及び基板組立方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101591771A (zh) * 2008-05-30 2009-12-02 财团法人工业技术研究院 真空设备的基座定位支撑装置
CN101622703A (zh) * 2007-02-28 2010-01-06 周星工程股份有限公司 基板支持框架及包含此支持框架的基板处理设备和利用此支持框架装载与卸载基板的方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006046379A1 (ja) * 2004-10-28 2006-05-04 Shin-Etsu Engineering Co., Ltd. 粘着チャック装置
KR100953101B1 (ko) * 2008-09-29 2010-04-19 (주)아폴로테크 기판척

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101622703A (zh) * 2007-02-28 2010-01-06 周星工程股份有限公司 基板支持框架及包含此支持框架的基板处理设备和利用此支持框架装载与卸载基板的方法
CN101591771A (zh) * 2008-05-30 2009-12-02 财团法人工业技术研究院 真空设备的基座定位支撑装置

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Publication number Publication date
KR20120007804A (ko) 2012-01-25
KR101152232B1 (ko) 2012-06-08
CN102338950A (zh) 2012-02-01

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Granted publication date: 20140716