CN102335868A - chemical mechanical polishing device and method - Google Patents
chemical mechanical polishing device and method Download PDFInfo
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- CN102335868A CN102335868A CN2010102294016A CN201010229401A CN102335868A CN 102335868 A CN102335868 A CN 102335868A CN 2010102294016 A CN2010102294016 A CN 2010102294016A CN 201010229401 A CN201010229401 A CN 201010229401A CN 102335868 A CN102335868 A CN 102335868A
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Abstract
The invention discloses a chemical mechanical polishing device and method. the chemical mechanical polishing device comprises a polishing platform, a drive device connected with the polishing platform and used for driving the polishing platform to rotate, a sensor connected with the polishing platform and used for measuring a rotating speed of the polishing platform and converting the rotating speed into a rotating speed signal, and a controller connected with the sensor and used for receiving the rotating speed signal output by the sensor and outputting an alarm signal according to the rotating speed signal for starting the alarm device to alarm. The sensor can be used for measuring the actual rotating sped of the polishing platform, once the rotating speed of the polishing platform is abnormal, the controller can output the alarm signal according to the rotating speed signal output by the sensor, an operator can know that the chemical mechanical polishing platform fails and immediately processes a wafer, thus the wafer is avoided being scraped.
Description
Technical field
The present invention relates to integrated circuit and make the field, particularly relate to a kind of chemical mechanical polishing device and chemical and mechanical grinding method.
Background technology
Develop rapidly along with super large-scale integration; Integrated circuit fabrication process becomes and becomes increasingly complex with meticulous, in order to improve integrated level, reduces manufacturing cost; Size of semiconductor device reduces day by day; Plane routing has been difficult to satisfy semiconductor devices high density distribution requirements, can only adopt polylaminate wiring technique, further improves the integration density of semiconductor devices.Because multilayer interconnection or the bigger deposition process of filling depth ratio have caused the excessive fluctuating of wafer surface, cause the difficulty that photoetching process focuses on, feasible control ability to live width weakens, and has reduced the uniformity of live width on the entire wafer.For this reason, need carry out planarization to irregular wafer surface.At present; Cmp (Chemical Mechanical Polishing; CMP) be the best approach of reaching overall planarization, especially after semiconductor fabrication process got into submicrometer field, cmp had become an indispensable manufacture craft technology.
Please refer to Fig. 1, it is the sketch map of existing chemical mechanical polishing device.As shown in Figure 1, existing work-table of chemicomechanical grinding mill 100 comprises: grinding plate (Polish platen) 110, drive unit 120, grinding pad (Polish pad) 130 and grinding head (head) 140.Wherein, Drive unit 120 comprises: CD-ROM drive motor (Drive motor) 121, drive pulley (Drive pulley) 122 and driving belt (Drivebelt) 123; Said drive pulley 122 is fixedly connected with the driving shaft of said CD-ROM drive motor 121; Said driving belt 123 is wrapped on the said drive pulley 122 and in the rotating shaft of grinding plate 110, said CD-ROM drive motor 121 is used to produce driving force, and said CD-ROM drive motor 121 rotations can drive said drive pulley 122 rotations; Said driving belt 123 can be transferred to said driving force on the said grinding plate 110, thereby drives said grinding plate 110 rotations; Said grinding pad 130 is attached at the surface of said grinding plate 100, and when said grinding plate 110 rotated, said grinding pad 130 is rotation thereupon also; Said grinding head 140 is used for clamping, moves and rotation wafer 170.
When carrying out chemical mechanical milling tech, utilize grinding head 140 that wafer 170 is pressed on the grinding plate 110, and make wafer 170 to be groundly face down and contact counterrotating grinding pad 130; Simultaneously, lapping liquid is transported on the grinding pad 130, lapping liquid is evenly distributed on the grinding pad 130 through centrifugal force, thus through the relative motion between wafer 170 surface and the grinding pad 130 with wafer 170 having an even surface.
As everyone knows, in chemical mechanical milling tech, the rotating speed of grinding plate 110 is vital parameters, thereby its grinding rate that can influence wafer influences grinding effect.Therefore, in existing work-table of chemicomechanical grinding mill 100, also be provided with rotational speed measuring device 150 and controller 160 usually, said rotational speed measuring device 150 is connected with CD-ROM drive motor 121, in order to monitor the rotating speed of said CD-ROM drive motor 121.When the rotating speed of said CD-ROM drive motor 121 is undesirable; Said rotational speed measuring device 150 exportable signals to said controller 160; Said controller 160 receives the signal of rotational speed measuring device 150 outputs and according to said signal output alarm signal, reports to the police with the warning device that starts work-table of chemicomechanical grinding mill 100.
Yet; In actual production, find, because the rotating speed that said rotational speed measuring device 150 only can monitoring driving motor 121, and can't monitor the actual speed of grinding plate 110; Therefore; When the rotating speed of said CD-ROM drive motor 121 meets the requirements, but owing to said drive pulley 122 or when driving belt 123 and occurring causing unusually the rotating speed of grinding plate 110 undesirable, said rotational speed measuring device 150 can't be monitored; This wafer that will cause carrying out chemical mechanical milling tech is scrapped, and brings massive losses to explained hereafter.
Summary of the invention
The present invention provides a kind of chemical mechanical polishing device, can't monitor the problem of the actual speed of grinding plate to solve existing chemical mechanical polishing device.
For solving the problems of the technologies described above, the present invention provides a kind of chemical mechanical polishing device, comprising: grinding plate; Drive unit is connected with said grinding plate, is used to drive said grinding plate rotation; Sensor is connected with said grinding plate, is used to measure the rotating speed of said grinding plate and converts said rotating speed into tach signal; Controller is connected with said sensor, is used to receive the tach signal of said sensor output and according to said tach signal output alarm signal, reports to the police to start warning device.
Optional, in said chemical mechanical polishing device, said grinding plate comprises main platform body and the rotating shaft that is connected with said main platform body, said sensor is connected with said rotating shaft.
Optional, in said chemical mechanical polishing device, said sensor is connected with said controller through a connector lug.
Optional, in said chemical mechanical polishing device, said sensor is a speed probe.
Optional; In said chemical mechanical polishing device; Said drive unit comprises: CD-ROM drive motor, drive pulley and drive belt, and said drive pulley is fixedly connected with said CD-ROM drive motor, and said driving belt is wrapped on the said drive pulley and on the grinding plate.
Accordingly, the present invention also provides a kind of chemical and mechanical grinding method, comprising: utilize drive unit to drive the grinding plate rotation; Utilize the rotating speed of the said grinding plate of sensor measurement and convert said rotating speed into tach signal; Utilize controller to receive the tach signal of said sensor output; Said controller is reported to the police to start warning device according to said tach signal output alarm signal.
Optional, in said chemical and mechanical grinding method, said grinding plate comprises main platform body and the rotating shaft that is connected with said main platform body, said sensor is connected with said rotating shaft.
Optional, in said chemical and mechanical grinding method, said sensor is connected with said controller through a connector lug.
Optional, in said chemical and mechanical grinding method, said sensor is a speed probe.
Optional; In said chemical and mechanical grinding method; Said drive unit comprises: CD-ROM drive motor, drive pulley and drive belt, and said drive pulley is fixedly connected with said CD-ROM drive motor, and said driving belt is wrapped on the said drive pulley and on the grinding plate.
Compared with prior art, the present invention has the following advantages:
Chemical mechanical polishing device provided by the invention comprises a sensor; Said sensor can be measured the actual speed of said grinding plate and convert said rotating speed into tach signal and transfer to controller; In case the rotating speed of said grinding plate occurs unusual; Said controller can receive the tach signal of said sensor output and according to said tach signal output alarm signal; Report to the police to start warning device, operating personnel can know that said work-table of chemicomechanical grinding mill breaks down and timely processing wafers, thereby avoid wafer to scrap.
Description of drawings
Fig. 1 is the sketch map of existing chemical mechanical polishing device;
The sketch map of the chemical mechanical polishing device that Fig. 2 provides for the embodiment of the invention;
The flow chart of the chemical and mechanical grinding method that Fig. 3 provides for the embodiment of the invention.
The specific embodiment
Below in conjunction with accompanying drawing and specific embodiment chemical mechanical polishing device and chemical and mechanical grinding method that the present invention proposes are done further explain.According to following explanation and claims, advantage of the present invention and characteristic will be clearer.What need explanation is, accompanying drawing all adopts the form of simplifying very much and all uses non-ratio accurately, only in order to convenient, the purpose of the aid illustration embodiment of the invention lucidly.
Core concept of the present invention is; A kind of chemical mechanical polishing device and chemical and mechanical grinding method are provided; Said chemical mechanical polishing device comprises a sensor; Said sensor is connected with grinding plate, and said sensor can be measured the actual speed of said grinding plate and convert said rotating speed into tach signal and transfer to controller, in case the rotating speed of said grinding plate occurs unusually; Said controller receives the tach signal of said sensor output and can report to the police to start warning device according to said tach signal output alarm signal.
Please refer to Fig. 2, the sketch map of the chemical mechanical polishing device that it provides for the embodiment of the invention, as shown in Figure 2, chemical mechanical polishing device 200 comprises: grinding plate 210, drive unit 220, sensor 250 and controller 260.Said drive unit 220 is connected with grinding plate 210, is used to drive said grinding plate 210 rotations; Said sensor 250 is connected with grinding plate 210, is used to measure the rotating speed of said grinding plate 210 and converts said rotating speed into tach signal; Said controller 260 is connected with sensor 250, is used for the tach signal of receiving sensor 250 output and according to said tach signal output alarm signal, reports to the police to start warning device (not shown).Said sensor 250 can directly be measured the actual speed of grinding plate 210; In case the rotating speed of said grinding plate 210 occurs unusual; Said controller 260 exportable alarm signals; Operating personnel can know said work-table of chemicomechanical grinding mill breaks down, and then processing in time carrying out the wafer 270 of chemical mechanical milling tech, avoids wafer to scrap.
Wherein, Said drive unit 220 comprises: CD-ROM drive motor (Drive motor) 221, drive pulley (Drivepulley) 222 and driving belt (Drive belt) 223; Said drive pulley 222 is fixedly connected with the driving shaft of CD-ROM drive motor 221, and said driving belt 223 is wrapped on the said drive pulley 222 and in the rotating shaft of grinding plate 210, said CD-ROM drive motor 221 is used to produce driving force; Said CD-ROM drive motor 221 rotations can drive said drive pulley 222 rotations; And then driving said driving belt 223 rotations, said driving belt 223 is transferred to said driving force on the grinding plate 210, thereby drives grinding plate 210 rotations.Said chemical mechanical polishing device 200 also comprises grinding pad (Polish pad) 230 and grinding head (head) 240, and said grinding pad 230 is attached at the surface of grinding plate 200, and when said grinding plate 210 rotated, said grinding pad 230 is rotation thereupon also; Said grinding head 240 is used for clamping, moves and rotation wafer 270.
In a specific embodiment of the present invention; Said grinding plate 210 comprises main platform body 211 and the rotating shaft 212 that is connected with said main platform body 211; Said grinding pad 230 is attached at the surface of the main platform body 211 of grinding plate 200, and said sensor 250 is connected with said rotating shaft 212.
Because said grinding plate 210 is far away with the distance of said controller 260, and is preferred, said sensor 250 is connected with said controller 260 through connector lug (bulkhead) (not shown).Certainly, said sensor 250 also can directly be connected with said controller 260.
In a specific embodiment of the present invention, said sensor 250 is a speed probe, and said sensor 250 is measured the rotating speed of the rotating shaft 212 of said grinding plate 210, and converts the rotating speed of said rotating shaft 212 into tach signal and export controller 260 to.
The present invention also provides a kind of chemical and mechanical grinding method.Please refer to Fig. 3, the flow chart of the chemical and mechanical grinding method that it provides for the embodiment of the invention, in conjunction with this Fig. 3, this chemical and mechanical grinding method may further comprise the steps:
Step S300 utilizes drive unit to drive the grinding plate rotation;
Step S310 utilizes the rotating speed of the said grinding plate of sensor measurement and converts rotating speed into tach signal;
Step S320 utilizes controller to receive the tach signal of said sensor output;
Step S330, said controller report to the police to start warning device according to the tach signal output alarm signal.
Please continue with reference to figure 3, and combine Fig. 2, when carrying out chemical mechanical milling tech; At first, the grinding head that is adsorbing wafer 270 240 is moved to grinding plate 210 tops, simultaneously wafer 270 is pressed on the grinding plate 210; Said wafer 270 to be ground faces down and contacts grinding pad 230; At this moment, utilize drive unit 220 to drive grinding plate 210 rotations, said grinding head 240 also carries out relative motion simultaneously; Then, lapping liquid is transported on the grinding pad 230, and said lapping liquid is evenly distributed on the grinding pad 230 through centrifugal force, thus through the relative motion between wafer 270 surface and the grinding pad 230 with wafer 270 having an even surface.In the chemical and mechanical grinding method that the embodiment of the invention provides; When carrying out chemical mechanical milling tech; But the actual speed of the said grinding plate 210 of said sensor 250 synchro measures, in case the rotating speed of said grinding plate 210 occurs unusually, said controller 260 gets final product output alarm signal; Operating personnel can in time handle the wafer that carries out chemical mechanical milling tech, avoid wafer to scrap.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, belong within the scope of claim of the present invention and equivalent technologies thereof if of the present invention these are revised with modification, then the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. chemical mechanical polishing device comprises:
Grinding plate;
Drive unit is connected with said grinding plate, is used to drive said grinding plate rotation;
Sensor is connected with said grinding plate, is used to measure the rotating speed of said grinding plate and converts said rotating speed into tach signal;
Controller is connected with said sensor, is used to receive the tach signal of said sensor output and according to said tach signal output alarm signal, reports to the police to start warning device.
2. chemical mechanical polishing device as claimed in claim 1 is characterized in that, said grinding plate comprises main platform body and the rotating shaft that is connected with said main platform body, and said sensor is connected with said rotating shaft.
3. chemical mechanical polishing device as claimed in claim 1 is characterized in that, said sensor is connected with said controller through a connector lug.
4. like any described chemical mechanical polishing device in the claim 1 to 3, it is characterized in that said sensor is a speed probe.
5. chemical mechanical polishing device as claimed in claim 4; It is characterized in that; Said drive unit comprises: CD-ROM drive motor, drive pulley and driving belt, and said drive pulley is fixedly connected with said CD-ROM drive motor, and said driving belt is wrapped on said drive pulley and the grinding plate.
6. chemical and mechanical grinding method comprises:
Utilize drive unit to drive the grinding plate rotation;
Utilize the rotating speed of the said grinding plate of sensor measurement and convert said rotating speed into tach signal;
Utilize controller to receive the tach signal of said sensor output;
Said controller is reported to the police to start warning device according to said tach signal output alarm signal.
7. chemical and mechanical grinding method as claimed in claim 6 is characterized in that, said grinding plate comprises main platform body and the rotating shaft that is connected with said main platform body, and said sensor is connected with said rotating shaft.
8. chemical and mechanical grinding method as claimed in claim 6 is characterized in that, said sensor is connected with said controller through a connector lug.
9. like any described chemical and mechanical grinding method in the claim 6 to 8, it is characterized in that said sensor is a speed probe.
10. chemical and mechanical grinding method as claimed in claim 9; It is characterized in that; Said drive unit comprises: CD-ROM drive motor, drive pulley and driving belt, and said drive pulley is fixedly connected with said CD-ROM drive motor, and said driving belt is wrapped on said drive pulley and the grinding plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102294016A CN102335868A (en) | 2010-07-16 | 2010-07-16 | chemical mechanical polishing device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102294016A CN102335868A (en) | 2010-07-16 | 2010-07-16 | chemical mechanical polishing device and method |
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| CN102335868A true CN102335868A (en) | 2012-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010102294016A Pending CN102335868A (en) | 2010-07-16 | 2010-07-16 | chemical mechanical polishing device and method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104380439A (en) * | 2012-06-25 | 2015-02-25 | 胜高股份有限公司 | Method for polishing work and work polishing device |
| CN107363701A (en) * | 2017-07-04 | 2017-11-21 | 希尔维斯特·本杰明 | Controllable upper dish structure and burnishing device |
| CN108188921A (en) * | 2018-03-09 | 2018-06-22 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Water circle device and grinding device |
Citations (4)
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| US20010001755A1 (en) * | 1993-08-25 | 2001-05-24 | Sandhu Gurtej S. | System for real-time control of semiconductor wafer polishing |
| US6257953B1 (en) * | 2000-09-25 | 2001-07-10 | Center For Tribology, Inc. | Method and apparatus for controlled polishing |
| US6709314B2 (en) * | 2001-11-07 | 2004-03-23 | Applied Materials Inc. | Chemical mechanical polishing endpoinat detection |
| CN101362309A (en) * | 2007-08-09 | 2009-02-11 | 富士通株式会社 | Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method |
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2010
- 2010-07-16 CN CN2010102294016A patent/CN102335868A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010001755A1 (en) * | 1993-08-25 | 2001-05-24 | Sandhu Gurtej S. | System for real-time control of semiconductor wafer polishing |
| US6257953B1 (en) * | 2000-09-25 | 2001-07-10 | Center For Tribology, Inc. | Method and apparatus for controlled polishing |
| US6709314B2 (en) * | 2001-11-07 | 2004-03-23 | Applied Materials Inc. | Chemical mechanical polishing endpoinat detection |
| CN101362309A (en) * | 2007-08-09 | 2009-02-11 | 富士通株式会社 | Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104380439A (en) * | 2012-06-25 | 2015-02-25 | 胜高股份有限公司 | Method for polishing work and work polishing device |
| CN104380439B (en) * | 2012-06-25 | 2016-09-07 | 胜高股份有限公司 | Workpiece Ginding process and workpiece grinding device |
| CN107363701A (en) * | 2017-07-04 | 2017-11-21 | 希尔维斯特·本杰明 | Controllable upper dish structure and burnishing device |
| CN108188921A (en) * | 2018-03-09 | 2018-06-22 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Water circle device and grinding device |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHA Effective date: 20130617 Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130617 |
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Effective date of registration: 20130617 Address after: 100176 No. 18 Wenchang Avenue, Beijing economic and Technological Development Zone Applicant after: Semiconductor Manufacturing International (Beijing) Corporation Applicant after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 No. 18 Zhangjiang Road, Shanghai Applicant before: Semiconductor Manufacturing International (Shanghai) Corporation |
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Application publication date: 20120201 |