CN102332407B - Technology for manufacturing ceramic cofiring four-side lead flat package - Google Patents
Technology for manufacturing ceramic cofiring four-side lead flat package Download PDFInfo
- Publication number
- CN102332407B CN102332407B CN2011103198631A CN201110319863A CN102332407B CN 102332407 B CN102332407 B CN 102332407B CN 2011103198631 A CN2011103198631 A CN 2011103198631A CN 201110319863 A CN201110319863 A CN 201110319863A CN 102332407 B CN102332407 B CN 102332407B
- Authority
- CN
- China
- Prior art keywords
- lead
- wire
- flat
- ceramic
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000000919 ceramic Substances 0.000 title claims abstract description 16
- 238000005516 engineering process Methods 0.000 title abstract description 7
- 238000005452 bending Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000010931 gold Substances 0.000 claims abstract description 4
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims abstract description 4
- 230000001681 protective effect Effects 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims abstract description 3
- 229910052573 porcelain Inorganic materials 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000007766 curtain coating Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract 2
- 230000007547 defect Effects 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 238000003556 assay Methods 0.000 description 2
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a technology for manufacturing a ceramic cofiring four-side lead flat package, comprising the following steps of: manufacturing a ceramic package main body; processing a flat lead; welding the flat lead with a ceramic part by welding fluxes; plating a layer of gold on the flat lead and the ceramic part; coating a protective material on the lead surface; cutting off connecting parts of four sides of the flat lead; bending and forming the lead; and giving the qualified products after check to a user. The technology has the beneficial effects that the steps of cutting and bending the leads by the user in the traditional technology for manufacturing a ceramic cofiring four-side lead flat package are conducted before a package-manufacturing stage, that is, the step of bending and forming the leads is carried out in the process of manufacturing the packages, thus solving the defects that the user operation is complicated, the rate of finished products is low and the leads are scrapped easily in the process of bending and forming the leads in the traditional technology, and improving the use convenience of the user.
Description
Technical field
The present invention relates to a kind of manufacture craft, the manufacture craft of especially a kind of ceramic co-fired four limits lead-in wire flat package is applicable to the encapsulation field of large scale integrated chip.
Background technology
Lead-in wires shell in HTCC four limits comprises porcelain spare, lead-in wire, finalization area, heat sink etc.; Traditional manufacture craft is that lead-in wire is soldered on the porcelain spare; As input, the output of packaged IC chip, pay the user then, carry out die bonding, bonding, packaging technology such as seal by the user; What the user went between as requested again afterwards cuts and bending and molding; The user lead-in wire is carried out in the bending and molding process, very easily cause defectives such as porcelain spare is cracked, lead deformation, cause and scrap.Generally improve Forming Quality through being modified into type die, cost height and quality are unstable.
Summary of the invention
The technical problem that the present invention will solve provides and a kind of lead-in wire cut, the go between operation of bending is advanceed to the ceramic co-fired four limits lead-in wire flat package production phase, reduces the damage that the user goes between and bends and possibly bring, and has improved the convenience that the user uses.
For solving the problems of the technologies described above, the technical scheme that the present invention taked is: a kind of ceramic co-fired four limits lead-in wire flat package manufacture craft, and its method step is following:
(1) porcelain spare housing main body is made: through curtain coating, punching, printing, lamination, fervent and sintering process step making porcelain spare housing main body;
(2) flat lead-in wire processing: through the flat lead frame of etching technics processing;
(3) soldering: through scolder will put down the lead-in wire and porcelain spare housing main body weld together;
(4) gold-plated: plating one deck gold on flat lead-in wire and porcelain spare housing main body;
(5) pilot protection: apply protective material at flat wire surface;
(6) lead-in wire cuts: the coupling part sanction that will put down lead-in wire four limits is gone;
(7) lead-in wire bends: adopt particular manufacturing craft, the flat lead-in wire after cutting is carried out bending and molding one time.
(8) carry out die bonding, bonding, seal according to user's request.
Ceramic co-fired four limits lead-in wire flat package through above-mentioned steps is processed is paid the user through after the assay was approved.
Beneficial effect of the present invention is following: the present invention cuts and the step of bending that goes between advances to the shell production phase through traditional ceramics being burnt altogether being gone between by the user in the four limits lead-in wires flat package manufacture craft; The bending and molding that promptly in the shell production process, goes between; Solved traditional handicraft user's complicated operation, rate of finished products low, in lead-in wire bending and molding process, cause the shortcoming of scrapping easily, improved the convenience that the user uses.
Embodiment
Ceramic co-fired four limits of the present invention lead-in wire flat package manufacture craft, its method step is following:
(1) porcelain spare housing main body is made: through curtain coating, punching, printing, lamination, earnestly and processing step such as sintering make porcelain spare housing main body;
(2) flat lead-in wire processing: through the flat lead frame of etching technics processing, the lead-in wire after machining is in straightened condition;
(3) soldering: through scolder will put down the lead-in wire and porcelain spare weld together;
(4) gold-plated: as to be needs such as satisfy the installation of user's chip, bonding and seal, on flat lead-in wire and porcelain spare, to plate certain thickness gold;
(5) pilot protection: for avoiding cutting and go between when bending to the damage of lead-in wire, at flat wire surface coating protective material at lead-in wire;
(6) lead-in wire cuts: can carry out smoothly for next step lead-in wire bends, the coupling part on flat lead-in wire four limits cut out go;
(7) lead-in wire bends: adopt particular manufacturing craft, the lead-in wire after cutting is carried out bending and molding one time, obtain ceramic co-fired four limits lead-in wire flat package finished product.Pay the user through after the assay was approved.
(8) user carries out die bonding, bonding, seals according to self-demand.
The present invention cuts and the step of bending that goes between advances to the shell production phase through traditional ceramics being burnt altogether being gone between by the user in the four limits lead-in wires flat package manufacture craft; The bending and molding that promptly in the shell production process, goes between; Solved traditional handicraft user's complicated operation, rate of finished products low, in lead-in wire bending and molding process, cause the shortcoming of scrapping easily, improved the convenience that the user uses.
Claims (1)
1. ceramic co-fired four limits lead-in wire flat package manufacture craft is characterized in that its method step is following:
(1) porcelain spare housing main body is made: through curtain coating, punching, printing, lamination, fervent and sintering process step making porcelain spare housing main body;
(2) flat lead-in wire processing: through the flat lead frame of etching technics processing;
(3) soldering: through scolder will put down the lead-in wire and porcelain spare housing main body weld together;
(4) gold-plated: plating one deck gold on flat lead-in wire and porcelain spare housing main body;
(5) pilot protection: apply protective material at flat wire surface;
(6) lead-in wire cuts: the coupling part sanction that will put down lead-in wire four limits is gone;
(7) lead-in wire bends: adopt particular manufacturing craft, the flat lead-in wire after cutting is carried out bending and molding one time;
(8) carry out die bonding, bonding, seal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103198631A CN102332407B (en) | 2011-10-20 | 2011-10-20 | Technology for manufacturing ceramic cofiring four-side lead flat package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103198631A CN102332407B (en) | 2011-10-20 | 2011-10-20 | Technology for manufacturing ceramic cofiring four-side lead flat package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102332407A CN102332407A (en) | 2012-01-25 |
| CN102332407B true CN102332407B (en) | 2012-10-31 |
Family
ID=45484133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103198631A Expired - Fee Related CN102332407B (en) | 2011-10-20 | 2011-10-20 | Technology for manufacturing ceramic cofiring four-side lead flat package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102332407B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103077898B (en) * | 2012-12-28 | 2015-07-08 | 北京时代民芯科技有限公司 | Mould for synchronously covering upper and lower cavities of dual-chamber CQFP (Ceramic Quad Flat Package) ceramic shell |
| CN107680941A (en) * | 2017-10-13 | 2018-02-09 | 中国电子科技集团公司第十三研究所 | Ceramic package shell |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201378591Y (en) * | 2009-04-01 | 2010-01-06 | 中国电子科技集团公司第十三研究所 | Surface-mounted metal wall ceramic substrate shell |
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2011
- 2011-10-20 CN CN2011103198631A patent/CN102332407B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN102332407A (en) | 2012-01-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121031 |