CN103077898B - Mould for synchronously covering upper and lower cavities of dual-chamber CQFP (Ceramic Quad Flat Package) ceramic shell - Google Patents
Mould for synchronously covering upper and lower cavities of dual-chamber CQFP (Ceramic Quad Flat Package) ceramic shell Download PDFInfo
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- CN103077898B CN103077898B CN201210595066.0A CN201210595066A CN103077898B CN 103077898 B CN103077898 B CN 103077898B CN 201210595066 A CN201210595066 A CN 201210595066A CN 103077898 B CN103077898 B CN 103077898B
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Abstract
The invention provides a mould for synchronously covering upper and lower cavities of a dual-chamber CQFP (Ceramic Quad Flat Package) ceramic shell. The mould comprises an upper mould and a lower mould; an upper cavity cover plate positioning accommodating slot and an upper mould steel clip outlet are arranged in the upper mould; the upper cavity cover plate positioning accommodating slot is used for placing the upper cavity cover plate; a lower cavity cover plate positioning accommodating slot, a ceramic shell main body positioning accommodating slot, a ceramic insulation connecting rib accommodating slot and a lower mould steel slip outlet are arranged in the lower mould; the lower cavity cover plate positioning accommodating slot is used for placing the lower cavity cover plate; the ceramic shell main body positioning accommodating slot is used for placing the ceramic shell main body part; the ceramic insulation connecting rib accommodating slot is used for placing the insulated connecting rib part in the ceramic shell; when the mould is used, after the lower cavity cover plate, the ceramic shell and the upper cavity cover plate are placed, the steel slip is used for fixing the upper cavity cover plate and the lower cavity cover plate; and the upper mould steel clip outlet and the lower mould steel clip outlet are used as the outlets of the steel clip when the mould is removed. The mould provided by the invention is simple and convenient in use and good in consistency.
Description
Technical field
The present invention relates to a kind of sealing cap top cover die, particularly relate to a kind of mould of the sealing by fusing upper cover based on dual chamber CQFP type ceramic package, belong to integrated antenna package technical field.
Background technology
Generally need complete in the glove box that internal atmosphere is nitrogen environment during conventional single cavity sealing by fusing technique upper cover, first hold steadily on the other hand and need carry out the shell of upper cover, another hand uses vacuum WAND cover plate absorption to be placed on above shell weld-ring and to adjust cap locations, guarantee cover plate is placed in the middle, uses special steel clamp to be fixed it after cover plate adjustment.In the process, upper cover needs manually to carry out cap locations adjustment, and consistency is poor, and easily occurs touching silk or cap locations phenomenon not placed in the middle.
The structural representation of dual chamber CQFP type ceramic package as shown in Figure 4, in prior art, first cavity of resorption cover plate need be held with a finger when upper cover plate operation is carried out for dual chamber CQFP type ceramic package, shell is pressed on cavity of resorption cover plate, again epicoele cover plate is placed on ceramic package, steel clamp is finally used to be fixed, when shell pushes down cavity of resorption cover plate, cover plate easily produces movement, thus it is poor to cause cover plate to be located, if cover plate will be absorbed in enclosure cavity inside and cause bonding wire or wafer damage when mobile range is larger.
Summary of the invention
Technology of the present invention is dealt with problems and is: overcome the deficiencies in the prior art, provides a kind of mould of simple to operate, quick, dual chamber CQFP type ceramic package positive and negative two disposable upper covers of cavity that consistency is good.
Technical solution of the present invention is: a kind of mould for upper cover while of dual chamber CQFP type ceramic package upper and lower cavity, comprise upper die and lower die, patrix is provided with epicoele cover plate location tank, the outlet of patrix steel clamp, and described epicoele cover plate location tank is for placing epicoele cover plate; Counterdie is provided with cavity of resorption cover plate location tank, ceramic package agent localization tank, ceramic insulation connects muscle tank, counterdie steel clamp exports, described cavity of resorption cover plate location tank is for placing cavity of resorption cover plate, ceramic package agent localization tank is used for placing ceramic housing body portion, and ceramic insulation connects muscle tank and connects muscle part for the insulation in placing ceramic shell; During use, after cavity of resorption cover plate, ceramic package and epicoele cover plate all place, steel clamp is used to fix epicoele cover plate and cavity of resorption cover plate, the outlet of steel clamp when the outlet of patrix steel clamp and counterdie steel clamp export for removing mould.
Described patrix is connected by pin with counterdie.
The corresponding sides that tank located by described epicoele cover plate location tank and cavity of resorption cover plate are parallel to each other.
The corresponding sides of described cavity of resorption cover plate location tank, ceramic package agent localization tank are parallel to each other.
The corresponding sides that described ceramic package agent localization tank, ceramic insulation connect muscle tank are parallel to each other.
Described epicoele cover plate location tank, cavity of resorption cover plate location tank, ceramic package agent localization tank, ceramic insulation connect the mismachining tolerance of muscle tank for [0,0.05] mm.
Described patrix and counterdie adopt aluminum alloy materials.
The present invention's advantage is compared with prior art:
(1) mould of the present invention break traditions manual operations location defect, complete upper cover work and only need 10 seconds, enhance productivity 3 ~ 4 times;
(2) the present invention is by corresponding for each location notch position of upper and lower mould, and corresponding sides are parallel, make the consistency of upper and lower two the cavity upper cover plates of dual chamber CQFP type ceramic package;
(3) the present invention adopts pin to be fixed by upper and lower mould, only needs the folding work carrying out mould, can not produce relative displacement, cause deviations during work;
(4) the present invention adopts upper and lower mould steel clamp to export, convenient taking-up after steel clamp is fixing;
(5) material of the present invention adopts aluminum alloy materials, not only light but also more durable.
Accompanying drawing explanation
Fig. 1 is the three-dimensional axonometric drawing of the present invention;
Fig. 2 is lower die structure schematic diagram of the present invention;
Fig. 3 is upper die structure schematic diagram of the present invention;
Fig. 4 is dual chamber CQFP type ceramic package schematic diagram
Embodiment
The present invention relates to a kind of dual chamber CQFP type ceramic package upper and lower cavity mould, whole set of die is made up of upper die and lower die, solves the technical barrier that existing dual chamber CQFP ceramic package is difficult to upper cover simultaneously.Mold materials aluminium alloy of the present invention, upper and lower mould is connected by stainless steel pin, adopt and first in the tank of cavity of resorption cover plate location, put into cavity of resorption cover plate, again dual chamber CQFP ceramic package is put into housing main body location tank, the even muscle that now insulate drops on ceramic insulation and connects in muscle tank, and closing molding upper cover, puts into epicoele cover plate by epicoele cover plate positioning through hole, fixing steel clamp, upper cover while finally realizing dual chamber CQFP ceramic package upper and lower cavity cover plate.The present invention is conducive to the batch production of dual chamber CQFP ceramic package sealing by fusing, enhances productivity and the consistency level of product.
Below in conjunction with accompanying drawing, the present invention is described in detail.
As shown in Figure 1,2 and 3, the present invention relates to the disposable top cover die of dual chamber CQFP type ceramic package upper and lower cavity, comprise upper die and lower die, patrix is provided with epicoele cover plate location tank 1, patrix steel clamp outlet 2, counterdie is provided with cavity of resorption cover plate location tank 4, ceramic package agent localization tank 5, ceramic insulation connects muscle tank 6, counterdie steel clamp exports 7, realized the location of upper and lower cover plates and shell by the mode of upper and lower mould main part central coaxial, and the corresponding sides that tank 4 located by epicoele cover plate location tank 1 and cavity of resorption cover plate are parallel to each other; Cavity of resorption cover plate location tank 4, ceramic package agent localization tank 5 corresponding sides are parallel to each other; It is parallel to each other that ceramic package agent localization tank 5, ceramic insulation connect muscle tank 6 corresponding sides.Ensure that when carrying out upper cover work cover plate accurate positioning and steel clamp can not produce displacement after fixing, ensure the consistency of dual chamber QFP type ceramic package positive and negative two cavity upper cover plates, enhance productivity.
In addition, patrix is also provided with die pin hole 3, counterdie is also provided with lower die pin hole 8, upper die and lower die are connected by pin, and upper mould and counterdie are made up of aluminum alloy materials.Epicoele cover plate location tank 1, cavity of resorption cover plate location tank 4, ceramic package agent localization tank 5, ceramic insulation connect the mismachining tolerance of muscle tank 6 for [0,0.05] mm.
During use, cavity of resorption cover plate is placed on and positions cavity of resorption cover plate in the location notch 4 of cavity of resorption cover plate location, again dual chamber CQFP ceramic package is placed in ceramic package agent localization tank 5, now casing insulation connects muscle and drops on ceramic insulation to connect muscle tank 6 inner, play positioning action, close upper mould body, epicoele cover plate is put in the tank 1 of epicoele cover plate location, play the positioning action of epicoele cover plate, exporting 7 sides in patrix steel clamp outlet 2 with counterdie steel clamp uses steel clamp upper and lower cover plates to be fixed, conveniently remove mould, open upper mould body taking-up ceramic package and namely complete the disposable upper cover work of upper and lower cavity cover plate.Because top cover die adopts upper and lower mould to arrange steel clamp outlet mode, facilitate shell to take out, ensure that convenience and the efficiency of upper cover; Because top cover die adopts aluminum alloy materials to make, effectively improve die life.
The content be not described in detail in specification of the present invention belongs to the known technology of those skilled in the art.
Claims (7)
1. the mould for upper cover while of dual chamber CQFP type ceramic package upper and lower cavity, it is characterized in that: comprise upper die and lower die, patrix is provided with epicoele cover plate location tank (1), patrix steel clamp outlet (2), and described epicoele cover plate location tank (1) is for placing epicoele cover plate; Counterdie is provided with cavity of resorption cover plate location tank (4), ceramic package agent localization tank (5), ceramic insulation connects muscle tank (6), counterdie steel clamp exports (7), described cavity of resorption cover plate location tank (4) is for placing cavity of resorption cover plate, ceramic package agent localization tank (5) is for placing ceramic housing body portion, and ceramic insulation connects muscle tank (6) and connects muscle part for the insulation in placing ceramic shell; During use, after cavity of resorption cover plate, ceramic package and epicoele cover plate all place, steel clamp is used to fix epicoele cover plate and cavity of resorption cover plate, the outlet of steel clamp when patrix steel clamp outlet (2) and counterdie steel clamp export (7) for removing mould.
2. a kind of mould for upper cover while of dual chamber CQFP type ceramic package upper and lower cavity according to claim 1, is characterized in that: described patrix is connected by pin with counterdie.
3. mould according to claim 1, is characterized in that: the corresponding sides that tank (4) located by described epicoele cover plate location tank (1) and cavity of resorption cover plate are parallel to each other.
4. mould according to claim 1, is characterized in that: the corresponding sides of described cavity of resorption cover plate location tank (4), ceramic package agent localization tank (5) are parallel to each other.
5. mould according to claim 1, is characterized in that: the corresponding sides that described ceramic package agent localization tank (5), ceramic insulation connect muscle tank (6) are parallel to each other.
6. a kind of mould for upper cover while of dual chamber CQFP type ceramic package upper and lower cavity according to claim 1, it is characterized in that: described epicoele cover plate location tank (1), cavity of resorption cover plate location tank (4), ceramic package agent localization tank (5), ceramic insulation connect the mismachining tolerance of muscle tank (6) for [0,0.05] mm.
7. a kind of mould for upper cover while of dual chamber CQFP type ceramic package upper and lower cavity according to claim 1, is characterized in that: described patrix and counterdie adopt aluminum alloy materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210595066.0A CN103077898B (en) | 2012-12-28 | 2012-12-28 | Mould for synchronously covering upper and lower cavities of dual-chamber CQFP (Ceramic Quad Flat Package) ceramic shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210595066.0A CN103077898B (en) | 2012-12-28 | 2012-12-28 | Mould for synchronously covering upper and lower cavities of dual-chamber CQFP (Ceramic Quad Flat Package) ceramic shell |
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| Publication Number | Publication Date |
|---|---|
| CN103077898A CN103077898A (en) | 2013-05-01 |
| CN103077898B true CN103077898B (en) | 2015-07-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210595066.0A Active CN103077898B (en) | 2012-12-28 | 2012-12-28 | Mould for synchronously covering upper and lower cavities of dual-chamber CQFP (Ceramic Quad Flat Package) ceramic shell |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112563182B (en) * | 2020-11-30 | 2023-06-13 | 西安微电子技术研究所 | CFP flat ceramic tube shell packaging, assembling and transferring universal die |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201458083U (en) * | 2009-07-23 | 2010-05-12 | 北京时代民芯科技有限公司 | IC packing box with ceramic quad package |
| CN102332407A (en) * | 2011-10-20 | 2012-01-25 | 中国电子科技集团公司第十三研究所 | Technology for manufacturing ceramic cofiring four-side lead flat package |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8963572B2 (en) * | 2010-12-13 | 2015-02-24 | Rf Micro Devices, Inc. | Testing in trays |
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- 2012-12-28 CN CN201210595066.0A patent/CN103077898B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201458083U (en) * | 2009-07-23 | 2010-05-12 | 北京时代民芯科技有限公司 | IC packing box with ceramic quad package |
| CN102332407A (en) * | 2011-10-20 | 2012-01-25 | 中国电子科技集团公司第十三研究所 | Technology for manufacturing ceramic cofiring four-side lead flat package |
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| CN103077898A (en) | 2013-05-01 |
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