CN102323334A - Energy factor based ultrasonic guided wave detection method of debonding defect of bonding structure - Google Patents
Energy factor based ultrasonic guided wave detection method of debonding defect of bonding structure Download PDFInfo
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- CN102323334A CN102323334A CN201110125248A CN201110125248A CN102323334A CN 102323334 A CN102323334 A CN 102323334A CN 201110125248 A CN201110125248 A CN 201110125248A CN 201110125248 A CN201110125248 A CN 201110125248A CN 102323334 A CN102323334 A CN 102323334A
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Abstract
The invention relates to an energy factor based ultrasonic guided wave detection method of the debonding defect of a bonding structure, which is characterized in that: whether a region of a connecting line between a transmitter transducer and a receiver transducer has the debonding defect or not is judged according to the size of the energy factor of received ultrasonic guided waves. Compared with the prior art, the detection method has the advantages of quick detection speed, high efficiency and wide covering range of detection regions, and can realize the detection of unreachable parts of certain transducers; and compared with the traditional pulse echo method, the target feature value changes more sensitively and the debonding defect is more easily found.
Description
Technical field
The invention belongs to technical field of nondestructive testing, relate to a kind of supersonic guide-wave method that is used for bonded structure unsticking defects detection, relate in particular to a kind of bonded structure unsticking defective ultrasonic guided wave detecting method based on energy factors.
Background technology
Bonded structure is a kind of common version, has light weight, high, the low cost and other advantages of intensity, is widely used in people's productive life.The quality of bonding quality directly affects the usability and the reliability of bonded structure, and unsticking is one type of maximum defective of harm in the bonded structure, and it can significantly reduce structural strength, cause structural failure, even lead to disastrous consequence.Therefore the unsticking defects detection receives much attention in the production of bonded structure and use.
In the prior art before the present invention, the most frequently used detection method of bonded structure is that conventional ultrasound detects, and comprises ultrasonic penetration method and pulse echo method.Through transmission technique is with two ultrasonic transducers, places the both sides of member to be detected respectively, and one of them transducers transmit ultrasonic waves penetrates behind the member and received by another transducer, judges whether to exist the unsticking defective according to the ultrasound wave magnitude that receives.Through transmission technique requires transducer to place the structure both sides respectively, therefore can only one be sidelong the structure of putting transducer for some, and like enclosed construction, through transmission technique is just inapplicable.Pulse echo method only uses a transducer; Double as transmits and receives; Transducers transmit ultrasonic waves gets into component inside from member one side to be detected, and ultrasound wave runs into the unsticking defective at internal communication can produce boundary reflection, judges whether to exist unsticking according to the reflex amplitude that receives.No matter being ultrasonic penetration method or pulse echo method, all is that " pointwise " detects in testing process, i.e. corresponding point of detection signal, and therefore for the large tracts of land bonded structure, detection efficiency is lower.In addition, the ultrasonic penetration method all requires transducer to contact with pulse echo method or near tested zone, if tested zone has other barrier to stop, then can't detect.
Summary of the invention
To above-mentioned prior art situation, the object of the present invention is to provide a kind of based on energy factors convenience and ultrasonic guided wave detecting method efficiently can realize that the quick nondestructive of unsticking defective in the large tracts of land bonded structure detects.
For realizing above-mentioned purpose; The basic design that the present invention is based on the bonded structure unsticking defective ultrasonic guided wave detecting method of energy factors is to judge according to the energy factors size of the supersonic guide-wave that receives whether the zone between transmitting transducer and the receiving transducer line exists the unsticking defective; Supersonic guide-wave in the top dielectric is received the transducer reception after propagating certain distance, and to the ultrasonic guided wave signals that receives, described energy factors defines as follows:
Wherein, the time dependent ultrasonic guided wave signals of U (t) for receiving, T are that time integral is interval, and it has contained the duration of ultrasonic guided wave signals.
The required incident angle of described transmitting transducer is calculated by following formula:
Wherein, α is an incident angle, C
PBe the phase velocity of supersonic guide-wave in the top dielectric, C
LBe ultrasonic compressional wave velocity in the transducer.The phase velocity of supersonic guide-wave is relevant with the pattern of supersonic guide-wave in the top dielectric, should be chosen in the supersonic guide-wave pattern that bonding interface place particle has big vibration amplitude as far as possible.
The present invention further provides a kind of bonded structure unsticking defective ultrasonic guided wave detecting method based on energy factors, and it is characterized in that: concrete steps are following:
Step 1: use two ultrasonic transducers, one is used to launch supersonic guide-wave, and another is used to receive supersonic guide-wave, and two transducers place by on the surface, the same side of bonded structure;
Step 2: keep the distance between transmitting transducer and the receiving transducer constant, move two transducers simultaneously and cover whole surveyed area, to realize unsticking detection to whole bonded structure;
Step 3: transmitting transducer motivates the supersonic guide-wave of suitable pattern in the top dielectric of bonded structure with certain incident angle transponder pulse supersonic guide-wave;
Step 4: according to the definition of supersonic guide-wave energy factors, under the situation of distance and detecting instrument parameter constant between the transducer, the size of energy factors has been represented the relative size of supersonic guide-wave energy; Thereby can judge whether zone between transmitting transducer and the receiving transducer line exists the relative size of unsticking defective and unsticking defective through the size of energy factors;
Step 5: bonding when good when top dielectric and layer dielectric, its energy can leak in the layer dielectric through bonding interface in the supersonic guide-wave communication process in the top dielectric, and the supersonic guide-wave energy that receives is minimum; When having the unsticking defective between top dielectric and the layer dielectric, the supersonic guide-wave energy in the top dielectric can not leak in the layer dielectric and go, and when having the unsticking defective, it is big that the supersonic guide-wave energy that receives is wanted relatively, and the unsticking area is big more, and energy is big more.
The present invention is a kind of ultrasonic ultrasonic guided wave detecting method of bonded structure unsticking defective based on energy factors further, it is characterized in that: be chosen in supersonic guide-wave that bonding interface place particle has big vibration amplitude as detected value.
The superiority that the present invention compares with prior art is:
(1) detection speed is fast, efficient is high.In the same side of bonded structure, one-time detection can obtain the unsticking information in zone between two transducer lines to said method with two transducer arrangement, belongs to " by line " and detects." pointwise " with respect to the conventional acoustic detection method detects, and this method obviously has higher detection efficiency, is specially adapted to the fast detecting of large tracts of land bonded structure.
(2) can realize the detection at some unreachable position of transducer, the surveyed area wide coverage.For example; When there are other obstacle parts in the bonded structure surface; When hindering the placement of transducer, traditional acoustic detection method just can't detect the zone of obstacle parts below, and adopts the method for the invention; Transducer arrangement in obstacle parts both sides, can be realized the detection to the unreachable position of transducer, obstacle parts below.
(3) with respect to traditional pulse echo method, the object feature value of the method for the invention changes sensitive more, more is prone to find the unsticking defective.Promptly; The object feature value of the method for the invention is for receiving the supersonic guide-wave energy factors of signal; The object feature value of tradition pulse echo method is the amplitude of bonding interface reflection echo, and for same unsticking defective, the variation of supersonic guide-wave energy factors is bigger than the variation of interface echo amplitude.
Description of drawings
Fig. 1 is the detection method synoptic diagram
Transducer translation synoptic diagram when Fig. 2 detects for detection method of the present invention
Fig. 3 is detection method of the present invention transducer arrangement synoptic diagram when the obstacle parts are arranged
The ultrasonic guided wave signals of Fig. 4 a for receiving at bonding good area receiving transducer
Fig. 4 b is a transducer position synoptic diagram when detecting bonding good area
The ultrasonic guided wave signals that Fig. 5 a receives for the receiving transducer in the unsticking zone
Fig. 5 b is a transducer position synoptic diagram when detecting the unsticking zone
Wherein: the supersonic guide-wave 7 obstacle parts 8 unsticking defectives in 1 transmitting transducer, 2 receiving transducers, 3 top dielectric, 4 layer dielectric, 5 bonding interfaces, 6 top dielectric
Embodiment
Combine accompanying drawing that the specific embodiment of the invention is further specified at present:
Embodiment 1:
As shown in Figure 1; Tested sample is the bonded structure of glass fiber compound material plate and rubber in the present embodiment, and size is 200mm * 200mm, and top dielectric is a composite panel; Thickness is 5mm; Layer dielectric is a rubber, and thickness is 3mm, and artificial prefabricated diameter is the circular unsticking defective of 30mm between the zone line compound substance of structure and rubber.
Step 1: will launch with the ultrasonic transducer that receives two variable angles and place on the composite panel, the transducer centre frequency is 0.5MHz; Selecting the supersonic guide-wave in the composite panel is the S0 pattern, consults the composite panel dispersion curve, obtains that supersonic guide-wave speed is about 4800m/s under this pattern; Ultrasound wave velocity of longitudinal wave in transducer is about 2700m/s; Calculate according to the incident angle formula and can get the required incident angle of transducer and be about 34 °;
Step 2: keeping the distance between two transducers is that 60mm is constant, and translation scanning on composite panel;
Embodiment 2:
Above-mentioned sample is compared detection:
Adopt the pulse echo detection method that this sample is detected, the interface echo amplitude in bonding good district is 0.79, and the interface echo amplitude in unsticking district is 1.1, and unsticking district object feature value (being the echo amplitude) is changed to 39.2% with respect to bonding good district.And employing the method for the invention, unsticking district supersonic guide-wave energy factors is changed to 49.3% with respect to bonding good district.It is thus clear that it is more sensitive to adopt the method for the invention to change than pulse echo method object feature value, more be prone to find the unsticking defective.
Claims (3)
1. the bonded structure unsticking defective ultrasonic guided wave detecting method based on energy factors is characterized in that: judge according to the energy factors of the supersonic guide-wave that receives is big or small whether the zone between transmitting transducer and the receiving transducer line exists the unsticking defective; Described energy factors defines as follows:
Wherein, the time dependent ultrasonic guided wave signals of U (t) for receiving, T are that time integral is interval, and it has contained the duration of ultrasonic guided wave signals; The required incident angle of described transmitting transducer is calculated by following formula:
Wherein, α is an incident angle, C
PBe the phase velocity of supersonic guide-wave in the top dielectric, C
LBe ultrasonic compressional wave velocity in the transducer.
2. the bonded structure unsticking defective ultrasonic guided wave detecting method based on energy factors according to claim 1 is characterized in that: specifically comprise:
Step 1: use two ultrasonic transducers, one is used to launch supersonic guide-wave, and another is used to receive supersonic guide-wave, and two transducers place by on the surface, the same side of bonded structure;
Step 2: keep the distance between transmitting transducer and the receiving transducer constant, move two transducers simultaneously and cover whole surveyed area, to realize unsticking detection to whole bonded structure;
Step 3: transmitting transducer motivates the supersonic guide-wave of suitable pattern in the top dielectric of bonded structure with certain incident angle emission pulse ultrasonic;
Step 4: according to the definition of supersonic guide-wave energy factors, under the situation of distance and detecting instrument parameter constant between the transducer; Judge through the size of energy factors whether zone between transmitting transducer and the receiving transducer line exists the relative size of unsticking defective and unsticking defective;
Step 5: bonding when good when top dielectric and layer dielectric, the supersonic guide-wave energy that receives is minimum; When having the unsticking defective between top dielectric and the layer dielectric, it is big that the supersonic guide-wave energy that receives is wanted relatively, and the unsticking area is big more, and energy is big more.
3. according to the arbitrary described ultrasonic ultrasonic guided wave detecting method of bonded structure unsticking defective of claim 1～2, it is characterized in that: be chosen in supersonic guide-wave that bonding interface place particle has big vibration amplitude as detected value based on energy factors.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104198583A (en) * | 2014-09-09 | 2014-12-10 | 上海交通大学 | Ultrasonic echo measurement method and ultrasonic echo measurement device for debonding defect detection of common-base sandwich member |
| CN105486747A (en) * | 2015-11-19 | 2016-04-13 | 北京工业大学 | SH guided wave detection method for interfacial state of bonded structure |
| CN105717198A (en) * | 2016-05-12 | 2016-06-29 | 南京航空航天大学 | Single frequency and re-estimation MUSIC (multiple signal classification) method for structure-oriented impact locating |
| CN107085040A (en) * | 2017-04-21 | 2017-08-22 | 华南理工大学 | A kind of composite insulator unsticking detection method based on torsion mode supersonic guide-wave |
| CN108872380A (en) * | 2018-06-04 | 2018-11-23 | 航天特种材料及工艺技术研究所 | The bonding defect detecting method of multi-layer bonded component |
| CN110702794A (en) * | 2019-11-12 | 2020-01-17 | 南通赛洋电子有限公司 | Method for rapidly identifying substance based on ultrasonic waves |
| CN113466343A (en) * | 2021-07-20 | 2021-10-01 | 中国人民解放军火箭军工程大学 | Nondestructive testing method for adhesion structure clinging type debonding defect |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104198583A (en) * | 2014-09-09 | 2014-12-10 | 上海交通大学 | Ultrasonic echo measurement method and ultrasonic echo measurement device for debonding defect detection of common-base sandwich member |
| CN104198583B (en) * | 2014-09-09 | 2016-11-23 | 上海交通大学 | The ultrasonic echo measuring method of end sandwich component debonding defect detection altogether |
| CN105486747A (en) * | 2015-11-19 | 2016-04-13 | 北京工业大学 | SH guided wave detection method for interfacial state of bonded structure |
| CN105486747B (en) * | 2015-11-19 | 2018-06-29 | 北京工业大学 | The SH wave detecting methods of bonded structure interface configuration |
| CN105717198A (en) * | 2016-05-12 | 2016-06-29 | 南京航空航天大学 | Single frequency and re-estimation MUSIC (multiple signal classification) method for structure-oriented impact locating |
| CN107085040A (en) * | 2017-04-21 | 2017-08-22 | 华南理工大学 | A kind of composite insulator unsticking detection method based on torsion mode supersonic guide-wave |
| CN108872380A (en) * | 2018-06-04 | 2018-11-23 | 航天特种材料及工艺技术研究所 | The bonding defect detecting method of multi-layer bonded component |
| CN110702794A (en) * | 2019-11-12 | 2020-01-17 | 南通赛洋电子有限公司 | Method for rapidly identifying substance based on ultrasonic waves |
| CN113466343A (en) * | 2021-07-20 | 2021-10-01 | 中国人民解放军火箭军工程大学 | Nondestructive testing method for adhesion structure clinging type debonding defect |
| CN113466343B (en) * | 2021-07-20 | 2024-03-19 | 中国人民解放军火箭军工程大学 | Nondestructive testing method for adhesion type debonding defect of adhesion structure |
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Application publication date: 20120118 |