CN113466343B - Nondestructive testing method for adhesion type debonding defect of adhesion structure - Google Patents
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- 230000008878 coupling Effects 0.000 claims description 13
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- 239000011521 glass Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
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- 239000000523 sample Substances 0.000 description 4
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- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920005372 Plexiglas® Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- 230000014509 gene expression Effects 0.000 description 1
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- 230000035945 sensitivity Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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- G01N2291/044—Internal reflections (echoes), e.g. on walls or defects
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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Abstract
The invention relates to a nondestructive testing method for adhesion type debonding defects of an adhesion structure, which comprises a container, the adhesion structure and an ultrasonic transducer; the bonding structure and the ultrasonic transducer are arranged in the container; placing the transmitting-end ultrasonic transducer and the receiving-end ultrasonic transducer on the same side of the bonding structure; the ultrasonic transducer at the transmitting end takes a first critical angle as an incident angle, transmits incident ultrasonic longitudinal waves into the bonding structure, and excites transverse waves in an upper medium; the transverse wave in the upper medium reaches the bonding interface to generate reflection, and the receiving end ultrasonic transducer receives an interface reflected wave signal from the bonding interface at the same reflection angle as the incidence angle; fixing an emitting end ultrasonic transducer and a receiving end ultrasonic transducer on an ultrasonic C scanning platform, and performing ultrasonic oblique incidence C scanning detection; if the detected image has a close-fitting debonding defect, the characteristic value of the interface reflected wave signal of the defect area is larger than a reference value. The method can easily detect and distinguish a good bonding interface and a close-fitting debonding interface.
Description
Technical Field
The invention relates to the field of nondestructive testing, in particular to a nondestructive testing method for a close-fitting type debonding defect of a bonding structure.
Background
The bonding structure is a common structural form, has the advantages of light weight, high strength, low cost and the like, and is widely applied to the production and the living of people. The quality of the bonding directly affects the service performance and reliability of the bonding structure, while debonding is the most harmful type of defect in the bonding structure, which can significantly reduce the structural strength, cause structural failure, and even cause catastrophic results. Therefore, the detection of debonding defects during the production and use of bonded structures is of great interest.
The interfacial debonding defect can be generally divided into two forms, one form is that the viscosity of two adhered objects is lost, and the adhered interfaces are completely separated, namely, certain gaps exist on the adhered surfaces, and the adhesive surfaces are in an open state, so-called "debonding" refers to the defect; another form is that the two bonded interfaces lose adhesion, but the bonding surfaces between the two surfaces still closely adhere without gaps, and the bonded interfaces are closely adhered together to be called as adhesion type debonding.
The most common methods of inspection of bonded structures are conventional ultrasonic inspection, including ultrasonic penetration and pulse echo. The penetrating method is to use two ultrasonic transducers (probes) respectively arranged at two sides of the detected member, wherein one probe transmits ultrasonic waves, the penetrating member is received by the other probe, and whether the debonding defect exists is judged according to the amplitude change of the received ultrasonic waves. The pulse echo method uses only one transducer, which is used for both transmitting and receiving, the transducer transmits ultrasonic waves into the member from one side of the detected member, the ultrasonic waves are transmitted in the member to generate interface reflection when encountering the debonding defect, and whether the debonding exists is judged according to the amplitude of the received reflected waves.
The ultrasonic penetration method and the pulse echo method aim at debonding of an interface in an open state in the detection process, and have poor detection effect on 'close-fitting debonding'. Namely: the existing ultrasonic penetration method and pulse echo method can detect common debonding defects, but can not effectively detect close-fitting debonding defects.
Patent document 2015102026706 discloses a method for detecting interface morphology of a multi-layer bonding structure, which characterizes mechanical properties of a bonding interface by normal and tangential stiffness coefficients based on a wave propagation control equation, derives reflection and transmission coefficient expressions of longitudinal waves in the multi-layer bonding structure and transverse waves in an upper medium when ultrasonic longitudinal waves are incident, and selects a proper mode or optimal incidence angle and frequency according to the reflection and transmission coefficients to detect different interface morphologies of the bonding interface. By using the method for detection, physical parameters such as the thickness, density, elastic constant and the like of the adhesive layer of the adhesive interface are required to be known in advance, but in practice, the thickness of the adhesive layer is often very thin and is difficult to measure, and the mechanical properties of the adhesive layer are also very different due to different adhesive formulas, so that the mechanical parameters of an adhesive layer medium are very difficult to accurately obtain. Furthermore, the above method requires complex mathematical calculations, which are also difficult for the skilled engineer.
Disclosure of Invention
Aiming at the problems, the invention provides a nondestructive detection method for the adhesion structure adhesion type debonding defect, which is simple in time operation and can be realized only by knowing the longitudinal wave of a coupling medium and the transverse wave sound velocity in an upper medium.
The technical scheme of the invention is as follows:
a nondestructive testing method for adhesion type debonding defect of adhesion structure comprises a container filled with liquid coupling medium, an adhesion structure and an ultrasonic transducer, wherein the liquid coupling medium is water; the bonding structure and the ultrasonic transducer are arranged in the container; the bonding structure comprises a bonding interface, and an upper medium and a lower medium which are positioned at two sides of the bonding interface; the ultrasonic transducer comprises a transmitting end ultrasonic transducer and a receiving end ultrasonic transducer;
placing the transmitting-end ultrasonic transducer and the receiving-end ultrasonic transducer on the same side of the bonding structure;
the ultrasonic transducer at the transmitting end takes a first critical angle as an incident angle, transmits incident ultrasonic longitudinal waves into the bonding structure, and excites transverse waves in an upper medium;
the transverse wave in the upper medium reaches the bonding interface to generate reflection, and the receiving end ultrasonic transducer receives an interface reflected wave signal from the bonding interface at the same reflection angle as the incidence angle;
fixing an emitting end ultrasonic transducer and a receiving end ultrasonic transducer on an ultrasonic C scanning platform, adjusting the horizontal distance between the emitting end ultrasonic transducer and the receiving end ultrasonic transducer until the intersection point of sound velocity axes of the emitting end ultrasonic transducer and the receiving end ultrasonic transducer is positioned on an adhesive interface, and further performing ultrasonic oblique incidence C scanning detection;
and (3) taking the maximum amplitude of the interface reflected wave signal as a characteristic parameter, manufacturing a detection image of ultrasonic oblique incidence C scanning, taking the average value of the characteristic values of the interface reflected wave signal in a good bonding area as a reference value, and if a certain area bonding interface in the detection image has a close-fitting debonding defect, making the value of the detection image larger than the reference value.
The method for calculating the incidence angle comprises the following steps:
wherein: alpha is the incident angle, degree;
C 0 the velocity of ultrasonic longitudinal wave in coupling medium water is m/s;
C 1 is the ultrasonic longitudinal wave speed in the upper medium, m/s.
The method for calculating the horizontal distance between the transmitting-end ultrasonic transducer and the receiving-end ultrasonic transducer comprises the following steps:
L＝htanα+dtanβ (2)
wherein: h is the vertical distance from the midpoint of the surface of the ultrasonic transducer to the surface of the upper medium, and mm;
d is the thickness of the upper medium, mm;
beta is the angle of refraction of transverse wave in the upper medium, °;
wherein β is determined by the formula:
wherein: c (C) 2 Is the shear wave velocity in the upper medium, m/s.
The interface reflected wave signal is received by the ultrasonic transducer at the receiving end, and is arranged at a certain detection point, and the received interface reflected wave signal is:
v＝f(t) (4)
wherein: v is the amplitude of the received interface reflected wave signal, V;
t is ultrasonic propagation time, s;
taking the maximum value of V as the characteristic value of the interface reflected wave signal of the detection point, and marking the characteristic value as V, namely:
V＝max(v) (5)
fixing an ultrasonic transducer at a transmitting end and an ultrasonic transducer at a receiving end on an ultrasonic C scanning platform, and obliquely scanning the bonding structure by ultrasonic C; for each detection point (x, y), there is a value of V corresponding to it, i.e. V is a function of the detection point (x, y), noted as:
V＝V(x,y) (6)
using the V value as a characteristic value, manufacturing a detection image of ultrasonic oblique incidence C scanning, wherein coordinates of pixels in the detection image correspond to coordinates of detection points, and colors of the pixels are represented by the V value; and taking the average value of the V values of the good bonding areas as a reference, and if a certain area bonding interface in the detection image has a close-fitting type debonding defect, the V value of the area detection image is larger than the reference value.
The invention has the technical effects that:
(1) The adhesion type debonding defect in the adhesion structure can be detected. Compared with the conventional ultrasonic penetration method and pulse echo method, the method can not distinguish the good bonding interface and the close-fitting type debonding interface, and the method can easily detect and distinguish the good bonding interface and the close-fitting type debonding interface;
(2) The method utilizes the ultrasonic C scanning technology, and the detection result is displayed by an image, so that whether the interface is debonded or not and the size and the position of the defect can be visually seen;
(3) In the method, ultrasonic longitudinal waves emitted by the emission probe are incident to an upper medium at a first critical angle, and are completely converted into transverse waves in the upper medium, and the wavelength of the transverse waves in the upper medium is shorter than that of the longitudinal waves, so that the ultrasonic longitudinal waves have higher detection sensitivity compared with the longitudinal wave detection;
(4) The method takes the amplitude of the interface echo signal as the characteristic value of the defect signal, and is simpler in signal acquisition and processing.
Drawings
FIG. 1 is a schematic diagram of the detection method of the present invention.
Fig. 2 is a schematic view (top view) of the ultrasonic transducer translation during detection by the detection method of the present invention.
Fig. 3 shows the interface reflected ultrasonic signal received at the well-bonded area.
FIG. 4 is an interface reflected ultrasonic signal received at the debonded area.
Fig. 5 is an ultrasonic C-scan test result.
Reference numerals: 1. the ultrasonic transducer comprises a transmitting end ultrasonic transducer, a receiving end ultrasonic transducer, an upper medium, a lower medium, a bonding interface, an incident ultrasonic longitudinal wave, a transverse wave, a liquid coupling medium, a water tank, an interface reflection wave signal, a bonding well area and a bonding well area, wherein the bonding well area is the bonding well area, and the bonding well area is the bonding well area.
Detailed Description
Example 1
A bonding structure cling type debonding defect nondestructive testing method comprises a container filled with a liquid coupling medium 8, a bonding structure and an ultrasonic transducer, wherein the liquid coupling medium 8 is water; the bonding structure and the ultrasonic transducer are arranged in the container; the bonding structure comprises a bonding interface 5, an upper medium 3 and a lower medium 4 which are positioned on two sides of the bonding interface 5; the ultrasonic transducer comprises a transmitting end ultrasonic transducer 1 and a receiving end ultrasonic transducer 2;
the transmitting end ultrasonic transducer 1 and the receiving end ultrasonic transducer 2 are arranged on the same side of the bonding structure;
the transmitting-end ultrasonic transducer 1 transmits an incident ultrasonic longitudinal wave 6 into the bonding structure by taking a first critical angle as an incident angle, and excites transverse waves in an upper medium 3;
the transverse wave 7 in the upper medium reaches the bonding interface 5 to generate reflection, and the receiving end ultrasonic transducer 2 receives an interface reflection wave signal 10 from the bonding interface 5 at the same reflection angle as the incidence angle;
fixing the transmitting-end ultrasonic transducer 1 and the receiving-end ultrasonic transducer 2 on an ultrasonic C-scanning platform, and adjusting the horizontal distance between the transmitting-end ultrasonic transducer 1 and the receiving-end ultrasonic transducer 2 until the intersection point of sound velocity axes of the transmitting-end ultrasonic transducer 1 and the receiving-end ultrasonic transducer 2 is positioned on a bonding interface 5, so that ultrasonic oblique incidence C-scanning detection is performed;
and (3) taking the maximum amplitude of the interface reflected wave signal 10 as a characteristic parameter, preparing a detection image of ultrasonic oblique incidence C scanning, taking the average value of characteristic values of the interface reflected wave signal 11 in a good adhesion area as a reference value, and if the detection image has a close adhesion type debonding defect, making the characteristic value of the interface reflected wave signal 12 in the close adhesion type debonding area larger than the reference value.
Example 2
On the basis of the embodiment 1, the method further comprises the following steps: the method for calculating the incidence angle comprises the following steps:
wherein: alpha is the incident angle, degree;
C 0 the velocity of ultrasonic longitudinal wave in coupling medium water is m/s;
C 1 is the ultrasonic longitudinal wave velocity in the upper medium 3, m/s.
Example 3
On the basis of embodiment 2, further comprising: the method for calculating the horizontal distance between the transmitting-end ultrasonic transducer 1 and the receiving-end ultrasonic transducer 2 comprises the following steps:
L＝htanα+dtanβ (2)
wherein: h is the vertical distance from the midpoint of the surface of the ultrasonic transducer to the surface of the upper medium 3, and mm;
d is the thickness of the upper medium 3, mm;
beta is the refraction angle of transverse wave 7 in the upper medium;
wherein β is determined by the formula:
wherein: c (C) 2 Is the transverse wave 7 velocity in the upper medium, m/s.
Example 4
On the basis of embodiment 3, further comprising: the interface reflected wave signal 10 is received by the receiving end ultrasonic transducer 2, and is set at a certain detection point, and the received interface reflected wave signal 10 is:
v＝f(t) (4)
wherein: v is the amplitude of the received interface reflected wave signal 10, V;
t is ultrasonic propagation time, s;
taking the maximum value of V as the characteristic value of the interface reflected wave signal 10 of the detection point, and marking the characteristic value as V, namely:
V＝max(v) (5)
fixing the transmitting-end ultrasonic transducer 1 and the receiving-end ultrasonic transducer 2 on an ultrasonic C scanning platform, and obliquely scanning the bonding structure by ultrasonic C; for each detection point (x, y), there is a value of V corresponding to it, i.e. V is a function of the detection point (x, y), noted as:
V＝V(x,y) (6)
using the V value as a characteristic value, manufacturing a detection image of ultrasonic oblique incidence C scanning, wherein coordinates of pixels in the detection image correspond to coordinates of detection points, and colors of the pixels are represented by the V value; when a region of the detected image has a close-contact type debonding defect at the bonding interface 5, the V value of the region detected image is larger than the reference value, based on the average value of the V values of the good bonding regions 13.
Specific application example
The bonding structure in this example is a two-layer organic glass plate bonding structure, the size of the upper organic glass plate (number A) is 300mm multiplied by 150mm, and the thickness is 5mm; the number of the lower organic glass plate is two (the numbers are B1 and B2 respectively), the size is 100mm multiplied by 100mm, and the thickness is 5mm.
Wherein; b1 and A are firmly bonded by 502 glue, so as to simulate the bonding good area 13.
A water film is firstly coated between the B2 and the A, so that air is discharged as much as possible and the two are in close contact, and then the two are fastened by 4 screws, so that the close-fitting type debonding area 14 is simulated. The frequency of the ultrasonic transducer used for detection is 1MHz.
According to the method shown in fig. 1, an adhesive structure is placed in a water tank 9, a transmitting-end ultrasonic transducer 1 and a receiving-end ultrasonic transducer 2 are connected with an ultrasonic C scanning platform by a clamp, a liquid coupling medium 8 is filled between the transmitting-end ultrasonic transducer 1 and the receiving-end ultrasonic transducer 2 and the adhesive structure, and the liquid coupling medium 8 adopted in the application example is water;
it is known that the longitudinal wave velocity of ultrasonic waves in water is about 1490m/s, the longitudinal wave velocity in plexiglass is about 2670m/s, and the transverse wave velocity is about 1120m/s at room temperature of 25 ℃. Substituting the above parameters into equation (1), the input/output angle α can be calculated as:
therefore, the angles of the transmitting-end ultrasonic transducer 1 and the receiving-end ultrasonic transducer 2 are both adjusted to 34.1 °.
The transverse wave refraction angle β in the organic glass is calculated according to formula (3) as:
the distance from the center of the ultrasonic transducer 1 at the transmitting end to the upper surface of the upper medium 3 is 75mm, the thickness d=5mm of the upper organic glass, and the beta value is substituted into (2), so that the method can be obtained:
L＝htanα+dtanβ＝75*tan(34.1°)+5*tan(48.4°)＝56.4(mm)
thus, the center distance L between the transmitting-end ultrasonic transducer 1 and the receiving-end ultrasonic transducer was adjusted to be 56.4mm.
The distance between the transmitting end ultrasonic transducer 1 and the receiving end ultrasonic transducer 2 is kept unchanged, and meanwhile, the transmitting end ultrasonic transducer 1 and the receiving end ultrasonic transducer 2 are moved to enable the intersection point of the sound beam axes to be located in a good bonding area 13 between B1 and A, and at the moment, the received reflected wave signal 11 at the interface of the good bonding area is shown in fig. 3, so that it can be seen that: the maximum amplitude of the reflected wave signal 11 at the interface of the well-adhered region is about 0.006.
Meanwhile, the transmitting-end ultrasonic transducer 1 and the receiving-end ultrasonic transducer 2 are moved to enable the intersection point of the acoustic beam axes to be located in a close-fitting type debonding area 14 between B2 and A, and at the moment, a received reflected wave signal 12 at the interface of the close-fitting type debonding area is shown as figure 4, and can be seen: the maximum amplitude of the reflected wave signal 12 at the interface of the close-fitting debonding region is about 0.11, which is significantly higher than that of the well-adhered region 13.
And carrying out ultrasonic oblique incidence C scanning detection by taking the maximum amplitude of the interface reflected wave signal 10 as a characteristic value. The resulting detected image is shown in fig. 5. As can be seen from fig. 5, the average value of the characteristic values in this region of the good adhesion region 13 is about 0.038, which is taken as a reference value. The characteristic value in this area of the close-fitting type release region 14 is between 0.19 and 0.2, which is significantly larger than the reference value. From the detection result, the good adhesion region 13 and the close adhesion type debonding region 14 can be clearly distinguished, and the effectiveness of the method for detecting the close adhesion type debonding defect is demonstrated.
Claims (3)
1. A nondestructive testing method for adhesion type debonding defect of adhesion structure comprises a container filled with liquid coupling medium, an adhesion structure and an ultrasonic transducer, wherein the liquid coupling medium is water; the bonding structure and the ultrasonic transducer are arranged in the container; the bonding structure comprises a bonding interface, and an upper medium and a lower medium which are positioned at two sides of the bonding interface; the ultrasonic transducer comprises a transmitting end ultrasonic transducer and a receiving end ultrasonic transducer; the method is characterized in that:
placing the transmitting-end ultrasonic transducer and the receiving-end ultrasonic transducer on the same side of the bonding structure;
the ultrasonic transducer at the transmitting end takes a first critical angle as an incident angle, transmits incident ultrasonic longitudinal waves into the bonding structure, and excites transverse waves in an upper medium;
the method for calculating the incident angle comprises the following steps:
α=arcsin(C 0 /C 1 ) （1）
wherein:αangle of incidence, °;
C 0 the velocity of ultrasonic longitudinal wave in coupling medium water is m/s;
C 1 the ultrasonic longitudinal wave speed in the upper medium is m/s;
the transverse wave in the upper medium reaches the bonding interface to generate reflection, and the receiving end ultrasonic transducer receives an interface reflected wave signal from the bonding interface at the same reflection angle as the incidence angle;
fixing an emitting end ultrasonic transducer and a receiving end ultrasonic transducer on an ultrasonic C scanning platform, adjusting the horizontal distance between the emitting end ultrasonic transducer and the receiving end ultrasonic transducer until the intersection point of sound velocity axes of the emitting end ultrasonic transducer and the receiving end ultrasonic transducer is positioned on an adhesive interface, and further performing ultrasonic oblique incidence C scanning detection;
and (3) taking the maximum amplitude of the interface reflected wave signal as a characteristic parameter, manufacturing an ultrasonic oblique incidence C-scan detection image, taking the average value of the characteristic values of the interface reflected wave signals of the good bonding areas as a reference value, and if the detection image has a close-fitting type debonding defect, making the characteristic value of the interface reflected wave signal of the defective area larger than the reference value.
2. The method for nondestructive testing of adhesion-type debonding defects of an adhesion structure according to claim 1, wherein: the method for calculating the horizontal distance between the transmitting-end ultrasonic transducer and the receiving-end ultrasonic transducer comprises the following steps:
L=htanα+dtanβ （2）
wherein:his the vertical distance from the midpoint of the ultrasonic transducer surface to the upper medium surface，mm；
dIs the thickness of the upper medium, mm;
βis the angle of refraction of transverse wave in the upper medium;
wherein,βdetermined by the following formula:
β=arcsin(C 2 /C 0 ) （3）
wherein:C 2 is the shear wave velocity in the upper medium, m/s.
3. The method for nondestructive testing of adhesion-type debonding defects of an adhesion structure according to claim 2, wherein: the interface reflected wave signal is received by the ultrasonic transducer at the receiving end, is arranged at a certain detection point, and is received as follows:
v=f(t) （4）
wherein:vv is the amplitude of the received interface reflected wave signal;
tis the acoustic propagation time, s;
taking outvThe maximum value of (2) is taken as the characteristic value of the interface reflected wave signal of the detection point and is recorded asVThe method comprises the following steps:
V=max(v) （5）
fixing an ultrasonic transducer at a transmitting end and an ultrasonic transducer at a receiving end on an ultrasonic C scanning platform, and obliquely scanning the bonding structure by ultrasonic C; for each detection pointx,y) All have oneVThe value corresponds to it, i.eVIs a detection point [ ]x,y) Is noted as a function of:
V=V(x,y) （6）
to be used forVThe value is a characteristic value, a detection image of ultrasonic oblique incidence C scanning is produced, the coordinates of pixels in the detection image correspond to the coordinates of detection points, and the colors of the pixels are usedVA value representation; to bond good areasVTaking the average value of the values as a reference, if in the detected imageIf there is a close-fitting debonding defect at the bonding interface of a certain area, the area detects an imageVThe value is greater than the reference value.
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