CN113176340A - Ultrasonic guided wave detection method for coating bonding strength - Google Patents
Ultrasonic guided wave detection method for coating bonding strength Download PDFInfo
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Abstract
The invention discloses an ultrasonic guided wave detection method of coating bonding strength, which comprises the steps of manufacturing a ten-level square bonding sample for ultrasonic guided wave detection, setting up a special ultrasonic guided wave coating bonding strength detection system, calculating an ultrasonic guided wave method bonding strength coefficient of the ten-level square bonding sample, performing a coating strength tensile test on the ten-level square bonding sample for ultrasonic guided wave detection, calculating equivalent bonding strength, performing ultrasonic guided wave detection on an actual detected piece, and calculating a coating bonding strength value. The invention overcomes the inherent defects of large near-field blind area, more joint surface clutter signals, low detection resolution, large influence on the substrate sound permeability and the like of the conventional ultrasonic longitudinal wave detection method, can carry out numerical quantification on the detection result of the tensile test of the strength of the combined coating, and further realizes the graded evaluation on the bonding strength of the coating of the workpiece and the substrate. The detection process is low in cost, does not need auxiliary equipment or destructive evaluation of related materials, and has a very positive effect on evaluating the combination quality monitoring of the coating of the detected piece.
Description
Technical Field
The invention relates to the technical field of nondestructive testing of coating bonding strength, in particular to an ultrasonic guided wave detection method of coating bonding strength.
Background
The coating technology is an important technology in the modern material surface strengthening treatment technology, and is widely applied to the aspects of manufacturing and repairing engines of aerospace, weapons, power equipment, transportation equipment and the like.
Good bonding (high bond strength) between the coating and the substrate material is the most important prerequisite for the coating to function. The interfacial bond strength between the coating and the substrate is usually measured by mechanical methods such as indentation, expansion, twisting, stretching, bending, etc., but the material itself is damaged to some extent. Nondestructive testing methods which can not damage sampling and the bonding strength of the coating of in-service equipment include penetration testing, ultrasonic longitudinal wave testing and the like. The penetrant inspection method can only inspect the bonding condition of the side of the bonding surface, but cannot inspect the bonding condition of the invisible part inside the bonding surface.
The standard of the ultrasonic nondestructive detection method of the coating bonding strength at present is GB/T38898-. The basic principle underlying this standard is: the ultrasonic longitudinal waves are adopted, and for the state that the coating is well bonded, after the ultrasonic waves completely penetrate through the bonding interface of the coating and enter the matrix, the reflection echo energy of the bottom waves of the matrix is large, the energy reflectivity of the bonding interface is low, and the transmissivity is high; for the state that the coating completely falls off or is not combined, ultrasonic energy is completely reflected by the coating debonding interface to form a coating bottom surface reflection echo, and the energy reflectivity and the transmissivity of the combined interface are high; for the state that the coating is not well bonded or weakly bonded, the coating and the substrate interface have reflection echoes and transmission echoes to a certain degree, the higher the ultrasonic energy transmittance is, the better the bonding state is, the higher the bonding strength is, and vice versa; therefore, the coating bonding state can be obtained by detecting the amplitude or energy of the coating echo, the substrate echo and the bonding interface echo. The coating structure and the ultrasonic pulse signal propagation process are shown in figure 1.
If the reflection coefficient is 0 or the minimum value and the transmission coefficient is 1 or the maximum value when the ultrasonic longitudinal wave is scanned, the coating and the bonding layer interface which is the corresponding point of the ultrasonic beam is completely bonded, the ultrasonic signal energy is completely transmitted, and the bonding strength of the corresponding point is 1 or the maximum value at the moment.
If the reflection coefficient is 1 or the maximum value and the transmission coefficient is 0 or the minimum value when the ultrasonic longitudinal wave is scanned, the coating and the bonding layer interface which is the corresponding point of the ultrasonic beam is completely debonded, the ultrasonic signal energy is totally reflected, and the bonding strength of the corresponding point is 0 or the minimum value at the moment.
The core technology of the method is that the ultrasonic longitudinal wave technology is utilized, the pulse reflection echo method or the transmission method is adopted, the bonding strength coefficient of the bonding layer by the ultrasonic reflection method or the bonding strength coefficient by the ultrasonic transmission method is measured, the relation between the bonding strength coefficient and the equivalent bonding strength value of the standard sample is established, and the bonding strength of the coating is calculated.
The method has the advantages that the coating bonding strength of the workpiece material can be detected quickly, and the workpiece material is not damaged or damaged. However, the conventional ultrasonic longitudinal wave method has the following difficulties:
firstly, because the coating and the bonding layer are very thin relative to the thickness of the substrate, the coating thickness is possibly in a near field region of the ultrasonic transducer, and the ultrasonic longitudinal wave propagates in the range, so that the sound pressure is extremely high and extremely low, and regular reflection on a reflector cannot be made on an ultrasonic detector. The conventional ultrasonic transducer has the problems of large initial wave occupation, large blind area, difficulty in identifying short-distance defects and the like in flaw detection, so that the requirement on the inspection of an extremely thin coating cannot be met by adopting the common ultrasonic transducer.
Secondly, in order to obtain higher detection resolution of the bonding strength state of the coating, a high-frequency ultrasonic focusing ultrasonic transducer needs to be selected as much as possible. However, the higher the frequency is, the greater the attenuation is, no matter the pulse reflection echo method or the transmission method is adopted, if the thickness of the matrix is thicker, the scattering energy of the ultrasonic wave in the matrix is too large, the proportion of the reflection energy and the transmission energy of the ultrasonic wave energy at the coating layer and the bonding layer can be greatly influenced, and the detection resolution can be further influenced, so that the frequency selection cannot be too high; the focusing probe also has the problem that the sensitivity of the interface echo at the coating layer and the bonding layer and the substrate interface echo can not be considered.
Thirdly, if the acoustic impedance difference between the coating, the bonding layer and the matrix is large, interface echo can occur on the bonding surfaces of different materials no matter whether the bonding is good or bad, thereby bringing difficulty to the judgment of the bonding strength.
Fourthly, in order to express the coating bonding strength from energy, the existing ultrasonic detection method needs to know the conditions such as the sound velocity and the sound path of the coupling medium, the sound velocity and the thickness of the coating, the sound velocity and the thickness of the bonding layer, the sound velocity and the thickness of the matrix and the like (prepare a standard sample), and sums the reflected or transmitted ultrasonic energy of the bonding layer in a window with a specified time length on the basis of accurately obtaining the ultrasonic full time domain waveform. The known conditions are more, and the data selection is more difficult.
Fifth, particularly, if the substrate is made of a material such as coarse crystals having poor acoustic transparency and a large attenuation coefficient, since most of the propagation energy is dissipated inside the substrate, the ultrasonic longitudinal wave detection method based on the pulse reflection echo method or the transmission method may not be implemented.
Even though the existing techniques such as a bimorph focusing probe and a time-delay wedge are used to overcome the defects, the method adopts the principle based on the ultrasonic longitudinal wave method, and each reflected echo of the ultrasonic longitudinal wave at the interface of the coating, the bonding layer and the substrate and the interface of the coating and the time-delay wedge enters the detection system, which may cause the effective echo signal to be annihilated in useless clutter signals, thus greatly interfering the judgment of the detection result.
Therefore, a novel detection method is needed to be invented, and the inherent defects of large near-field blind area, more joint surface clutter signals, low detection resolution, large influence of substrate sound permeability and the like of the conventional ultrasonic longitudinal wave detection method can be overcome by the method for detecting the coating bonding strength through ultrasonic guided waves, so that the accuracy of the detection result is improved.
Disclosure of Invention
Aiming at the defects of the existing detection method, the invention provides the ultrasonic guided wave detection method of the coating bonding strength, the method is simple and convenient to operate, the detection of the coating bonding strength is realized by the ultrasonic guided wave technology, and the inherent defects of large near-field blind area, more joint surface clutter signals, low detection resolution, large substrate additional influence and the like of the existing ultrasonic longitudinal wave detection method can be overcome, so that the accuracy of the detection result is improved.
The invention adopts the following technical scheme:
an ultrasonic guided wave detection method for coating bonding strength is characterized by comprising the following steps:
step 1: manufacturing a ten-level square bonding sample for ultrasonic guided wave detection;
the ten-level square bonding sample comprises a 0-9-level square bonding sample, wherein the 0-level square bonding sample shows that any matrix is not bonded on the lower surface of the complete coating, the 1-8-level square bonding sample shows that the area of the matrix bonded on the lower surface of the complete coating is increased continuously, and the 9-level square bonding sample shows that the matrix is bonded on the lower surface of the complete coating completely;
step 2: setting up a special ultrasonic guided wave coating bonding strength detection system;
the ultrasonic guided wave coating bonding strength detection system comprises a multi-channel ultrasonic guided wave detector and a special probe for coating ultrasonic guided wave detection, wherein the special probe for coating ultrasonic guided wave detection is electrically connected with the multi-channel ultrasonic guided wave detector;
and step 3: calculating the ultrasonic guided wave method bonding strength coefficient of the ten-level square bonding sample;
testing the wave amplitude value of the guided wave of the ten-level square bonding sample by using an ultrasonic guided wave coating bonding strength detection system, and calculating the ultrasonic guided wave method bonding strength coefficient of the ten-level square bonding sample according to the wave amplitude value of the guided wave;
and 4, step 4: performing a coating strength tensile test on a ten-level square bonding sample for ultrasonic guided wave detection, and calculating equivalent bonding strength;
and 5: and carrying out ultrasonic guided wave detection on the actual detected piece, and calculating the bonding strength value of the coating.
Preferably, the coating of the 0-9 level square bonding sample is divided into 9 small blocks with 3 rows and 3 columns, wherein the 9 small blocks of the 0 level square bonding sample are not bonded with the matrix, the middle small block of the 2 nd row of the 1 level square bonding sample is bonded with the matrix, the left and right small blocks of the 2 nd row of the 2 level square bonding sample are bonded with the matrix, all the small blocks of the 2 nd row of the 3 level square bonding sample are bonded with the matrix, the middle small block of the 1 st row of the 4 level square bonding sample is bonded with the matrix, the left and right small blocks of the 2 nd row are bonded with the middle small block of the 3 rd row, the middle small block of the 1 st row of the 5 level square bonding sample, all the small blocks of the 2 nd row, and the middle small block of the 3 rd row are bonded with the matrix, the left and middle small blocks of the 1 st row of the 6 level square bonding sample are bonded with the middle small blocks of the matrix, the left and right small areas of the 2 nd row, the middle and right small areas of the 3 rd row are all bonded to the substrate, the left and middle small areas of the 1 st row of the 7-level square bonding sample, all the small areas of the 2 nd row, the middle and right small areas of the 3 rd row are all bonded to the substrate, all the small areas of the 1 st row of the 8-level square bonding sample, the left and right small areas of the 2 nd row, all the small areas of the 3 rd row are bonded to the substrate, and all the 9 small areas of the 9 th row of the 9-level square bonding sample are bonded to the substrate.
Preferably, the material of the substrate and the coating is the same as that of the substrate and the coating of the actual test piece.
Preferably, the special probe for detecting the coating ultrasonic guided wave comprises a probe main body, a planar wedge is arranged at the bottom of the probe main body, the probe main body and the planar wedge are divided into a left transmitting part and a right receiving part through a sound insulation layer, a transmitting piezoelectric wafer is obliquely arranged in the left transmitting part, a receiving piezoelectric wafer is obliquely arranged in the right receiving part, a transmitting signal interface and a receiving signal interface are arranged at the top of the probe main body, the transmitting piezoelectric wafer is electrically connected with the transmitting signal interface, the receiving piezoelectric wafer is electrically connected with the receiving signal interface, and the transmitting signal interface and the receiving signal interface are both electrically connected with the multi-channel ultrasonic guided wave detector.
Preferably, a damping block is arranged on each of the transmitting piezoelectric wafer and the receiving piezoelectric wafer.
Preferably, the probe body is made of a sound absorbing material.
Preferably, the transmitting signal interface and the receiving signal interface are both electrically connected with the multi-channel ultrasonic guided wave detector through cables.
Preferably, step 3 specifically comprises:
placing a special probe for detecting the ultrasonic guided wave of the coating on a 0-level square bonding sample, starting a multi-channel ultrasonic guided wave detector, sending ultrasonic waves by a transmitting piezoelectric wafer, transmitting the ultrasonic guided wave in an ultrasonic guided wave mode by multiple reflections in the 0-level square bonding sample, having no transmission loss of guided wave energy, having the least energy loss of ultrasonic guided wave propagation, having the largest amplitude of guided wave sound energy received by a receiving piezoelectric wafer, adjusting the multi-channel ultrasonic guided wave detector, adjusting the amplitude to the full screen height, recording the amplitude of the received guided wave, and recording the amplitude as H0；
The special probe for detecting the ultrasonic guided wave of the coating is placed on a 9-level square bonding sample, a multi-channel ultrasonic guided wave detector is started, ultrasonic waves are emitted by a transmitting piezoelectric wafer, multiple reflections in the 9-level square bonding sample propagate in an ultrasonic guided wave mode, the coating is completely bonded with a substrate, most guided wave energy is transmitted into the substrate through a bonding layer through multiple reflections in the propagation process, the propagation energy loss is maximum at the moment, the amplitude of sound energy wave received by the receiving piezoelectric wafer is minimum, the amplitude of the received guided wave is recorded and is recorded as H9；
Respectively placing the special probe for detecting the ultrasonic guided wave of the coating on the 1-8-level square bonding sample, and measuring the amplitude values of the received guided waves, which are respectively recorded as H1～H8；
The ultrasonic guided wave method bonding strength coefficient K of the 0-level square bonding sampled0Comprises the following steps:
Kd0＝H0/H9；
ultrasonic guided wave method bonding strength coefficient K of 9-level square bonding sampled9Is composed of
Kd9＝H9/H9；
Similarly, K can be obtainedd1～Kd8。
Preferably, step 4 specifically includes:
respectively placing the 0-9-grade square bonding samples on a tensile testing machine, respectively performing tensile test on the 0-9-grade square bonding samples by using the tensile testing machine, testing the tensile force required for breaking the bonding between the coating and the substrate, and calculating the equivalent bonding strength sigma corresponding to the 0-9-grade square bonding samplesth0～σth9。
Preferably, step 5 specifically includes:
placing a special probe for detecting the ultrasonic guided wave of the coating on an actual detected piece, starting a multi-channel ultrasonic guided wave detector, sending ultrasonic waves by a transmitting piezoelectric wafer, transmitting the ultrasonic waves in an ultrasonic guided wave mode in the actual detected piece after multiple reflections, then, reaching a receiving piezoelectric wafer, recording the amplitude value of the received guided wave, and recording the amplitude value as Hs；
The ultrasonic guided wave method bonding strength coefficient K of the actual detected piecedsComprises the following steps:
Kds＝Hs/H9；
according to the obtained KdsThe value of (a) is obtained as the grade of the corresponding square bonding sample, and the corresponding equivalent bonding strength σ is obtained from the grade of the corresponding square bonding sampleth；
The coating bonding strength σ of the actual test piece is:
σ＝σth×(1-Kds)。
the invention has the beneficial effects that:
the invention builds a special ultrasonic guided wave coating bonding strength detection system by means of the developed special probe and the grade square bonding sample for detecting the ultrasonic guided wave of the coating, establishes the corresponding relation between the amplitude of the ultrasonic guided wave propagation sound energy and the bonding strength of the coating and a substrate, performs a strength tensile test on the coating to determine the equivalent bonding strength, develops a calculation formula of the bonding strength coefficient of the ultrasonic guided wave method and a calculation formula of the bonding strength of the coating, and realizes the calculation of the bonding strength value of the coating of an actual detected piece by using the developed formulas.
The special probe for detecting the ultrasonic guided wave of the special coating, which is developed by the invention, adopts a transmitting and receiving piezoelectric wafer, and the ultrasonic guided wave transmitted by the transmitting wafer is reflected back and forth for multiple times on the parallel boundaries at the two sides of the coating and then enters the receiving wafer.
The ten-grade square bonding sample for ultrasonic guided wave detection developed by the invention can realize the classification of the coating bonding strength grade by adjusting the bonding state of the test block coating, and has the advantage of accurate evaluation.
The method for detecting the bonding strength of the coating by adopting the ultrasonic guided wave can overcome the inherent defects of large near-field blind area, more joint surface clutter signals, low detection resolution, large influence on the sound permeability of the substrate and the like of the conventional ultrasonic longitudinal wave detection method, can carry out numerical quantification on the detection result of the tensile test of the strength of the bonding coating, and further realizes the graded evaluation on the bonding strength of the coating and the substrate of the workpiece.
The method for detecting the bonding strength of the coating by adopting the ultrasonic guided wave has low cost in the detection process, does not need destructive evaluation of auxiliary equipment or related materials, and has very positive effect on evaluating the in-service and in-process bonding quality monitoring of the coating of the detected piece.
The calculation formula obtained by the method is visual, the numerical value is clear, and the method has the advantages of high detection efficiency and accurate calculation data.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.
Fig. 1 is a diagram of the coating structure and the propagation process of ultrasonic pulse signals.
Fig. 2 is a schematic diagram of a special probe for ultrasonic guided wave detection of a coating.
Fig. 3 is a schematic of a class 0 square bonded sample.
FIG. 4 is a schematic representation of a class 1 square bonded sample.
FIG. 5 is a schematic representation of a 2-stage square bonded sample.
FIG. 6 is a schematic representation of a class 3 square bonded sample.
FIG. 7 is a schematic representation of a class 4 square bonded sample.
Fig. 8 is a schematic of a class 5 square bonded sample.
Fig. 9 is a schematic of a 6-stage square bonded sample.
Fig. 10 is a schematic of a 7-stage square bonded sample.
Fig. 11 is a schematic of a class 8 square bonded sample.
Fig. 12 is a schematic of a class 9 square bonded sample.
Fig. 13 is a side view of a square bonded sample.
Figure 14 is a schematic diagram of an application of the ultrasonic guided wave coating bonding strength detection system.
1. Coating; 2. a substrate; 3. a bonding layer; 4. a probe body; 5. a planar wedge; 6. a sound insulating layer; 7. emitting the piezoelectric wafer; 8. receiving a piezoelectric wafer; 9. a transmit signal interface; 10. a receive signal interface; 11. a damping block; 12. a cable wire; 13. a multi-channel ultrasonic guided wave detector.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Ultrasonic guided waves are mechanical waves generated due to the existence of a medium boundary, and can be propagated in a medium with the boundary, such as a container, a pipeline, a flat plate, a rod and the like, wherein the propagation direction is parallel to the boundary surface of the medium. After the ultrasonic guided waves are injected into the plate-shaped workpiece, longitudinal waves and transverse waves in the workpiece are reflected back and forth for multiple times on the parallel boundaries at two sides and advance along the direction parallel to the plate surface, namely, the parallel boundaries guide ultrasonic waves to propagate in the plate, and the sound field of the guided waves is distributed over the whole wall thickness.
It is defined as a guided wave because its propagation is governed by the geometric boundary shape of the medium. In the flat panel, the guided wave exists in two waveforms of lamb wave and plane shear wave SH. The guided wave has frequency dispersion characteristics, and the material characteristics, the geometric shape and the size of the acoustic transmission medium have direct influence on the guided wave.
From the above, in the flat plate, the ultrasonic guided wave can only propagate in the medium with parallel boundary surfaces; when the ultrasonic guided wave travels in the direction parallel to the plate surface, multiple back-and-forth reflections are generated on the boundary with two parallel sides. The two characteristics of the ultrasonic guided wave can be utilized, the coating of an actual detected piece is regarded as a flat plate for the ultrasonic guided wave propagation, and the working surface/bonding surface of the flat plate is regarded as two parallel boundary surfaces; if the coating exists independently (namely the interface of the coating and the bonding layer is completely debonded), the ultrasonic guided wave can normally propagate energy in the parallel interface of the working surface/bonding surface of the coating; if the coating is completely bonded with the bonding layer and the substrate, one side (bonding surface) of a parallel interface for ultrasonic guided wave propagation is damaged, most energy of the ultrasonic guided wave is transmitted into the steel substrate through the bonding layer, and a small part of energy is continuously propagated in the parallel interface in the coating. And as the ultrasonic guided wave continues to advance along the direction parallel to the plate surface, the energy of the ultrasonic guided wave is attenuated until the ultrasonic guided wave cannot be detected through multiple transmission and reflection in the coating. This yields:
if the guided wave energy propagation coefficient is 1 or the maximum value and the loss coefficient is 0 or the minimum value when the ultrasonic guided wave is scanned, the condition that the coating and the bonding layer interface at the corresponding point of the ultrasonic beam is completely debonded and the ultrasonic guided wave receiving signal energy has the maximum value is assumed, and the corresponding coating point bonding strength is 0 or the minimum value at the moment.
If the guided wave energy propagation coefficient is 0 or the minimum value and the loss coefficient is 1 or the maximum value when the ultrasonic guided wave is scanned, the condition that the coating and the bonding layer interface which is the corresponding point of the ultrasonic beam is completely bonded is shown, the minimum value of the ultrasonic guided wave receiving signal energy appears, and the corresponding coating point bonding strength is 1 or the maximum value at the moment.
With reference to fig. 2 to 14, a method for detecting the bonding strength of a coating by ultrasonic guided wave comprises the following steps:
step 1: and manufacturing a ten-level square bonding sample for ultrasonic guided wave detection.
The ten-level square bonding samples comprise 0-9-level square bonding samples, the 0-level square bonding samples show that any matrix 2 is not bonded on the lower surface of the complete coating 1, the 1-8-level square bonding samples show that the area of the lower surface of the complete coating bonded with the matrix is increased continuously, and the 9-level square bonding samples show that the matrix is bonded on the lower surface of the complete coating completely.
For the purpose of being unified with the current standard, the ten-grade square bonding sample for ultrasonic guided wave detection can refer to the ten-grade square standard sample specified in GB/T38898-2020. But unlike the standard sample: the standard sample is a coating with different area adhered on the complete substrate, and the ten-grade square bonding sample for ultrasonic guided wave detection is a substrate with different area adhered on the complete coating material.
The material with the same type as the practical application is selected as the substrate of the sample, the bonding surface of the substrate is smooth and has no deformation, the non-bonding surface of the substrate has no requirement, and the thickness of the substrate of the sample is not required to be the same as that of the sample to be detected because the ultrasonic guided wave technology is selected instead of the transmitted or reflected ultrasonic longitudinal wave technology.
The materials of the substrate 2 and the coating 1 are the same as those of the substrate and the coating of the actual test piece. According to the combination mode of different grades of standard tensile samples specified in GB/T38898-. The thickness and the material of the bonding layer 3 of the actual application material are the same as those of the bonding layer of the manufactured standard tensile sample.
Specifically, the coating of each 0-9-level square bonding sample is divided into 9 small areas with 3 rows and 3 columns.
None of the 9-patch regions of the 0-level square bonded sample had a matrix bonded thereto, as shown in fig. 3.
The middle panel of row 2 of the level 1 square bonded sample was bonded to the substrate as shown in the black area in fig. 4.
The left and right panel areas of row 2 of the level 2 square bonded sample were bonded to the substrate as shown in the black area in fig. 5.
All the patch areas of row 2 of the level 3 square bonded test specimens were bonded to the substrate, as in the black area in fig. 6.
The middle panel of row 1, left and right panels of row 2, and middle panel of row 3 of the 4-level square bonded sample were bonded to the substrate, as shown in the black area in fig. 7.
The middle patch area of row 1, all patch areas of row 2, and the middle patch area of row 3 of the 5-level square bonding sample were bonded to the substrate, as shown in the black area in fig. 8.
The left and middle small areas of the 1 st row, the left and right small areas of the 2 nd row and the middle and right small areas of the 3 rd row of the 6-level square bonding sample are all bonded with the matrix, as shown by the black area in fig. 9.
The left and middle small areas of row 1, all small areas of row 2, and middle and right small areas of row 3 of the 7-grade square bonding sample are bonded to the substrate, as shown by the black areas in fig. 10.
All the small areas of row 1, left and right of row 2, and all the small areas of row 3 of the 8-level square bonding sample were bonded to the substrate, as shown by the black areas in fig. 11.
All 9 small areas of the class 9 square bonded samples were bonded to the substrate, as shown by the black areas in fig. 12.
Step 2: and (4) setting up a special ultrasonic guided wave coating bonding strength detection system.
The ultrasonic guided wave coating bonding strength detection system comprises a multi-channel ultrasonic guided wave detector 13 and a special probe for coating ultrasonic guided wave detection, wherein the special probe for coating ultrasonic guided wave detection is electrically connected with the multi-channel ultrasonic guided wave detector.
The special probe for detecting the coating ultrasonic guided wave comprises a probe main body 4, a planar wedge block 5 is arranged at the bottom of the probe main body, the probe main body and the planar wedge block are divided into a left transmitting part and a right receiving part through a sound insulation layer 6, a transmitting piezoelectric wafer 7 is obliquely arranged in the left transmitting part, a receiving piezoelectric wafer 8 is obliquely arranged in the right receiving part, a transmitting signal interface 9 and a receiving signal interface 10 are arranged at the top of the probe main body, the transmitting piezoelectric wafer is electrically connected with the transmitting signal interface, the receiving piezoelectric wafer is electrically connected with the receiving signal interface, and the transmitting signal interface and the receiving signal interface are electrically connected with a multi-channel ultrasonic guided wave detector.
Specifically, the transmitting piezoelectric wafer and the receiving piezoelectric wafer are both provided with damping blocks 11.
The probe body is made of sound absorbing material.
The transmitting signal interface and the receiving signal interface are electrically connected with the multi-channel ultrasonic guided wave detector through a cable 12.
And step 3: and calculating the ultrasonic guided wave method bonding strength coefficient of the ten-level square bonding sample.
And testing the wave amplitude value of the guided wave of the ten-level square bonding sample by using an ultrasonic guided wave coating bonding strength detection system, and calculating the ultrasonic guided wave method bonding strength coefficient of the ten-level square bonding sample according to the wave amplitude value of the guided wave.
The step 3 specifically comprises the following steps:
placing a special probe for detecting the ultrasonic guided wave of the coating on a 0-level square bonding sample, starting a multi-channel ultrasonic guided wave detector, sending ultrasonic waves by a transmitting piezoelectric wafer, transmitting the ultrasonic guided wave in an ultrasonic guided wave mode by multiple reflections in the 0-level square bonding sample, having no transmission loss of guided wave energy, having the least energy loss of ultrasonic guided wave propagation, having the largest amplitude of guided wave sound energy received by the receiving piezoelectric wafer, adjusting the multi-channel ultrasonic guided wave detector, adjusting the amplitude to the full screen height (100%), recording the amplitude of the received guided wave, and recording the amplitude as H0(unit dB);
the special probe for detecting the ultrasonic guided wave of the coating is placed on the 9-level square bonding sample, the multichannel ultrasonic guided wave detector is started, ultrasonic waves are emitted by the transmitting piezoelectric wafer, multiple reflections are transmitted in an ultrasonic guided wave mode in the 9-level square bonding sample, and the coating is completely bonded with the matrix,and in the process of propagation, after multiple reflections, most of guided wave energy is transmitted into the matrix through the bonding layer, the loss of the propagation energy is maximum, the amplitude of the sound energy wave received by the receiving piezoelectric wafer is minimum, and the amplitude of the received guided wave is recorded as H9. Amplitude value H of received guided wave9The height of the full screen is not larger than 10 percent, namely the amplitude energy value of the received guided wave is equal to that of the grass wave, and a detection system consisting of the special guided wave probe and the instrument meets the requirement.
Respectively placing the special probe for detecting the ultrasonic guided wave of the coating on the 1-8-level square bonding sample, and measuring the amplitude values of the received guided waves, which are respectively recorded as H1～H8；
The ultrasonic guided wave method bonding strength coefficient K of the 0-level square bonding sampled0Comprises the following steps:
Kd0＝H0/H9；
ultrasonic guided wave method bonding strength coefficient K of 9-level square bonding sampled9Is composed of
Kd9＝H9/H9；
Similarly, K can be obtainedd1～Kd8。
And 4, step 4: and (3) performing a coating strength tensile test on the ten-level square bonding sample for ultrasonic guided wave detection, and calculating the equivalent bonding strength.
The step 4 specifically comprises the following steps:
respectively placing the 0-9-grade square bonding samples on a tensile testing machine, respectively performing tensile test on the 0-9-grade square bonding samples by using the tensile testing machine, testing the tensile force required for breaking the bonding between the coating and the substrate, and calculating the equivalent bonding strength sigma corresponding to the 0-9-grade square bonding samplesth0～σth9。
In order to enable the tensile force to be uniformly applied to the bonding area of the ten-grade square bonding sample for ultrasonic guided wave detection without any twisting action, the tensile stress is applied in the direction vertical to the bonding plane of the sample, and the tensile force required for breaking the bonding sample is accurately obtained.
The tensile test device for the coating strength can be referred to GB/T38898-2020 appendix A.
And 5: and carrying out ultrasonic guided wave detection on the actual detected piece, and calculating the bonding strength value of the coating.
The step 5 specifically comprises the following steps:
placing a special probe for detecting the ultrasonic guided wave of the coating on an actual detected piece, starting a multi-channel ultrasonic guided wave detector, sending ultrasonic waves by a transmitting piezoelectric wafer, transmitting the ultrasonic waves in an ultrasonic guided wave mode in the actual detected piece after multiple reflections, then, reaching a receiving piezoelectric wafer, recording the amplitude value of the received guided wave, and recording the amplitude value as Hs；
The ultrasonic guided wave method bonding strength coefficient K of the actual detected piecedsComprises the following steps:
Kds＝Hs/H9；
according to the obtained KdsThe value of (a) is obtained as the grade of the corresponding square bonding sample, and the corresponding equivalent bonding strength σ is obtained from the grade of the corresponding square bonding sampleth；
The coating bonding strength σ of the actual test piece is:
σ＝σth×(1-Kds)。
in one embodiment, the obtained ultrasonic guided wave method bonding strength coefficient K of the actual detected piecedsUltrasonic guided wave method bonding strength coefficient K of 6-level square bonding sampled6In the same way, the equivalent bonding strength of the obtained 6-grade square bonding sample is sigmath6Then, the coating bonding strength σ of the actual test piece is:
σ＝σth6×(1-Kds)。
it is to be understood that the above description is not intended to limit the present invention, and the present invention is not limited to the above examples, and those skilled in the art may make modifications, alterations, additions or substitutions within the spirit and scope of the present invention.
Claims (10)
1. An ultrasonic guided wave detection method for coating bonding strength is characterized by comprising the following steps:
step 1: manufacturing a ten-level square bonding sample for ultrasonic guided wave detection;
the ten-level square bonding sample comprises a 0-9-level square bonding sample, wherein the 0-level square bonding sample shows that any matrix is not bonded on the lower surface of the complete coating, the 1-8-level square bonding sample shows that the area of the matrix bonded on the lower surface of the complete coating is increased continuously, and the 9-level square bonding sample shows that the matrix is bonded on the lower surface of the complete coating completely;
step 2: setting up a special ultrasonic guided wave coating bonding strength detection system;
the ultrasonic guided wave coating bonding strength detection system comprises a multi-channel ultrasonic guided wave detector and a special probe for coating ultrasonic guided wave detection, wherein the special probe for coating ultrasonic guided wave detection is electrically connected with the multi-channel ultrasonic guided wave detector;
and step 3: calculating the ultrasonic guided wave method bonding strength coefficient of the ten-level square bonding sample;
testing the wave amplitude value of the guided wave of the ten-level square bonding sample by using an ultrasonic guided wave coating bonding strength detection system, and calculating the ultrasonic guided wave method bonding strength coefficient of the ten-level square bonding sample according to the wave amplitude value of the guided wave;
and 4, step 4: performing a coating strength tensile test on a ten-level square bonding sample for ultrasonic guided wave detection, and calculating equivalent bonding strength;
and 5: and carrying out ultrasonic guided wave detection on the actual detected piece, and calculating the bonding strength value of the coating.
2. The ultrasonic guided wave detection method for the coating bonding strength according to claim 1, wherein the coating of the 0-9 level square bonding sample is divided into 3 rows and 3 columns of 9 small areas, wherein no matrix is bonded in the 9 small areas of the 0 level square bonding sample, the middle small area of the 2 nd row of the 1 level square bonding sample is bonded with the matrix, the left and right small areas of the 2 nd row of the 2 level square bonding sample are bonded with the matrix, all the small areas of the 2 nd row of the 3 level square bonding sample are bonded with the matrix, the middle small area of the 1 st row of the 4 level square bonding sample, the left and right small areas of the 2 nd row, and the middle small area of the 3 rd row are bonded with the matrix, the middle small area of the 1 st row of the 5 level square bonding sample, all the small areas of the 2 nd row, and the middle small area of the 3 rd row are bonded with the matrix, the left and middle small areas of the 1 st row, the left and right small areas of the 2 nd row, and the middle and right small areas of the 3 rd row of the 6-level square bonding sample are bonded to the substrate, the left and middle small areas of the 1 st row, and all the small areas of the 2 nd row, and the middle and right small areas of the 3 rd row are bonded to the substrate, and all the small areas of the 1 st row, the left and right small areas of the 2 nd row, and all the small areas of the 3 rd row are bonded to the substrate, and the 9 small areas of the 9 th row, and all the small areas are bonded to the substrate.
3. The method of claim 2, wherein the base and the coating are made of the same material as the base and the coating of the actual object.
4. The method for detecting the ultrasonic guided wave of the coating bonding strength of claim 2, wherein the probe specially used for detecting the ultrasonic guided wave of the coating comprises a probe main body, a planar wedge is arranged at the bottom of the probe main body, the probe main body and the planar wedge are divided into a left transmitting part and a right receiving part through a sound insulation layer, a transmitting piezoelectric wafer is obliquely arranged in the left transmitting part, a receiving piezoelectric wafer is obliquely arranged in the right receiving part, a transmitting signal interface and a receiving signal interface are arranged at the top of the probe main body, the transmitting piezoelectric wafer is electrically connected with the transmitting signal interface, the receiving piezoelectric wafer is electrically connected with the receiving signal interface, and the transmitting signal interface and the receiving signal interface are both electrically connected with a multi-channel ultrasonic guided wave detector.
5. The method as claimed in claim 4, wherein damping blocks are disposed on the transmitting piezoelectric wafer and the receiving piezoelectric wafer.
6. The method of claim 4, wherein the probe body is made of sound absorbing material.
7. The method as claimed in claim 4, wherein the transmission signal interface and the reception signal interface are electrically connected to the multi-channel ultrasonic guided wave detector through cables.
8. The method for detecting the bonding strength of a coating according to claim 4, wherein the step 3 specifically comprises:
placing a special probe for detecting the ultrasonic guided wave of the coating on a 0-level square bonding sample, starting a multi-channel ultrasonic guided wave detector, sending ultrasonic waves by a transmitting piezoelectric wafer, transmitting the ultrasonic guided wave in an ultrasonic guided wave mode by multiple reflections in the 0-level square bonding sample, having no transmission loss of guided wave energy, having the least energy loss of ultrasonic guided wave propagation, having the largest amplitude of guided wave sound energy received by a receiving piezoelectric wafer, adjusting the multi-channel ultrasonic guided wave detector, adjusting the amplitude to the full screen height, recording the amplitude of the received guided wave, and recording the amplitude as H0；
The special probe for detecting the ultrasonic guided wave of the coating is placed on a 9-level square bonding sample, a multi-channel ultrasonic guided wave detector is started, ultrasonic waves are emitted by a transmitting piezoelectric wafer, multiple reflections in the 9-level square bonding sample propagate in an ultrasonic guided wave mode, the coating is completely bonded with a substrate, most guided wave energy is transmitted into the substrate through a bonding layer through multiple reflections in the propagation process, the propagation energy loss is maximum at the moment, the amplitude of sound energy wave received by the receiving piezoelectric wafer is minimum, the amplitude of the received guided wave is recorded and is recorded as H9；
Respectively placing the special probe for detecting the ultrasonic guided wave of the coating on the 1-8-level square bonding sample, and measuring the amplitude values of the received guided waves, which are respectively recorded as H1～H8；
The ultrasonic guided wave method bonding strength coefficient K of the 0-level square bonding sampled0Comprises the following steps:
Kd0＝H0/H9；
ultrasonic guided wave method bonding strength coefficient K of 9-level square bonding sampled9Is composed of
Kd9＝H9/H9；
Similarly, K can be obtainedd1～Kd8。
9. The method for detecting the bonding strength of a coating according to claim 8, wherein the step 4 specifically comprises:
respectively placing the 0-9-grade square bonding samples on a tensile testing machine, respectively performing tensile test on the 0-9-grade square bonding samples by using the tensile testing machine, testing the tensile force required for breaking the bonding between the coating and the substrate, and calculating the equivalent bonding strength sigma corresponding to the 0-9-grade square bonding samplesth0～σth9。
10. The method as claimed in claim 9, wherein the step 5 comprises:
placing a special probe for detecting the ultrasonic guided wave of the coating on an actual detected piece, starting a multi-channel ultrasonic guided wave detector, sending ultrasonic waves by a transmitting piezoelectric wafer, transmitting the ultrasonic waves in an ultrasonic guided wave mode in the actual detected piece after multiple reflections, then, reaching a receiving piezoelectric wafer, recording the amplitude value of the received guided wave, and recording the amplitude value as Hs；
The ultrasonic guided wave method bonding strength coefficient K of the actual detected piecedsComprises the following steps:
Kds＝Hs/H9；
according to the obtained KdsThe value of (a) is obtained as the grade of the corresponding square bonding sample, and the corresponding equivalent bonding strength σ is obtained from the grade of the corresponding square bonding sampleth；
The coating bonding strength σ of the actual test piece is:
σ＝σth×(1-Kds)。
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