CN102322580A - LED (light-emitting diode) bulb light with high-whiteness substrate - Google Patents

LED (light-emitting diode) bulb light with high-whiteness substrate Download PDF

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Publication number
CN102322580A
CN102322580A CN201110266632A CN201110266632A CN102322580A CN 102322580 A CN102322580 A CN 102322580A CN 201110266632 A CN201110266632 A CN 201110266632A CN 201110266632 A CN201110266632 A CN 201110266632A CN 102322580 A CN102322580 A CN 102322580A
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CN
China
Prior art keywords
led
reflector
substrate
light
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201110266632A
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Chinese (zh)
Inventor
何文铭
唐秋熙
童庆锋
申小飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
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FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd filed Critical FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201110266632A priority Critical patent/CN102322580A/en
Publication of CN102322580A publication Critical patent/CN102322580A/en
Pending legal-status Critical Current

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Abstract

The invention provides an LED (light-emitting diode) bulb light with a high-whiteness substrate. The LED bulb light comprises a light head, a heat radiator, a bracket, an LED light source module, a power supply part and a transparent cover, wherein the LED light source module comprises a base and LED chips, the base comprises a substrate and at least one reflector cup, at least one LED chip is fixed on the bottom of the at least one reflector cup with an insulating adhesive, fluorescent powder and an adhesive layer are coated on the surface of each LED chip, and the whiteness of a light-emitting surface on which LEDs are mounted on the at least one reflector cup is not less than 70. The LED light of the structure has good safety performance and light weight, is non-conducting and not fragile; moreover the production cost can be greatly reduced, which is favorable to the large-scale industrial production.

Description

High whiteness substrate LED bulb lamp
Technical field
The present invention relates to a kind of lighting apparatus, relate in particular to a kind of LED lamp.
Background technology
LED is a kind of low voltage light sources, because its power saving, life-span are long, has been widely used in various lighting devices at present, and traditional LED bulb lamp all adopts the die casting fin of band dentation, and production technology is complicacy, and production cost is higher; Simultaneously, traditional led light source module encapsulation construction generally comprise one have a reflector metab, its heat dispersion is relatively poor, particularly can't solve the heat dissipation problem of high-power LED light source module.
Summary of the invention
The technical problem that the present invention will solve is to provide a kind of and can either saves production cost, can keep the high whiteness substrate LED bulb lamp of heat dispersion preferably again.
The technical scheme that the present invention adopts is: a kind of high whiteness substrate LED bulb lamp, comprise lamp holder, radiator, support, led light source module, power unit and translucent cover, and an end of said support is fixedly connected radiator; The other end is fixedly connected lamp holder; Radiator muff-joint is located at the outside of led light source module, and the led light source module connects power unit through electric wire, and translucent cover also is equipped with in the surface of light source outside of led light source module; It is characterized in that: said led light source module; Comprise base and led chip, said base comprises substrate and is arranged at least one reflector on the substrate, and the bottom of reflector is adhesively fixed with at least one led chip through insulating cement; The upper surface of said led chip is coated with fluorescent material and glue layer, is used to install light-emitting area whiteness >=70 of LED on the said reflector.
Said base adopts pottery or one-body molded the firing of glass to form, and perhaps substrate is to adopt pottery or glass to process, and reflector is bonded and fixed on the substrate.
The light-emitting area whiteness that is used to install LED on the said reflector is more preferred from >=and 85.
Be used on the said reflector to install that the light-emitting area whiteness of LED is best is >=88.
The sidewall of said reflector also is provided with opening; Also be concaved with a circuit board slot on the said base; This circuit board slot extends to respectively in the opening of reflector sidewall, in the circuit board slot wiring board is installed, and said led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
The below of said circuit board slot is provided with a through hole and extends base.
The bottom of said circuit board slot is lower than the bottom of reflector.
Said base and reflector are circle.
Compared with prior art, the present invention has following advantage: after employing had the LED base plate for packaging of high whiteness, the heat dispersion of led light source module improves, and was non-conductive, non-friable; Its security performance of LED lamp of processing is good, and weight lightens, and can save production cost greatly, helps large batch of suitability for industrialized production.
Description of drawings
Combine embodiment that the present invention is further described with reference to the accompanying drawings.
Fig. 1 is the STRUCTURE DECOMPOSITION sketch map of the high whiteness substrate of the present invention LED bulb lamp.
Fig. 2 is the structural representation of the led light source module of the high whiteness substrate of the present invention LED bulb lamp.
Fig. 3 is the A-A generalized section of Fig. 2.
Fig. 4 is the structural representation of the base of led light source module.
Fig. 5 is the B-B generalized section of Fig. 4.
The specific embodiment
Come the present invention is carried out detailed explanation below in conjunction with specific embodiment.
As shown in Figure 1; A kind of high whiteness substrate LED bulb lamp comprises lamp holder 100, radiator 200, support 300, led light source module 400, power unit 500 and translucent cover 600, and an end of said support 300 is fixedly connected radiator 200; The other end is fixedly connected lamp holder 100; Radiator 200 is set in the outside of led light source module 400, and led light source module 400 connects power unit 500 through electric wire 501, and translucent cover 600 also is equipped with in the surface of light source outside of led light source module 400.
As shown in Figures 2 and 3, be the structural representation of many glasss of modules of a kind of high whiteness substrate led light source, comprise base 10 and some led chips 20; Like Fig. 4 and shown in Figure 5, said base 10 comprises substrate 1 and is arranged on several reflectors 2 on the substrate 1, and led chip 20 is bonded and fixed at the bottom of reflector 2 through insulating cement; The upper surface of said led chip 20 is coated with fluorescent material and glue layer 40, and the sidewall 22 of said reflector 2 also is provided with opening 21, and the outside at reflector 2 on the substrate 1 also is provided with circuit board slot 3; Said circuit board slot 3 is " king " font; And extend into reflector sidewall 22, wiring board 30 is installed in the circuit board slot 3, said led chip 20 is connected on the wiring board 30 through serial or parallel connection and draws both positive and negative polarity; Base described in the present embodiment and reflector are circle, and said reflector is 6.
Said base adopts pottery or one-body molded the firing of glass to form, and perhaps substrate is to adopt pottery or glass to process, and reflector is bonded and fixed on the substrate.Be used to install light-emitting area whiteness >=70 of LED on the said reflector, be more preferred from >=85, the best is >=88.
In addition; Can also further below this circuit board slot 3, be provided with a through hole 31 and extend base in the foregoing description; Supply led chip 20 after serial or parallel connection is connected on the wiring board 30, pass this through hole again and draw both positive and negative polarity usefulness, can be more convenient during the routing of led chip in process of production; All leads all are encapsulated in fluorescent material and the glue layer, better must reach the object of the invention.
Because traditional general whiteness of LED metab is all less than 70; Therefore in actual production, need light-emitting area above that to increase the reflector layer production process; But do like this heat dispersion of LED base is reduced greatly, and increase production process, also increase production cost.The present invention adopts the pottery or the glass base of high whiteness, according to the prefabricated size that processes needs of production needs, has both met the requirement of whiteness >=70; Can improve heat dispersion again, adopt above-mentionedly in addition, all be encapsulated in the inner encapsulating structure of reflector below glue and the fluorescent material mixed layer led chip and wiring board and the lead between them; Can in the operation of led chip encapsulation, just can accomplish in a direct step; Both can simplify production technology, can also save a large amount of production costs, help large batch of suitability for industrialized production; Simultaneously can adopt prefabricated mode Direct Production base, production efficiency will improve greatly.

Claims (8)

1. one kind high whiteness substrate LED bulb lamp comprises lamp holder, radiator, support, led light source module, power unit and translucent cover, and an end of said support is fixedly connected radiator; The other end is fixedly connected lamp holder; Radiator muff-joint is located at the outside of led light source module, and the led light source module connects power unit through electric wire, and translucent cover also is equipped with in the surface of light source outside of led light source module; It is characterized in that: said led light source module; Comprise base and led chip, said base comprises substrate and is arranged at least one reflector on the substrate, and the bottom of reflector is adhesively fixed with at least one led chip through insulating cement; The upper surface of said led chip is coated with fluorescent material and glue layer, is used to install light-emitting area whiteness >=70 of LED on the said reflector.
2. high whiteness substrate LED bulb lamp according to claim 1 is characterized in that: said base adopts pottery or one-body molded the firing of glass to form, and perhaps substrate is to adopt pottery or glass to process, and reflector is bonded and fixed on the substrate.
3. high whiteness substrate LED bulb lamp according to claim 1 is characterized in that: the light-emitting area whiteness that is used to install LED on the said reflector is more preferred from >=and 85.
4. high whiteness substrate LED bulb lamp according to claim 1 is characterized in that: be used on the said reflector to install that the light-emitting area whiteness of LED is best is >=88.
5. high whiteness substrate LED bulb lamp according to claim 1; It is characterized in that: the sidewall of said reflector also is provided with opening; Also be concaved with a circuit board slot on the said base; This circuit board slot extends to respectively in the opening of reflector sidewall, in the circuit board slot wiring board is installed, and said led chip is connected to through serial or parallel connection and draws both positive and negative polarity on the wiring board.
6. high whiteness substrate LED bulb lamp according to claim 5, it is characterized in that: the below of said circuit board slot is provided with a through hole and extends base.
7. high whiteness substrate LED bulb lamp according to claim 5, it is characterized in that: the bottom of said circuit board slot is lower than the bottom of reflector.
8. high whiteness substrate LED bulb lamp according to claim 1, it is characterized in that: said base and reflector are circle.
CN201110266632A 2011-09-09 2011-09-09 LED (light-emitting diode) bulb light with high-whiteness substrate Pending CN102322580A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110266632A CN102322580A (en) 2011-09-09 2011-09-09 LED (light-emitting diode) bulb light with high-whiteness substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110266632A CN102322580A (en) 2011-09-09 2011-09-09 LED (light-emitting diode) bulb light with high-whiteness substrate

Publications (1)

Publication Number Publication Date
CN102322580A true CN102322580A (en) 2012-01-18

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005166578A (en) * 2003-12-05 2005-06-23 Hamai Denkyu Kogyo Kk Electric-bulb-shaped led lamp
CN201202994Y (en) * 2008-05-22 2009-03-04 蔡干强 Decoration bulb
KR100932192B1 (en) * 2009-05-26 2009-12-16 김용철 A led light apparatus having the advanced radiation of heat
CN201407535Y (en) * 2009-03-31 2010-02-17 保定电谷科技有限公司 High-power LED bulb lamp
CN101749553A (en) * 2008-12-11 2010-06-23 上海恒烁光电科技有限公司 Packaging module of low-power light emitting diode (LED) luminescent chip
CN102007609A (en) * 2008-04-18 2011-04-06 旭硝子株式会社 Light-emitting diode package
CN102072422A (en) * 2010-09-30 2011-05-25 福建省万邦光电科技有限公司 Packaging structure of high-power LED (light emitting diode) light source module

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005166578A (en) * 2003-12-05 2005-06-23 Hamai Denkyu Kogyo Kk Electric-bulb-shaped led lamp
CN102007609A (en) * 2008-04-18 2011-04-06 旭硝子株式会社 Light-emitting diode package
CN201202994Y (en) * 2008-05-22 2009-03-04 蔡干强 Decoration bulb
CN101749553A (en) * 2008-12-11 2010-06-23 上海恒烁光电科技有限公司 Packaging module of low-power light emitting diode (LED) luminescent chip
CN201407535Y (en) * 2009-03-31 2010-02-17 保定电谷科技有限公司 High-power LED bulb lamp
KR100932192B1 (en) * 2009-05-26 2009-12-16 김용철 A led light apparatus having the advanced radiation of heat
CN102072422A (en) * 2010-09-30 2011-05-25 福建省万邦光电科技有限公司 Packaging structure of high-power LED (light emitting diode) light source module

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Application publication date: 20120118