CN102315133B - Conveying system for integrated circuit chip loader framework - Google Patents

Conveying system for integrated circuit chip loader framework Download PDF

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Publication number
CN102315133B
CN102315133B CN 201010212151 CN201010212151A CN102315133B CN 102315133 B CN102315133 B CN 102315133B CN 201010212151 CN201010212151 CN 201010212151 CN 201010212151 A CN201010212151 A CN 201010212151A CN 102315133 B CN102315133 B CN 102315133B
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jaws
conveying system
integrated circuit
transducer
circuit chip
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CN102315133A (en
Inventor
刘建峰
徐银森
李承峰
胡汉球
苏建国
吴华
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NANTONG KINGTECH CO Ltd
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吴华
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a conveying system for an integrated circuit chip loader framework. The conveying system comprises a feeding mechanism, a track mechanism, a discharging mechanism and program controlled equipment, wherein the feeding mechanism comprises a feeding mechanical hand and a feeding sensor, an open type platform is adopted for the track mechanism, the width and the thickness of a lead framework groove in the track mechanism can be regulated, the discharging mechanism comprises a discharging mechanical hand and a discharging sensor, and the conveying system is driven by a ball screw driven a motor. The conveying system is suitable for conveying lead frameworks of various specifications, is accurate in feeding amount control and high in automation degree, and can be used in an integrated circuit chip loader in scale production.

Description

Conveying system for integrated circuit chip loader framework
Technical field
The present invention relates to the conveying system of integrated circuit die bonder, refer in particular to the full-automatic conveying system of the circuit lead frame that can accurately control.
Background technology
With the chip pick-up of integrated circuit and be loaded on the circuit lead frame, it is the operating procedure of integrated circuit die bonder key.Usually the conveying system of integrated circuit die bonder comprises feed mechanism, rail mechanism, cutting agency.In traditional integrated circuit die bonder, taking, transmit and placing of lead frame is difficult to the realization full automatic working, and production efficiency is low, and the load precision is low, is difficult to adapt to the lead frame use of different size.Disclosed a kind of integrated circuit feed mechanism in the specification of patent 200720131627.9, though used manipulator, not mentioned material loading transducer is controlled not full implementation automatically.Gluing and chip loading method on the disclosed circuit lead frame in the specification of patent 200710019239.3, its conveying mechanism does not have accurate control assembly, so adopted the local method of covering film, production efficiency is low, brings pollution.Disclosed a kind of quartz wafer loading machine in the patent 200720094963.8, its delivery track size do not have free regulation function and accurate control function, can not be applicable to the use of series of products and accurately control.
Summary of the invention
Goal of the invention: the invention provides a kind of material loading, conveying, blanking and all can accurately control, adapt to the conveying system for integrated circuit chip loader framework of the lead frame use of different size.
Technical scheme: the present invention is achieved in that
Contain feeding manipulator and material loading transducer in the feed mechanism; Rail mechanism contains several set of jaws, track, driving element and rail sensor; Cutting agency contains blanking mechanical hand and blanking transducer; Rail mechanism is a kind of Open architecture, width between the set of jaws of rail mechanism is or/and thickness can free adjustment, width between each set of jaws is by the distance adjustment between this set of jaws, thickness between each set of jaws is regulated seam by this set of jaws thickness and is regulated, the width of track or also can regulate is to adapt to the lead frame of different size.
Described material loading transducer, blanking transducer and rail sensor are connected respectively in program-controlled equipment such as the program control computer, program-controlled equipment is controlled respectively the action of the driving element of feeding manipulator, blanking mechanical hand, rail mechanism, reaches accurate control material loading, blanking, conveying.
Among the present invention, described feeding manipulator contains vacuum cup, and vacuum cup is connected to external vacuum pump, and vacuum suction material loading suction is large, picks and places speed fast.
The driving element of described rail mechanism is the ball screw of driven by motor, preferably adopts precise ball screw, and to realize the accurate conveying of lead frame, accurately the location guarantees gluing and the smooth realization of pasting integrated circuit (IC) chip.
Contain general switching software in the described program-controlled equipment, collect signal by material loading transducer, rail sensor, blanking transducer, the corresponding program that transmission prelists and makes, the respectively automatically action of control feed mechanism (5), rail mechanism (8), cutting agency (13).
Beneficial effect: conveying system for integrated circuit chip loader framework of the present invention, can the free adjustment jaw and the size of track, to adapt to the lead frame of different size, a tractor serves several purposes; Material loading, conveying, the blanking amount of feeding are controlled accurately, and automaticity is high, are fit to the large scale integrated circuit load and use.
Description of drawings
Fig. 1 is a perspective view of the present invention;
Fig. 2 is the structural representation of the set of jaws of a rail mechanism of the present invention.
Among the figure: 1, driving element; 2, rail sensor; 3, feeding manipulator; 4, material loading transducer; 5, feed mechanism; 6, material loading closes; 7, track; 8, rail mechanism; 9, set of jaws; 10, blanking is closed; 11, lead frame; 12, blanking mechanical hand; 13, cutting agency; 14, blanking transducer; 15, program-controlled equipment; 16, the width between the set of jaws; 17, the thickness between the set of jaws; 18, set of jaws thickness is regulated seam.
Embodiment
Feeding manipulator 3, material loading transducer 4 of choosing appropriate size and function etc. is made as feed mechanism 5; Choose the number cover set of jaws 9 of appropriate size and function, two tracks 7, driving element 1, rail sensor 2 etc. and be made as rail mechanism 8; Blanking mechanical hand 12, the blanking transducer 14 of choosing appropriate size and function are made as cutting agency 13; Select the program-controlled equipment 15 of the general switching software that good program prepared in advance has been installed.
Each components and parts are coupled together according to installation shown in Figure 1.Lead frame 11 is transported to now blanking and closes in 10, width 16 between the set of jaws and the thickness between the set of jaws 17 coincide with the size of lead frame 11, width 16 between the set of jaws is by the distance adjustment between the set of jaws, and the thickness 17 between the set of jaws is regulated seam 18 adjusting sizes by set of jaws thickness.
After starting power supply, program-controlled equipment 15 is by material loading transducer 4, rail sensor 2, blanking transducer 14 collection status information, then control respectively feeding manipulator 3, driving element 1, blanking mechanical hand 12 generation actions, close taking-up lead frame 11 6 from material loading, pass in the rail mechanism 8, carry out the operation of gluing and paster, be put at last blanking and close in 10, finish the course of conveying of the lead frame 11 of one-period.

Claims (4)

1. a conveying system for integrated circuit chip loader framework comprises feed mechanism (5), rail mechanism (8), cutting agency (13), it is characterized in that:
Feed mechanism (5) contains feeding manipulator (3) and material loading transducer (4); Rail mechanism (8) contains several set of jaws (9), track (7), driving element (1) and rail sensor (2); Cutting agency (13) contains blanking mechanical hand (12) and blanking transducer (14); Rail mechanism (8) is a kind of Open architecture, thickness (17) between width between the set of jaws (16) or the set of jaws can free adjustment, width between each set of jaws (16) is by the distance adjustment between this set of jaws, thickness between each set of jaws (17) is regulated seam (18) by this set of jaws thickness and is regulated, the width of track (7) can be regulated, with the lead frame (11) that adapts to different size;
Also contain program-controlled equipment (15), material loading transducer (4), blanking transducer (14), rail sensor (2) are connected respectively in the program-controlled equipment (15), and program-controlled equipment (15) is controlled respectively the action of the driving element (1) of feeding manipulator (3), blanking mechanical hand (12), rail mechanism (8).
2. conveying system for integrated circuit chip loader framework according to claim 1, it is characterized in that: described feeding manipulator (3) contains vacuum cup, and vacuum cup is connected to vacuum pump.
3. conveying system for integrated circuit chip loader framework according to claim 1, it is characterized in that: the driving element (1) of rail mechanism (8) is the ball screw of driven by motor.
4. conveying system for integrated circuit chip loader framework according to claim 1, it is characterized in that: described program-controlled equipment contains general switching software in (15), collect signal by material loading transducer (4), rail sensor (2), blanking transducer (14) respectively, the corresponding program that transmission prelists and makes, the respectively automatically action of control feed mechanism (5), rail mechanism (8), cutting agency (13).
CN 201010212151 2010-06-29 2010-06-29 Conveying system for integrated circuit chip loader framework Active CN102315133B (en)

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Application Number Priority Date Filing Date Title
CN 201010212151 CN102315133B (en) 2010-06-29 2010-06-29 Conveying system for integrated circuit chip loader framework

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Application Number Priority Date Filing Date Title
CN 201010212151 CN102315133B (en) 2010-06-29 2010-06-29 Conveying system for integrated circuit chip loader framework

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CN102315133B true CN102315133B (en) 2013-04-24

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103373699B (en) * 2012-04-28 2016-06-15 无锡华润安盛科技有限公司 The guide rail of lead frame and system for conveyer belt pre-plastic package body
CN102637620A (en) * 2012-05-21 2012-08-15 吴华 Integrated circuit case chip feeder and grip thereof
CN104227781B (en) * 2014-09-23 2016-04-20 东莞市华恒工业自动化集成有限公司 A kind of automatic punching machine equipment and processing method thereof
CN104600011A (en) * 2014-12-31 2015-05-06 上海新阳半导体材料股份有限公司 Lead frame conveying device
CN105514017B (en) * 2015-12-31 2019-01-11 上海新阳半导体材料股份有限公司 Lead frame fixture
CN107086191B (en) * 2017-04-25 2019-08-02 无锡明祥电子有限公司 Lead frame auto loading machine
CN112366164B (en) * 2021-01-13 2021-03-23 四川富美达微电子有限公司 Lead frame levelling collimation loading attachment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2826897A1 (en) * 2001-07-04 2003-01-10 Hpe Mechanism for loading and unloading of boxes containing microelectronic wafers for transferring from equipment to trolley and vice versa
CN201068341Y (en) * 2007-01-16 2008-06-04 天津必利优科技发展有限公司 Full-automatic loader for quartz wafer
CN101369062A (en) * 2007-08-13 2009-02-18 庄添财 Adjusting device of objective table
CN201397825Y (en) * 2009-05-14 2010-02-03 李希望 Extension shaft
CN201435384Y (en) * 2009-07-06 2010-03-31 晶诚(郑州)科技有限公司 Adjustable combination type tray

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1003342C2 (en) * 1996-06-14 1997-12-17 Fico Bv Apparatus for simultaneously moving and changing the orientation of at least one carrier for electronic components.

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2826897A1 (en) * 2001-07-04 2003-01-10 Hpe Mechanism for loading and unloading of boxes containing microelectronic wafers for transferring from equipment to trolley and vice versa
CN201068341Y (en) * 2007-01-16 2008-06-04 天津必利优科技发展有限公司 Full-automatic loader for quartz wafer
CN101369062A (en) * 2007-08-13 2009-02-18 庄添财 Adjusting device of objective table
CN201397825Y (en) * 2009-05-14 2010-02-03 李希望 Extension shaft
CN201435384Y (en) * 2009-07-06 2010-03-31 晶诚(郑州)科技有限公司 Adjustable combination type tray

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Application publication date: 20120111

Assignee: Nantong Kingtech Co., Ltd.

Assignor: Wu Hua

Contract record no.: 2011320000966

Denomination of invention: Conveying system for integrated circuit chip loader framework

License type: Exclusive License

Record date: 20110712

LICC Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20161226

Address after: Jiangsu province Nantong City Chongchuan road 226000 No. 27 4 1 floor

Patentee after: Nantong Kingtech Co., Ltd.

Address before: Jiangsu province Nantong City Chongchuan road 226006 No. 27 4 1 floor

Patentee before: Wu Hua