CN102306689A - 以导热塑料为基础的led支架的生产方法 - Google Patents

以导热塑料为基础的led支架的生产方法 Download PDF

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CN102306689A
CN102306689A CN201110134611A CN201110134611A CN102306689A CN 102306689 A CN102306689 A CN 102306689A CN 201110134611 A CN201110134611 A CN 201110134611A CN 201110134611 A CN201110134611 A CN 201110134611A CN 102306689 A CN102306689 A CN 102306689A
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led lamp
lamp plate
plate substrate
lamp panel
panel substrate
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CN102306689B (zh
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邓衔翔
李强
花赟
李华
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FORTUNE (JIANGSU) MULTIMEDIA Co Ltd
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FORTUNE (JIANGSU) MULTIMEDIA Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

本发明公开了一种以导热塑料为基础的LED支架的生产方法，包括将聚苯硫醚热塑性树脂使用注塑机注塑成型，制作LED灯板基板；由注塑机射出制作的LED灯板基板，成型碗底结构供固晶工艺使用；使用丝印印刷机在LED灯板基板上印刷绝缘导线并通过UV照射烘干；使用磁性溅镀机在LED灯板基板上溅镀银层作为导电线路；利用油墨与PPS基板结合不良的特点，清除油墨导线以及粘连在导线上的银层后形成绝缘线，完成银导线P极、N极；使用固晶机在LED灯板基板碗底固晶打线。本发明可减少封装生产环节，降低生产成本；使用塑料代替金属板材料，环保节能。

Description

以导热塑料为基础的LED支架的生产方法
技术领域
本发明涉及一种LED支架的生产方法。
背景技术
现有的LED灯板生产工艺复杂，生产成本高。
发明内容
本发明的目的在于提供一种生产方便、成本低的LED灯板的生产方法。
本发明的技术解决方案是：
一种以导热塑料为基础的LED支架的生产方法，其特征是：依次包括下列步骤：
（1）将聚苯硫醚热塑性树脂使用注塑机注塑成型，制作LED灯板基板； 
（2）由注塑机射出制作的LED灯板基板，成型碗底结构供固晶工艺使用；
（3）使用丝印印刷机在LED灯板基板上印刷绝缘导线并通过UV照射烘干；
（4）使用磁性溅镀机在LED灯板基板上溅镀银层作为导电线路；
（5）利用油墨与PPS基板结合不良的特点，清除油墨导线以及粘连在导线上的银层后形成绝缘线，完成银导线P极、N极；
（6）使用固晶机在LED灯板基板碗底固晶打线。
本发明可减少封装生产环节，降低生产成本；可不依赖国外封装专利以自有技术方式进行量产；可使用自有设备生产降低成本；使用塑料代替金属板材料，环保节能。
附图说明
下面结合附图和实施例对本发明作进一步说明。
图1是步骤（1）状态图。
图2是步骤（2）状态图。
图3是步骤2碗底结构示意图。
图4是步骤（3）状态图。
图5是步骤（4）状态图。
图6是步骤（5）状态图。
图7是步骤（6）状态图。
图中：1、LED灯板基板，2、碗底结构，3、印刷的绝缘导线，4、溅镀银层，5、覆盖了银层的印刷绝缘导线，6、导电线路正极，7、导电线路负极，8、除去银层的绝缘线路，9、银导线P极，10、银导线N极，11、金线，12、金线，13、晶片P极，14、晶片N极。
具体实施方式
一种以导热塑料为基础的LED支架的生产方法，依次包括下列步骤：
（1）将聚苯硫醚热塑性树脂使用注塑机注塑成型，制作LED灯板基板； 
（2）由注塑机射出制作的LED灯板基板，成型碗底结构供固晶工艺使用；
（3）使用丝印印刷机在LED灯板基板上印刷绝缘导线并通过UV照射烘干；
（4）使用磁性溅镀机在LED灯板基板上溅镀银层作为导电线路；
（5）利用油墨与PPS（聚苯硫醚热塑性树脂）基板结合不良的特点，清除油墨导线以及粘连在导线上的银层后形成绝缘线，完成银导线P极、N极；
（6）使用固晶机在LED灯板基板碗底固晶打线。

Claims (1)

1. 一种以导热塑料为基础的LED支架的生产方法，其特征是：依次包括下列步骤：
（1）将聚苯硫醚热塑性树脂使用注塑机注塑成型，制作LED灯板基板； 
（2）由注塑机射出制作的LED灯板基板，成型碗底结构供固晶工艺使用；
（3）使用丝印印刷机在LED灯板基板上印刷绝缘导线并通过UV照射烘干；
（4）使用磁性溅镀机在LED灯板基板上溅镀银层作为导电线路；
（5）利用油墨与PPS基板结合不良的特点，清除油墨导线以及粘连在导线上的银层后形成绝缘线，完成银导线P极、N极；
（6）使用固晶机在LED灯板基板碗底固晶打线。
CN2011101346111A 2011-05-24 2011-05-24 以导热塑料为基础的led支架的生产方法 Expired - Fee Related CN102306689B (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102281718A (zh) * 2011-06-16 2011-12-14 江苏永兴多媒体有限公司 结合油墨印刷与磁性溅镀制造led灯板用导线的方法
CN107170873A (zh) * 2017-04-26 2017-09-15 安徽欧瑞特照明有限公司 一种led支架清洗工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2903656Y (zh) * 2005-10-24 2007-05-23 东莞广宏电子有限公司 一种大功率led照明发光灯具
US20070145398A1 (en) * 2005-12-23 2007-06-28 Lg Innotek Co., Ltd Light emission diode and method of fabricating thereof
CN2937778Y (zh) * 2006-07-31 2007-08-22 周朝华 微型防水高透明发光二极管灯带
CN101430052A (zh) * 2008-12-15 2009-05-13 伟志光电（深圳）有限公司 Pcb胶壳一体化封装led照明光源及其制备工艺
CN102054918A (zh) * 2009-11-09 2011-05-11 深圳市瑞丰光电子股份有限公司 一种led封装方法及led装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2903656Y (zh) * 2005-10-24 2007-05-23 东莞广宏电子有限公司 一种大功率led照明发光灯具
US20070145398A1 (en) * 2005-12-23 2007-06-28 Lg Innotek Co., Ltd Light emission diode and method of fabricating thereof
CN2937778Y (zh) * 2006-07-31 2007-08-22 周朝华 微型防水高透明发光二极管灯带
CN101430052A (zh) * 2008-12-15 2009-05-13 伟志光电（深圳）有限公司 Pcb胶壳一体化封装led照明光源及其制备工艺
CN102054918A (zh) * 2009-11-09 2011-05-11 深圳市瑞丰光电子股份有限公司 一种led封装方法及led装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102281718A (zh) * 2011-06-16 2011-12-14 江苏永兴多媒体有限公司 结合油墨印刷与磁性溅镀制造led灯板用导线的方法
CN107170873A (zh) * 2017-04-26 2017-09-15 安徽欧瑞特照明有限公司 一种led支架清洗工艺
CN107170873B (zh) * 2017-04-26 2018-11-13 安徽欧瑞特照明有限公司 一种led支架清洗工艺

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