CN102303174B - 一种采用叠加法的陶瓷与铝相互焊接的焊接方法 - Google Patents
一种采用叠加法的陶瓷与铝相互焊接的焊接方法 Download PDFInfo
- Publication number
- CN102303174B CN102303174B CN 201110242568 CN201110242568A CN102303174B CN 102303174 B CN102303174 B CN 102303174B CN 201110242568 CN201110242568 CN 201110242568 CN 201110242568 A CN201110242568 A CN 201110242568A CN 102303174 B CN102303174 B CN 102303174B
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- Prior art keywords
- ceramic
- silver
- ceramic substrate
- sintering
- aluminum
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 title claims abstract description 72
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 49
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000003466 welding Methods 0.000 title claims abstract description 25
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 239000004332 silver Substances 0.000 claims abstract description 30
- 229910052709 silver Inorganic materials 0.000 claims abstract description 30
- 238000005245 sintering Methods 0.000 claims abstract description 30
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 22
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 238000009713 electroplating Methods 0.000 claims abstract description 10
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims abstract description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910001868 water Inorganic materials 0.000 claims abstract description 7
- 238000007639 printing Methods 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims abstract description 4
- 239000003960 organic solvent Substances 0.000 claims abstract description 4
- 229910000029 sodium carbonate Inorganic materials 0.000 claims abstract description 4
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 claims abstract description 4
- 229910000375 tin(II) sulfate Inorganic materials 0.000 claims abstract description 4
- 239000004411 aluminium Substances 0.000 claims description 42
- 239000002002 slurry Substances 0.000 claims description 20
- 238000005476 soldering Methods 0.000 claims description 15
- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 6
- 239000006071 cream Substances 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims description 4
- 230000004927 fusion Effects 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 108010010803 Gelatin Proteins 0.000 claims description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 3
- 239000003513 alkali Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000011010 flushing procedure Methods 0.000 claims description 3
- 229920000159 gelatin Polymers 0.000 claims description 3
- 239000008273 gelatin Substances 0.000 claims description 3
- 235000019322 gelatine Nutrition 0.000 claims description 3
- 235000011852 gelatine desserts Nutrition 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 150000004780 naphthols Chemical class 0.000 claims description 3
- 239000008096 xylene Substances 0.000 claims description 3
- 150000003738 xylenes Chemical group 0.000 claims description 3
- 239000000203 mixture Substances 0.000 abstract description 4
- 239000003350 kerosene Substances 0.000 abstract description 2
- 229910052755 nonmetal Inorganic materials 0.000 abstract description 2
- 238000005406 washing Methods 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000011224 oxide ceramic Substances 0.000 abstract 1
- 229910052574 oxide ceramic Inorganic materials 0.000 abstract 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 1
- 238000010992 reflux Methods 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000005336 cracking Methods 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008275 binding mechanism Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000003913 materials processing Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 239000008207 working material Substances 0.000 description 1
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Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201110242568 CN102303174B (zh) | 2011-08-23 | 2011-08-23 | 一种采用叠加法的陶瓷与铝相互焊接的焊接方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201110242568 CN102303174B (zh) | 2011-08-23 | 2011-08-23 | 一种采用叠加法的陶瓷与铝相互焊接的焊接方法 |
Publications (2)
Publication Number | Publication Date |
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CN102303174A CN102303174A (zh) | 2012-01-04 |
CN102303174B true CN102303174B (zh) | 2012-12-26 |
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CN 201110242568 Expired - Fee Related CN102303174B (zh) | 2011-08-23 | 2011-08-23 | 一种采用叠加法的陶瓷与铝相互焊接的焊接方法 |
Country Status (1)
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CN (1) | CN102303174B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103817390B (zh) * | 2014-02-24 | 2016-01-20 | 贵州天义电器有限责任公司 | 一种用于接触器装配的钎焊连接工艺 |
US9287106B1 (en) | 2014-11-10 | 2016-03-15 | Corning Incorporated | Translucent alumina filaments and tape cast methods for making |
CN106552990B (zh) * | 2016-09-13 | 2019-03-01 | 武汉理工大学 | 一种贴片电位器的内部微焊接方法 |
CN114682872A (zh) * | 2022-05-18 | 2022-07-01 | 南京航空航天大学 | 一种激光热源辅助金属-陶瓷回流焊的精准控温装置和方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR950006066B1 (ko) * | 1992-11-14 | 1995-06-08 | 만도기계주식회사 | 알루미늄 냉각판 접합방법 |
CN1159376A (zh) * | 1997-03-12 | 1997-09-17 | 太原工业大学 | 陶瓷与金属的辉光钎焊方法 |
CN1396037A (zh) * | 2002-08-09 | 2003-02-12 | 中国科学院上海硅酸盐研究所 | 氮化铝与铜的高温钎焊方法 |
JP2006245437A (ja) * | 2005-03-04 | 2006-09-14 | Hitachi Metals Ltd | セラミックス回路基板およびパワーモジュール並びにパワーモジュールの製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02153868A (ja) * | 1988-12-06 | 1990-06-13 | Mitsubishi Alum Co Ltd | セラミック板と金属板のろう付け方法 |
JPH05129770A (ja) * | 1991-10-30 | 1993-05-25 | Sumitomo Electric Ind Ltd | ハンダ付け補助層 |
-
2011
- 2011-08-23 CN CN 201110242568 patent/CN102303174B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR950006066B1 (ko) * | 1992-11-14 | 1995-06-08 | 만도기계주식회사 | 알루미늄 냉각판 접합방법 |
CN1159376A (zh) * | 1997-03-12 | 1997-09-17 | 太原工业大学 | 陶瓷与金属的辉光钎焊方法 |
CN1396037A (zh) * | 2002-08-09 | 2003-02-12 | 中国科学院上海硅酸盐研究所 | 氮化铝与铜的高温钎焊方法 |
JP2006245437A (ja) * | 2005-03-04 | 2006-09-14 | Hitachi Metals Ltd | セラミックス回路基板およびパワーモジュール並びにパワーモジュールの製造方法 |
Non-Patent Citations (2)
Title |
---|
陶瓷与金属连接技术的研究进展;王新阳 等;《热加工工艺》;20090715;第38卷(第13期);145-148 * |
陶瓷-金属焊接的方法与技术;钱耀川 等;《材料导报》;20051130;第19卷(第11期);98-100,104 * |
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CN102303174A (zh) | 2012-01-04 |
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Owner name: WANG LIANG Free format text: FORMER OWNER: HE YONGXIANG Effective date: 20130321 Owner name: HE YONGXIANG Free format text: FORMER OWNER: ZHEN HAIWEI Effective date: 20130321 |
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Effective date of registration: 20130321 Address after: Hangzhou City, Zhejiang province Xihu District 310023 North Building 10, unit 1, Jia Garden Room 201 Patentee after: He Yongxiang Patentee after: Wang Liang Address before: 310023, Zhejiang, Hangzhou, Xihu District, leaving the town, left 14 street, unit 401, room 3 Patentee before: Zhen Haiwei Patentee before: He Yongxiang |
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Effective date of registration: 20180307 Address after: 200120 Shanghai City, Pudong New Area China (Shanghai) free trade zone fanchun Road No. 400 Building 1 layer 3 Patentee after: SHANGHAI ZR-DATA TECHNOLOGY CO., LTD. Address before: Hangzhou City, Zhejiang province Xihu District 310023 North Building 10, unit 1, Jia Garden Room 201 Co-patentee before: Wang Liang Patentee before: He Yongxiang |
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