CN102301836A - 产生印制或涂布功能件用基板的方法、基板、功能装置及其用途 - Google Patents
产生印制或涂布功能件用基板的方法、基板、功能装置及其用途 Download PDFInfo
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Abstract
本发明涉及产生印制或涂布功能件用基板的方法。所述方法包括获得包含纤维素和/或木纤维的底幅材基板,使所述底幅材基板涂布有阻挡层,以及使所述阻挡层涂布有包含矿物颗粒和/或颜料颗粒的顶涂层。本发明还涉及印制或涂布功能件用基板,其包括包含纤维素和/或木纤维的底幅材基板层、涂布在所述底幅材基板层上的阻挡层和涂布在所述阻挡层上的包含矿物颗粒和/或颜料颗粒的顶涂层。本发明还涉及多功能装置及其用途。
Description
根据所附权利要求书的前述部分,本发明涉及产生印制或涂布功能件(printed or coated functionality)用基板的方法,基板和功能装置及其用途。
背景技术
柔性显示器和传感器技术的趋势之一是开发低成本的一次性或可抛型电子产品。这些一次性或可抛型电子产品要求装置具有合理的电学性能和实际上可忽略的生产成本。用于制造低成本电子产品的令人感兴趣的可选方法是通过使用导电墨将电路印制在基板上。已采用聚萘二甲酸乙二醇酯(PEN)和聚对苯二甲酸乙二醇酯(PET)基础上的基于柔性聚合物膜的基板用于可印制电路中。
廉价的基板可选物是纸或板。然而,传统的纸基板受到电路制造过程中所需的湿制法和热处理的影响而受到限制。当利用导体材料或半导体材料在纸基板上进行印制时,温度和湿度的改变影响最终印制品的传导性。用于印制电路的传导印制液体或墨中所需的不同溶剂也容易被纸吸收。溶剂吸收引起印制结果的传播,从而使印制结果不可用。
为了改善纸基板对湿度、水和/或有机溶剂的整体抗性,已经用阻挡板对纸基板进行层积。使用聚合物基板和层积纸基板的问题是由于所述基板的表面能低而导致印制性差。印制性差是指采用旋转印制时出现渗墨或使用喷墨印刷法时,墨仅以墨滴停留在基板上。可以通过用电子束或者等离子体处理表面对表面能进行修饰,然而这些处理(尤其是电晕处理)可能对屏障性质产生不良影响。
发明目的和发明内容
本发明的目的是尽可能减小或者甚至消除现有技术中存在的缺点。
本发明的另一个目的是提供简易产生基于纸的印制或涂布功能件用基板的方法。
再一个目的是提供用于功能装置(例如电路)的廉价基板。
再一个目的是提供适合以卷对卷(reel-to-reel或roll-to-roll)的方式制造基板的方法。
这些目的通过具有在独立权利要求的特征部分描述的特征的本发明而实现。
本发明用于产生印制或涂布功能件用基板的典型方法包括:
-获得包含纤维素和/或木纤维的底幅材基板(base web substrate),
-使所述底幅材基板涂布有阻挡层,和
-使所述阻挡层涂布有包含颜料颗粒的顶涂层。
本发明的印制或涂布功能件用典型基板包含
-包含纤维素和/或木纤维的底幅材基板层,
-涂布在所述底幅材基板层上的阻挡层,
-涂布在所述阻挡层上的包含矿物颗粒和/或颜料颗粒的顶涂层。
通过使用印制,例如喷墨印制、柔版印刷、移印、轮转凹版印刷、胶版印刷、丝网印刷,或者涂布,例如反向凹版涂布、刮刀涂布、棒涂布、浸涂、滴涂、帘幕涂布、喷涂、旋转涂布或压花将本发明的典型功能装置印制或涂布至本发明的基板上。
现在已经发现,通过在底幅材基板和包含矿物颗粒的薄顶涂层之间涂布阻挡层,可以防止导电印制墨被吸收至底幅材基板,并且同时可以实现最佳的印制结果。所述顶涂层使表面易于印制,并且使问题(例如渗色)最小化。本发明能够使廉价的含纤维基板(例如纸和板)应用在可印制电路的制造中。
所述底幅材基板可以是任何包含源于天然的纤维(例如纤维素和/或木纤维)的可涂布幅材基板。所述底幅材表面可以包括超级压光(SC)纸、超低定量涂布(ULWC)纸、低定量涂布(LWC)纸、中定量涂布(MWC)纸、高定量涂布(HWC)纸、机械整饰涂布(MFC)纸、薄膜涂布胶印(FCO)纸、不含磨木浆涂布(WFC)纸(woodfree coated(WFC)paper)、低定量涂布(LWCO)打印纸、SC胶印(SCO)打印纸、机械整饰专用纸(MFS)、复印纸或新闻纸,但不限于这些。典型的涂布杂志纸(例如LWC)包含约40-60重量%的机械纸浆,约25-40重量%的漂白软木浆和约20-35重量%的填料和/或涂布剂。SC纸包含约70-90重量%的机械纸浆和约10-30%的长纤维纤维素纸浆。不同纸的典型每平方米克重值可以为:SC为40-80g/m2,LWC为40-70g/m2,MWC为70-130g/m2,MFC为50-70g/m2,FCO为40-70g/m2,MWC为70-90g/m2,HWC为100-135g/m2,WFC为80-140g/m2。
所述底幅材基板还可以包括回收纤维。例如,MFS纸级是由机械纤维以及至少部分回收纤维制得的未涂布纸。
所述底幅材基板还可以是纸板,例如折叠箱纸板(FBB)、白挂面纸板(WLC)、固体漂白硫酸盐(SBS)板、固体未漂白硫酸盐(SUS)板或液体包装用纸板(LPB),但不限于这些。板的每平方米克重可以是120-500g/m2,其可以100%基于原始纤维,100%基于回收纤维,或者原始纤维和回收纤维之间的任何可能的混合。
当底幅材基板是常规的纸或板时,易于被常规的废纸厂回收,并且可以通过利用现有的废物收集系统向用者收集。
所获得的底幅材基板可以为包含预涂层的来自造纸厂的现成的预涂布消费卷(customer reel)。根据本发明的一个实施方式,在底幅材基板涂布有阻挡层前可以使底幅材基板涂布有预涂层,即可以一个接一个地进行所有涂布步骤。所述预涂层通常包含粗矿物颗粒和/或颜料颗粒,例如碾碎的碳酸钙、高岭土、沉淀的碳酸钙或滑石。通过沉降测定,所述颗粒的平均粒径通常可以超过1μm,但所采用的矿物/颜料的粒径并不是重要因素。出于经济原因优选粗颗粒。可以通过表面施胶,可能通过使用颜料化表面施胶剂(surface size,即包含颜料颗粒的表面施胶剂)获得预涂层。涂层重量可以为1.0-2.0g/m2。
根据本发明的一个实施方式,可能在阻挡层和在先层之间涂布光滑层,其中所述在先层可以是预涂层。换句话说,可以将光滑层涂布至包含预涂层的底幅材基板。所述光滑层包含细的矿物颗粒和/或颜料颗粒,例如碳酸钙、高岭土、煅烧高岭土、滑石、二氧化钛、石膏、白垩、缎光白、硫酸钡、硅铝酸钠、氢氧化铝或其任意混合物。通过沉积测定,所述矿物颗粒/颜料颗粒的平均粒径通常可以小于1μm。
可以通过表面施胶获得光滑层。根据在先层和底幅材基板,所述光滑层的厚度通常为3-7μm。光滑层的功能是使要涂布的阻挡层的表面光滑且平坦,从而保证终产品的改良的印制性质。如果底幅材基板的表面本来就光滑或者其表面通过预涂布变得光滑,光滑层可以是薄的或者其可以完全省略。因此,光滑层不是必须的,但其可以改善最终基板的印制性质。用于光滑层的典型涂布量为约3-15g/m2。
所述阻挡层通常包含乳胶或聚烯烃分散体。可以用在本发明的典型的合成乳胶为本领域已知的乳胶,例如苯乙烯丁二烯(SB)、苯乙烯丙烯酸酯(SA)、聚乙烯醇或聚乙酸乙烯酯(PVAc)乳胶或其任意混合物。优选地,所述乳胶为苯乙烯丙烯酸共聚物乳胶或苯乙烯丁二烯乳胶。典型的聚烯烃分散体为可通过使用机械分散技术获得的基于水的分散体。所述聚烯烃分散体可以具有高的固体含量,即40-55重量%固体,并且平均粒径可以小于1μm。合适的聚烯烃是乙烯和丙烯共聚物。
根据一个优选的实施方式,阻挡层包含乳胶和矿物颗粒和/或颜料颗粒,其提高了阻挡层的表面能。阻挡层的表面能的提高改善了顶涂层至阻挡层的粘附。所采用的矿物颗粒/颜料颗粒可以与顶涂层中所用的(即高岭土、沉淀碳酸钙(PCC)、碾磨碳酸钙(GCC)、滑石、云母或其包含两种或更多种所述矿物/颜料的混合物)相同。通常,阻挡层中矿物颗粒/颜料颗粒的量为0-85重量%,更通常为0.1-50重量%。特别地,当使用纵横比为50-150,优选约100的扁平状颜料,例如高岭土、滑石或云母时,阻挡层中颜料的量可以为>50重量%,例如50-85重量%。颗粒的纵横比描述了颗粒长度和颗粒宽度之比,即给出的纵横比可以为颗粒的最长尺寸和最短尺寸之比,并且被更具体地定义为穿过颗粒的几何中心的最长和最短颗粒半径之比。通过提高阻挡层中的颜料颗粒和/或矿物颗粒的量,可以根据相关需要而容易地控制阻挡层的重量和厚度。通过调整阻挡层中矿物颗粒/颜料颗粒的量,还可能控制阻挡层的渗透性、多孔性、表面能和表面形貌学。
阻挡层的厚度通常为1-25μm,优选2-10μm。涂布量通常为0.5-30g/m2。
根据本发明,将薄顶涂层涂布在阻挡层上,优选与之直接接触。所述顶涂层包含矿物颗粒和/或颜料颗粒,从而改善最终基板的可印制性,并且有利地,所述顶涂层尽可能的薄和光滑。可以用在顶涂层中的典型矿物/颜料是碳酸钙、高岭土、煅烧高岭土、滑石、二氧化钛、石膏、白垩、缎光白、硫酸钡、硅铝酸钠、氢氧化铝或其任意混合物,优选高岭土或沉淀的碳酸钙(PCC)。通常,顶涂层中的矿物颗粒/颜料颗粒的量为60-100重量%,更优选85-95重量%。顶涂层中的矿物/颜料可以混合有乳胶,例如苯乙烯丁二烯乳胶、苯乙烯-正丁基-丙烯酸酯乳胶、聚丙烯酸乙烯酯乳胶、聚乙烯醇乳胶、聚乙酸乙烯酯乳胶或其任意混合物。或者,顶涂层中的矿物/颜料可以混合有聚烯烃分散体。还可以以两个或数个步骤涂布顶涂层,即所述顶涂层可以包含已经涂布在彼此顶部的两个或更多个亚层。
通常,顶涂层的厚度为0.4-15μm,更通常为0.7-10μm。所述涂布量通常为0.5-15g/m2,更通常为0.7-8g/m2。
所述顶涂层可以包含与阻挡层相同的组分,但顶涂层和阻挡层彼此不同,至少其物理性质不同,并且其化学组成也常常不同。至少顶涂层和阻挡层的表面能彼此不同。如果顶涂层和阻挡层包含相同组分,不同层中所述组分间的比例也不同。
在本发明的一个实施方式中,可能使用醇而非水作为用于顶涂层的分散介质。在阻挡层具有低的表面能且疏水性非常低的那些情况下,这可以改善阻挡层上顶涂层的涂布或者使能够在阻挡层上涂布顶涂层。
本发明的优势是用于产生可印制基板的材料是广泛用于造纸和涂布的散装化学品(bulk chemicals)。原则上,在构建可印制基板时,在本发明中可以使用来自任何供应商的并且具有所需性质的常规工业级化学品。这表示为了获得适合印制电路的基板,不需要使用昂贵和/或特制化学品。
根据本发明的一个实施方式,通过控制顶涂层的厚度和多孔性可能控制整饰基板(finished substrate)的印制性质。换句话说,通过控制顶涂层的厚度和多孔性,可能调整导电或半导电印制色料或墨的量。印制色料或墨渗透至顶涂层,但在阻挡层终止。如果顶涂层厚或者多孔,更多的印制色料被其吸收,并获得更强的导电性质。
通过正确选择顶涂层和/或阻挡层中的矿物/颜料类型、质量和量,还可能控制最终基板的印制性质。例如,可以通过选择顶涂层中使用的颜料颗粒(其影响顶涂层的多孔性、孔几何学、渗透性、表面能和粗糙度)调整印制质量、印制分辨率和墨附着力。例如,包含沉淀碳酸钙(PCC)颗粒的顶涂层通常比包含高岭土颗粒的顶涂层更多孔且粗糙。由于通过提高粗糙度防止了墨滴(drop)的传播,包含PCC颗粒的顶涂层因此常常显示更锐利的印制分辨率。当印制功能墨可以渗透至顶涂层而不渗透至阻挡层中时,决定在基板上形成完整膜所需的墨量的是顶涂层的厚度。用于包含PCC颗粒的多孔顶涂层所需的墨量通常高于用于包含高岭土颗粒的紧密的且密实的顶涂层。
可以通过调整阻挡层中矿物颗粒/颜料颗粒的量、类型和/或质量控制阻挡层的表面能。阻挡层的表面能可以用以改善顶涂层至阻挡层表面的粘附或者能够使顶涂层粘附至阻挡层的表面。阻挡层的表面能还可以用以在功能印制墨渗透顶涂层并到达阻挡层表面后控制印制墨在阻挡层表面的传播。
根据本发明的一个实施方式,以刮刀涂布、棒涂布、反向凹版涂布或帘幕涂布进行不同层的涂布。这意味着通过使用常规的卷对卷(roll-to-roll或reel-to-reel)涂布方法可以将不同层涂布至底幅材基板,使基板的制造容易且划算。这些涂布方法能够以低成本产生大量基板,这对于制备一次性电路或印制功能装置是重要的。根据本发明的一个实施方式,通常通过利用热压花可以将通道(channels)或孔结构等压印至基板。这尤其适合于制造传感器,其中预期分析物将停留在基板的某些部分内或者以某种限定的方式流过传感器。可能结合有机和/或无机试剂或反应物,例如酶或指示剂。可以通过将所述试剂或反应物印制或涂布至通道或孔而进行粘附。
可能在涂布顶涂层后对所述基板进行压光,以改善顶涂层与阻挡层的粘附并避免可能的剥纸(picking)问题。同时,可以实现高度光滑。可以利用不同的线荷重,例如50-300kN/m对涂布的基板进行压光。可以在提高的温度下,例如40-200℃下进行压光。为了与阻挡层最佳粘附,可以使用数个压光压区(calendering nips)并且可以调整压光参数。利用提高的温度的压光改善了顶涂层至阻挡层的粘附,原因是顶涂层的颗粒被压成部分熔融的阻挡层而没有对其造成破坏。
通过使表面进行λmax=254nm的紫外C辐照、λmax=185nm和λmax=254nm的紫外-臭氧辐照、等离子体处理、电子束处理或电晕处理,可以修饰涂布基板的表面能。还可能通过在涂布顶涂层之前使阻挡层表面进行紫外C辐照、等离子体、电子束或电晕处理,修饰阻挡层的表面。在阻挡层为疏水性且具有低极性的情况下,可能提高极性并且使阻挡层表面更亲水。
通过使用现有印制和涂布方法,例如喷墨印刷、柔版印刷、移印、轮转凹版印刷、胶版印刷、丝网印刷、反凹版印刷、棒涂或旋转涂布,可以将功能装置印制至涂布基板上。在本申请中,印制功能装置包含印制电路、印制电子件、印制传感器或印制显示器等。可以将印制功能件容易地印制在不同种类的封装件或包装件上。印制功能件可以是简单显示器或传感器,其能够显示封装或包装材料的情况,,或者是封装/包装件被打开时的简单显示器或传感器。印制功能件还可以是可以在后勤管理中使用的产品ID或RFID标签。通常,本发明的印制功能件可用在柔性显示器、智能包装、一次性计算机、光伏产品(photovoltaics)、用于跟踪、库存或行李的标记、电子条形码和智能卡中。
还可能印制至包含两个电极和功能化的半导体或有机导电墨的基板化学电阻器,例如生物传感器或化学传感器。基本上,所述功能化材料本身可以是溶解在合适溶剂中的导电墨、有机导体、有机半导体或绝缘体。阻挡层的溶剂抗性和顶涂层的溶剂耐久性对于基板是重要的。所述阻挡层优选可经受有机溶剂,例如四氢呋喃(THF)、二甲基甲酰胺(DMF)、氯仿、二甲基亚砜(DMSO)、乙醇、乙二醇、二氯苯(DCB)、氯苯(CB)、二甲苯、甲苯、三甲苯、四氢化萘、乙酸乙酯、异丙醇和己醇。所述阻挡层还具有良好的酸/碱抗性,并且优选可经受酸,例如HCl、乙酸和/或碱,例如NaOH。
当待检测的分析物与本发明的涂布基板上的印制半导体接触时,传导性改变,并且可以利用独立的装置检测到该改变。合适的装置为,例如通常在芯片实验室(lab-on-a-chip)应用中使用的独立分析仪。待检测的分析物还可以是固体、气体或液体,优选为气体或液体。当所述分析物为液体形式时,所述基板表面优选可经受该分析物,从而使涂布基板可以沉渗在液体流中或者可以被浸入液体中。优选地,所述阻挡层是疏水的,但顶涂层中的颜料颗粒和/或矿物颗粒提高了基板的表面能,使所述表面亲水。
在印制功能件,例如电路被印制在本发明的涂布基板上后,可以通过烧结处理改善所述电路的导电性质。如果色料包含银这将尤其有利,原因是银颗粒熔融形成均匀层和/或有机化合物从颗粒表面被分解,确保高导电性。
可以在炉中或通过IR辐照进行烧结,优选IR辐照。在用IR辐照的烧结中,热主要影响基板表面(传导色料设于此)并且在该短时间内不影响顶涂层之下的阻挡层。还可以容易地将IR烧结应用至卷对卷工序中。通过使用气体加热或IR电加热装置可以进行利用红外线(IR)辐照的烧结。对于气体加热IR装置所采用的烧结温度可以为约900℃-1200℃,而对于IR电加热装置则高达2000℃。所需的热取决于多个因素,例如卷对卷工序中幅材的速度就是一个重要的因素。速度越高,烧结所需的温度就越高,原因是与表面的接触时间短。通常,可以根据所用墨和幅材速度调整烧结中使用的参数。例如,约180℃的烧结温度可能需要约5-15秒的处理时间,通常需要约10秒。约300℃的烧结温度可能需要约1-10秒的处理时间,通常需要约5秒。
附图说明
通过以下非限制性示意图和图像对本发明进行更详细的说明。
图1A-1C示意性地显示了本发明的一些实施方式的层状结构的实施例。
图2显示了显示本发明的实施方式的层状基板结构的横截面SEM图像。
图3显示了显示本发明的实施方式的层状基板结构的横截面SEM图像。
图4示意性地显示了本发明的一个实施方式的全印制HIFET晶体管。
图5示意性地显示了本发明的另一个实施方式的全印制HIFET晶体管。
图6示意性地显示了本发明的一个实施方式的全印制传感器。
图1A-1C示意性地显示了本发明的一些实施方式的层状结构的实例。在图1A中,底幅材基板1涂布有预涂层2。在预涂层上涂覆光滑层3,并且在光滑层3上方涂布阻挡层4。基板10的表面由涂布在阻挡层4上的顶涂层5构成。
图1B显示了层状基板10′的另一实施方式,其中底幅材基板1涂布有预涂层2。在预涂层上直接涂布阻挡层4。基板10′的表面由涂布在阻挡层4上的顶涂层5构成。不使用光滑层。
图1C显示的是层状基板10″又另一实施方式,其中底幅材基板1直接涂布有阻挡层4。基板10″的表面由涂布在阻挡层4上的顶涂层5制得。不使用预涂层或光滑层。
图2为显示了本发明的实施方式的基板的层状结构的横截面SEM图像。将两面涂布有预涂层2、2′的底纸1用作底幅材基板。预涂层2、2′包含碾碎的碳酸钙颗粒。在最上方的预涂层2上涂布光滑层3,所述光滑层3包含高岭土颗粒以尽可能地获得光滑且平坦的表面。在光滑层3上涂布阻挡层4,并将顶涂层5涂布在阻挡层4上。所述阻挡层主要包含乳胶且顶涂层主要包含沉淀碳酸钙或高岭土颗粒。可以看出,在该实施方式中,阻挡层4明显比顶涂层5、光滑层3或预涂层2、2′厚。在图2的实施方式中,本发明的层状结构仅产生底幅材基板1的一面。显然,如果需要可以在所述底幅材基板的两面上涂布类似的层状结构,并且底幅材基板不同面上的层可以不同。
图3为显示了本发明的实施方式的基板的层状结构的横截面SEM图像。使用两面涂布有预涂层2、2′的底纸1作为底幅材基板。在最上方的预涂层2上涂布光滑层3,以尽可能地获得光滑且平坦的表面。在光滑层3上涂布阻挡层4,并将顶涂层5涂布在阻挡层4上。所述阻挡层主要包含混合有矿物颗粒的乳胶和顶涂层主要包含沉淀碳酸钙或高岭土颗粒。可以在顶涂层5的上方观察到印制银墨层。
图4示意性地显示了本发明的一个实施方式的全印制HIFET晶体管。所述全印制HIFET晶体管31包含用于源32和排放管32′的银墨、Ag。用溶解在二氯苯中的聚-3-己基噻吩(P3HT)层33覆盖银源32和排放管32′,其中层33发挥半导体的功能。用聚乙烯苯酚(PVP)层34覆盖该P3HT层33,其中聚乙烯苯酚层34发挥绝缘体的功能。在绝缘体层34上布置聚(3,4-乙撑二氧基噻吩)∶聚(苯乙烯磺酸盐)(PEDOT∶PSS)柵35。PEDOT∶PSS柵35被印制成两层35′、35″。通过使用醇作为溶剂印制第一层35′,通过使用水作为溶剂印制第二层35″。所述醇优选在第一柵层35′中用作溶剂,原因是包含PVP的绝缘体层34溶于水。在这种情况下,由于相邻层的溶剂不同,而有可能避免在印制第一柵层35′时已经印制的绝缘体层34的潜在溶解。在制造中采用了喷墨印刷法,印刷机是DimatixTM Materials Printer(DMP-2800)。
图5示意性地显示了本发明的另一个实施方式的全印制HIFET晶体管。全印制HIFET晶体管31包含用于印制在本发明的多层涂布纸40上的源32和排放管32′的银墨、Ag。用聚-3-己基噻吩(P3HT)层33覆盖银源32和排放管32′,其中层33发挥半导体的功能。用聚乙烯苯酚(PVP)层34覆盖该P3HT层33,其中聚乙烯苯酚层34发挥绝缘体的功能。在绝缘体层34上布置聚(3,4-乙撑二氧基噻吩)∶聚(苯乙烯磺酸盐)(PEDOT∶PSS)柵35。PEDOT∶PSS柵35印制成一层。在制造中采用了喷墨印刷法,印刷机是Dimatix Materials Printer(DMP-2800)。
图6示意性地显示了本发明的一个实施方式的全印制传感器。全印制传感器61包含用于印制在本发明的多层涂布纸60上的电极62、62′的银墨、Ag。在电极62、62′之间布置有有机导电墨或导电聚合物(例如聚苯胺(PANI))层63。缓冲液中的分析物层64、64′与识别层65反应,由此使层63的传导性改变。识别层65包含埋在保护基质67中的识别组分66、66′。所述识别组分可以选自包含不同酶、抗体和官能团的组,并且所述保护基质可以为,例如离子导电水凝胶。根据传感器的功能和设计,可以省略包含识别组分和保护基质的所述识别层。在图6中用箭头表示流至传感器表面或从传感器表面流出的液体或气体。
即使参考目前似乎是最可行的和优选的实施方式描述了本发明,应当理解,本发明不应限于上述实施方式,但本发明还旨在覆盖所附权利要求范围内的不同的变体和等同的技术方案。
Claims (14)
1.产生印制或涂布功能件用基板的方法,其包括:
-获得包含纤维素和/或木纤维的底幅材基板,
-使所述底幅材基板涂布有阻挡层,和
-使所述阻挡层涂布有包含矿物颗粒和/或颜料颗粒的顶涂层。
2.如权利要求1所述的方法,其特征在于,通过在涂布所述顶涂层之前使所述阻挡层进行能量处理或者通过控制所述阻挡层内矿物颗粒和/或颜料颗粒的量来控制所述阻挡层的表面能。
3.如权利要求2所述的方法,其特征在于,在向所述阻挡层上涂布所述顶涂层之前,使所述阻挡层的表面进行紫外C辐照、等离子体、E-束或电晕处理。
4.如权利要求1、2或3所述的方法,其特征在于,在使所述底幅材基板涂布有所述阻挡层前,使所述底幅材基板涂布有预涂层和/或光滑层。
5.如权利要求1-4中任一项所述的方法,其特征在于,控制所述顶涂层的厚度,以控制所述整饰基板的印制性质。
6.如权利要求1-5中任一项所述的方法,其特征在于,通过刮刀涂布、棒涂布、反向凹版涂布或帘幕涂布对不同的层进行涂布。
7.如权利要求1-6中任一项所述的方法,其特征在于,在涂布所述顶涂层后对所述基板进行压光处理。
8.印制或涂布功能件用基板,其包含:
-包含纤维素和/或木纤维的底幅材基板层,
-涂布在所述底幅材基板层上的阻挡层,
-涂布在所述阻挡层上的包含矿物颗粒和/或颜料颗粒的顶涂层。
9.如权利要求8所述的基板,其特征在于,所述阻挡层包含乳胶或聚烯烃和矿物颗粒和/或颜料颗粒。
10.如权利要求8或9所述的基板,其特征在于,所述顶涂层包含以下物质的颗粒:沉淀的碳酸钙、高岭土、煅烧高岭土、滑石、二氧化钛、石膏、白垩、缎光白、硫酸钡、硅铝酸钠、氢氧化铝或其任意混合物,优选为高岭土或沉淀的碳酸钙。
11.如权利要求8-10中任一项所述的基板,其特征在于,所述基板包含置于所述底幅材基板层和所述阻挡层之间的预涂层和/或光滑层。
12.一种功能装置,其通过使用印制,例如喷墨印刷、柔版印刷、移印、轮转凹版印刷、胶版印刷、丝网印刷,或涂布,例如反向凹版涂布、刮刀涂布、棒涂布、浸涂、滴涂、帘幕涂布、喷涂、旋转涂布或压花而印制和/或涂布在权利要求8-11中任一项所述的基板上。
13.如权利要求12所述的功能装置,其特征在于,所述功能装置是电路、印制电子件、印制传感器、印制显示器、产品的ID或RFID标记。
14.权利要求12或13所述的功能装置在柔性显示器、智能包装、一次性计算机、光伏产品、用于跟踪、库存或行李的标记、电子条形码和智能卡中的用途。
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- 2010-02-02 EP EP10704581.7A patent/EP2392197B1/en not_active Not-in-force
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Publication number | Priority date | Publication date | Assignee | Title |
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CN105849032A (zh) * | 2013-10-23 | 2016-08-10 | 多伦多大学董事局 | 打印式数字微流体装置的使用及其制造方法 |
CN106104584A (zh) * | 2014-04-02 | 2016-11-09 | 意法半导体股份有限公司 | 增强的ic卡 |
CN106104584B (zh) * | 2014-04-02 | 2019-02-19 | 意法半导体股份有限公司 | 增强的ic卡 |
CN106325020A (zh) * | 2016-09-23 | 2017-01-11 | 深圳市科洛德打印耗材有限公司 | 涂液、涂液的制作方法、清洁刮刀的制作方法及清洁刮刀 |
Also Published As
Publication number | Publication date |
---|---|
WO2010086511A1 (en) | 2010-08-05 |
FI20095089A0 (fi) | 2009-02-02 |
CN102301836B (zh) | 2014-07-23 |
EP2392197A1 (en) | 2011-12-07 |
US20110293851A1 (en) | 2011-12-01 |
EP2392197B1 (en) | 2014-11-19 |
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