FI20095089A0 - Menetelmä substraatin luomiseksi painetulle toiminnallisuudelle, substraatti ja painettu toiminnallinen laite - Google Patents
Menetelmä substraatin luomiseksi painetulle toiminnallisuudelle, substraatti ja painettu toiminnallinen laiteInfo
- Publication number
- FI20095089A0 FI20095089A0 FI20095089A FI20095089A FI20095089A0 FI 20095089 A0 FI20095089 A0 FI 20095089A0 FI 20095089 A FI20095089 A FI 20095089A FI 20095089 A FI20095089 A FI 20095089A FI 20095089 A0 FI20095089 A0 FI 20095089A0
- Authority
- FI
- Finland
- Prior art keywords
- substrate
- printed
- functionality
- functional device
- coated
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 8
- 238000000034 method Methods 0.000 title abstract 3
- 230000004888 barrier function Effects 0.000 abstract 4
- 229920003043 Cellulose fiber Polymers 0.000 abstract 2
- 229920002522 Wood fibre Polymers 0.000 abstract 2
- 239000001913 cellulose Substances 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 229910052500 inorganic mineral Inorganic materials 0.000 abstract 2
- 239000011707 mineral Substances 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- 239000000049 pigment Substances 0.000 abstract 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/50—Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
- B41M5/52—Macromolecular coatings
- B41M5/5218—Macromolecular coatings characterised by inorganic additives, e.g. pigments, clays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0386—Paper sheets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M2205/00—Printing methods or features related to printing methods; Location or type of the layers
- B41M2205/38—Intermediate layers; Layers between substrate and imaging layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0284—Paper, e.g. as reinforcement
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
- H10K10/471—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising only organic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
- H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31971—Of carbohydrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31971—Of carbohydrate
- Y10T428/31989—Of wood
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/147,424 US20110293851A1 (en) | 2009-02-02 | 2006-02-02 | Method for creating a substrate for printed or coated functionality, substrate, functional device and its use |
FI20095089A FI20095089A0 (fi) | 2009-02-02 | 2009-02-02 | Menetelmä substraatin luomiseksi painetulle toiminnallisuudelle, substraatti ja painettu toiminnallinen laite |
EP10704581.7A EP2392197B1 (en) | 2009-02-02 | 2010-02-02 | Method for creating a substrate for printed or coated functionality, substrate and its use |
PCT/FI2010/050056 WO2010086511A1 (en) | 2009-02-02 | 2010-02-02 | Method for creating a substrate for printed or coated functionality, substrate, functional device and its use |
CN201080006446.5A CN102301836B (zh) | 2009-02-02 | 2010-02-02 | 产生印制或涂布功能件用基板的方法、基板、功能装置及其用途 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20095089A FI20095089A0 (fi) | 2009-02-02 | 2009-02-02 | Menetelmä substraatin luomiseksi painetulle toiminnallisuudelle, substraatti ja painettu toiminnallinen laite |
Publications (1)
Publication Number | Publication Date |
---|---|
FI20095089A0 true FI20095089A0 (fi) | 2009-02-02 |
Family
ID=40404593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20095089A FI20095089A0 (fi) | 2009-02-02 | 2009-02-02 | Menetelmä substraatin luomiseksi painetulle toiminnallisuudelle, substraatti ja painettu toiminnallinen laite |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110293851A1 (fi) |
EP (1) | EP2392197B1 (fi) |
CN (1) | CN102301836B (fi) |
FI (1) | FI20095089A0 (fi) |
WO (1) | WO2010086511A1 (fi) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PT103999B (pt) * | 2008-03-20 | 2012-11-16 | Univ Nova De Lisboa | Processo de utilização e criação de papel à base de fibras celulósicas naturais, fibras sintéticas ou mistas como suporte físico e meio armazenador de cargas elétricas em transístores de efeito de campo com memória autossustentáveis usando óxidos sem |
PT104635A (pt) * | 2009-06-16 | 2010-12-16 | Univ Nova De Lisboa | Dispositivo electrocrómico e método para a sua produção |
WO2011137533A1 (en) | 2010-05-05 | 2011-11-10 | The Governing Council Of The University Of Toronto | Method of processing dried samples using digital microfluidic device |
FI20105692A0 (fi) | 2010-06-15 | 2010-06-15 | Aabo Akademi University | Menetelmä arkkimaisen reaktiolevyn valmistamiseksi, reaktiolevy ja sen käyttö |
EP2632731B1 (en) * | 2010-10-29 | 2015-06-03 | Hewlett-Packard Development Company, L.P. | Photo paper |
WO2014098275A1 (ko) * | 2012-12-17 | 2014-06-26 | 코오롱글로텍주식회사 | 플렉서블 디스플레이를 위한 평탄화 섬유기판의 제조방법 |
FR3005320B1 (fr) * | 2013-05-02 | 2015-11-20 | Arjo Wiggins Fine Papers Ltd | Support plan hydrophobe |
FR3005391B1 (fr) * | 2013-05-03 | 2016-12-09 | Linxens Holding | Procede de fabrication d'un circuit flexible pour module de carte a puce, circuit flexible de carte a puce otenu par ce procede et module de carte a puce comportant un tel circuit flexible |
FR3012153B1 (fr) * | 2013-10-21 | 2016-03-04 | Arjo Wiggins Fine Papers Ltd | Papier destine en particulier a l'impression d'une couche electro-conductrice |
MX2016005353A (es) * | 2013-10-23 | 2017-03-01 | Governing Council Univ Toronto | Dispositivos microfluidicos digitales impresos, metodos de uso y fabricacion de los mismos. |
CN106104584B (zh) * | 2014-04-02 | 2019-02-19 | 意法半导体股份有限公司 | 增强的ic卡 |
JP6630053B2 (ja) * | 2015-03-25 | 2020-01-15 | スタンレー電気株式会社 | 電子デバイスの製造方法 |
JP6491032B2 (ja) | 2015-04-24 | 2019-03-27 | スタンレー電気株式会社 | 抵抗器の製造方法、および、抵抗器 |
US10464067B2 (en) | 2015-06-05 | 2019-11-05 | Miroculus Inc. | Air-matrix digital microfluidics apparatuses and methods for limiting evaporation and surface fouling |
US10695762B2 (en) | 2015-06-05 | 2020-06-30 | Miroculus Inc. | Evaporation management in digital microfluidic devices |
EP3362297B1 (en) * | 2015-10-14 | 2021-07-21 | Capital One Services, LLC | Multilayer composite backed card |
FI129075B (fi) * | 2016-03-24 | 2021-06-30 | Paptic Ltd | Menetelmä luonnonkuituja ja synteettisiä kuituja sisältävän kuituradan valmistamiseksi |
WO2018022020A1 (en) | 2016-07-26 | 2018-02-01 | Hewlett-Packard Development Company, L.P. | Coating composition for corrugated paper board |
WO2018039281A1 (en) | 2016-08-22 | 2018-03-01 | Miroculus Inc. | Feedback system for parallel droplet control in a digital microfluidic device |
CN106325020A (zh) * | 2016-09-23 | 2017-01-11 | 深圳市科洛德打印耗材有限公司 | 涂液、涂液的制作方法、清洁刮刀的制作方法及清洁刮刀 |
EP3563151A4 (en) | 2016-12-28 | 2020-08-19 | Miroculus Inc. | DIGITAL MICROFLUIDIC DEVICES AND METHODS |
US11623219B2 (en) | 2017-04-04 | 2023-04-11 | Miroculus Inc. | Digital microfluidics apparatuses and methods for manipulating and processing encapsulated droplets |
EP3405011A1 (en) * | 2017-05-16 | 2018-11-21 | Arjo Wiggins Fine Papers Limited | Paper-in-resin electronics - process for producing it and application in manufactured products |
JP7128659B2 (ja) | 2017-06-15 | 2022-08-31 | ダウ グローバル テクノロジーズ エルエルシー | 機能性ポリオレフィンフィルムでコーティングされた紙 |
CN110892258A (zh) | 2017-07-24 | 2020-03-17 | 米罗库鲁斯公司 | 具有集成的血浆收集设备的数字微流控系统和方法 |
CN115582155A (zh) | 2017-09-01 | 2023-01-10 | 米罗库鲁斯公司 | 数字微流控设备及其使用方法 |
US11786840B2 (en) | 2017-11-17 | 2023-10-17 | Saint-Gobain Ceramics & Plastics, Inc. | Filtration process and assembly |
CN112469504A (zh) | 2018-05-23 | 2021-03-09 | 米罗库鲁斯公司 | 对数字微流控中的蒸发的控制 |
WO2020076876A1 (en) | 2018-10-09 | 2020-04-16 | Reelables, Inc. | Low-power electronic tape for tracking items |
CA3133124A1 (en) | 2019-04-08 | 2020-10-15 | Miroculus Inc. | Multi-cartridge digital microfluidics apparatuses and methods of use |
WO2021016614A1 (en) | 2019-07-25 | 2021-01-28 | Miroculus Inc. | Digital microfluidics devices and methods of use thereof |
US11857961B2 (en) | 2022-01-12 | 2024-01-02 | Miroculus Inc. | Sequencing by synthesis using mechanical compression |
CN115305744B (zh) * | 2022-08-31 | 2023-07-04 | 安徽清澜新材料科技有限公司 | 光伏台面纸用无纺布及其生产方法 |
Family Cites Families (17)
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US3960797A (en) * | 1973-12-28 | 1976-06-01 | Pennwalt Corporation | Water-in-oil emulsions of fluoroalkyl polymer, chlorinated alkane solvent and non-ioinic surfactant |
EP0605840A3 (en) * | 1992-12-25 | 1994-12-14 | Mitsubishi Paper Mills Ltd | Inkjet recording sheet. |
US5709976A (en) * | 1996-06-03 | 1998-01-20 | Xerox Corporation | Coated papers |
US6203067B1 (en) * | 1997-12-17 | 2001-03-20 | Moore U.S.A., Inc. | Linerless postage stamps with cancellation ink absorbing particles |
DE60026248T2 (de) * | 1999-10-25 | 2006-11-16 | Oji Paper Co., Ltd. | Aufzeichnungsblatt für Tintenstrahldruck |
US20020182376A1 (en) * | 2001-03-27 | 2002-12-05 | Debabrata Mukherjee | Novel universal ink jet recording medium |
US6857736B2 (en) * | 2001-08-10 | 2005-02-22 | Seiko Epson Corporation | Ink jet recorded matter and production process therefor, and thermal transfer sheet, ink jet recording apparatus, thermal transfer apparatus, and ink jet recording medium |
US20030152752A1 (en) * | 2001-09-25 | 2003-08-14 | Oji Paper Co., Ltd. | Water-resistant and organic solvent-resistant recording sheet |
EP1295729A3 (en) * | 2001-09-25 | 2003-05-14 | Oji Paper Co., Ltd. | Water-resistant and organic solvent-resistant recording sheet |
US20060159838A1 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Controlling ink migration during the formation of printable electronic features |
EP1383364A3 (en) * | 2002-05-23 | 2006-01-04 | Nashua Corporation | Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture |
EP1544905A4 (en) * | 2002-09-25 | 2009-11-18 | Konica Minolta Holdings Inc | ELECTRICAL SWITCHING, THIN FILM TRANSISTOR, METHOD FOR PRODUCING ELECTRICAL SWITCHING AND METHOD FOR PRODUCING A THIN FILM TRANSISTOR |
GB2410705B (en) * | 2004-02-03 | 2007-08-22 | Ilford Imaging Uk Ltd | Recording material and method |
WO2006076604A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Processes for planarizing substrates and encapsulating printable electronic features |
US7955668B2 (en) * | 2006-10-12 | 2011-06-07 | Hewlett-Packard Development Company, L.P. | Media sheet |
EP1926357A3 (en) * | 2006-11-21 | 2009-09-30 | Ricoh Company, Ltd. | Functional device fabrication apparatus and functional device fabricated with the same |
US20090053409A1 (en) * | 2007-08-24 | 2009-02-26 | Fujifilm Corporation | Recording medium, method for producing the same, and inkjet recording method using the recording medium |
-
2006
- 2006-02-02 US US13/147,424 patent/US20110293851A1/en not_active Abandoned
-
2009
- 2009-02-02 FI FI20095089A patent/FI20095089A0/fi not_active Application Discontinuation
-
2010
- 2010-02-02 WO PCT/FI2010/050056 patent/WO2010086511A1/en active Application Filing
- 2010-02-02 CN CN201080006446.5A patent/CN102301836B/zh not_active Expired - Fee Related
- 2010-02-02 EP EP10704581.7A patent/EP2392197B1/en not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
WO2010086511A1 (en) | 2010-08-05 |
EP2392197A1 (en) | 2011-12-07 |
EP2392197B1 (en) | 2014-11-19 |
CN102301836A (zh) | 2011-12-28 |
US20110293851A1 (en) | 2011-12-01 |
CN102301836B (zh) | 2014-07-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD | Application lapsed |