CN102270630A - Light emitting device package - Google Patents

Light emitting device package Download PDF

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Publication number
CN102270630A
CN102270630A CN2011101521731A CN201110152173A CN102270630A CN 102270630 A CN102270630 A CN 102270630A CN 2011101521731 A CN2011101521731 A CN 2011101521731A CN 201110152173 A CN201110152173 A CN 201110152173A CN 102270630 A CN102270630 A CN 102270630A
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CN
China
Prior art keywords
luminescent device
reflector
wiring
main body
height
Prior art date
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Granted
Application number
CN2011101521731A
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Chinese (zh)
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CN102270630B (en
Inventor
闵凤杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Lekin Semiconductor Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100051840A external-priority patent/KR101103674B1/en
Priority claimed from KR1020110034720A external-priority patent/KR101859149B1/en
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Priority to CN201510782887.9A priority Critical patent/CN105355624B/en
Priority to CN201510783126.5A priority patent/CN105448905B/en
Priority to CN201510784661.2A priority patent/CN105355625A/en
Publication of CN102270630A publication Critical patent/CN102270630A/en
Application granted granted Critical
Publication of CN102270630B publication Critical patent/CN102270630B/en
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Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

A light emitting device package (100) is provided. The light emitting device package may include a main body (110) having a cavity including side surfaces and a bottom, and a first reflective cup (122) and a second reflective cup (124) provided in the bottom of the cavity (105) of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup.

Description

The luminescent device encapsulation
The cross reference of related application
The application requires the priority of the korean patent application No.10-2010-0051840 of submission on June 1st, 2010, by reference its integral body is incorporated into here, as setting forth fully at this.
The application requires the priority of the korean patent application No.10-2011-0034720 of submission on April 14th, 2011, by reference its integral body is incorporated into here, as setting forth fully at this.
Technical field
The present invention relates to a kind of luminescent device encapsulation.
Background technology
For example the luminescent device of light-emitting diode can comprise the semiconductor device that converts electrical energy into light.Such light-emitting diode can use such semiconductor device to produce light, thereby compares with for example incandescent lamp or fluorescent lamp, consumes few relatively energy.Light-emitting diode can use the gesture crack of semiconductor device to produce light, thereby long relatively life-span and fast response time is provided, and is environmental protection.
Summary of the invention
The luminescent device encapsulation comprises: main body, and this main body has the cavity that is formed on wherein, and this cavity comprises side surface and bottom; First reflector and second reflector, this first reflector and second reflector are arranged in the bottom of cavity and the part of the bottom by cavity is separated from each other; First luminescent device, this first luminescent device is arranged in first reflector; And second luminescent device, this second luminescent device is arranged in second reflector.
First reflector and second reflector form depression in the bottom of cavity.The part of each in first reflector and second reflector can and be exposed to the outside of main body by main body.The shape and size of first reflector and second reflector are symmetry substantially.Each side surface of in first reflector and second reflector each can be between 90 ° and 160 ° with respect to the inclination angle of its each basal surface.
The luminescent device encapsulation can further comprise step edge, and this step edge is formed on the upper surface of main body and is formed between the upper end of the cavity in the main body, and the upper surface of this step edge and main body has the difference in height of regulation and is parallel to the upper surface of main body.The upper surface that the upper surface of first reflector is parallel to the upper surface of first luminescent device and second reflector can be parallel to the upper surface of second luminescent device.The height of first reflector can be greater than the height of second luminescent device greater than the height of the height of first luminescent device and second reflector.The degree of depth of first reflector can be greater than the height of first luminescent device and can be less than the twice of the height of first luminescent device, and the degree of depth of second reflector can be greater than the height of second luminescent device and can be less than the twice of the height of second luminescent device.The height of first reflector can be less than the height of second luminescent device less than the height of the height of first luminescent device and second reflector.The degree of depth of first reflector can be less than the height of first luminescent device and can be greater than half of the height of first luminescent device, and the degree of depth of second reflector can be less than the height of second luminescent device and can be greater than half of the height of second luminescent device.
The luminescent device encapsulation can further comprise encapsulating material, this encapsulating material is filled the inside of the cavity of main body, wherein the inside of first reflector of first luminescent device and the inside that second reflector of second luminescent device wherein is set is set, with first luminescent device and second luminescent device and external isolation.
The luminescent device encapsulation comprises: main body, and this main body has the cavity that is formed on wherein; First reflector and second reflector, this first reflector and second reflector are arranged in the bottom of cavity; First luminescent device, this first luminescent device is arranged in first reflector; Second luminescent device, this second luminescent device is arranged in second reflector; And connection pads, this connection pads is arranged in the bottom of cavity and with first reflector separates with second reflector.
First and second reflectors can be by cavity the part of bottom be separated from each other, and wherein be electrically connected first luminescent device and second luminescent device via connection pads.
The luminescent device encapsulation can further comprise: first wiring, and this first wiring connects first reflector and first luminescent device; Second wiring, this second wiring connects first luminescent device and connection pads; The 3rd wiring, the 3rd wiring connects the connection pads and second luminescent device; And the 4th wiring, the 4th wiring connects second luminescent device and second reflector, and wherein first luminescent device and second luminescent device are connected in series by first wiring, second wiring, the 3rd wiring and the 4th wiring.
The luminescent device encapsulation can further comprise first wiring, and this first wiring connects first reflector and first luminescent device; Second wiring, this second wiring connects first luminescent device and second reflector; The 3rd wiring, the 3rd wiring connects first reflector and second luminescent device; And the 4th wiring, the 4th wiring connects second luminescent device and second reflector, and wherein first luminescent device connects up and is connected in parallel by first wiring, second wiring, the 3rd wiring and the 4th with second luminescent device.
The luminescent device encapsulation can further comprise first wiring, and this first wiring connects first reflector and first luminescent device; Second wiring, this second wiring connects first luminescent device and second luminescent device; And the 3rd wiring, the 3rd wiring connects second luminescent device and second reflector, and wherein first luminescent device and second luminescent device are connected in series by first wiring, second wiring and the 3rd wiring.
The luminescent device encapsulation comprises: first and second reflectors, and this first and second reflector is orientated as located adjacent one another, and wherein the profile of first and second reflectors forms first and second cavitys respectively; First and second luminescent devices, this first and second luminescent device are separately positioned in first and second cavitys that are formed in first and second reflectors; Sidewall, the periphery of these side walls enclose first and second reflectors; And partition wall, this partition wall is arranged between first and second reflectors, and wherein the height of partition wall is less than the height of sidewall.
Sidewall can extend upward from the top surface of first and second reflectors to limit the 3rd cavity.First and second reflectors can form depression in the bottom of the 3rd cavity.The first of the first of first reflector and second reflector can be exposed to the outside of luminescent device encapsulation by each opening in the bottom of the 3rd cavity.The second portion of the second portion of first reflector and second reflector can extend to the outside of luminescent device encapsulation by the various piece of sidewall.
The luminescent device encapsulation can further comprise: connection pads, this connection pads are arranged on the bottom of the 3rd cavity, separate with second reflector with first reflector, wherein are electrically connected first luminescent device and second luminescent device via connection pads.The luminescent device encapsulation can further comprise many wirings, and every wiring has first end that is connected to first or second luminescent device and one or second end of connection pads being connected respectively in first or second reflector.
The top surface of first luminescent device can be positioned at the top edge below of first reflector and the top surface of second luminescent device can be positioned at below the top edge of second reflector.The top surface of first luminescent device can extend beyond the top edge of first reflector, and the top surface of second luminescent device can extend beyond the top edge of second reflector.The top surface of first luminescent device can be arranged essentially parallel to the top surface of first reflector, and the top surface of second luminescent device can be arranged essentially parallel to the top surface of second reflector.
The degree of depth of first reflector can be greater than the height of first luminescent device and can be less than the twice of the height of first luminescent device, and the degree of depth of second reflector can be greater than the height of second luminescent device and can be less than the twice of the height of second luminescent device.The degree of depth of first reflector can be less than the height of first luminescent device and can be greater than half of the height of first luminescent device, and the degree of depth of second reflector can be less than the height of second luminescent device and can be greater than half of the height of second luminescent device.
The luminescent device encapsulation comprises: main body; First reflector and second reflector, this first reflector and second reflector are arranged in the main body, and are separated from each other by the part of main body; First luminescent device, this first luminescent device is arranged in first reflector; And second luminescent device, this second luminescent device is arranged in second reflector, and wherein first reflector and second reflector are made by the material that is different from main body.
The luminescent device encapsulation can further comprise connection pads, and this connection pads is arranged in the main body, and separates with second reflector with first reflector, and wherein connection pads is made by the material that is different from main body.Can be electrically connected first luminescent device and second luminescent device via connection pads.Main body can be by such as polyphthalamide (PPA) or silicon (Si), photosensitive glass (PSG) or sapphire (Al 2O 3) material make.
The luminescent device encapsulation comprises main body; First reflector and second reflector, this first reflector and second reflector are arranged in the main body; First luminescent device, this first luminescent device is arranged in first reflector, and wherein first luminescent device comprises first electrode and second electrode; And second luminescent device, this second luminescent device is arranged in second reflector, wherein second luminescent device comprises third electrode and the 4th electrode, wherein first electrode is electrically connected to first reflector and the 4th electrode is connected to second reflector, and first electrode and the 4th electrode have the polarity that differs from one another.
Second electrode can be electrically connected to second reflector, and third electrode is electrically connected to first reflector.Second electrode is electrically connected to third electrode.
The luminescent device encapsulation can further comprise connection pads, and this connection pads is arranged in the main body and with first reflector separates with second reflector, and wherein connection pads is electrically connected second electrode and third electrode.First electrode and third electrode can be mutually the same polarity.
The luminescent device encapsulation comprises: bottom section body; First reflector, this first reflector is arranged in the bottom section body; Second reflector, this second reflector are arranged in the bottom and by the part of bottom section body and separate with first reflector; First luminescent device, this first luminescent device is arranged in first reflector; Second luminescent device, this second luminescent device is arranged in second reflector; And the side surface on bottom section body, this side surface surrounds first reflector and second reflector.Luminescent device encapsulation can further be included in connection pads in the bottom section body and this connection pads another part by bottom section body and separate with second reflector with first reflector.
Description of drawings
To describe embodiment with reference to the accompanying drawings in detail, wherein identical Reference numeral is represented components identical, wherein:
Fig. 1 is the perspective view that encapsulates according to the luminescent device at this embodiment that broadly describes;
Fig. 2 is the bottom view of the luminescent device encapsulation shown in Fig. 1;
Fig. 3 is first end view of the luminescent device encapsulation shown in Fig. 1;
Fig. 4 is second end view of the luminescent device encapsulation shown in Fig. 1;
Fig. 5 is the 3rd end view of the luminescent device encapsulation shown in Fig. 1;
Fig. 6 is the 4th end view of the luminescent device encapsulation shown in Fig. 1;
Fig. 7 is the plane graph of the luminescent device encapsulation shown in Fig. 1;
Fig. 8 is the sectional view along the line A-A ' intercepting of the encapsulation of the luminescent device shown in Fig. 7;
Fig. 9 is the sectional view along the line B-B ' intercepting of the encapsulation of the luminescent device shown in Fig. 7;
Figure 10 illustrates according to being connected in series in the luminescent device packaged light emitting device of this embodiment that broadly describes;
Figure 11 illustrates according to being connected in parallel in the luminescent device packaged light emitting device of this another embodiment that broadly describes;
Figure 12 illustrates according to being connected in series in the luminescent device packaged light emitting device of this another embodiment that broadly describes;
Figure 13 a illustrates the degree of depth of basis at first reflector of this embodiment that broadly describes;
Figure 13 b illustrates the degree of depth of basis at first reflector of this another embodiment that broadly describes;
Figure 13 c illustrates the degree of depth of basis at first reflector of this another embodiment that broadly describes;
Figure 14 is according to first luminescent device and second luminescent device at this embodiment that broadly describes;
Figure 15 is according to first connection between the first, second, third and the 4th electrode of this embodiment that broadly describes;
Figure 16 is according to second connection between the first, second, third and the 4th electrode of this embodiment that broadly describes;
Figure 17 is according to the 3rd connection between the first, second, third and the 4th electrode of this embodiment that broadly describes;
Figure 18 is according to the decomposition diagram that comprises the lighting apparatus that luminescent device encapsulates at this embodiment that broadly describes; And
Figure 19 is according to the decomposition diagram that comprises the display device that luminescent device encapsulates at this embodiment that broadly describes.
Embodiment
In the detailed below description, reference forms its a part of accompanying drawing, and illustrates by means of the illustrative specific embodiment of broadly describing at this.In the accompanying drawings, for the convenience described and clear for the purpose of, thickness of each layer or size can be by exaggerative, omissions or schematically illustrated.In addition, each size of component does not need to represent its actual size.In addition, as possible, represent identical or similar elements, although may in different accompanying drawings, be described by identical Reference numeral.
As shown in fig. 1, can comprise according to the luminescent device of the embodiment that broadly describes at this encapsulation 100: main body 110, first reflector 122, second reflector 124, connection pads 126, luminescent device 132 and 134, Zener diode 150 and connect up 152,154,156,158 and 159.
Main body 110 can be by for example such as resin, silicon (Si), metal, photosensitive glass (PSG), the sapphire (Al of polyphthalamide (PPA) 2O 3) and printed circuit board (PCB) (PCB) in one material make.In certain embodiments, main body 110 is by making such as the resin of polyphthalamide (PPA).Main body 110 can be made of a conductor.If main body 110 is made by electric conducting material, dielectric film can be formed on the surface of main body 110 to prevent main body 110 and first reflector 122, second reflector 124 and connection pads 126 electrical shorts so.
When the top is seen, according to the purposes and the design of specific luminescent device encapsulation, the upper surface 106 of main body 110 can have the different shape such as triangle, rectangle, polygon, circle or suitable other shape.For example, as shown in fig. 1, luminescent device encapsulation 100 can be used in the peripheral type back light unit (BLU).For example, if luminescent device encapsulation 100 is applied to portable flash lamp or domestic lighting equipment, main body 110 can be revised as and have the size and dimension that can easily be installed in portable flash lamp or the domestic lighting equipment so.
Main body 110 can comprise cavity 105 (being called as hereinafter, " main body cavity ").The top of cavity 105 can be opened wide, and can comprise side surface 102 and bottom 103.Main body cavity 105 can have cup-shaped or the depression container shapes, and the side surface 102 of main body cavity 105 can be with respect to bottom 103 vertical or inclinations.Other layout also can be fit to.
When the top is seen, the shape of main body cavity 105 can be the shape of circular, oval, polygon (for example, rectangle) or suitable other.In certain embodiments, the bight of main body cavity 105 can become curve.In the embodiment shown in Fig. 1, when when the top is seen, the shape of main body cavity 105 comes down to octagonal, and the side surface 102 of main body cavity 105 comprises eight planes.Four first planes that can be called as each bight of agent-oriention 110 and form the side surface 102 of main body cavity 105 in eight planes, and four remaining planes can be called as second plane of the side surface 102 of the elongation of extending and form main body cavity 105 between first plane.The area on first plane is less than the area on second plane.The shape of the opposite planar in the middle of first plane and second plane can be identical.The area of the opposite planar in the middle of first plane and second plane can equate.In another embodiment, the side surface 102 of main body cavity 105 can comprise and is less than eight plane, and the some of them plane can be can relative mutually curved surface.
First reflector 122 and second reflector 124 can be positioned in the main body 110 below the bottom 103 of main body cavity 105, thereby the part of the bottom 103 of first and second reflectors 122 and 124 by main body cavity 105 is separated from each other.The bottom 103 of first reflector 122 from main body cavity 105 can be pressed down, the top of first reflector 122 is opened wide simultaneously.
For example, first cavity 162 can form in the bottom 103 of main body cavity 105, and the top of first cavity 162 is opened wide.First cavity 162 can comprise side surface and bottom, and first reflector 122 can be positioned in first cavity 162.
Second reflector 124 can separate with first cavity 162 and also press down from the bottom 103 of main body cavity 105, and the top of second reflector 124 is opened wide.For example, second cavity 164 can be formed in the bottom 103 of main body cavity 105, and the top of second cavity 164 is opened wide.Second cavity 164 can comprise side surface and bottom, and second reflector 124 can be positioned in second cavity 164.The part of bottom 103 between first reflector 122 and second reflector 124 by main body cavity 105 can be separated second cavity 164 with first cavity 162, this part is separated from each other first reflector 122 and second reflector 124 and isolates.
When the top was seen, first cavity 162 and second cavity 164 can have cup-shaped or the depression container shapes, and its side surface can be with respect to its bottom vertical or inclination.Other layout also can be suitable.
At least a portion of in first reflector 122 and second reflector 124 each can be passed through main body 110 and is exposed to the outside of main body 110.Because at least a portion of each in first reflector 122 and second reflector 124 is exposed to the outside of main body 110, so can improve the efficient that the heat emission of first luminescent device 132 and 134 generations of second luminescence chip is arrived the outside of main body 110.
For example, an end 142 of first reflector 122 can pass through first side surface of main body 110 and be exposed to the outside.Similarly, an end 144 of second reflector 142 can pass through second side surface of main body 110 and be exposed to the outside.First side surface of main body 110 and second side surface can perhaps otherwise suitably be located toward each other.
First reflector 122 and second reflector 124 can perhaps can be made by plating by making such as metal material or other material of silver, gold, copper.First reflector 122 and second reflector 124 can be by making with main body 110 identical materials, and form with main body 110.Alternatively, first reflector 122 and second reflector 124 can be made by the material that is different from main body 110, and form discretely with main body 110.In certain embodiments, the shape and size of first reflector 122 and second reflector 124 can be with respect to connection pads 126 symmetries.Connection pads 126 can be formed in the main body 110 below the bottom 103 of main body cavity 105, thereby connection pads 126 is separated with second reflector 124 with first reflector 122.Connection pads 126 can be made by electric conducting material.
As shown in fig. 1, connection pads 126 can be positioned between first reflector 122 and second reflector 124.For example, connection pads 126 can be positioned at the inside of the bottom 103 of main body cavity 105, and is adjacent with the 3rd side surface of main body cavity 105 and between first reflector 122 and second reflector 124.Other layout also can be suitable.
At least a portion of connection pads 126 can be passed through main body 110 and is exposed to the outside of main body 110.For example, an end 146 of connection pads 126 can pass through the 3rd side surface of main body cavity 105 and be exposed to the outside.In this exemplary embodiment, the 3rd side surface of main body 110 can be vertical from first and second side surfaces of the main body 110 of its process with 144 with respect to first and second reflectors 122 and 124 end 142.
Zener diode 150 can be arranged on in first reflector 122 or second reflector 124 one, to improve the puncture voltage of luminescent device encapsulation 100.As shown in fig. 1, Zener diode 150 can be installed on the upper surface 124-1 of second reflector 124.Other layout also can be suitable.
Fig. 2 is the bottom view of the luminescent device encapsulation shown in Fig. 1, and Fig. 3-the 6th, the various end views of the luminescent device encapsulation shown in Fig. 1.Referring to figs. 2 to Fig. 6, by the opening that wherein forms, the lower surface 202 of first reflector 122 is exposed on lower surface 107 places of main body 110, and the outside of main body 110 is given prominence to and be exposed in the end 142 of first reflector 122 from first side surface 210 of main body 110.By another opening that wherein forms, the lower surface 204 of second reflector 124 also is exposed on lower surface 107 places of main body 110, and the outside of main body 110 is given prominence to and be exposed in the end 144 of second reflector 124 from second side surface 220 of main body 110.The outside of main body 110 is given prominence to and is exposed in the end 146 of coupling part 126 from the 3rd side surface 230 of main body 110.The lower surface 202 of first and second reflectors 122 and 124 exposure and 204 and end 142 and 144 can allow the heat that first luminescent device 132 and second luminescent device 134 produce to be delivered to the outside of main body 110 and to distribute, and allow to cool off more effectively the luminescent device encapsulation.
The end 142 of first and second reflectors 122 and 124 exposure and 144 and the end 146 of the exposure of connection pads 126 can have different shape such as rectangle, circle, U-shaped or suitable other shape.Each thickness of first reflector 122, second reflector 124 and connection pads 126 can be 200 μ m～300 μ m.Each thickness of the end 142,144,146 that exposes can be 0.2mm～0.3mm.
First luminescent device 132 can be arranged in first cavity 162 of first reflector 122, and second luminescent device 134 can be arranged in second cavity 164 of second reflector 124.That is, first luminescent device 132 can be positioned on the bottom of first cavity 162 of first reflector 122 and second luminescent device 134 can be positioned on the bottom of second cavity 164 of second reflector 124.First luminescent device 132 can separate with the side surface of first cavity 162, and second luminescent device 134 can separate with the side surface of second cavity 164.The length of the length of first luminescent device 132 and second luminescent device 134 can be respectively 400 μ m～1200 μ m.The width of the width of first luminescent device 132 and second luminescent device 134 can be respectively 400 μ m～1200 μ m.The thickness of the thickness of first luminescent device 132 and second luminescent device 134 can be respectively 100 μ m～200 μ m.For example, the chip size of the chip size of first luminescent device 132 and second luminescent device can be 800 μ m * 400 μ m.The thickness of the thickness of first luminescent device 132 and second luminescent device can be 100 μ m～150 μ m.
Wiring 152,154,156 and 158 can connect first luminescent device 132 and second luminescent device 134 via connection pads 126.In the embodiment shown in Fig. 1, first wiring 152 connects first luminescent device 132 and second reflector 122, second wiring 154 connects first luminescent device 132 and connection pads 126, the 3rd wiring 156 connects the connection pads 126 and second luminescent device 134, and the 4th wiring 158 connects second luminescent device 134 and second reflector 124.Second wiring 154 can be combined between the connection pads 126 and first luminescent device 132, and the 3rd wiring 156 can be combined between the connection pads 126 and second luminescent device 134, thereby is electrically connected first luminescent device 132 and second luminescent device 134.
As shown in fig. 1, Zener diode 150 can be installed on the upper surface 124-1 of second reflector 124, and can be electrically connected to first reflector 122 by the 5th wiring 159.For example, an end of the 5th wiring 159 can be incorporated into Zener diode 150, and the other end of the 5th wiring 159 can be incorporated into the upper surface 122-1 of first reflector 122.In alternate embodiment, Zener diode 150 can be installed on the upper surface 122-1 of first reflector 122, and the 5th a wiring end of 159 other end that can be incorporated into Zener diode 150 and the 5th wiring 159 can be incorporated into the upper surface 124-1 of second reflector 124.
Connection pads 126 can be separated with second reflector 124 with first reflector 122, therefore is independent of first luminescent device 132 and second luminescent device 134.This can allow connection pads 126 stably to be electrically connected in series first luminescent device 132 and second luminescent device 134, thereby improves electric reliability.
When first luminescent device 132 and 134 emission light time of second luminescent device, they can also produce heat in the process of operation.First reflector 122 can prevent the heat that produced by first luminescent device 132 by radiation or be delivered to main body 110, and second reflector 124 can prevent that the heat that produced by second luminescent device 134 is by radiation or be delivered to main body 110.That is, first reflector 122 and second reflector 124 can make first luminescent device 132 and 134 thermal releases of second luminescent device.In addition, first reflector 122 and second reflector 124 can prevent to interfere mutually with the light of launching from second luminescent device 134 from the light of first luminescent device, 132 emissions.In addition, because first reflector 122 and second reflector 124 are positioned at the inner bottom part place of main body 110, therefore the thermal release between first reflector 122 and second reflector 124 can be improved, and preventing of the interference of light between first luminescent device 132 and second luminescent device 134 can be improved.
Therefore, in the present embodiment, first luminescent device 132 is positioned in first cavity 162 of first reflector 122, and second luminescent device 134 is positioned in second cavity 164 of second reflector 124, thereby first luminescent device 132 separates with second luminescent device, 134 mutual light and heat.
Can be formed on the lower surface 107 of main body 110 by its resin hand-hole 240 that resin can be injected main body 110.Resin hand-hole 240 can be in the position between first reflector 122 and second reflector 124.
Fig. 7 is the plane graph of the luminescent device encapsulation shown in Fig. 1.In Fig. 7, only for for the purpose of the clear convenience of describing, the wiring 152,154,156,158 and 159 of having omitted Fig. 1.As shown in Figure 7, first reflector 122 can separate distance to a declared goal D1 with second reflector 124, and the part of the bottom of the main body 110 that can be made by polyphthalamide (PPA) can be therebetween.
In order to separate thermal source (heat that the operation by first and second chips 132 and 134 produces) and to prevent the interference of light between luminescent device 132 and 134 effectively, separating distance D1 between first reflector 122 and second reflector 124 for example can be, 100 μ m or more.Based on the relative size of associated component, other separating distance also can be suitable.
In addition, in order to prevent the interference of light between luminescent device 132 and 134 effectively and to increase reflection efficiency, first luminescent device 132 can be positioned on the bottom of first reflector 124 and with the side surface of first reflector 122 and separate distance to a declared goal, and second luminescent device 134 can be positioned on the bottom of second reflector 124 and with the side surface of second reflector 124 and separates distance to a declared goal.From the separating distance to side surface of first luminescent device, 132 to first reflectors 122 can be equal or unequal.From the separating distance to side surface of second luminescent device, 134 to second reflectors 124 can be equal or unequal.
For example, be installed in first luminescent device 132 on first reflector 122 and the pitch that is installed between second luminescent device 134 on second reflector 124 can be 2mm～3mm.
For example, first luminescent device 132 can be installed in the center of the bottom of first reflector 122, and second luminescent device 134 can be installed in the center of the bottom of second reflector 124.
In further detail, the separating distance D2 from the short side surfaces of first reflector 122 to first luminescent device 132 can be 200 μ m for example, and can be 500 μ m for example from the surface, long limit of first reflector 122 to the separating distance D3 of first luminescent device 132.Based on the chip size relevant with the reflector size, other separating distance also can be suitable.
Connection pads 126 can be separated distance to a declared goal D4 with second reflector 124 with first reflector 122, and the part of the bottom of the main body 110 that can be made by polyphthalamide (PPA) can be therebetween.
For example, the separating distance D4 between first reflector 122 and the connection pads 126 can equal the separating distance D1 between first reflector 122 and second reflector 124.Based on the relative size of associated component, other separating distance also can be suitable.
Fig. 8 is the sectional view along the line A-A ' intercepting of the encapsulation of the luminescent device shown in Fig. 7.In Fig. 8, only for the sake of clarity, omitted wiring 152,154,156,158 and 159.
As shown in Figure 8, the tiltangle 1 of the side surface of first reflector 122 can be different from the inclination angle of the side surface of main body cavity 105.For example, the side surface of first reflector 122 can be 90～160 ° with respect to the tiltangle 1 of the bottom of first reflector 122.Other orientation also can be suitable.The side surface 102 of main body cavity 105 can be 140～170 ° with respect to the tiltangle 2 of the bottom 103 of main body cavity 105.
The upper end of the side surface of main body cavity 105 can comprise curved edge.That is, the side surface of the upper end of main body cavity 105 can be crooked.In further detail, main body cavity 105 can have in the upper surface 802 of main body 110 and the marginal portion 804 between the bottom 103.Marginal portion 804 can have difference in height K1 with the upper surface 802 of main body 110, and can be parallel to the upper surface 802 of main body 110.For example, marginal portion 804 can be formed on the upper end of the side surface 102 of main body cavity 105.
The upper surface 802 of main body cavity 105 and the difference in height K1 between the marginal portion 804 can be 50～80 μ m for example, and the length K 2 of marginal portion 804 can be 50～130 μ m.Based on the size of associated component, other height/length also can be suitable.In addition, the upper end of the side surface 102 of main body cavity 105 can have the marginal portion above two, and each marginal portion has difference in height to form a series of steps.The formation that has the marginal portion 804 of difference in height K1 with upper surface 802 at the upper end of the side surface 102 of main body cavity 105 can prolong the gas permeation path, thereby prevents that extraneous gas is penetrated into the inside of luminescent device encapsulation 100 and has therefore improved the air-tightness of luminescent device encapsulation 100.
In order to prevent the interference of light between luminescent device 132 and 134 and to improve the light reflection efficiency, can determine the depth H of first reflector 122 and second reflector 124 by the height of considering luminescent device 132 and 134.
For example, as shown in Figure 13 a, the upper surface 122-1 of first reflector 122 can be parallel to the upper surface of first luminescent device 132 on the bottom 122-2 that is installed in first reflector 122.The depth H 1 of first reflector 122 can equal the height a1 (H1=a1) of first luminescent device 132.Depth H 1 can be the upper surface 122-1 of first reflector 122 and the distance between the 122-2 of bottom.Can determine the degree of depth of second relevant in the present embodiment reflector 124 in a similar fashion with the height of luminescence chip 134.In certain embodiments, the degree of depth of first reflector 122 can equal the degree of depth of second reflector 124. Reflector 122 and 124 other height and the corresponding height of luminescent device 132 and 134 and to make up also can be suitable.
In the embodiment shown in Figure 13 b, the upper surface 122-1 of first reflector 122 is higher than the upper surface of first luminescent device 132 on the bottom 122-2 that is installed in first reflector 122.That is, the depth H 2 of first reflector 122 is greater than the height a1 of first luminescent device 132 (H2＞a1).In certain embodiments, the depth H 2 of first reflector 122 can be greater than the height a1 of first luminescent device 132 and less than the twice of the height a1 of first luminescent device 132 (a1＜H2＜2a1).Can determine in the present embodiment degree of depth of second reflector 124 relevant in a similar fashion with luminescence chip 134.
In the embodiment shown in Figure 13 c, the upper surface 122-1 of first reflector 122 is lower than the upper surface of first luminescent device 132 on the bottom 122-2 that is installed in first reflector 122.The depth H 3 of first reflector 122 is less than the height a1 of first luminescent device 132 (H3＜a1).In certain embodiments, the depth H 3 of first reflector 122 can be less than the height a1 of first luminescent device 132 and greater than half (a1/2＜H3＜a1) of the height a1 of first luminescent device 132.Can determine in the present embodiment height of second reflector 124 relevant in a similar fashion with luminescence chip 134.
Fig. 9 is the sectional view along the line B-B ' intercepting of the encapsulation of the luminescent device shown in Fig. 7.In Fig. 9, only for the sake of clarity, omitted wiring 152,154,156,158 and 159.As shown in Figure 9, the upper surface of connection pads 126 can be basically parallel to the upper surface of first reflector 122 and second reflector 124, and when its through the 3rd side surface 230 of main body 110 and when being exposed to main body 110 outside, the end 146 of connection pads 126 can form the part of the bottom of main body 110.
In the luminescent device encapsulation 100 according to present embodiment, as shown in Figure 8, the inside of main body cavity 105 can be filled with encapsulating material 820, so that seal and protect first luminescent device 132 and second luminescent device 134.
Encapsulating material 820 can be filled the inside of first reflector 122 that first luminescent device 132 wherein is installed and the inside of second reflector 124 of second luminescent device 134 and the inside of main body cavity 105 wherein are installed, with first luminescent device 132 and second luminescent device 134 and the external isolation.For example, encapsulating material 820 can be silicon, resin or other such material.By using silicon or resin material to fill the inside of main body cavity 105, and then suitably curing materials can realize the formation of encapsulating material 820.Encapsulating material 820 can be other material that is filled in by rights in the cavity 105.
Encapsulating material 820 can comprise fluorophor changing from the characteristic of the light of first luminescent device 132 and 134 emissions of second luminescent device, thereby and can encourage from first and second luminescent devices 132 by fluorophor and to realize different colors with the light of 134 emissions.For example, comprise yellow fluorophor,, thereby produce white light so by yellow fluorophor excitation blue light if luminescent device 132 and 134 is blue LED and encapsulating material 820.If luminescent device 132 and 134 emission ultraviolet (UV) light, encapsulating material 820 can comprise that red (R), green (G) and blue (B) fluorophor are to produce white light so.In addition, lens also can be arranged on the encapsulating material 820 to regulate the distribution by the light of luminescent device encapsulation 100 emissions.
Figure 10 illustrates according to being connected in series in the luminescent device packaged light emitting device of this embodiment that broadly describes.As shown in Figure 10, an end of first wiring 1052 can be incorporated into the upper surface 122-1 of first reflector 122, and the other end of first wiring 1052 can be incorporated into first luminescent device 132.In addition, an end of second wiring 1054 can be incorporated into first luminescent device 132, and the other end of second wiring 1054 can be incorporated into connection pads 126.One end of the 3rd wiring 1056 can be incorporated into connection pads 126, and the other end of the 3rd wiring 1056 can be incorporated into second luminescent device 134.In addition, an end of the 4th wiring 1058 can be incorporated into second luminescent device 134, and the other end of the 4th wiring 1058 can be incorporated into the upper surface 124-1 of second reflector 124.
Luminescent device 132 shown in Figure 10 and 134 can in series be electrically connected by first to fourth wiring 1052,1054,1056 and 1058.Because realize being connected in series between the luminescent device 132 and 134 shown in Figure 10 via the connection pads 126 that is independent of luminescent device 132 and 134, so can stably be electrically connected in series first luminescent device 132 and second luminescent device 134, thereby improve the electric reliability of luminescent device encapsulation.
Figure 11 illustrates according to being connected in parallel in the luminescent device packaged light emitting device of this another embodiment that broadly describes.As shown in Figure 11, an end of first wiring 1152 can be incorporated into the upper surface 122-1 of first reflector 122, and the other end of first wiring 1152 can be incorporated into first luminescent device 132.One end of second wiring 1154 can be incorporated into first luminescent device 132, and the other end of second wiring 1154 can be incorporated into the upper surface 124-1 of second reflector 124.One end of the 3rd wiring 1156 can be incorporated into the upper surface 122-1 of first reflector 122, and the other end of the 3rd wiring 1156 can be incorporated into second luminescent device 134.At last, an end of the 4th wiring 1158 can be incorporated into second luminescent device 134, and the other end of the 4th wiring 1158 can be incorporated into the upper surface 124-1 of second reflector 124.Therefore, luminescent device 132 and 134 can be electrically connected in parallel by first to fourth wiring 1152,1154,1156 and 1158.
Figure 12 illustrates according to being connected in series in the luminescent device packaged light emitting device of this another embodiment that broadly describes.As shown in Figure 12, an end of first wiring 1252 can be incorporated into the upper surface 122-1 of first reflector 122, and the other end of first wiring 1252 can be incorporated into first luminescent device 132.In addition, an end of second wiring 1254 can be incorporated into first luminescent device 132, and the other end of second wiring 1254 can directly be attached to second luminescent device 134.One end of the 3rd wiring 1256 can be incorporated into second luminescent device 134, and the other end of the 3rd wiring 1256 can be incorporated into the upper surface 124-1 of second reflector 124.
Can in series be electrically connected the luminescent device 132 and 134 shown in Figure 12 by first to the 3rd wiring 1252,1254 and 1256.Be different from Figure 10, first luminescent device 132 is not connected via connection pads 126 with second luminescent device 134 but directly connects by second wiring 1254.
The above-mentioned wiring that is attached to first reflector 122, second reflector 124, first luminescent device 132, second luminescent device 134 and Zener diode 150 respectively can be positioned at below the upper surface 106 of main body cavity 105.
The foregoing description is not described the luminescent device encapsulation of a cup type, is installed in luminescent device encapsulation 100 in two independent reflectors 122 and 124 in the main body 110 respectively but described luminescent device 132 and 134 wherein.By such structure, can be separated from each other the luminescent device 132 and 134 that produces heat during operation, and can stop the heat that produce by luminescent device 132 and 134 by reflector 122 and 124, thereby prevent that the main body 110 of luminescent device encapsulation 100 is because heat and variable color and prolong the life-span of luminescent device encapsulation 100.In addition, two the independent reflectors 122 and 124 interference of light that can prevent between luminescent device 132 and 134.
Figure 14 is according to first luminescent device and second luminescent device at this embodiment that broadly describes.As shown in Figure 14, first luminescent device 132 comprises substrate 20, ray structure 30, conductive layer 40, first electrode 12 and second electrode 14.Second luminescent device 134 comprises substrate 20, ray structure 30, conductive layer 40, third electrode 16 and the 4th electrode 18.Second luminescent device 134 can comprise the assembly identical with first luminescent device.
Substrate 20 supports ray structures 30 and can be Sapphire Substrate, silicon Si substrate, zinc oxide ZnO substrate and have GaN, InGaN, AlInGaN, SiC, GaP, InP, the Ga that piles up thereon 2O 3, and GaAs at least one the nitride-based semiconductor substrate or any one in the template substrate.
Ray structure 130 comprises first conductive type semiconductor layer 32, active layer 33 and second conductive type semiconductor layer 34.For example, ray structure 30 can be that wherein first conductive type semiconductor layer 32, active layer 33 and second conductive type semiconductor layer 34 sequentially are stacked on structure on the substrate 20.
First conductive type semiconductor layer 32 is arranged on the substrate 20.For example, first conductive type semiconductor layer 32 can comprise from having In xAl yGa 1-x-yN (0≤x≤1, the semi-conducting material of composition 0≤y≤1,0≤x+y≤1), for example, the n type semiconductor layer of selecting among GaN, AlN, AlGaN, InGaN, InN, InAlGaN, the AlInN, and can be doped n type alloy such as Si, Ge, Sn, Se, Te.
Active layer 22 is arranged on conduction type first semiconductor layer 32.For example, active layer 33 can comprise having In xAl yGa 1-x-yThe semi-conducting material of the composition of N (0≤x≤1,0≤y≤1,0≤x+y≤1), and can comprise at least one that from quantum wire structure, quantum-dot structure, single quantum and multi-quantum pit structure MQW, select.
Second conductive type semiconductor layer 34 is arranged on the active layer 33.For example, second conductive type semiconductor layer 34 can be from having In xAl yGa 1-x-yN (0≤x≤1, the semi-conducting material of composition 0≤y≤1,0≤x+y≤1), for example, the p type semiconductor layer of selecting among GaN, AlN, AlGaN, InGaN, InN, InAlGaN, the AlInN, and can be doped p type alloy such as Mg, Zn, Ca, Sr, Ba.
Ray structure 30 can be wherein the part of second conductive type semiconductor layer 34, active layer 33 and first conductive type semiconductor layer 32 to be carried out the structure of mesa etch with the zone that exposes first conductive type semiconductor layer 32.
Conductive layer 40 is arranged on second conductive type semiconductor layer 34.Because conductive layer 40 not only reduces total reflection, and have outstanding transmitance, so conductive layer 40 increases the extraction efficiency that is transmitted into the light of second conductive type semiconductor layer 34 from active layer 33.Conductive layer 40 can be formed by the transparent oxide family material that has high-transmission rate on light wavelength.For example, transparent oxide family material can be ITO (indium tin oxide), TO (tin oxide), IZO (indium-zinc oxide) and ZnO (zinc oxide).
First electrode 12 or third electrode 16 can be arranged on the exposed region of first conductive type semiconductor layer 32.Second electrode 14 or the 4th electrode 18 can be arranged on the conductive layer 40.First electrode 12 and second electrode 14 are the types that differ from one another.Third electrode 16 and the 4th electrode 14 are the types that differ from one another.First electrode 12 and third electrode 18 are mutually the same types.Second electrode 14 and the 4th electrode 18 are mutually the same types.For example, first electrode 12 and third electrode 16 can be n type electrodes, and second electrode 14 and the 4th electrode 18 can be p type electrodes.First to fourth electrode 12,14,16,18 can be comprise from Ti, Al, Al alloy, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Ag alloy, Au, Hf, Pt, Ru and Au, select at least one alloy or the individual layer or the multilayer of material.
Figure 15 is according to first connection between the first, second, third and the 4th electrode of this embodiment that broadly describes.As shown in Figure 15, one in first electrode 12 and second electrode 14 is electrically connected to first reflector 122, and in third electrode 16 and the 4th electrode 18 one is electrically connected to second reflector 124.In in connection pads 126 electrical connection first electrodes 12 and second electrode 14 another and third electrode 16 and the 4th electrode 18 another.
For example, first electrode 12 of first luminescent device 132 can be electrically connected to first reflector 122 by first wiring 1052, and the 4th electrode 18 of second luminescent device 134 can be electrically connected to second reflector 124 by the 4th wiring 1058.Connection pads 126 is electrically connected second electrode 14 of first luminescent device 132 and the third electrode 16 of second luminescent device 134 by the second and the 3rd wiring 1054 and 1056.Second electrode 14 of first luminescent device can be electrically connected to connection pads 126 by second wiring 1054, and the third electrode 16 of second electrode 134 can be electrically connected to connection pads 126 by the 3rd wiring 1056.
Figure 16 is according to second connection between the first, second, third and the 4th electrode of this embodiment that broadly describes.As shown in Figure 16, one in first electrode 12 and second electrode 14 is electrically connected to first reflector 122, and in third electrode 16 and the 4th electrode 18 one is electrically connected to second reflector 124.In first electrode 12 and second electrode 14 another is electrically connected to second reflector 124.In third electrode 16 and the 4th electrode 18 another is electrically connected to first reflector 122.
For example, first electrode 12 of first luminescent device 132 can be electrically connected to first reflector 122 by first wiring 1152, and the 4th electrode 18 of second luminescent device 134 can be electrically connected to second reflector 124 by the 4th wiring 1158.Second electrode 14 of first luminescent device can be electrically connected to second reflector 124 by second wiring 1154, and the third electrode 16 of second luminescent device 134 can be electrically connected to first reflector 122 by the 3rd wiring 1156.
Figure 17 is according to the 3rd connection between the first, second, third and the 4th electrode of this embodiment that broadly describes.As shown in Figure 17, one in first electrode 12 and second electrode 14 is electrically connected to first reflector 122, and in third electrode 16 and the 4th electrode 18 one is electrically connected to second reflector 124.In first electrode 12 and second electrode 14 another is electrically connected to another in third electrode 16 and the 4th electrode 18.
For example, first electrode 12 of first luminescent device 132 can be electrically connected to first reflector 122 by first wiring 1252, and the 4th electrode 18 of second luminescent device 134 can be electrically connected to second reflector 124 by the 4th wiring 1258.Second electrode 14 of first luminescent device can be electrically connected to the third electrode 16 of second luminescent device 134 by the 3rd wiring 1254.
Figure 18 is the decomposition diagram that is included in the lighting apparatus of this luminescent device encapsulation specific and that broadly describe.Lighting apparatus can comprise: light source 750, these light source 750 emission light; Shell 700, light source 750 is installed in wherein; Heat abstractor 740, this heat abstractor 740 distributes the heat of light source 750; And retainer 760, this retainer 760 is connected to shell 700 with light source 750 and heat abstractor 740.
Shell 700 comprises socket connector 710, and this socket connector 710 is used to be connected to electrical socket; With main body 730, this main body 730 is connected with socket connector 710.Air flow hole 720 can form passes main body 730.
Alternatively, a plurality of air flow hole 720 can form and pass main body 730.That is, an air flow hole 720 can form passes main body 730, perhaps can form with a plurality of air flow hole of radial arrangements and pass main body 730.Other layout of a plurality of air flow hole 730 also can be suitable.
Light source 750 can comprise substrate 754 and a plurality of luminescent devices encapsulation 752 that are arranged on the substrate 754.Substrate 754 can have the shape in the opening that can be inserted into shell 700, and can be made to transfer heat to heat abstractor 740 by the material with high relatively thermal conductivity.
Retainer 760 can be arranged in below the light source 750.Retainer 760 can comprise framework and extra air flow hole.It is following with diffusion, scattering or the concentrated light of launching from the luminescent device encapsulation 752 of light source 750 that optical component also can be arranged in light source 750.Lighting apparatus according to present embodiment can adopt according to the luminescent device encapsulation at this embodiment that broadly describes, thereby prolongs the life-span of the luminescent device encapsulation that is installed on the lighting apparatus and prevent the interference of light.
Figure 19 is the decomposition diagram that is included in the display device of this luminescent device encapsulation specific and that broadly describe.
Display device 800 can comprise: light source module; Reflecting plate 820, this reflecting plate 820 is arranged on bottom 810 tops; The front that light guide plate 840, this light guide plate 840 are positioned at reflecting plate 820 is with will be from the photoconduction of the light source module emission front portion to display device 800; Optical sheet comprises for example prismatic lens 850 and 860, and is positioned at the front of light guide plate 840; Panel 870, this panel 870 is positioned at the front of prismatic lens 850 and 860; And colour filter 880, this colour filter 880 is positioned at the front of panel 870.Bottom 810, reflecting plate 820, light source module, light guide plate 840 and optical sheet can form back light unit.
Light source module can comprise substrate 830 and the luminescent device encapsulation 835 that is arranged on the substrate 830.Printed circuit board (PCB) (PCB) can be used as substrate 830, and the encapsulation of the luminescent device shown in Fig. 1 100 can be as luminescent device encapsulation 835.Other combination also can be suitable.
Bottom 810 can hold the assembly in the display device 800.Reflecting plate 820 can be set to independent element, as shown in Figure 19, perhaps can apply the rear surface of light guide plate 840 by the material that use has a high reflectance or the front surface of bottom 810 comes cremasteric reflex plate 820.For example, reflecting plate 820 can be by the material that has relative high reflectance and can be used for/can make under ultra-thin state such as polyethylene terephthalate (PET), and perhaps other such material is made.
Light guide plate 840 can scattering from the light of light source module emission light is evenly distributed in the difference/All Ranges of display device 800.Therefore, for example, light guide plate 840 can be by the material with high index of refraction and transmissivity such as polymethyl methacrylate (PMMA), Merlon (PC), polyethylene (PE), and perhaps other such material is made.
A surface that represents light transmission and flexible polymer-coated basilar memebrane by use can form first prismatic lens 850, and polymer can comprise the layers of prisms that wherein repeats a plurality of three-dimensional structures with appointed pattern.For example, pattern can be the stripe of replicated ridges and paddy wherein, as shown in Figure 19, and other perhaps suitable pattern.
Second prismatic lens 860 can so be constructed, and ridge that forms on respect to a surface at the basilar memebrane of first prismatic lens 850 in the arranged direction of ridge that forms on the surface of the basilar memebrane of second prismatic lens 860 and paddy and the arranged direction of paddy are vertical.Such structure can make the whole surface from the light of light source module and reflector plate emission towards panel 870 distribute equably.
Screening glass can be arranged on each the top in prismatic lens 850 and 860.Screening glass can comprise two lip-deep protective layers of basilar memebrane, and it comprises light granule proliferation and adhesive.In addition, for example, layers of prisms can be by making such as the polymer of polyurethane, styrene butadiene copolymer, polyacrylate, polymethacrylates, polymethyl methacrylate, polyethylene terephthalate elastomer, polyisoprene, polysilicon etc.
Diffusion sheet can be arranged between the light guide plate 840 and first prismatic lens 850.Diffusion sheet can be made by polyester or polycarbonate-base material, and can increase the light projectional angle by refraction and the scattering from the light of back light unit incident the biglyyest.In addition, diffusion sheet can comprise the supporting layer with light diffusing agent, the second layer that is formed on the ground floor of (on the direction of first prismatic lens) on the light-emitting area and is formed on light incident surface (on the direction of reflector plate).First and second layers can not comprise light diffusing agent.
In the present embodiment, optical sheet can comprise the combination of diffusion sheet, first prismatic lens 850 and second prismatic lens 860.Yet for example, optical sheet can comprise other combination such as the combination of the combination of microlens array, diffusion sheet and microlens array or prismatic lens and microlens array.
Display panels can be used as panel 870.Yet, also can adopt the display unit of other kind that requires light source.Display floater 870 can so be constructed, and liquid crystal layer is between glass substrate, and polarization plates is installed in the glass substrate top in order to the polarization properties of using up.Such liquid crystal layer can have the character between liquid and the solid.That is, in liquid crystal layer, to being that the liquid crystal with organic molecule of the flowability that is similar to liquid is aimed at regularly, and owing to the reason liquid crystal layer of external electrical field uses the variation of molecular alignment to come display image.
The such display panels that uses in display device can be an active array type, and can use transistor to regulate the voltage that imposes on each pixel as switch.In addition, colour filter 880 can be arranged on the front surface of panel 870, and only R, G and the B light from panel 870 projection of each pixel of transmission, thus display image.
Display device according to present embodiment can adopt the luminescent device encapsulation of specializing and broadly describing at this, thereby prevents the interference of light between luminescent device 132 and 134.
The life-span of the variable color of main body can be prevented in this luminescent device encapsulation specific and that broadly describe, and the interference of light can be prevented with the encapsulation of prolongation luminescent device.
Can comprise in this luminescent device encapsulation specific and that broadly describe: main body, this main body has the cavity that comprises side surface and bottom; First reflector and second reflector, this first reflector and second reflector are arranged in the bottom of cavity of main body and are separated from each other; First luminescent device, this first luminescent device is arranged in first reflector; And second luminescent device, this second luminescent device is arranged in second reflector.Can press down first reflector and second reflector from the bottom of the cavity of main body.First reflector and second reflector can be made by one that selects from the group that comprises silver, gold and copper.
The thermal radiation that first reflector and second reflector can prevent to be produced by first luminescent device and second luminescent device is to main body.
At least a portion of in first reflector and second reflector each can be passed through main body and is exposed to the outside of main body.The shape and size of first reflector and second reflector can be symmetrical.The side surface of each in first reflector and second reflector can be 90～160 ° with respect to the inclination angle of its bottom.
Luminescent device encapsulation also can comprise the marginal portion between the bottom of the cavity of the upper surface of main body and main body, the upper surface that the upper surface of itself and main body has difference in height and is parallel to main body.The upper surface that the upper surface of first reflector can be parallel to the upper surface of first luminescent device and second reflector can be parallel to the upper surface of second luminescent device.
In another embodiment that this broadly describes, the luminescent device encapsulation can comprise: main body, and this main body has the cavity that comprises side surface and bottom; First reflector and second reflector, this first reflector and second reflector are arranged in the bottom of cavity of main body and are separated from each other; First luminescent device, this first luminescent device is arranged in first reflector; Second luminescent device, this second luminescent device is arranged in second reflector; And the coupling part, this coupling part is formed in the bottom of cavity of main body and with first reflector separates with second reflector, wherein is electrically connected first luminescent device and second luminescent device by the coupling part.Can press down first reflector and second reflector from the bottom of the cavity of main body.
The luminescent device encapsulation also can comprise first wiring, and this first wiring connects first reflector and first luminescent device; Second wiring, this second wiring connects first luminescent device and coupling part; The 3rd wiring, the 3rd wiring connects the coupling part and second luminescent device; And the 4th wiring, the 4th wiring connects second luminescent device and second reflector, and wherein first luminescent device and second luminescent device are connected in series by first wiring, second wiring, the 3rd wiring and the 4th wiring.
The luminescent device encapsulation can also comprise first wiring, and this first wiring connects first reflector and first luminescent device; Second wiring, this second wiring connects first luminescent device and second reflector; The 3rd wiring, the 3rd wiring connects first reflector and second luminescent device; And the 4th wiring, the 4th wiring connects second luminescent device and second reflector, and wherein first luminescent device connects up and is connected in parallel by first wiring, second wiring, the 3rd wiring and the 4th with second luminescent device.
The luminescent device encapsulation can also comprise first wiring, and this first wiring connects first reflector and first luminescent device; Second wiring, this second wiring connects first luminescent device and second luminescent device; And the 3rd wiring, the 3rd wiring connects second luminescent device and second reflector, and wherein first luminescent device and second luminescent device are connected in series by first wiring, second wiring and the 3rd wiring.
At least a portion of in first reflector, second reflector and the coupling part each can be passed through main body and is exposed to the outside of main body.
Mean that for quoting of " embodiment ", " embodiment ", " exemplary embodiment " etc. special characteristic, structure or the characteristic described in conjunction with the embodiments are included among at least one embodiment of the present invention in this manual.In specification, identical embodiment needn't all be represented in this class phrase of Chu Xianing throughout.In addition, when describing special characteristic, structure or characteristic in conjunction with any embodiment, other embodiment in all thinking in conjunction with the embodiments realize such feature, structure or characteristic also be those skilled in the art can expect.
Though described embodiment, should be appreciated that those skilled in the art can expect many interior other modification and embodiment of spirit and scope that fall into disclosure principle with reference to a plurality of exemplary embodiments of the present invention.More specifically, in the scope of the disclosure, accompanying drawing and appended claims, the building block that subject combination is arranged and/or the variations and modifications of layout aspect all are possibilities.Except the variation and modification of building block and/or layout aspect, for a person skilled in the art, alternative use also will be conspicuous.

Claims (40)

1. luminescent device encapsulation comprises:
Main body, described main body has the cavity that is formed on wherein, and described cavity comprises side surface and bottom;
First reflector and second reflector, described first reflector and second reflector are arranged in the bottom of described cavity and the part of the bottom by described cavity is separated from each other;
First luminescent device, described first luminescent device are arranged in described first reflector; And
Second luminescent device, described second luminescent device is arranged in described second reflector.
2. luminescent device encapsulation according to claim 1, the part of each in wherein said first reflector and second reflector are passed through described main body and are exposed to the outside of described main body.
3. luminescent device encapsulation comprises:
Main body, described main body has the cavity that is formed on wherein;
First reflector and second reflector, described first reflector and second reflector are arranged in the bottom of described cavity;
First luminescent device, described first luminescent device are arranged in described first reflector;
Second luminescent device, described second luminescent device are arranged in described second reflector; And
Connection pads, described connection pads are arranged in the bottom of described cavity and with described first reflector separates with described second reflector.
4. luminescent device according to claim 3, wherein said first and second reflectors are separated from each other by the part of the bottom of described cavity, and wherein are electrically connected described first luminescent device and described second luminescent device via described connection pads.
5. luminescent device encapsulation according to claim 3 further comprises:
First wiring, described first wiring connects described first reflector and described first luminescent device;
Second wiring, described second wiring connects described first luminescent device and described connection pads;
The 3rd wiring, described the 3rd wiring connects described connection pads and described second luminescent device; And
The 4th wiring, described the 4th wiring connects described second luminescent device and described second reflector, and wherein said first luminescent device and described second luminescent device are connected in series by described first wiring, described second wiring, described the 3rd wiring and described the 4th wiring.
6. luminescent device encapsulation according to claim 3 further comprises:
First wiring, described first wiring connects described first reflector and described first luminescent device;
Second wiring, described second wiring connects described first luminescent device and described second reflector;
The 3rd wiring, described the 3rd wiring connects described first reflector and described second luminescent device; And
The 4th wiring, described the 4th wiring connects described second luminescent device and described second reflector, and wherein said first luminescent device is connected by described first wiring, described second wiring, described the 3rd wiring and described the 4th wiring in parallel with described second luminescent device.
7. luminescent device encapsulation according to claim 3 further comprises:
First wiring, described first wiring connects described first reflector and described first luminescent device;
Second wiring, described second wiring connects described first luminescent device and described second luminescent device; And
The 3rd wiring, described the 3rd wiring connects described second luminescent device and described second reflector, and wherein said first luminescent device and described second luminescent device are connected in series by described first wiring, described second wiring and described the 3rd wiring.
8. luminescent device encapsulation comprises:
First and second reflectors, described first and second reflectors are orientated as located adjacent one another, and the profile of wherein said first and second reflectors forms first and second cavitys respectively;
First and second luminescent devices, described first and second luminescent devices are separately positioned in described first and second cavitys that are formed in described first and second reflectors;
Sidewall, the periphery of described first and second reflectors of described side walls enclose; And
Partition wall, described partition wall are arranged between described first and second reflectors, and the height of wherein said partition wall is less than the height of described sidewall.
9. luminescent device encapsulation according to claim 8, wherein said sidewall extends upward to limit the 3rd cavity from the top surface of described first and second reflectors.
10. luminescent device encapsulation according to claim 9, wherein said first and second reflectors form depression in the bottom of described the 3rd cavity.
11. luminescent device encapsulation according to claim 10, the first of the first of wherein said first reflector and described second reflector is exposed to the outside of described luminescent device encapsulation by each opening in the bottom of described the 3rd cavity.
12. luminescent device encapsulation according to claim 11, the second portion of the second portion of wherein said first reflector and described second reflector extend through the outside of the various piece of described sidewall to described luminescent device encapsulation.
13. luminescent device encapsulation according to claim 10, further comprise connection pads, described connection pads is arranged on the bottom of described the 3rd cavity, described connection pads is separated with described second reflector with described first reflector, and wherein said first luminescent device and described second luminescent device are electrically connected via described connection pads.
14. luminescent device encapsulation according to claim 10, further comprise many wirings, every wiring has one first end that is connected in described first or second luminescent device and one or second end of described connection pads being connected respectively in described first or second reflector.
15. luminescent device encapsulation according to claim 8, the top surface of wherein said first luminescent device are positioned at the top edge below of described first reflector, and the top surface of described second luminescent device is positioned at the top edge below of described second reflector.
16. luminescent device encapsulation according to claim 8, the top surface of wherein said first luminescent device extends beyond the top edge of described first reflector, and the top surface of described second luminescent device extends beyond the top edge of described second reflector.
17. luminescent device encapsulation according to claim 8, the top surface of wherein said first luminescent device is arranged essentially parallel to the top surface of described first reflector, and the top surface of described second luminescent device is arranged essentially parallel to the top surface of described second reflector.
18. luminescent device encapsulation according to claim 8, the degree of depth of wherein said first reflector is greater than the height of described first luminescent device and less than the twice of the height of described first luminescent device, and the degree of depth of described second reflector is greater than the height of described second luminescent device and less than the twice of the height of described second luminescent device.
19. luminescent device encapsulation according to claim 8, the degree of depth of wherein said first reflector is less than the height of described first luminescent device and greater than half of the height of described first luminescent device, and the degree of depth of described second reflector is less than the height of described second luminescent device and greater than half of the height of described second luminescent device.
20. a luminescent device encapsulation comprises:
Main body;
First reflector and second reflector, described first reflector and second reflector are arranged in the described main body, and are separated from each other by the part of described main body;
First luminescent device, described first luminescent device are arranged in described first reflector; And
Second luminescent device, described second luminescent device are arranged in described second reflector,
Wherein said first reflector and described second reflector are made by the material that is different from described main body.
21. luminescent device encapsulation according to claim 20, further comprise connection pads, described connection pads is arranged in the described main body, and separates with described second reflector with described first reflector, and wherein said connection pads is made by the material that is different from described main body.
22. luminescent device encapsulation according to claim 20, wherein said first luminescent device and described second luminescent device are electrically connected via described connection pads.
23. a luminescent device encapsulation comprises:
Main body;
First reflector and second reflector, described first reflector and second reflector are arranged in the described main body;
First luminescent device, described first luminescent device are arranged in described first reflector, and wherein said first luminescent device comprises first electrode and second electrode; And
Second luminescent device, described second luminescent device are arranged in described second reflector, and wherein said second luminescent device comprises third electrode and the 4th electrode,
Wherein said first electrode is electrically connected to described first reflector and described the 4th electrode is connected to described second reflector, and described first electrode and described the 4th electrode have the polarity that differs from one another.
24. luminescent device encapsulation according to claim 23, wherein said second electrode is electrically connected to described second reflector, and described third electrode is electrically connected to described first reflector.
25. luminescent device encapsulation according to claim 23, wherein said second electrode is electrically connected to described third electrode.
26. luminescent device encapsulation according to claim 23, further comprise connection pads, described connection pads is arranged in the described main body and with described first reflector separates with described second reflector, and wherein said connection pads is electrically connected described second electrode and described third electrode.
27. luminescent device encapsulation according to claim 23, wherein said first electrode and described third electrode are mutually the same polarity.
28. a luminescent device encapsulation comprises:
Bottom section body;
First reflector, described first reflector is arranged in the described bottom section body;
Second reflector, described second reflector are arranged in the bottom and by the part of described bottom section body and separate with described first reflector;
First luminescent device, described first luminescent device are arranged in described first reflector;
Second luminescent device, described second luminescent device are arranged in described second reflector; And
Side surface on described bottom section body, described side surface surround described first reflector and described second reflector.
29. luminescent device encapsulation according to claim 28 further is included in the connection pads in the described bottom section body, described connection pads is separated with described second reflector with described first reflector by another part of described bottom section body.
30. according to any described luminescent device encapsulation in the claim 1 to 29, wherein said first reflector and described second reflector form depression in the bottom of described cavity.
31. according to any described luminescent device encapsulation in the claim 1 to 29, the shape and size substantial symmetry of wherein said first reflector and described second reflector.
32. according to any described luminescent device encapsulation in the claim 1 to 29, each side surface of each in wherein said first reflector and described second reflector is between 90 ° and 160 ° with respect to the inclination angle of its each basal surface.
33. according to any described luminescent device encapsulation in the claim 1 to 29, further comprise step edge, described step edge is formed on the upper surface of described main body and is formed between the upper end of the described cavity in the described main body, and the upper surface of described step edge and described main body has the difference in height of regulation and is parallel to the upper surface of described main body.
34. according to any described luminescent device encapsulation in the claim 1 to 29, the upper surface of wherein said first reflector is parallel to the upper surface of described first luminescent device, and the upper surface of described second reflector is parallel to the upper surface of described second luminescent device.
35. according to any described luminescent device encapsulation in the claim 1 to 29, the height of wherein said first reflector is greater than the height of described first luminescent device, and the height of described second reflector is greater than the height of described second luminescent device.
36. luminescent device encapsulation according to claim 35, the degree of depth of wherein said first reflector is greater than the height of described first luminescent device and less than the twice of the height of described first luminescent device, and the degree of depth of described second reflector is greater than the height of described second luminescent device and less than the twice of the height of described second luminescent device.
37. according to any described luminescent device encapsulation in the claim 1 to 29, the height of wherein said first reflector is less than the height of described first luminescent device, and the height of described second reflector is less than the height of described second luminescent device.
38. according to the described luminescent device encapsulation of claim 37, the degree of depth of wherein said first reflector is less than the height of described first luminescent device and greater than half of the height of described first luminescent device, and the degree of depth of described second reflector is less than the height of described second luminescent device and greater than half of the height of described second luminescent device.
39. according to any described luminescent device encapsulation in the claim 1 to 29, further comprise encapsulating material, described encapsulating material is filled the inside of the cavity of described main body, wherein the inside of described first reflector of described first luminescent device and the inside that described second reflector of described second luminescent device wherein is set is set, so that with described first luminescent device and described second luminescent device and external isolation.
40. according to the encapsulation of the described luminescent device of claim 39, wherein said main body is by such as polyphthalamide (PPA) or silicon (Si), photosensitive glass (PSG) or sapphire (Al 2O 3) material make.
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104380489A (en) * 2012-06-29 2015-02-25 夏普株式会社 Light-emitting device, illumination device and backlight for display device
CN105977246A (en) * 2015-03-11 2016-09-28 Lg伊诺特有限公司 Light emitting device
TWI552390B (en) * 2014-01-29 2016-10-01 一詮精密工業股份有限公司 Manufacturing method of led tape
CN106067508A (en) * 2016-08-03 2016-11-02 江西亚中电子科技有限公司 Multipurpose dual-colored LED patch support
CN107045992A (en) * 2017-04-19 2017-08-15 中国科学院上海微系统与信息技术研究所 Imaging sensor wafer-level encapsulation method and encapsulating structure
CN107210352A (en) * 2015-01-19 2017-09-26 Lg 伊诺特有限公司 Light-emitting component
CN107546310A (en) * 2016-06-24 2018-01-05 首尔半导体株式会社 Light emission diode package member
CN114334930A (en) * 2021-12-30 2022-04-12 惠州市艾斯谱光电有限公司 Lighting lamp and lamp panel thereof
CN114859601A (en) * 2022-04-28 2022-08-05 上海天马微电子有限公司 Reflection assembly, backlight module, display module and display device
WO2022242476A1 (en) * 2021-05-20 2022-11-24 华为技术有限公司 Backlight module and manufacturing method therefor, display apparatus, and electronic device

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201334150A (en) * 2012-02-03 2013-08-16 Lextar Electronics Corp Light emitting device
TWI570904B (en) * 2012-02-17 2017-02-11 晶元光電股份有限公司 Light-emitting diode device
TWI506822B (en) * 2013-03-25 2015-11-01 I Chiun Precision Ind Co Ltd Supporting base with asymmetrical circle wall for light-emitting diode chip
TWI631694B (en) * 2017-06-26 2018-08-01 錼創科技股份有限公司 Display panel
KR102473424B1 (en) * 2018-01-03 2022-12-02 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device package
TW202349704A (en) * 2018-02-14 2023-12-16 晶元光電股份有限公司 Light-emitting device, manufacturing method thereof and display module using the same
TWI720806B (en) * 2020-02-03 2021-03-01 友達光電股份有限公司 Light-emitting diode display
TWI753431B (en) * 2020-05-19 2022-01-21 光感動股份有限公司 Packaging component
TWI738430B (en) * 2020-07-22 2021-09-01 友達光電股份有限公司 Organic light emitting diode display panel

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6531328B1 (en) * 2001-10-11 2003-03-11 Solidlite Corporation Packaging of light-emitting diode
US7345318B2 (en) * 2004-07-05 2008-03-18 Citizen Electronics Co., Ltd. Light-emitting diode
US20100078661A1 (en) * 2008-09-26 2010-04-01 Wei Shi Machined surface led assembly

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5350658B2 (en) * 2007-03-30 2013-11-27 シャープ株式会社 Light emitting element
KR20090003378A (en) * 2007-06-05 2009-01-12 주식회사 루멘스 Light emitting diode package
US7985980B2 (en) * 2007-10-31 2011-07-26 Sharp Kabushiki Kaisha Chip-type LED and method for manufacturing the same
JP2009302339A (en) * 2008-06-13 2009-12-24 Sanken Electric Co Ltd Semiconductor light emitting device
KR100944085B1 (en) * 2008-06-23 2010-02-24 서울반도체 주식회사 Light emitting device
CN201336305Y (en) * 2008-11-14 2009-10-28 河源市粤兴实业有限公司 Diamond LED module group with lamp cups
TWM361722U (en) * 2008-12-29 2009-07-21 Brightek Optoelectronic Co Ltd Light emitting diode
CN201475686U (en) * 2009-07-31 2010-05-19 陈忠 Two-light-source LED lighting module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6531328B1 (en) * 2001-10-11 2003-03-11 Solidlite Corporation Packaging of light-emitting diode
US7345318B2 (en) * 2004-07-05 2008-03-18 Citizen Electronics Co., Ltd. Light-emitting diode
US20100078661A1 (en) * 2008-09-26 2010-04-01 Wei Shi Machined surface led assembly

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104380489A (en) * 2012-06-29 2015-02-25 夏普株式会社 Light-emitting device, illumination device and backlight for display device
CN104380489B (en) * 2012-06-29 2017-03-15 夏普株式会社 Light-emitting device, lighting device and display device backlight
TWI552390B (en) * 2014-01-29 2016-10-01 一詮精密工業股份有限公司 Manufacturing method of led tape
CN107210352A (en) * 2015-01-19 2017-09-26 Lg 伊诺特有限公司 Light-emitting component
US10340433B2 (en) 2015-01-19 2019-07-02 Lg Innotek Co., Ltd. Light emitting device
CN105977246B (en) * 2015-03-11 2020-04-28 Lg伊诺特有限公司 Light emitting device
CN105977246A (en) * 2015-03-11 2016-09-28 Lg伊诺特有限公司 Light emitting device
CN107546310A (en) * 2016-06-24 2018-01-05 首尔半导体株式会社 Light emission diode package member
CN106067508A (en) * 2016-08-03 2016-11-02 江西亚中电子科技有限公司 Multipurpose dual-colored LED patch support
CN107045992A (en) * 2017-04-19 2017-08-15 中国科学院上海微系统与信息技术研究所 Imaging sensor wafer-level encapsulation method and encapsulating structure
WO2022242476A1 (en) * 2021-05-20 2022-11-24 华为技术有限公司 Backlight module and manufacturing method therefor, display apparatus, and electronic device
CN114334930A (en) * 2021-12-30 2022-04-12 惠州市艾斯谱光电有限公司 Lighting lamp and lamp panel thereof
CN114334930B (en) * 2021-12-30 2022-09-27 惠州市艾斯谱光电有限公司 Lighting lamp and lamp panel thereof
CN114859601A (en) * 2022-04-28 2022-08-05 上海天马微电子有限公司 Reflection assembly, backlight module, display module and display device
CN114859601B (en) * 2022-04-28 2023-09-08 上海天马微电子有限公司 Reflection assembly, backlight module, display module and display device

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TWI594464B (en) 2017-08-01
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CN105355624B (en) 2019-12-03
TW201203620A (en) 2012-01-16
CN105355624A (en) 2016-02-24
CN105448905A (en) 2016-03-30
TW201624772A (en) 2016-07-01
TWI557951B (en) 2016-11-11
CN105448905B (en) 2019-03-05
TW201701504A (en) 2017-01-01
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TWI634677B (en) 2018-09-01
CN105355625A (en) 2016-02-24

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