TW201334150A - Light emitting device - Google Patents

Abstract

The invention provides a light emitting device. The light emitting device includes a lead frame. The lead frame includes a first wiring lead frame having a first die pad and a second wiring lead frame having a second die pad. A first light emitting chip and a second light emitting chip are respectively disposed on the first and second die pads. A bonding composite structure is disposed between a surface of one of the first and second wiring lead frames, between the first and second die pads. The bonding composite structure includes an insulating layer and a conductive layer disposed on the insulating layer. The conductive layer electrically connects to the first and second light emitting chips, so that the first and second light emitting chips are connected in series.

Description

Illuminating device

The present invention relates to a light-emitting device, and more particularly to a wiring arrangement of a light-emitting diode package structure of a series design.

There are two main types of light-emitting diode package structures that are conventionally designed in series. The first type is to directly connect two or more light emitting diode chips in series using gold wires. However, longer gold wires require higher costs and can withstand greater internal stress in the glue. Moreover, each of the light-emitting diode wafers has two solder joints. In order to avoid damage to the light-emitting diode wafers, when the wire bonding is performed, it is necessary to adjust and lower the relevant pressure parameters, but the risk of the gold wire pulling force is lowered. Another type is to design a safety island isolated from the crystal holder and the conductive bracket of the light-emitting diode when forming the bracket in the injection molding process, as a relay point of the gold wire series connection, the safety island during the injection molding process It is designed to be connected to the wire holder with an additional connection portion, and the connection portion is cut off in a subsequent process. However, the additional connecting portion described above extends to the outside of the wire holder such that the wire holder will have an additional projection, thereby creating additional stent mold costs. Moreover, the above-mentioned additional protruding portions may affect the appearance of the package structure, and thus it is necessary to redesign the amount to produce the classification of the production line and the conveyor belt track. In addition, the above-mentioned additional protruding portion causes the circuit loop of the light-emitting diode package structure to pass through the above-mentioned additional protruding portion without passing through the positive electrode or the negative electrode originally designed on the wire holder and the Zener diode designed on the wire holder (Zener Diode), thus causing the Zener diode to fail to create circuit loop protection and causing the LED to burn out.

In this technical field, there is a need for a light-emitting diode package structure designed in series to improve the service life of the light-emitting diode package structure and to avoid an increase in process cost.

In view of this, an embodiment of the present invention provides a light emitting device including a bracket including a first wire holder having a first crystal holder and a second wire having a second crystal holder. a first light emitting chip and a second light emitting chip respectively disposed on the first and second crystal holders; and a bonding composite structure disposed on the first between the first and second crystal holders And a conductive layer is stacked on the insulating layer, wherein the conductive layer is electrically connected to the first light emitting chip. And the second illuminating wafer, wherein the first and second illuminating wafers are brought into series.

Another embodiment of the present invention provides a light emitting device including a bracket including a first wire holder having a first crystal holder and a second wire holder having a second crystal holder. a first light emitting chip and a second light emitting chip are respectively disposed on the first and second crystal holders; a joint composite structure is disposed in the groove between the first and second wire holders, wherein the The bonding composite structure includes an insulating layer; a conductive layer is stacked on the insulating layer, wherein the conductive layer is electrically connected to the first light emitting chip and the second light emitting chip, so that the first and second light emitting wafers are In series.

The following is a detailed description of the embodiments and examples accompanying the drawings, which are the basis of the present invention. In the drawings or the description of the specification, the same drawing numbers are used for similar or identical parts. In the drawings, the shape or thickness of the embodiment may be expanded and simplified or conveniently indicated. In addition, the components of the drawings will be described separately, and it is noted that the components not shown or described in the drawings are known to those of ordinary skill in the art, and in particular, The examples are merely illustrative of specific ways of using the invention and are not intended to limit the invention.

The embodiment of the invention provides a light-emitting device, in particular, a package structure comprising at least two light emitting diodes connected in series, between different wire supports carrying the two light-emitting diodes, Or one of the wire holders is provided with a joint composite structure for electrically connecting the two light emitting diodes, so as to shorten the length of the gold wire for the series light emitting diodes. Fig. 1a is a top view of a light-emitting device 500a according to an embodiment of the present invention. Fig. 1b is a cross-sectional view showing a light-emitting device 500a according to an embodiment of the present invention. In order to facilitate the display of the wiring arrangement of the light-emitting device 500a, the packaging material of the light-emitting device 500a is not shown in FIG. 1a (top view). As shown in FIG. 1a to FIG. 1b, the light-emitting device 500a of the embodiment of the present invention may include a bracket 200 including a first wire holder 302 having a first crystal holder 202 and a second portion separated from each other. The second wire holder 304 of the crystal holder 204. In an embodiment of the invention, the stent 200 can be formed by injection molding. A first luminescent wafer 206 and a second luminescent wafer 208 are disposed on the first pedestal 202 and the second pedestal 204, respectively. In an embodiment of the invention, the first luminescent wafer 206 and the second luminescent wafer 208 may comprise a light emitting diode (LED). The first luminescent wafer 206 has a first electrode 218a and a second electrode 218b of opposite polarities, all located on the upper surface of the first luminescent wafer 206. In addition, the second illuminating wafer 208 has a third electrode 220a and a fourth electrode 220b of opposite polarities, all located on the upper surface of the second illuminating wafer 208. In an embodiment of the invention, the first electrode 218a and the third electrode 220a are positive electrodes, and the second electrode 218b and the fourth electrode 220b are negative electrodes.

In order to shorten the wire length of the tandem light-emitting chip, a groove 222 may be formed in the mold forming the bracket 200, and disposed between the first wire holder 302 and the second wire holder 304. Therefore, the stent 200 formed by the injection molding process will have a recess 222 and a joint composite structure 210 disposed in the recess 222. As shown in FIG. 1b, in an embodiment of the invention, the top surface of the joint composite structure 210 may be no higher than the top surfaces of the first wire holder 302 and the second wire holder 304. Figure 3 is a schematic illustration of a bonded composite structure 210 in accordance with one embodiment of the present invention. As shown in FIG. 3, in an embodiment of the invention, the bonding composite structure 210 can be an insulating layer-conductive layer composite structure including an insulating layer 214 and a conductive layer 216 stacked on the insulating layer 214. In an embodiment of the invention, an insulating material 214 can be cut into a suitable shape. Thereafter, an electroplating process is performed to form the bonding composite structure 210 by forming a conductive layer 216 on one surface of the insulating layer 214. In an embodiment of the invention, the insulating material may comprise sapphire, glass, tantalum oxide or tantalum nitride, and the material of the conductive layer 216 may comprise a metal such as gold or silver.

As shown in FIGS. 1a-1b, the conductive layer 216 of the bonded composite structure 210 is electrically connected to the second electrode 218b of the first luminescent wafer 206 and the third electrode of the second luminescent wafer 208 by bonding wires 224, 226, respectively. 220a. In addition, the bonding wires 230 are electrically connected to the first wire holder 302 and the first electrode 218a of the first light emitting chip 206, respectively, and the bonding wires 232 are electrically connected to the second wire holder 304 and the fourth electrode 220b of the second light emitting chip 208, respectively. The first luminescent wafer 206 and the second luminescent wafer 208 are brought into series. In an embodiment of the invention, when the first electrode 218a and the third electrode 220a are positive electrodes, and the second electrode 218b and the fourth electrode 220b are negative electrodes, the first wire holder 302 can be regarded as a positive wire holder 302, and the second wire The bracket 304 can be considered as a negative lead bracket 304. In an embodiment of the invention, the conductive layer 216 of the bonded composite structure 210 is non-polar.

As shown in FIG. 1a, the illuminating device 500a further includes a Zener diode 228 disposed on the surface of the first wire holder 302 or the second wire holder 304 and electrically connected to the first wire holder 302 and the second wire holder. 304. In the present embodiment, the Zener diode 228 is disposed on the surface of the first wire holder 302, and the second wire holder 304 is electrically connected by the bonding wire 234. In one embodiment of the invention, Zener diode 228 is used to protect the circuit loops of series first light emitting wafer 206 and second light emitting wafer 208. In an embodiment of the invention, the Zener diode 228 can be a bidirectional Zener diode.

As shown in FIG. 1b, the light-emitting device 500a further includes a packaging material 236 covering the first wire holder 302, the second wire holder 304, the first light-emitting chip 206, the second light-emitting chip 208, the joint composite structure 210, and the Zener. The diode 228 and the bonding wires 224, 226, 230, 232, 234 protect the light emitting device 500a. In an embodiment of the invention, encapsulating material 236 may comprise a polymeric material such as polyphthalamide (PPA).

Fig. 2 is a top view of a light-emitting device 500b according to another embodiment of the present invention. Similarly, in order to facilitate display of the wiring configuration of the light-emitting device 500b, the packaging material of the light-emitting device 500b is not shown in FIG. 2 (top view). The difference between the light-emitting device 500b and the light-emitting device 500a shown in FIG. 1 is that the joint composite structure 210 of the light-emitting device 500b can be disposed between the first crystal holder 202 and the second crystal holder 204. The surface of one of the wire holder 302 or the second wire holder 304 is not disposed in the groove of the holder 200. In addition, the Zener diode 228 is disposed on the surface of the first wire holder 302 or the second wire holder 304 that is different from the joint composite structure 210. In the present embodiment, the bonding composite structure 210 is disposed on the surface 212 of the second wire holder 304 between the first crystal holder 202 and the second crystal holder 204. In more detail, the insulating layer 214 is located at the On the surface of the two wire holders 304, a conductive layer 216 is stacked on the insulating layer 214, and a Zener diode 228 is disposed on the surface of the first wire holder 302.

The embodiment of the invention provides a light-emitting device, in particular, a package structure comprising at least two light-emitting diodes (LEDs) connected in series, between different wire supports carrying the two light-emitting diodes, or one of them The wire holder is provided with a joint composite structure for electrically connecting the two light emitting diodes, so as to shorten the length of the wire for the series light emitting diodes, and the conventional injection molding bracket can be improved by providing additional joints. The extra protrusion formed by the area (safety island) causes the asymmetry of the stent to affect the appearance of the product, increase the cost of the stent mold, and prevent the Zener diode from fully functioning. In addition, the illuminating device of the embodiment of the invention can increase the electrostatic discharge (ESD) protection capability of the LED series circuit, improve the service life of the LED package structure and avoid increasing the process cost, and can directly change the original product design. Import the app.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope is defined as defined in the scope of the patent application.

500a, 500b. . . Illuminating device

200. . . support

202. . . First crystal holder

302. . . First wire bracket

204. . . Second crystal holder

304. . . Second wire bracket

206. . . First light emitting chip

208. . . Second light emitting chip

210. . . Joint composite structure

212. . . surface

214. . . Insulation

216. . . Conductive layer

218a. . . First electrode

218b. . . Second electrode

220a. . . Third electrode

220b. . . Fourth electrode

222. . . Groove

224, 226, 230, 232, 234. . . Welding wire

228. . . Zener diode

236. . . Packaging material

Fig. 1a is a top view of a light emitting device according to an embodiment of the present invention.

Fig. 1b is a cross-sectional view showing a light-emitting device according to an embodiment of the present invention.

Fig. 2 is a top view of a light-emitting device according to another embodiment of the present invention.

Figure 3 is a schematic view of a bonded composite structure in accordance with one embodiment of the present invention.

500a. . . Illuminating device

200. . . support

202. . . First crystal holder

302. . . First wire bracket

204. . . Second crystal holder

304. . . Second wire bracket

206. . . First light emitting chip

208. . . Second light emitting chip

210. . . Joint composite structure

218a. . . First electrode

218b. . . Second electrode

220a. . . Third electrode

220b. . . Fourth electrode

222. . . Groove

224, 226, 230, 232, 234. . . Welding wire

228. . . Zener diode

Claims (19)

A light-emitting device includes: a bracket including a first wire holder having a first crystal holder and a second wire holder having a second crystal holder; a first light-emitting chip and a first Two illuminating wafers respectively disposed on the first and second crystal holders; and a bonding composite structure disposed in the first lead frame or the second lead bracket between the first and second crystal holders On one surface, the bonded composite structure includes: an insulating layer; and a conductive layer stacked on the insulating layer, wherein the conductive layer is electrically connected to the first light emitting chip and the second light emitting chip, The first and second luminescent wafers are brought into series. The illuminating device of claim 1, wherein the material of the insulating layer comprises sapphire, glass, yttria or tantalum nitride. The illuminating device of claim 1, wherein the conductive layer is made of metal. The illuminating device of claim 1, wherein the insulating layer of the bonding composite structure is located on the surface of the first wire holder or the second wire holder. The illuminating device of claim 1, wherein the first illuminating wafer has a first electrode and a second electrode, and the second illuminating wafer has a third electrode and a fourth electrode. The illuminating device of claim 5, further comprising: a first bonding wire electrically connected to the first wire holder and the first electrode of the first illuminating wafer; and a second bonding wire, respectively Electrically connecting the conductive layer and the second electrode of the first light-emitting chip; a third bonding wire electrically connecting the conductive layer and the third electrode of the second light-emitting chip respectively; and a fourth bonding wire, The second lead holder and the fourth electrode of the second illuminating wafer are electrically connected respectively. The illuminating device of claim 6, wherein the first and third electrodes are positive electrodes, and the second and fourth electrodes are negative electrodes. The illuminating device according to any one of claims 1 to 7, further comprising a Zener diode disposed on a surface of the first or second wire holder different from the joint structure. The illuminating device of claim 8, wherein the Zener diode is electrically connected to the first and second lead supports. The illuminating device of claim 8, wherein the Zener diode is a bidirectional Zener diode. A light-emitting device includes: a bracket including a first wire holder having a first crystal holder and a second wire holder having a second crystal holder; a first light-emitting chip and a first Two illuminating wafers respectively disposed on the first and second crystal holders; and a bonding composite structure disposed in the groove between the first and second wire holders, wherein the bonding composite structure comprises: An insulating layer; and a conductive layer stacked on the insulating layer, wherein the conductive layer is electrically connected to the first light emitting wafer and the second light emitting wafer, so that the first and second light emitting wafers are connected in series. The illuminating device of claim 11, wherein the material of the insulating layer comprises sapphire, glass, yttria or tantalum nitride. The illuminating device of claim 11, wherein the conductive layer is made of metal. The illuminating device of claim 11, wherein the first illuminating wafer has a first electrode and a second electrode, and the second illuminating wafer has a third electrode and a fourth electrode. The illuminating device of claim 14, further comprising: a first bonding wire electrically connected to the first wire holder and the first electrode of the first illuminating wafer, and a second bonding wire, respectively Electrically connecting the conductive layer and the second electrode of the first light-emitting chip; a third bonding wire electrically connecting the conductive layer and the third electrode of the second light-emitting chip respectively; and a fourth bonding wire, The second lead holder and the fourth electrode of the second illuminating wafer are electrically connected respectively. The illuminating device of claim 15, wherein the first and third electrodes are positive electrodes, and the second and fourth electrodes are negative electrodes. The illuminating device of any one of the preceding claims, further comprising a Zener diode disposed on the surface of the first or second wire holder different from the joint composite structure. The illuminating device of claim 17, wherein the Zener diode is electrically connected to the first and second lead supports. The illuminating device of claim 18, wherein the Zener diode is a bidirectional Zener diode.