CN102235651A - High-density radiator for high-power light emitting diode work light - Google Patents
High-density radiator for high-power light emitting diode work light Download PDFInfo
- Publication number
- CN102235651A CN102235651A CN2010101638242A CN201010163824A CN102235651A CN 102235651 A CN102235651 A CN 102235651A CN 2010101638242 A CN2010101638242 A CN 2010101638242A CN 201010163824 A CN201010163824 A CN 201010163824A CN 102235651 A CN102235651 A CN 102235651A
- Authority
- CN
- China
- Prior art keywords
- radiator
- heat
- power light
- emitting diodes
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention provides a high-density radiator for a high-power light emitting diode work light, which comprises a plurality of radiation fins. The radiator is characterized by comprising a circuit board, wherein a plurality of high-power light emitting diodes are arranged on the circuit board; the heat-radiation fins on the radiator are of an aslant-arranged structure; the inclining range of the heat-radiation fins relative to the ground is between 0 and 90 degrees; and the heat-radiation fins are arranged in an interdigital structure manner. The aslant-arranged structure of the heat-radiation fins ensures that an excellent flowability of the air is maintained among the heat-radiation fins when the radiator is in a horizontal arrangement state and a vertical arrangement state; the high-power light emitting diodes and the circuit board are soldered and fixed by soldering tin; the circuit board and the radiator are fixedly connected by adopting a thermal conductive adhesive; and the circuit board is made of an aluminum substrate; compared with the traditional radiator, the high-density radiator has larger thermal conductive coefficient and smaller thermal resistance, and can quickly and effectively conduct heat.
Description
Technical field
The present invention relates to the radiator structure that a kind of principle that can nature rises after utilizing air to be heated is dispelled the heat, be specifically related to a kind of large-power light-emitting diodes portable lamp high-density radiator.
Background technology
At present, the scope of great power LED (light emitting diode) light fixture utilization is more and more, comprise lighting field and automobile signal light field, a series of advantages such as that the LED light fixture has is energy-conservation, the life-span is long, but to guarantee that these advantages of LED light fixture must solve the heat dissipation problem of led light source.Because led light source must operate under the maximum temperature scope of regulation, otherwise at high temperature light intensity attenuation, change color can take place led light source, a series of problems such as life-span minimizing, and present LED technology, 80% energy is a heat, so great power LED cooling is a difficult problem.In the prior art, be a kind of effective reduction led light source method of temperature to led light source design radiator.
As shown in Figure 1, adopt heat-conducting glue to be fixedly connected on the two-sided epoxy plate 12 light emitting diode 11, the heat that light emitting diode 11 sends is delivered on the two-sided epoxy plate 12 by heat-conducting glue, two-sided epoxy plate 12 is installed on the radiator 14, be provided with heat conduction silicon chip 13 between two-sided epoxy plate 12 and the radiator 14, heat on the two-sided epoxy plate 12 is delivered on the radiator 14, do radiating ribs or fin 141 on the radiator 14, the radiating ribs of radiator 14 and fin 141 are exposed in the air, near the air heating, air is heated and can produces the phenomenon of free convection, utilizes this phenomenon that the temperature of radiator 14 is delivered in the air.
Existing traditional heat-dissipating device is considered the characteristic that hot-air free convection meeting is risen in design, all be that direction that fin is placed is perpendicular to ground, though vertically arranged the time, can make air that good flowability is arranged like this, can reach better radiating effect.But its shortcoming is, light fixture in actual applications, the user tends to adjust lamp installation angle or installation site, to obtain better light angle and illuminating effect, if with light fixture horizontal positioned or installation, the air between the fin 141 does not almost flow, cause very poor of radiating effect, cause light fixture a series of problems of bringing because of the LED heating to occur the most at last, so existing traditional heat-dissipating device can only be with vertically being provided with under this a kind of installment state, could efficiently radiates heat.
As shown in Figure 2, during the horizontal installment state of existing traditional heat-dissipating device, its fin 141 vertically is provided with respect to ground, and the air 3 between the fin 141 has good flowability, and this moment, the radiating effect of radiator 14 was fine.And during the vertical installment state of traditional heat-dissipating device, its fin 141 is placed with respect to ground level, air 3 flow effects between the fin 141 as shown in Figure 3, the air 3 between this moment fin 141 can't flow smoothly, the radiating effect of radiator is not good.
Summary of the invention
The invention provides a kind of large-power light-emitting diodes portable lamp high-density radiator, solved the problems of excessive heat of light emitting diode, the temperature that makes light emitting diode increases the life-span of led lamp in controlled range, satisfying the level installation simultaneously all has great heat radiation effect with vertical installation.
For achieving the above object, the invention provides a kind of large-power light-emitting diodes portable lamp high-density radiator, this radiator comprises some fin; It is characterized in that this radiator is provided with wiring board; This wiring board is provided with some large-power light-emitting diodes;
Fin on the above-mentioned radiator has adopted the structure that is obliquely installed, this fin with respect to the slant range on ground between 0 to 90 degree;
Above-mentioned fin adopts the interdigital structure setting.
Adopt the scolding tin welding fixing between above-mentioned large-power light-emitting diodes and the wiring board.
Adopt heat-conducting glue fixedly connected between above-mentioned wiring board and the radiator.
Above-mentioned wiring board adopts aluminium base to make.
Large-power light-emitting diodes of the present invention conducts to wiring board by scolding tin with heat, wiring board conducts to radiator with heat by heat-conducting glue, fin on the radiator flows by the air between each fin, and heat is diffused in the surrounding air, reaches the effect of efficiently radiates heat.
Large-power light-emitting diodes portable lamp high-density radiator of the present invention is compared with existing traditional heat-dissipating device, its advantage is, fin on the radiator of the present invention adopts the structure that is obliquely installed, make radiator no matter under horizontal installment state, still under vertically arranged state, air can both keep good flowability between fin, but solved the traditional heat-dissipating device can only be under a kind of installment state the shortcoming of efficiently radiates heat, make radiator under level and vertical two kinds of installment states, all have good thermal diffusivity;
Adopt the scolding tin welding fixing between large-power light-emitting diodes of the present invention and the wiring board, adopt heat-conducting glue to fix than the traditional heat-dissipating device, have better thermal conductivity, make conductive structure more reasonable, the heat that can conduct on the large-power light-emitting diodes better to be sent;
Adopt heat-conducting glue fixedly connected between wiring board of the present invention and the radiator, compare, have higher thermal conductivity factor, make conductive structure more reasonable, can better the heat on the wiring board be conducted to radiator with the heat conduction silicon chip that the traditional heat-dissipating device is adopted;
Wiring board of the present invention adopts aluminium base to make, and compares with the two-sided epoxy plate that the traditional heat-dissipating device is adopted, and has bigger thermal conductivity factor, makes conductive structure more reasonable, more fast and effeciently conducts heat.
Description of drawings
Fig. 1 is the structural representation of the radiator of prior art;
Fig. 2 is the air flow schematic diagram in radiator water safety when dress of prior art;
Air flow schematic diagram when Fig. 3 vertically installs for the radiator of prior art;
Fig. 4 is the structural representation of large-power light-emitting diodes portable lamp high-density radiator of the present invention;
Air flow schematic diagram when Fig. 5 installs for large-power light-emitting diodes portable lamp high-density radiator level of the present invention;
Air flow schematic diagram when Fig. 6 vertically installs for large-power light-emitting diodes portable lamp high-density radiator of the present invention.
The specific embodiment
Further specify embodiments of the invention below in conjunction with accompanying drawing.
As shown in Figure 4, large-power light-emitting diodes portable lamp high-density radiator of the present invention, this radiator comprise the some fin 23 that be arranged in parallel between mutually.This fin 23 has adopted the interdigital structure that is obliquely installed, and as shown in Figure 5 and Figure 6, radiator is when horizontal installment state or vertical installment state, and fin 23 on the radiator and ground angulation scope are between 0 to 90 degree.The heat-radiator plate face is rectangle in the present invention, the angle of inclination that its fin 23 is provided with and the limit of heat-radiator plate face are 45 degree, when radiator water safety of the present invention is adorned or is vertically installed, fin 23 is always 45 degree with the ground angulation on the radiator, make radiator of the present invention no matter when level is installed or vertically installed, after air is heated, air can convection current glibly between fin 23, heat on the radiator fast and effeciently is delivered in the air, has good heat radiation function.
As shown in Figure 4, radiator of the present invention is provided with wiring board 22, and this wiring board 22 adopts the aluminium base of 1.5mm to make, and the thermal conductivity factor of its aluminium base is 0.5W/m-k, and thermal resistance is 1.80 ℃/W, and this thermal resistance is much smaller than two-sided epoxy plate 12, and heat conductivility is fine.Adopt heat-conducting glue fixedly connected between this wiring board 22 and the radiator, this heat-conducting glue adopts No. 5 heat-conducting glues of silver fox of arctic silver, and its thermal conductivity factor is 3500000W/m-k, and thermal resistance is 0.0045 ℃/W, thermal resistance is much smaller than common heat-conducting glue and heat conduction silicon chip, and the capacity of heat transmission is very strong.
Large-power light-emitting diodes 11 is Ra to the thermal resistance of two-sided epoxy plate 12, and two-sided epoxy plate 12 top layers are Rb to the thermal resistance of bottom, and two-sided epoxy plate 12 bottoms are to the thermal resistance Rc of radiator 14.Rj is total thermal resistance, and promptly large-power light-emitting diodes 11 is transmitted to the thermal resistance on the radiator 14, Rj=Ra+Rb+Rc.The Rj heat of the bright large-power light-emitting diodes 11 of novel more is transmitted on the radiator 14 effective more.
Existing traditional heat-dissipating device and radiator of the present invention are compared:
In the principal element of decision Ra, the traditional heat-dissipating device adopts heat-conducting glue, and what radiator of the present invention was used is scolding tin, and the thermal resistance of scolding tin is much smaller than heat-conducting glue.In the principal element of decision Rb, the two-sided epoxy plate 12 of the employing of traditional heat-dissipating device, what radiator of the present invention was used is the wiring board 22 that aluminium base is made.Aluminium base is than two-sided epoxy plate, and its thermal conductivity factor is big, and thermal resistance is little.In the principal element of decision Rc, the traditional heat-dissipating device adopts heat conduction silicon chip 13, and what the present invention adopted is the heat-conducting glue of arctic silver.The heat-conducting glue of arctic silver is than heat conduction silicon chip 13, and its thermal conductivity factor is big, and thermal resistance is little.For the improvement of each radiator structure, make that the conductive structure of radiator of the present invention is more reasonable among the present invention, entire thermal resistance is much smaller than the radiator of prior art.
Application Of Radiator method of the present invention is as follows, earlier large-power light-emitting diodes 21 usefulness scolding tin is welded on the wiring board 22 that aluminium base makes, and the wiring board then aluminium base made 22 is installed on the radiator by heat-conducting glue.Its operation principle is: the heat that large-power light-emitting diodes 21 sends is transmitted on the wiring board 22, heat on the wiring board 22 is transmitted on the radiator by heat-conducting glue, heat on the radiator is delivered in the ambient air by fin 23, because fin 23 has adopted the structure that is obliquely installed, make radiator no matter still vertically place by horizontal positioned, fin 23 can effectively conduct heat in the ambient air, thereby reduced the temperature of large-power light-emitting diodes 21, reached the purpose of efficiently radiates heat.
Although content of the present invention has been done detailed introduction by above preferred embodiment, will be appreciated that above-mentioned description should not be considered to limitation of the present invention.After those skilled in the art have read foregoing, for multiple modification of the present invention with to substitute all will be conspicuous.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (4)
1. large-power light-emitting diodes portable lamp high-density radiator, this radiator comprises some fin (23); It is characterized in that this radiator is provided with wiring board (22); Described wiring board (22) is provided with some large-power light-emitting diodes (21);
Fin on the described radiator (23) has adopted the structure that is obliquely installed; Described fin (23) with respect to the slant range on ground between 0 to 90 degree;
Described fin (23) adopts the interdigital structure setting.
2. large-power light-emitting diodes portable lamp high-density radiator as claimed in claim 1 is characterized in that, adopts the scolding tin welding fixing between described large-power light-emitting diodes (21) and the described wiring board (22).
3. large-power light-emitting diodes portable lamp high-density radiator as claimed in claim 1 is characterized in that, adopts heat-conducting glue fixedly connected between described wiring board (22) and the described radiator.
4. large-power light-emitting diodes portable lamp high-density radiator as claimed in claim 1 is characterized in that, described wiring board (22) adopts aluminium base to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101638242A CN102235651A (en) | 2010-04-29 | 2010-04-29 | High-density radiator for high-power light emitting diode work light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101638242A CN102235651A (en) | 2010-04-29 | 2010-04-29 | High-density radiator for high-power light emitting diode work light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102235651A true CN102235651A (en) | 2011-11-09 |
Family
ID=44886558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101638242A Pending CN102235651A (en) | 2010-04-29 | 2010-04-29 | High-density radiator for high-power light emitting diode work light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102235651A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286395A (en) * | 2005-03-31 | 2006-10-19 | Ichikoh Ind Ltd | Vehicle lamp |
| CN200965178Y (en) * | 2006-10-20 | 2007-10-24 | 南京汉德森科技股份有限公司 | Large power LED traffic signal lamp |
| CN201178096Y (en) * | 2008-02-18 | 2009-01-07 | 杨良智 | Radiating construction of inserting pin type LED |
| CN201439936U (en) * | 2009-04-20 | 2010-04-21 | 深圳市深华龙科技实业有限公司 | Dust-proof LED street lamp radiating body |
-
2010
- 2010-04-29 CN CN2010101638242A patent/CN102235651A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286395A (en) * | 2005-03-31 | 2006-10-19 | Ichikoh Ind Ltd | Vehicle lamp |
| CN200965178Y (en) * | 2006-10-20 | 2007-10-24 | 南京汉德森科技股份有限公司 | Large power LED traffic signal lamp |
| CN201178096Y (en) * | 2008-02-18 | 2009-01-07 | 杨良智 | Radiating construction of inserting pin type LED |
| CN201439936U (en) * | 2009-04-20 | 2010-04-21 | 深圳市深华龙科技实业有限公司 | Dust-proof LED street lamp radiating body |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101469856A (en) | LED lamp | |
| CN101706078A (en) | High-power LED street lamp | |
| CN2898575Y (en) | High-density and directed-connected LED illuminating module | |
| CN201204203Y (en) | Radiating device for high-power LED | |
| CN105650566A (en) | LED headlamp with heat dissipation structure | |
| CN101660696B (en) | Large power LED square illuminating lamp | |
| CN101813266A (en) | High-power LED street lamp based on composite heat pipe | |
| CN202338809U (en) | Light-emitting diode (LED) lamp | |
| CN100594323C (en) | High power semiconductor lighting lamp | |
| CN201697081U (en) | Radiator suitable for being arranged horizontally and vertically | |
| CN201425286Y (en) | Heat dissipation structure of LED lamp | |
| CN201555083U (en) | Multi-chip high-power LED lamp and a radiator structure | |
| CN206449428U (en) | A kind of LED radiator structure | |
| CN102235651A (en) | High-density radiator for high-power light emitting diode work light | |
| CN202118606U (en) | Alloy heat radiating light-emitting diode (LED) lamp bulb | |
| CN201145243Y (en) | LED cup lamp | |
| CN204516803U (en) | Great power LED low thermal resistance radiator structure | |
| CN106051486A (en) | High-power LED lamp heat dissipation device based on graphene heat rectification material and lamp | |
| CN206724041U (en) | A kind of heat abstractor based on CPU water coolings | |
| CN205859636U (en) | Heat radiation device of high-power LED based on graphene thermal rectifying material and light fixture | |
| CN213479868U (en) | COB multilayer packaging structure capable of rapidly dissipating heat of LED light source | |
| CN202532320U (en) | High-power integrated LED (light emitting diode) mining lamp | |
| CN101749667A (en) | High-power LED lighting device | |
| KR101233644B1 (en) | Heat emittion device of large lamp having laminated heat emitting conductor | |
| CN201680251U (en) | High-power integrative LED road lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20111109 |