KR101233644B1 - Heat emittion device of large lamp having laminated heat emitting conductor - Google Patents

Heat emittion device of large lamp having laminated heat emitting conductor Download PDF

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KR101233644B1
KR101233644B1 KR1020120078066A KR20120078066A KR101233644B1 KR 101233644 B1 KR101233644 B1 KR 101233644B1 KR 1020120078066 A KR1020120078066 A KR 1020120078066A KR 20120078066 A KR20120078066 A KR 20120078066A KR 101233644 B1 KR101233644 B1 KR 101233644B1
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heat
lamp cover
conductor
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heat dissipation
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최두영
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두한종합건설 주식회사
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

본 발명은 LED 소자의 열전도를 빠르고 넓게 확산 전도시켜 방열 효과를 증대시킬 수 있는 적층방열 전도체를 갖는 대형 조명등의 방열 장치를 제공한다.
본 발명의 바람직한 실시예에 따른 적층방열 전도체를 갖는 대형 조명등의 방열 장치는, 일방으로 조명이 가능하도록 조명개구부를 갖는 알루미늄 램프 커버와; 다수의 LED 소자의 리드 프레임인 애노우드 단자와 캐소오드 단자를 고정시킬 수 있는 솔더 패드가 구비되어 상기 알루미늄 램프 커버의 내부에 위치된 PCB 기판과; 상기 솔더 패드를 통해 접합되어 PCB 기판에 배치되어 있는 다수의 LED 소자와; 상기 PCB기판과 알루미늄 램프 커버의 사이에 배치된 적층 배치된 적층방열 전도체; 및 상기 알루미늄 램프 커버에 삽입된 후 적층방열 전도체에 체결되어 상기 적층방열 전도체를 알루미늄 램프 커버에 지지시켜 놓는 체결수단;을 포함하는 것을 특징으로 한다.The present invention provides a heat dissipation device such as a large sized lamp having a laminated heat dissipation conductor capable of rapidly and widely diffusing and conducting heat conduction of an LED element.
According to a preferred embodiment of the present invention, a heat dissipating device such as a large sized lamp having a laminated heat dissipating conductor may include: an aluminum lamp cover having an illumination opening to enable one side lighting; A PCB substrate having an anode terminal, which is a lead frame of a plurality of LED elements, and a solder pad for fixing a cathode terminal, and positioned inside the aluminum lamp cover; A plurality of LED elements bonded to the solder pads and disposed on a PCB substrate; A laminated heat dissipation conductor disposed between the PCB substrate and the aluminum lamp cover; And a fastening means inserted into the aluminum lamp cover and fastened to the laminated radiant conductor to support the laminated radiant conductor on the aluminum lamp cover.

Description

적층방열 전도체를 갖는 대형 조명등의 방열 장치{Heat emittion device of large lamp having laminated heat emitting conductor}Heat emittion device of large lamp having laminated heat emitting conductor

본 발명은 LED를 갖는 대형 조명등의 방열 장치에 관한 것으로, 특히 LED 소자의 열전도를 빠르고 넓게 확산 전도시켜 방열 효과를 증대시킬 수 있는 적층방열 전도체를 갖는 대형 조명등의 방열 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation device for a large sized lamp having an LED, and more particularly, to a heat dissipation device for a large sized lamp having a laminated heat dissipation conductor capable of increasing the heat dissipation effect by spreading and conducting heat conduction of a LED element quickly and widely.

일반적으로 LED 발열에 있어 이슈는 소비 전력당 휘도(Efficacy)이며 이 때 적용되는 단위가 루멘(lm)/와트(W)다. 모든 LED 업체들은 이 값을 향상시키려는 노력을 하고 있으며, 이에 대한 기록경쟁이 치열하다. 발열 문제를 이해하기 위해서는 LED로부터의 광출력을 전기적 인가전력으로 나눈 WPE(Wall-Plug Efficiency)의 개념을 알아야 한다. 즉, 100%에서 WPE를 뺀 나머지 에너지 분율이 발열로 변환한다는 개념이다. 일반적으로 이 값은 20% 미만이지만, 41.7%의 아주 높은 효율의 WPE를 갖는 LED가 보고된 경우도 있다. 상용화 관점에서 WPE 값을 따지려면 적용 가능한 인가전류와 주변 환경에서의 측정 값을 고려해야 한다. In general, the issue of LED heating is the luminance per power consumption (Efficacy), the unit applied in this case is lumen (lm) / watt (W). All LED companies are trying to improve this value, and record competition is fierce. In order to understand the heat problem, it is necessary to understand the concept of Wall-Plug Efficiency (WPE) by dividing the light output from the LED by the electrical applied power. In other words, 100% minus WPE converts the energy fraction into heat. Typically this value is less than 20%, but LEDs with very high efficiency WPE of 41.7% have been reported. In order to determine the WPE value from the point of view of commercialization, it is necessary to consider the applicable applied current and the measured value in the surrounding environment.

일반적으로 이 값은 내부 및 외부 양자효율과 추출효율의 제한성으로 2020년까지 50% 이상 증가할 수 없다는 보고가 있다. 양자효율 및 추출효율과 연계되는 에피층의 품위, 소자 및 패키징 설계 기술 등에 관한 획기적인 진보기술이 없다면 LED 모듈 및 시스템에서의 발열문제는 지속적인 이슈가 될 것이라는 것을 의미한다.In general, it is reported that this value cannot increase more than 50% by 2020 due to the limitation of internal and external quantum efficiency and extraction efficiency. Without the breakthroughs in epilayer quality, device and packaging design technologies associated with quantum and extraction efficiencies, the problem of heat generation in LED modules and systems will be an ongoing issue.

LED의 높은 휘도를 얻으려면 인가전력을 높이면 된다. 그런데 문제는 소비전력이다. 인가전력이 대부분 광출력으로 변환한다면 아무 문제가 없는데 LED에서는 그렇지 못한 인가전력이 발열의 원인이 되며 소비전력을 증가시킨다.In order to obtain high luminance of the LED, it is necessary to increase the applied power. The problem is power consumption. If the applied power is mostly converted to light output, there is no problem. In the LED, the applied power causes heat and increases the power consumption.

발광소자인 동시에 발열소자인 LED는 유입되는 전류 중 30%에 못 미치는 에너지만을 빛에너지로 생성시키고 나머지는 모두 열에너지로 전환된다. 이때 발생되는 열이 신속히 처리되지 않으면 LED칩은 물론 주변 회로에 영향을 미쳐 제품의 신뢰성을 떨어뜨리는 주요인이 된다. 장기간에 걸쳐 누적된 열 쇼크로 인해 제품의 문제가 발생되는 것이다. LED, which is a light emitting device and a heating device, generates only energy that is less than 30% of the current flowing into the light energy, and all the rest are converted into thermal energy. If the generated heat is not processed quickly, it affects not only the LED chip but also the peripheral circuits, which is a major factor to reduce the reliability of the product. Accumulated heat shocks over long periods of time can cause product problems.

본 발명의 배경이 되는 기술로는 한국 등록특허 등록번호 제10-1023255호로서, 파워 ＬＥＤ 소자를 갖는 대형 조명등의 임플란트 타입 방열 장치가 제시되어 있다. 이는 파워 LED 소자를 갖는 대형 조명등의 방열 장치에 있어서, 상기 파워 LED 소자의 리드 프레임인 애노우드 단자와 캐소오드 단자를 고정시킬 수 있는 솔더 패드가 구비되는 양면기판과; 상기 파워 LED 소자가 솔더링된 양면기판과 대형 알루미늄 라지에이터를 장착시키는 알루미늄 등기구와; 상기 파워 LED소자의 발열부위인 방열점에서 발생되는 고열을 T자형 동 핀 구조체와 렌치볼트를 통해 축적시켜 3배 속도로 대형 알루미늄 라지에이터로 분산시키되, 상기 양면 PCB기판과 알루미늄 등기구를 하나의 방열 장치로 일체화시키는 임플란트 열전달 매체를 포함하는 것을 특징으로 한다.As a background technology of the present invention, Korean Patent Registration No. 10-1023255, an implant type heat dissipation device such as a large-sized lamp having a power LED element is proposed. The heat dissipation device of a large-sized lighting lamp having a power LED element, comprising: a double-sided board provided with a solder pad for fixing an anode terminal and a cathode terminal, which are lead frames of the power LED element; An aluminum luminaire for mounting the double-sided board on which the power LED device is soldered and a large aluminum radiator; The high heat generated at the heat radiating point of the heat LED of the power LED device is accumulated through a T-shaped copper pin structure and a wrench bolt to be distributed to a large aluminum radiator at three times the speed, and the double-sided PCB board and the aluminum luminaire are one heat dissipation device. It is characterized in that it comprises an implant heat transfer medium to integrate into.

그러나 상기 배경기술은 동 핀 구조체를 통과하는 전열면적이 제한적이므로 방열을 증대시키는데 한계를 가지는 문제가 있다.However, since the background art has a limited heat transfer area passing through the fin structure, there is a problem in that heat radiation is limited.

한국 등록특허 등록번호 제10-1060410호Korea Patent Registration No. 10-1060410 한국 등록특허 등록번호 제10-1129524호Korea Patent Registration No. 10-1129524

본 발명은 상기와 같은 사정을 감안하여 창안된 것으로, LED 소자의 열전도를 빠르고 넓게 확산 전도시켜 방열 효과를 증대시킬 수 있는 적층방열 전도체를 갖는 대형 조명등의 방열 장치를 제공함에 그 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a heat dissipation device such as a large sized lamp having a laminated heat dissipation conductor capable of increasing the heat dissipation effect by rapidly spreading and conducting heat conduction of an LED element.

본 발명의 바람직한 실시예에 따른 적층방열 전도체를 갖는 대형 조명등의 방열 장치는,The heat dissipation device of a large sized lamp having a laminated heat dissipating conductor according to a preferred embodiment of the present invention,

일방으로 조명이 가능하도록 조명개구부를 갖는 알루미늄 램프 커버와;An aluminum lamp cover having an illumination opening to enable illumination in one direction;

다수의 LED 소자의 리드 프레임인 애노우드 단자와 캐소오드 단자를 고정시킬 수 있는 솔더 패드가 구비되어 상기 알루미늄 램프 커버의 내부에 위치된 PCB 기판과;A PCB substrate having an anode terminal, which is a lead frame of a plurality of LED elements, and a solder pad for fixing a cathode terminal, and positioned inside the aluminum lamp cover;

상기 솔더 패드를 통해 접합되어 PCB 기판에 배치되어 있는 다수의 LED 소자와;A plurality of LED elements bonded to the solder pads and disposed on a PCB substrate;

상기 PCB기판과 알루미늄 램프 커버의 사이에 배치된 적층 배치된 적층방열 전도체; 및A laminated heat dissipation conductor disposed between the PCB substrate and the aluminum lamp cover; And

상기 알루미늄 램프 커버에 삽입된 후 적층방열 전도체에 체결되어 상기 적층방열 전도체를 알루미늄 램프 커버에 지지시켜 놓는 체결수단;을 포함하는 것을 특징으로 한다.And a fastening means inserted into the aluminum lamp cover and fastened to the laminated radiant conductor to support the laminated radiant conductor on the aluminum lamp cover.

또한, 상기 적층방열 전도체는,In addition, the laminated heat conducting conductor,

외주면에 일정 간격을 두고 형성된 다수개의 전도판 끼움홈이 구비되어 있는 센터핀과;A center pin having a plurality of conductive plate fitting grooves formed at predetermined intervals on an outer circumferential surface thereof;

상기 센터핀의 전도판 끼움홈에 강제적으로 끼움되어져 밀착 결합된 확장열전도판과;An expansion heat conduction plate which is forcibly fitted into the conduction plate fitting groove of the center pin and is tightly coupled;

상기 확장열전도판의 적층된 상하로 이웃한 공간 사이에 형성된 방열챔버가 구성되어 있는 것을 특징으로 한다.The heat dissipation chamber is formed between the spaced up and down adjacent space of the expansion heat conductive plate is configured.

또한, 상기 방열챔버에는 탄소, 카본, 알루미늄에서 단일 또는 하나 이상 혼합된 분말 또는 섬유 형태의 열전도 충전제가 더 충전되어져 있는 것을 특징으로 한다.In addition, the heat dissipation chamber is characterized in that the thermally conductive filler in the form of powder or fiber mixed with one or more than one from carbon, carbon, aluminum.

또한, 상기 열전도 충전제는 실리콘 계열의 접착제와 혼합되어져 방열챔버에 충전되어진 것을 특징으로 한다.In addition, the thermally conductive filler is mixed with a silicone-based adhesive is characterized in that the filling in the heat radiation chamber.

또한, 상기 알루미늄 램프 커버에 형성된 외기유입구 및 외기유출구, 외기유입구와 외기유출구를 연통시켜주도록 확장열전도판에 관통된 다수의 방열공을 더 포함하는 것을 특징으로 한다.In addition, the air inlet and the outside air inlet formed in the aluminum lamp cover, characterized in that it further comprises a plurality of heat dissipating holes penetrated through the expansion heat conduction plate to communicate the outside air inlet and the outside air outlet.

또한, 상기 알루미늄 램프 커버의 상방에는 방열팬이 더 설치되어 있는 것을 특징으로 한다.In addition, the heat radiation fan is further provided above the aluminum lamp cover.

또한, 상기 PCB 기판에는 다수개의 기판측 외기유입구가 더 형성되어 있는 것을 특징으로 한다.In addition, the PCB substrate is characterized in that the plurality of substrate-side external air inlet is further formed.

또한, 외기유입구에는 유입된 빗물을 배수시키는 역류방지밸브가 더 설치되어 있는 것을 특징으로 한다.In addition, the outside air inlet is characterized in that the non-return valve for draining the rainwater is further installed.

또한, 외기유출구에는 조명등 내부에서 방출되는 열에 의해 개폐되는 열팽창 개폐밸브가 더 설치되어 있는 것을 특징으로 한다.In addition, the outdoor air outlet is characterized in that the thermal expansion on-off valve further opened and closed by the heat emitted from the interior of the lamp.

본 발명의 적층방열 전도체를 갖는 대형 조명등의 방열 장치에 따르면, LED 소자의 발열을 센터핀과 확장열전도판을 통해 빠르고 넓게 확산 전도시켜 방열 효과를 증대시킬 수 있다.According to the heat dissipation device of a large sized lamp having the laminated heat dissipation conductor of the present invention, the heat dissipation effect can be increased by quickly and widely spreading heat generated by the LED element through the center pin and the expansion heat conduction plate.

또한, 확장열전도판의 사이사이에 열전도 충전제가 충전되어 있을 경우 열전도를 더욱 향상시켜 조명 회로가 안정적으로 동작하며 LED 소자의 수명을 향상시킬 수 있다.In addition, when the thermally conductive filler is filled between the expansion heat conduction plates, the heat conduction is further improved, so that the lighting circuit operates stably and the life of the LED device can be improved.

또한, 방열팬을 설치하여 강제적으로 외기를 순환시켜 LED 소자의 냉각 성능을 향상시킬 수 있다.In addition, by installing a heat radiating fan forcibly circulating the outside air can improve the cooling performance of the LED device.

본 명세서에서 첨부되는 다음의 도면들은 본 발명의 바람직한 실시 예를 예시하는 것이며, 발명의 상세한 설명과 함께 본 발명의 기술사상을 더욱 이해시키는 역할을 하는 것이므로, 본 발명은 첨부한 도면에 기재된 사항에만 한정되어서 해석되어서는 아니 된다.
도 1은 본 발명에 따른 적층방열 전도체를 갖는 대형 조명등의 방열 장치의 구성도.
도 2는 도 1의 A부 확대도.
도 3은 도 1에서 방열챔버에 열전도 충전제가 충전되어 있는 상태도.
도 4는 도 3의 B부 확대도.
도 5는 도 1에 냉각팬이 설치된 상태도.
도 6은 도 5의 방열챔버에 열전도 충전제가 충전되어 있는 상태도.
도 7은 본 실시 예에 적용되는 알루미늄 램프 커버의 개략적인 평면도.The following drawings, which are attached in this specification, illustrate the preferred embodiments of the present invention, and together with the detailed description thereof, serve to further understand the technical spirit of the present invention. It should not be construed as limited.
1 is a block diagram of a heat dissipation device of a large lamp having a laminated heat dissipation conductor according to the present invention.
2 is an enlarged view of part A of Fig.
Figure 3 is a state filled with a heat conductive filler in the heat dissipation chamber in Figure 1;
4 is an enlarged view of a portion B of FIG. 3;
5 is a state in which the cooling fan is installed in FIG.
6 is a state in which the heat conductive filler is filled in the heat dissipation chamber of FIG.
7 is a schematic plan view of the aluminum lamp cover applied to this embodiment.

아래에서 본 발명은 첨부된 도면에 제시된 실시 예를 참조하여 상세하게 설명이 되지만 제시된 실시 예는 본 발명의 명확한 이해를 위한 예시적인 것으로 본 발명은 이에 제한되지 않는다. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the embodiments shown in the accompanying drawings, but the present invention is not limited thereto.

도 1 및 도 2에서와 같이 적층방열 전도체를 갖는 대형 조명등의 방열 장치(10)는, 일방으로 조명이 가능하도록 조명개구부(12a)를 갖는 알루미늄 램프 커버(12)가 구비된다. 이때 알루미늄 램프 커버(12)는 둘레에 하방으로 일정 폭을 가지고 절곡된 스커트부(12b)를 가진다. 스커트부(12b)는 조명의 최초 범위를 결정함과 동시에 조명개구부(12a)의 내부로 빗물 등이 침투하는 것을 방지한다. 알루미늄 램프 커버(12)는 예로 평면에서 보았을 때 도 7과 같이 한쪽 방향으로 긴 장방향 형태가 될 수 있다.1 and 2, the heat dissipation device 10 of a large-sized light having a laminated heat-dissipating conductor is provided with an aluminum lamp cover 12 having an illumination opening 12a so as to enable one side lighting. At this time, the aluminum lamp cover 12 has a skirt portion 12b bent with a predetermined width downward. The skirt portion 12b determines the initial range of illumination and at the same time prevents rainwater or the like from penetrating into the illumination opening 12a. For example, the aluminum lamp cover 12 may have a long longitudinal shape in one direction as shown in FIG. 7 when viewed in a plan view.

알루미늄 램프 커버(12)의 내부에 PCB 기판(14)이 위치되어 있다. PCB 기판(14)은 도 2와 같이 다수의 LED 소자(16)의 리드 프레임인 애노우드 단자와 캐소오드 단자를 고정시킬 수 있는 솔더 패드(141a,141b)가 구비되어 있다. 솔더 패드(141a.141b)를 통해 PCB 기판(14)에 다수의 LED 소자(16)가 접합되어 있다.The PCB substrate 14 is located inside the aluminum lamp cover 12. As shown in FIG. 2, the PCB substrate 14 includes solder pads 141a and 141b for fixing the anode terminals and the cathode terminals, which are lead frames of the plurality of LED elements 16. A plurality of LED elements 16 are bonded to the PCB substrate 14 through solder pads 141a and 141b.

PCB기판(14)과 알루미늄 램프 커버(12)의 사이에는 적층방열 전도체(18)가 설치되어 있다. 적층방열 전도체(18)는 LED 소자(16) 및 PCB기판(14)에서 발생된 열의 전도를 빠르고 넓게 확산시켜 램프 커버(12)로 전달한다.The laminated heat-dissipating conductor 18 is provided between the PCB board 14 and the aluminum lamp cover 12. The laminated radiating conductor 18 diffuses the conduction of heat generated from the LED element 16 and the PCB substrate 14 quickly and widely to the lamp cover 12.

적층방열 전도체(18)는 외주면에 일정 간격을 두고 형성된 다수개의 전도판 끼움홈(181a)이 구비되어 있는 센터핀(181)과, 센터핀(181)의 전도판 끼움홈(181a)에 강제적으로 끼움되어져 밀착 결합된 확장열전도판(182)과, 확장열전도판(182)의 적층된 상하로 이웃한 공간 사이에 형성된 방열챔버(183)가 구성되어져 있다. 센터핀(181)은 열전도가 우수한 금속으로 예로, 구리, 아연, 알루미늄 등의 열전도가 우수한 것이 바람직하다. 센터핀(181)은 도 2와 같이 LED 소자(16)와 절연층(17)으로 전기적으로 절연되어 있다. 절연층(17)은 고분자수지가 될 수 있다. 바람직하게 센터핀(181)은 LED 소자(16)와 동일 수직선상에 배열된다. 따라서 LED 소자(16)의 전기적 발열은 센터핀(181)으로 먼저 도달하여 전도된다.The laminated heat-dissipating conductor 18 is forced to a center pin 181 having a plurality of conductive plate fitting grooves 181a formed at regular intervals on an outer circumferential surface thereof, and a conductive plate fitting groove 181a of the center pin 181. An expansion heat conduction plate 182 fitted and tightly coupled to each other and a heat dissipation chamber 183 formed between the spaced up and down neighboring spaces of the expansion heat conduction plate 182 are configured. The center pin 181 is a metal having excellent thermal conductivity. For example, the center pin 181 may have excellent thermal conductivity such as copper, zinc, and aluminum. The center pin 181 is electrically insulated from the LED element 16 and the insulating layer 17 as shown in FIG. 2. The insulating layer 17 may be a polymer resin. The center pin 181 is preferably arranged on the same vertical line as the LED element 16. Therefore, the electric heat generated by the LED element 16 first reaches the center pin 181 and is conducted.

확장열전도판(182)은 이웃한 센터핀(181과 181)을 연결시킴으로써 센터핀(181)으로 유입된 열이 넓게 확산되어 신속한 열방출을 꾀한다. 확장열전도판(182)은 열전도가 우수한 금속으로 예로, 구리, 아연, 알루미늄 등으로 제작될 수 있다. 확장열전도판(182)은 2mm 이하의 얇은 박판형이다.The expansion heat conducting plate 182 connects the adjacent center fins 181 and 181 so that heat introduced into the center fins 181 is widely diffused to achieve rapid heat dissipation. The expanded thermal conductive plate 182 is a metal having excellent thermal conductivity, for example, may be made of copper, zinc, aluminum, or the like. The expansion heat conducting plate 182 is a thin thin plate of 2 mm or less.

방열챔버(183)에는 도 3 및 도 4와 같이 탄소, 카본, 알루미늄에서 단일 또는 하나 이상 혼합된 분말 또는 섬유 형태의 열전도 충전제(184)가 충전되어져 구성될 수 있다. 이때 열전도 충전제(184)는 내열성이나 내후성이 뛰어나고 경화 조건이나 점도 및 유동성 등의 조정이 용이한 실리콘 계열의 접착제와 혼합되어져 방열챔버(183)에 충전되어질 수 있다. 이때 열전도 충전제(184)와 접착제의 비율은 예로 8:2의 중량비가 될 수 있다.3 and 4, the heat dissipation chamber 183 may be filled with a thermally conductive filler 184 in the form of powder or fiber mixed with one or more mixtures of carbon, carbon, and aluminum. In this case, the thermally conductive filler 184 may be mixed with a silicone-based adhesive having excellent heat resistance or weather resistance and easy to adjust curing conditions, viscosity, and fluidity, and thus may be filled in the heat dissipation chamber 183. In this case, the ratio of the thermally conductive filler 184 and the adhesive may be, for example, a weight ratio of 8: 2.

적층방열 전도체(18)는 체결수단(20)을 통해 알루미늄 램프 커버(12)에 지지되어져 있다. 체결수단(20)은 구리 또는 강재로 제작된 볼트 형태이다. 체결수단(20)은 알루미늄 램프 커버(12)에 삽입된 후 센터핀(181)에 각기 나사 결합으로 체결된다. 이때 체결수단(20)이 삽입되는 알루미늄 램프 커버(12)에 누수의 침입을 방지하기 위해 주지의 오링이 체결수단(20)에 개재되어 설치될 수 있다.The laminated radiant conductor 18 is supported by the aluminum lamp cover 12 via the fastening means 20. The fastening means 20 is in the form of bolts made of copper or steel. The fastening means 20 is inserted into the aluminum lamp cover 12 and then fastened by screwing to the center pin 181, respectively. In this case, a well-known O-ring may be interposed in the fastening means 20 to prevent leakage of water into the aluminum lamp cover 12 into which the fastening means 20 is inserted.

이와 같이 구성된 적층방열 전도체를 갖는 대형 조명등의 방열 장치의 작용을 설명한다.The function of the heat dissipation device of the large sized lighting lamp having the laminated heat dissipation conductor configured as described above will be described.

먼저, LED 소자(16)가 전기적으로 동작하게 되면 조명이 이루어지고 동시에 고열이 발생된다.First, when the LED element 16 is electrically operated, illumination is generated and at the same time, high heat is generated.

이 고열은 적층방열 전도체(18)를 통해 전도되어 알루미늄 램프 커버(12)를 통해 외부로 방출된다. 이때 알루미늄 램프 커버(12)는 대류 열전도를 통해 발생열을 방출시킨다.This high heat is conducted through the laminated radiating conductor 18 and discharged to the outside through the aluminum lamp cover 12. At this time, the aluminum lamp cover 12 emits heat generated through convection heat conduction.

이때 적층방열 전도체(18)에서는 센터핀(181), 확장열전도판(182)을 통해 빠르고 넓게 열전도가 이루어진다. 방열챔버(183)에 탄소, 카본, 알루미늄에서 단일 또는 하나 이상 혼합된 분말 또는 섬유 형태의 열전도 충전제(184)가 충전되어져 있는 경우 더 급속하에 열이 방출되어 LED 소자(16)의 냉각을 촉진한다.At this time, the thermal radiation conductor 18 is fast and wide thermal conduction through the center fin 181, the expansion heat conduction plate 182. When the heat dissipation chamber 183 is filled with a thermally conductive filler 184 in the form of a powder or fiber mixed with one or more of carbon, carbon, and aluminum, heat is released more rapidly to promote cooling of the LED element 16. .

한편, 도 1과 같이 알루미늄 램프 커버(12)에 외기유입구(121)와 외기유출구(122)를 형성하고, 외기유입구(121)와 외기유출구(122)를 연통시켜주도록 확장열전도판(182)에 관통된 다수의 방열공(182a)을 더 구성할 수 있다.Meanwhile, as shown in FIG. 1, the outdoor air inlet 121 and the outdoor air outlet 122 are formed in the aluminum lamp cover 12, and the external air inlet 121 and the outdoor air outlet 122 are connected to the expansion heat conducting plate 182. A plurality of penetrating heat dissipation holes 182a may be further configured.

따라서 외기유입구(121)로 유입된 냉기(외기)는 다수의 방열공(182a)을 거친 후 외기유출구(122)를 빠져나간다. 이와 같이 자연적인 대류 현상에 의해 냉기를 알루미늄 램프 커버(12)내에서 확장열전도판(182)을 통해 순환시킬 경우 열전도 충전제(184)를 사용하지 않고도 LED 소자(16)의 냉각효과를 높일 수 있다.Therefore, the cold air (outside air) introduced into the outside air inlet 121 passes through the plurality of heat radiating holes 182a and then exits the outside air outlet 122. As such, when the cool air is circulated through the expansion heat conducting plate 182 in the aluminum lamp cover 12 by natural convection, the cooling effect of the LED element 16 may be enhanced without using the heat conductive filler 184. .

또한, 본 발명은 알루미늄 램프 커버(12)의 상방에 도 5 및 6과 같이 팬거치대(33)를 추가로 설치하고, 팬 거치대(33)에 지지되어 있는 방열팬(30)이 설치될 수 있다. 이때 방열팬(30)은 팬모터(31)와 팬날개(32)로 구성되며, 팬모터(31)는 태양광으로 충전된 전기에너지를 사용하여 등기구의 사용중에만 전기적으로 동작하도록 함이 바람직하다. 즉, 소등시 낮에는 태양광으로 솔라셀(도시안됨)을 통해 전기를 충전하였다가 야간의 점등시 회로가 동작하여 방열팬(30)이 동작되도록 한다. 이때 솔라셀은 알루미늄 램프 커버(12)가 설치되는 지주에 별도로 설치된 것이 이용될 수 있다.In addition, in the present invention, as shown in FIGS. 5 and 6, the fan holder 33 may be additionally installed above the aluminum lamp cover 12, and a heat dissipation fan 30 supported by the fan holder 33 may be installed. . At this time, the heat dissipation fan 30 is composed of a fan motor 31 and the fan blades 32, the fan motor 31 is preferably to be electrically operated only during the use of the luminaire using electrical energy charged with sunlight. Do. That is, when the lights are turned off during the day, the solar cell (not shown) is charged with electricity and the circuit is operated at night lighting so that the heat radiating fan 30 is operated. At this time, the solar cell may be used that is separately installed on the post where the aluminum lamp cover 12 is installed.

이때 LED 소자(16)의 냉각효과를 높이기 위해 PCB 기판(14)에는 다수개의 기판측 외기유입구(141)가 더 형성될 수 있다. 따라서 방열팬(30)에는 더 많은 열이 방출되어 LED 소자(16)의 냉각을 증대시킬 수 있다.In this case, in order to increase the cooling effect of the LED device 16, a plurality of substrate-side external air inlets 141 may be further formed on the PCB substrate 14. Therefore, more heat is released to the heat radiating fan 30 to increase the cooling of the LED element 16.

한편, 외기유입구(121)에는 유입된 빗물을 배수시키는 역류방지밸브(127)가 더 설치되어 구성될 수 있다. 역류방지밸브(127)는 고무마개의 개폐 작용으로 유로를 개방 및 폐쇄시키는 것으로, 외기유입구(121)의 내부측으로 유입된 빗물에 의해 개방된다. 따라서 LED 소자(16)측 전자 회로를 안전하게 보호할 수 있다.On the other hand, the outside air inlet 121 may be configured to further install a non-return valve 127 for draining the introduced rain water. The non-return valve 127 opens and closes the flow path by the opening and closing action of the rubber stopper, and is opened by rainwater introduced into the outside air inlet 121. Therefore, the electronic circuit on the LED element 16 side can be protected safely.

또한, 외기유출구(122)에는 조명등 내부에서 방출되는 열에 의해 개폐되는 열팽창 개폐밸브(125)가 더 설치되어 구성될 수 있다. 열팽창 개폐밸브(125)는 조명등 내부에서 방출되는 열의 유무에 의해 팽창 및 수축을 하는 열팽창물질을 이용하여 외기유출구(122)를 개폐한다. 따라서 외기유출구(122)를 통해 빗물의 유입을 방지할 수 있다.In addition, the outdoor air outlet 122 may be further provided with a thermal expansion opening and closing valve 125 that is opened and closed by the heat emitted from the interior of the lamp. The thermal expansion open / close valve 125 opens and closes the outside air outlet 122 using a thermal expansion material that expands and contracts with or without heat emitted from the interior of the lamp. Therefore, it is possible to prevent the inflow of rain water through the outdoor air outlet 122.

지금까지 본 발명은 제시된 실시 예를 참조하여 상세하게 설명이 되었지만 이 분야에서 통상의 지식을 가진 자는 제시된 실시 예를 참조하여 본 발명의 기술적 사상을 벗어나지 않는 범위에서 다양한 변형 및 수정 발명을 만들 수 있을 것이다. While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the above teachings. will be.

12: 알루미늄 램프 커버
121: 외기유입구
122: 외기유출구
14: PCB 기판
141: 기판측 외기유입구
16: LED 소자
18: 적층방열 전도체
181: 센터핀
181a: 전도판 끼움홈
182: 확장열전도판
182a: 방열공
183: 방열챔버
184: 충전제
20: 체결수단12: aluminum lamp cover
121: outside inlet
122: outside air outlet
14: PCB board
141: substrate air inlet
16: LED device
18: laminated heat conductor
181: center pin
181a: conduction plate fitting groove
182: expansion heat conduction plate
182a: heat sink
183: heat dissipation chamber
184: filler
20: fastening means

Claims (9)

일방으로 조명이 가능하도록 조명개구부(12a)를 갖는 알루미늄 램프 커버(12)와; 다수의 LED 소자(16)의 리드 프레임인 애노우드 단자와 캐소오드 단자를 고정시킬 수 있는 솔더 패드(141a,141b)가 구비되어 상기 알루미늄 램프 커버(12)의 내부에 위치된 PCB 기판(14)과; 상기 솔더 패드(141a,141b)를 통해 접합되어 PCB 기판(14)에 배치되어 있는 다수의 LED 소자(16)와; 상기 PCB기판(14)과 알루미늄 램프 커버(12)의 사이에 배치된 적층 배치된 적층방열 전도체(18)와; 상기 알루미늄 램프 커버(12)에 삽입된 후 적층방열 전도체(18)에 체결되어 상기 적층방열 전도체(18)를 알루미늄 램프 커버(12)에 지지시켜 놓는 체결수단(20);을 포함하는 적층방열 전도체를 갖는 대형 조명등의 방열 장치에 있어서,
상기 적층방열 전도체(18)는,
외주면에 일정 간격을 두고 형성된 다수개의 전도판 끼움홈(181a)이 구비되어 있는 센터핀(181)과; 상기 센터핀(181)의 전도판 끼움홈(181a)에 강제적으로 끼움되어져 밀착 결합된 확장열전도판(182)과; 상기 확장열전도판(182)의 적층된 상하로 이웃한 공간 사이에 형성된 방열챔버(183);로 구성하고,
상기 알루미늄 램프 커버(12)에 외기유입구(121) 및 외기유출구(122), 외기유입구(121)와 외기유출구(122)를 연통시켜주도록 확장열전도판(182)에 관통된 다수의 방열공(182a)을 형성하되,
상기 PCB 기판(14)에 다수개의 기판측 외기유입구(141)를 형성하고,
상기 외기유입구(121)에는 유입된 빗물을 배수시키는 역류방지밸브(127)를 설치하며, 상기 외기유출구(122)에 조명등 내부에서 방출되는 열에 의해 개폐되는 열팽창 개폐밸브(125)를 설치한 것을 특징으로 하는 적층방열 전도체를 갖는 대형 조명등의 방열 장치.An aluminum lamp cover 12 having an illumination opening 12a to enable illumination in one direction; PCB board 14 positioned inside the aluminum lamp cover 12 having solder pads 141a and 141b for fixing the anode and cathode terminals, which are lead frames of the plurality of LED elements 16. and; A plurality of LED elements 16 bonded to the solder pads 141a and 141b and disposed on the PCB substrate 14; A laminated heat dissipation conductor (18) disposed between the PCB substrate (14) and the aluminum lamp cover (12); And a fastening means (20) inserted into the aluminum lamp cover (12) and fastened to the laminated radiant conductor (18) to support the laminated radiant conductor (18) on the aluminum lamp cover (12). In the heat dissipation device of a large lamp having:
The laminated heat conducting conductor 18,
A center pin 181 having a plurality of conductive plate fitting grooves 181a formed at predetermined intervals on an outer circumferential surface thereof; An expansion heat conducting plate 182 that is forcibly fitted into the conductive plate fitting groove 181a of the center pin 181 and is tightly coupled; And a heat dissipation chamber 183 formed between the spaced up and down neighboring spaces of the expansion heat conductive plate 182,
A plurality of heat dissipation holes 182a penetrated through the expansion heat conducting plate 182 to communicate the outside air inlet 121 and the outside air outlet 122, the outside air inlet 121, and the outside air outlet 122 to the aluminum lamp cover 12. ),
Forming a plurality of substrate-side external air inlet 141 in the PCB substrate 14,
The outside air inlet 121 is installed with a non-return valve 127 for draining the rainwater introduced, and the thermal expansion opening and closing valve 125 is installed in the outside air outlet 122 is opened and closed by the heat emitted from the interior of the lamp. A heat dissipation device such as a large lamp having a laminated heat dissipating conductor. 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101488225B1 (en) * 2014-08-05 2015-02-06 에이컴주식회사 Outdoor lighting apparatus using both air cooling and water cooling
CN113310021A (en) * 2021-06-28 2021-08-27 江苏晨曦照明集团有限公司 High heat dissipation solar street lamp shade
KR102739284B1 (en) * 2024-05-16 2024-12-05 주식회사 월드씨엔에스 LED street light

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KR100923435B1 (en) * 2009-03-31 2009-10-27 주식회사 신한빛 LED lighting lamp with air-cooled heat-dissipating ventilating section of laminated heat sink
KR20100102929A (en) * 2009-03-12 2010-09-27 (주)플레넷아이엔티 Emergency lamp using led
KR20100115292A (en) * 2009-04-17 2010-10-27 (주)이지스테크 Illumination apparatus having a temperature maintenance part
KR20120002506U (en) * 2010-10-01 2012-04-12 (주) 성진기업 LED lighting

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Publication number Priority date Publication date Assignee Title
KR20100102929A (en) * 2009-03-12 2010-09-27 (주)플레넷아이엔티 Emergency lamp using led
KR100923435B1 (en) * 2009-03-31 2009-10-27 주식회사 신한빛 LED lighting lamp with air-cooled heat-dissipating ventilating section of laminated heat sink
KR20100115292A (en) * 2009-04-17 2010-10-27 (주)이지스테크 Illumination apparatus having a temperature maintenance part
KR20120002506U (en) * 2010-10-01 2012-04-12 (주) 성진기업 LED lighting

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101488225B1 (en) * 2014-08-05 2015-02-06 에이컴주식회사 Outdoor lighting apparatus using both air cooling and water cooling
CN113310021A (en) * 2021-06-28 2021-08-27 江苏晨曦照明集团有限公司 High heat dissipation solar street lamp shade
KR102739284B1 (en) * 2024-05-16 2024-12-05 주식회사 월드씨엔에스 LED street light

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