CN102214632A - Lead frame for replacing lead frame of fusion structure - Google Patents
Lead frame for replacing lead frame of fusion structure Download PDFInfo
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- CN102214632A CN102214632A CN2010101631648A CN201010163164A CN102214632A CN 102214632 A CN102214632 A CN 102214632A CN 2010101631648 A CN2010101631648 A CN 2010101631648A CN 201010163164 A CN201010163164 A CN 201010163164A CN 102214632 A CN102214632 A CN 102214632A
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- lead frame
- island
- pin
- circuit chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The invention discloses a lead frame for replacing a lead frame of a fusion structure, belonging to the technical field of semiconductor package. According to the lead frame disclosed by the invention, a plurality of second inner pins are mutually and electrically connected into a whole and is electrically communicated with an island through island connecting ribs so that the second inner pins can replace fusion inner pins of the lead frame of the fusion structure; and the pins of the lead frame can be distributed symmetrically about the island; thus the processing is easy; and the yield is high. The area of the island of the lead frame can be flexibly designed according to the area of a packed circuit chip without the problem of insufficient distance between the edge of the island and the edge of the lead frame, so the lead frame also has the advantage of strong generality.
Description
Technical field
The invention belongs to the semiconductor packaging field, relate to the lead frame in the encapsulation, relate in particular to a kind of in order to substitute the lead frame of fusion structure lead frame.
Background technology
For various packing forms, it generally comprises lead frame and packaging body (Package Body), wherein lead frame be used for realize installing, effect such as fixing and lead-in wire, packaging body is used for realizing effects such as protection chip, sealing.For the design feature and the circuit function requirement of various chips, can select different packing forms, design different lead frame structure.Wherein, a kind of more special fusion (Fuse) structural leadthroughs frame is arranged, its a plurality of interior pins directly are connected with island and are one, electricity conducting between interior pin and the island, thereby do not need on pins in these to carry out the spun gold distribution connect in chip on pin and the island, saved distribution spun gold cost.
Figure 1 shows that the structural representation of the DIP 8 fusion structure lead frames of prior art.As shown in Figure 1, in this embodiment, this lead frame is fit to be applied to DIP (Double In-linePackage, the in line encapsulation of biserial) packing forms.Wherein, 20 is the island of lead frame, and the chip after the encapsulation generally fixedly places island 20 central authorities, and 11,12,13,14 is conventional interior pin, and 16,17,18,19 are pin in merging.Wherein, normally, island 20 is to form by beating recessed method, for pin 11,12,13,14 in conventional, mutual electrical isolation between them, and between they and the island also is electrical isolation, generally by gold thread pin 11,12,13 or 14 in conventional is connected with the bonding region of packaged chip surface.And for pin 16,17,18,19 in merging, it directly is connected with island and is one, and beat spill jointly with island 20 and become, the electrical output of certain bonding region of packaged chip or export and to export or to export to 4 outer pins simultaneously by pin in 4 fusions.Therefore, merging interior pin 16,17,18,19 does not need the gold thread distribution to connect packaged chip.For example, when chip places on the island, if there is electrode in chip back, the direct electricity conducting of the electrode at the island and the back side, thus pin all electrically conducts with the electrode of chip back in 4 fusions.In addition, this 8 pin DIP lead frame comprises that also island connects muscle 21,22, and it is used for realizing support to lead frame in the distribution bonding technology process of back, it should be noted that island connects muscle 21,22 normally with island 20 electrical communication.
Figure 2 shows that the structural representation of the SOP 8 fusion structure lead frames of prior art.As shown in Figure 2, in this embodiment, this lead frame is fit to be applied to SOP (Small OutlinePackage, little outline packages) packing forms.Wherein, 30 is the island of lead frame, and the chip after the encapsulation generally fixedly places island 30 central authorities, and 11,12,13,14 is conventional interior pin, and 16,17,18,19 are pin in merging.Wherein, normally, island 30 is to form by beating recessed method, for pin 11,12,13,14 in conventional, mutual electrical isolation between them, and between they and the island also is electrical isolation, generally by gold thread pin 11,12,13 or 14 in conventional is connected with the bonding region of packaged chip surface.And for pin 16,17,18,19 in merging, it directly is connected with island and is one, and beat spill jointly with island 30 and become, the electrical output of certain bonding region of packaged chip or export and to export or to export to 4 outer pins simultaneously by pin in 4 fusions.Therefore, merging interior pin 16,17,18,19 does not need the gold thread distribution to connect packaged chip.In addition, this 8 pin SOP lead frame comprises that also island connects muscle 31,32, and it is used for realizing support to lead frame in the distribution bonding technology process of back, it should be noted that equally island connects muscle 31,32 normally with island 30 electrical communication.
The fusion structure lead frame of above illustrated embodiment can be with satisfying the not needs spun gold distribution requirement of exporting same electrical signal simultaneously of a plurality of pins, but also have following problem:
(1) in the fusion in the lead frame pin and conventional in pin and be not in relation to island Central Line symmetry, easily cause in the lead frame course of processing, the stressed difficult equilibrium of island opposite side that interior pin is merged in island one side of pin and distribution in the routine that distributes, therefore the easy stressed bending of a side, the island face be difficult to lead frame surperficial parallel (for example, plane, island place and conventional interior plane, pin place have certain depth of parallelism to require), cause the lead frame processing difficulties, decrease in yield.
(2) because the structure relative complex and the processing difficulties of this lead frame, and the applicable chip type of institute is few, therefore, for reducing design cost, prior art enlarges the island area usually as far as possible, can as often as possible be adapted to various area of chip requirements, strengthens its versatility.But the increase of island area also easily causes the spacing (D as shown in fig. 1) between island limit and the lead-in wire edge to dwindle the model range of choice of dwindling selected bonding machine in the follow-up bonding process of further restriction of this spacing.Therefore, there are contradiction in the versatility of the relative chip of lead frame and the lead frame versatility of the para-linkage processing model of bonding machine of using mutually, and the versatility of the lead frame of fusion structure is not enough.
In view of this, be necessary to propose a kind of novel lead frame to substitute existing fusion structure lead frame.
Summary of the invention
Be the problem that processing difficulties, rate of finished products are low, versatility is not enough that solves existing fusion structure lead frame.
The invention provides a kind of lead frame, it comprises that island, island connect muscle and be symmetrically distributed in island interior pin on every side, wherein, pin comprises the pin and a plurality of second interior pin in first in described, electrically connects for one and by island mutually between the described a plurality of second interior pin to connect muscle and described island electrical communication.
According to lead frame provided by the present invention, wherein, pin is at least two and electrical isolation each other in described first, electrical isolation between pin and the island in described first.
The described second interior pin is connected to described island by cross structure and connects muscle.
Described island is by beating spill separately.
Particularly, described lead frame can be the in line package leadframe of biserial; Described lead frame also can be little outline packages lead frame.Wherein, it is two that described island connects muscle, and it is symmetrically distributed in the island both sides and is positioned in the Central Line of island; The pin and the described second interior pin are symmetrically distributed along described Central Line in described first.
Preferably, the area of described island be the packaged circuit chip of described lead frame area 2-4 doubly.
The present invention further provides a kind of array of leadframes, it comprises a plurality of the above lead frame that reach, and described lead frame is pressed row and column and arranged.
The present invention also provides a kind of packaging, and it comprises:
The lead frame that the above reaches;
Packaged circuit chip; And
Structure matching is in the packaging body of described lead frame;
Described circuit chip fixedly places the island central authorities of described lead frame, and first pin of described lead frame is by spun gold and described circuit chip bonding, and second pin of described lead frame electrically connects by the specific bonding region of island and described circuit chip.
Technique effect of the present invention is, this lead frame connects muscle and described island electrical communication by electrically connecting for one and by island mutually between a plurality of second interior pin, can make the second interior pin can substitute the interior pin of fusion of fusion structure lead frame, simultaneously can make of the symmetrical distribution of the pin of this lead frame with island, processing is relatively easy, the rate of finished products height.And can there be the problem of the spacing deficiency between island limit and the lead-in wire edge in the island area of this lead frame according to the area flexible design of packaged circuit chip, and therefore, this lead frame also has the advantage of highly versatile.
Description of drawings
Fig. 1 is the structural representation of the DIP 8 fusion structure lead frames of prior art;
Fig. 2 is the structural representation of the SOP 8 fusion structure lead frames of prior art;
Fig. 3 is the lead frame structure schematic diagram according to DIP 8 packing forms of one embodiment of the present of invention;
Fig. 4 is the lead frame structure schematic diagram according to SOP 8 packing forms of another embodiment of the present invention.
Embodiment
Now more fully describe the present invention with reference to the accompanying drawings, exemplary embodiment of the present invention has been shown in the accompanying drawing.But the present invention can realize according to a lot of different forms, and should not be understood that to be limited to the embodiment of these elaborations.On the contrary, provide these embodiment to make the disclosure become thorough and complete, and design of the present invention is passed to those skilled in the art fully.In the accompanying drawings, for the sake of clarity, exaggerated the thickness in layer and zone.In the accompanying drawings, identical label refers to components identical or parts, therefore will omit description of them.
Figure 3 shows that lead frame structure schematic diagram according to DIP 8 packing forms of one embodiment of the present of invention.In an embodiment, specify with the lead frame of 8 pin DIP packing forms spirit this invention.As shown in Figure 3, DIP 8 lead frames comprise that the island 100 of central authorities, 8 interior pins, islands that are distributed in around the island connect muscle 110 and 130, and wherein, 162,164,166,168 is pin in first, and 142,144,146,148 is pin in second.In first in pin 162,164,166,168 and prior art conventional pin similar, it does not electrically connect each other, therefore be each other electrical isolation (the outer pin shown in Fig. 3 between physical connection be not electric connection).Pin 162,164,166,168 can be electrically connected to the different bonding regions (being on the different Pad of chip) on the packaged chip respectively in first, therefore, signal output/the input of pin can be mutually mutually different in 4 first, identical with the interior pin of routine, pin does not electrically connect (though physically being connected) with island 100 yet in 4 first, therefore, be electrical isolation between each first interior pin and the island 100.
Continue as shown in Figure 3, pin 142,144,146,148 combines together each other in second, must be electrically connected each other, output/the input signal of its pairing outer pin is also inevitable identical, what the interior pin of its fusion with prior art was different is, the second interior pin directly is not connected with island and is one, island 100 is to beat spill separately, pin does not need to beat recessed jointly with island in second, thereby pin and island be not or not same plane in second, but with the first interior pin on same plane.Pin 142,144,146,148 connects muscle 110,130 and island electric connection by island in second, and in this embodiment, the second interior pin 142,144,146,148 is electrically connected to island respectively by cross structure 132,134 earlier and connects muscle 110,130.Therefore, at this embodiment, packaged chip exports electrical signal on the island to can export pin in a plurality of second simultaneously to, need be on second pin gold thread distribution.This shows that the second interior pin can be replaced the interior pin of fusion of prior art shown in Figure 1.In this embodiment, island connects muscle 110,130 and is symmetrically distributed in island both sides up and down, and be positioned on the central symmetry line of island, the pin 162 and second pin 142 connect the upside that muscle 110 is symmetrically distributed in island with island in first, equally, the first interior pin 168 and second pin 148 connect the downside that muscle 130 is symmetrically distributed in island with island; Simultaneously, in first in the pin 162,164,166,168 minutes and second pin 142,144,146,148 connect the island Central Line symmetrical distribution at muscle place with island.
Continue as shown in Figure 3, island 100 structures are identical with the little island structure of the common lead frame of prior art DIP packing forms, also be to beat spill separately, pin 162 in first, 164,166,168 are symmetrically distributed in island both sides up and down, pin 142 in second, 144,146,148 also are symmetrically distributed in the island left and right sides substantially, therefore, this lead frame structure is good with respect to fusion structure lead frame structure symmetry shown in Figure 1, island is stressed evenly in the lead frame course of processing, the same with the common lead frame of prior art, realize the structure that island plane and leadframe surfaces parallel easily.Therefore, the fusion structure lead frame handling ease rate of finished products height of the relative prior art of this lead frame.
Figure 4 shows that lead frame structure schematic diagram according to SOP 8 packing forms of another embodiment of the present invention.As shown in Figure 4, SOP 8 lead frames comprise that the island 200 of central authorities, 8 interior pins, islands that are distributed in around the island connect muscle 210 and 230, and wherein, 262,264,266,268 is pin in first, and 242,244,246,248 is pin in second.The conventional interior pin of pin 262,264,266,268 and prior art is similar in first, and it does not electrically connect each other, is electrical isolation each other therefore.Pin 262,264,266,268 can be electrically connected to the different bonding regions on the packaged chip respectively in first, therefore, signal output/the input of pin can be mutually mutually different in 4 first, identical with the interior pin of routine, pin does not electrically connect (though physically being connected) with island 200 yet in 4 first, therefore, be electrical isolation between each first interior pin and the island 200.
Continue as shown in Figure 4, pin 242,244,246,248 combines together each other in second, must be electrically connected each other, the output signal of its pairing outer pin is also inevitable identical, what the interior pin of its fusion with prior art was different is, the second interior pin directly is not connected with island 200 and is one, island 200 is to beat spill separately, pin does not need to beat recessed jointly with island in second, thereby pin and island be not or not same plane in second, but with the first interior pin on same plane.Pin 242,244,246,248 connects muscle 210,230 and island electric connection by island in second, and in this embodiment, the second interior pin 242,244,246,248 is electrically connected to island respectively by cross structure 232,234 earlier and connects muscle 210,230.Therefore, at this embodiment, packaged chip inputs to electrical signal on the island can export pin in a plurality of second simultaneously to, need be on second pin gold thread distribution.This shows that the second interior pin can be replaced the interior pin of fusion of prior art shown in Figure 2.In this embodiment, island connects muscle 210,230 and is symmetrically distributed in the island left and right sides, and be positioned on the central symmetry line of island, the pin 262 and second pin 242 connect the left side that muscle 210 is symmetrically distributed in island with island in first, equally, the first interior pin 268 and second pin 248 connect the right side that muscle 230 is symmetrically distributed in island with island; Simultaneously, in first in the pin 262,264,266,268 minutes and second pin 242,244,246,248 connect the island Central Line symmetrical distribution at muscle place with island.
Continue as shown in Figure 4, island 400 structures are identical with the little island structure of the common lead frame of prior art SOP packing forms, also be to beat spill separately, the pin 262,264,266,268 and the second interior pin 242,244,246,248 are symmetrically distributed in island both sides up and down substantially in first, therefore, this lead frame structure is good with respect to fusion structure lead frame structure symmetry shown in Figure 2, island is stressed evenly in the lead frame course of processing, the same with the common lead frame of prior art, realize the structure that island plane and leadframe surfaces parallel easily.Therefore, the fusion structure lead frame handling ease rate of finished products height of the relative prior art of this lead frame.
Need to prove, more than just with the concrete lead frame structure of DIP packing forms and SOP packing forms as embodiment to specify this invention, those skilled in the art can directly know by inference according to the explanation of above embodiment, and this invention thought also is applied to the lead frame of the packing forms of other similar structures.Further, need to prove that the concrete quantity of pin is not subjected to the restriction of the embodiment of the invention in the first interior pin and second, the quantity of the second interior pin gets final product more than or equal to 2.
From the above, the common lead frame structure of the lead frame of this inventive embodiments and prior art is similar, but can replace special fusion structure lead frame, structure is simple relatively, handling ease, and can utilize the mould of common lead frame to come processing and manufacturing, in follow-up encapsulation bonding process, can utilize simultaneously the anchor clamps of prior art, do not need to upgrade anchor clamps, highly versatile helps reducing manufacturing, packaging cost.And as from the foregoing, the island of central authorities is easier to be amplified or dwindles design according to packaged chip area, therefore do not exist fusion structure lead frame of the prior art to cause the problem of the spacing deficiency between island limit and the lead-in wire edge because of the island area is excessive, thereby can overcome the less problem of model of the bonding machine that can select for use, further improve its versatility with respect to bonding apparatus.Preferably, the area design of the island of this lead frame is in 2-4 times of scope of the area of packaged circuit chip.Under the situation that the island area dwindles relatively, the distance of pin and packaged chip (placing island central authorities) in can also dwindling flexibly, thus save the spun gold material, reduce packaging cost.
In the actual package process, be that a plurality of circuit chips encapsulate formation simultaneously.Therefore the present invention further provides a kind of array of leadframes.This lead-in wire circle array comprises a plurality of DIP lead frames shown in Figure 3, perhaps comprises a plurality of SOP lead frames shown in Figure 4, and lead frame is pressed the form of row and column and arranged.The number of the lead frame that array of leadframes comprised is not limited by the embodiment of the invention.
The present invention further provides formed packaging after the leadframe package by this invention.This packaging comprises that the lead frame of being addressed, the predetermined circuit chip that encapsulates, structure matching are in the packaging body of this lead frame.The PAD of the specific bonding region of certain of this circuit chip can directly be electrically connected to island, it fixedly places the island central authorities of described lead frame, first pin of this lead frame is by spun gold and this circuit chip bonding, and second pin of this lead frame electrically connects by the specific bonding region of island and this circuit chip.This packaging has high reliability features.
Under situation without departing from the spirit and scope of the present invention, can also constitute many very embodiment of big difference that have.Should be appreciated that except as defined by the appended claims, the invention is not restricted at the specific embodiment described in the specification.
Claims (10)
1. lead frame, comprise that island, island connect muscle and be symmetrically distributed in island interior pin on every side, it is characterized in that, pin comprises the pin and a plurality of second interior pin in first in described, electrically connects for one and by described island mutually between the described a plurality of second interior pin to connect muscle and described island electrical communication.
2. lead frame as claimed in claim 1 is characterized in that, pin is at least two and electrical isolation each other in described first, electrical isolation between pin and the island in described first.
3. lead frame as claimed in claim 1 or 2 is characterized in that, the described second interior pin is connected to described island by cross structure and connects muscle.
4. lead frame as claimed in claim 1 or 2 is characterized in that, described island is by beating spill separately.
5. lead frame as claimed in claim 1 is characterized in that, described lead frame is the in line package leadframe of biserial.
6. lead frame as claimed in claim 1 is characterized in that, described lead frame is little outline packages lead frame.
7. as claim 5 or 6 described lead frames, it is characterized in that it is two that described island connects muscle, it is symmetrically distributed in the island both sides and is positioned in the Central Line of island; The pin and the described second interior pin are symmetrically distributed along described Central Line in described first.
8. lead frame as claimed in claim 1 is characterized in that, the area of described island be the packaged circuit chip of described lead frame area 2-4 doubly.
9. an array of leadframes is characterized in that, comprises a plurality ofly as the described lead frame of one of claim 1 to 8, and described lead frame is pressed row and column and arranged.
10. a packaging is characterized in that, comprising:
As the described lead frame of one of claim 1 to 8;
Packaged circuit chip; And
Structure matching is in the packaging body of described lead frame;
Described circuit chip fixedly places the island central authorities of described lead frame, and first pin of described lead frame is by spun gold and described circuit chip bonding, and second pin of described lead frame electrically connects by the specific bonding region of island and described circuit chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101631648A CN102214632A (en) | 2010-04-08 | 2010-04-08 | Lead frame for replacing lead frame of fusion structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101631648A CN102214632A (en) | 2010-04-08 | 2010-04-08 | Lead frame for replacing lead frame of fusion structure |
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| CN102214632A true CN102214632A (en) | 2011-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010101631648A Pending CN102214632A (en) | 2010-04-08 | 2010-04-08 | Lead frame for replacing lead frame of fusion structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103915403A (en) * | 2014-03-27 | 2014-07-09 | 珠海格力电器股份有限公司 | Dual in-line package frame |
| CN107451077A (en) * | 2013-08-27 | 2017-12-08 | 珠海艾派克微电子有限公司 | The method of measuring head, chip manufacture device and display chip style number |
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| CN1192582A (en) * | 1997-03-04 | 1998-09-09 | 松下电子工业株式会社 | Semiconductor device |
| US6242800B1 (en) * | 1997-03-12 | 2001-06-05 | International Rectifier Corp. | Heat dissipating device package |
| CN101499431A (en) * | 2008-01-31 | 2009-08-05 | 中芯国际集成电路制造(上海)有限公司 | Single-side bonding pad chip assembling method |
| CN201340853Y (en) * | 2008-12-27 | 2009-11-04 | 无锡华润安盛科技有限公司 | SOP / MSOP / TSSOP lead frame structure |
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2010
- 2010-04-08 CN CN2010101631648A patent/CN102214632A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1192582A (en) * | 1997-03-04 | 1998-09-09 | 松下电子工业株式会社 | Semiconductor device |
| US6242800B1 (en) * | 1997-03-12 | 2001-06-05 | International Rectifier Corp. | Heat dissipating device package |
| CN101499431A (en) * | 2008-01-31 | 2009-08-05 | 中芯国际集成电路制造(上海)有限公司 | Single-side bonding pad chip assembling method |
| CN201340853Y (en) * | 2008-12-27 | 2009-11-04 | 无锡华润安盛科技有限公司 | SOP / MSOP / TSSOP lead frame structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107451077A (en) * | 2013-08-27 | 2017-12-08 | 珠海艾派克微电子有限公司 | The method of measuring head, chip manufacture device and display chip style number |
| CN107451077B (en) * | 2013-08-27 | 2020-08-18 | 珠海艾派克微电子有限公司 | Test head, chip processing device and method for displaying chip type |
| CN103915403A (en) * | 2014-03-27 | 2014-07-09 | 珠海格力电器股份有限公司 | Dual in-line package frame |
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Application publication date: 20111012 |