CN102208413A - 内嵌晶闸管的pmos晶体管以及开关电路 - Google Patents
内嵌晶闸管的pmos晶体管以及开关电路 Download PDFInfo
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- CN102208413A CN102208413A CN2010101440725A CN201010144072A CN102208413A CN 102208413 A CN102208413 A CN 102208413A CN 2010101440725 A CN2010101440725 A CN 2010101440725A CN 201010144072 A CN201010144072 A CN 201010144072A CN 102208413 A CN102208413 A CN 102208413A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 229910044991 metal oxide Inorganic materials 0.000 title abstract 2
- 150000004706 metal oxides Chemical class 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000009792 diffusion process Methods 0.000 claims abstract description 18
- 238000002347 injection Methods 0.000 claims abstract description 16
- 239000007924 injection Substances 0.000 claims abstract description 16
- 230000035755 proliferation Effects 0.000 claims description 5
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 7
- 230000015556 catabolic process Effects 0.000 description 5
- 240000002853 Nelumbo nucifera Species 0.000 description 2
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 2
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
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CN201010144072.5A CN102208413B (zh) | 2010-03-31 | 2010-03-31 | 内嵌晶闸管的pmos晶体管以及开关电路 |
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CN201010144072.5A CN102208413B (zh) | 2010-03-31 | 2010-03-31 | 内嵌晶闸管的pmos晶体管以及开关电路 |
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CN102208413A true CN102208413A (zh) | 2011-10-05 |
CN102208413B CN102208413B (zh) | 2015-01-21 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6008684A (en) * | 1996-10-23 | 1999-12-28 | Industrial Technology Research Institute | CMOS output buffer with CMOS-controlled lateral SCR devices |
US20020130365A1 (en) * | 2001-03-14 | 2002-09-19 | Chartered Semiconductor Manufacturing Ltd. | Novel UMOS-like gate-controlled thyristor structure for ESD protection |
TW503536B (en) * | 2001-08-10 | 2002-09-21 | United Microelectronics Corp | Method of forming a silicon controlled rectifier devices in SOI CMOS process for on-chip ESD protection |
US20030038298A1 (en) * | 2000-09-28 | 2003-02-27 | Taiwan Semiconductor Manufacturing Company | Embedded SCR protection device for output and input pad |
CN101452913A (zh) * | 2007-12-03 | 2009-06-10 | 上海华虹Nec电子有限公司 | 利用硅控整流器作为静电保护的器件结构 |
-
2010
- 2010-03-31 CN CN201010144072.5A patent/CN102208413B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6008684A (en) * | 1996-10-23 | 1999-12-28 | Industrial Technology Research Institute | CMOS output buffer with CMOS-controlled lateral SCR devices |
US20030038298A1 (en) * | 2000-09-28 | 2003-02-27 | Taiwan Semiconductor Manufacturing Company | Embedded SCR protection device for output and input pad |
US20020130365A1 (en) * | 2001-03-14 | 2002-09-19 | Chartered Semiconductor Manufacturing Ltd. | Novel UMOS-like gate-controlled thyristor structure for ESD protection |
TW503536B (en) * | 2001-08-10 | 2002-09-21 | United Microelectronics Corp | Method of forming a silicon controlled rectifier devices in SOI CMOS process for on-chip ESD protection |
CN101452913A (zh) * | 2007-12-03 | 2009-06-10 | 上海华虹Nec电子有限公司 | 利用硅控整流器作为静电保护的器件结构 |
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CN102208413B (zh) | 2015-01-21 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140214 |
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Effective date of registration: 20140214 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai city Zuchongzhi road Pudong Zhangjiang hi tech Park No. 1399 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
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