CN102197486B - 具有用于色彩分离的光栅的图像传感器 - Google Patents

具有用于色彩分离的光栅的图像传感器 Download PDF

Info

Publication number
CN102197486B
CN102197486B CN200980142487.4A CN200980142487A CN102197486B CN 102197486 B CN102197486 B CN 102197486B CN 200980142487 A CN200980142487 A CN 200980142487A CN 102197486 B CN102197486 B CN 102197486B
Authority
CN
China
Prior art keywords
layer
image sensor
charge
optical paths
pixel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200980142487.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN102197486A (zh
Inventor
约翰·P·麦卡滕
约瑟夫·苏马
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omnivision Technologies Inc
Original Assignee
Omnivision Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omnivision Technologies Inc filed Critical Omnivision Technologies Inc
Publication of CN102197486A publication Critical patent/CN102197486A/zh
Application granted granted Critical
Publication of CN102197486B publication Critical patent/CN102197486B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/805Coatings
    • H10F39/8053Colour filters
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/199Back-illuminated image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H10F39/8023Disposition of the elements in pixels, e.g. smaller elements in the centre of the imager compared to larger elements at the periphery
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • H10F39/8063Microlenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Color Television Image Signal Generators (AREA)
CN200980142487.4A 2008-11-13 2009-10-30 具有用于色彩分离的光栅的图像传感器 Active CN102197486B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/269,907 US8400537B2 (en) 2008-11-13 2008-11-13 Image sensors having gratings for color separation
US12/269,907 2008-11-13
PCT/US2009/005915 WO2010056285A1 (en) 2008-11-13 2009-10-30 Image sensors having gratings for color separation

Publications (2)

Publication Number Publication Date
CN102197486A CN102197486A (zh) 2011-09-21
CN102197486B true CN102197486B (zh) 2015-02-18

Family

ID=41510937

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980142487.4A Active CN102197486B (zh) 2008-11-13 2009-10-30 具有用于色彩分离的光栅的图像传感器

Country Status (7)

Country Link
US (1) US8400537B2 (enExample)
EP (1) EP2347443B1 (enExample)
JP (1) JP5676462B2 (enExample)
KR (1) KR101593258B1 (enExample)
CN (1) CN102197486B (enExample)
TW (1) TWI476908B (enExample)
WO (1) WO2010056285A1 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7057256B2 (en) 2001-05-25 2006-06-06 President & Fellows Of Harvard College Silicon-based visible and near-infrared optoelectric devices
US7442629B2 (en) 2004-09-24 2008-10-28 President & Fellows Of Harvard College Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
US9673243B2 (en) 2009-09-17 2017-06-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US9911781B2 (en) 2009-09-17 2018-03-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US8692198B2 (en) 2010-04-21 2014-04-08 Sionyx, Inc. Photosensitive imaging devices and associated methods
CN106449684B (zh) 2010-06-18 2019-09-27 西奥尼克斯公司 高速光敏设备及相关方法
US9496308B2 (en) 2011-06-09 2016-11-15 Sionyx, Llc Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
WO2012174751A1 (zh) * 2011-06-24 2012-12-27 博立码杰通讯(深圳)有限公司 一种混合多光谱感光象素组、感光器件、及感光系统
CN103946867A (zh) 2011-07-13 2014-07-23 西奥尼克斯公司 生物计量成像装置和相关方法
JP5864990B2 (ja) * 2011-10-03 2016-02-17 キヤノン株式会社 固体撮像装置およびカメラ
EP2803123B1 (en) * 2012-01-12 2020-11-25 Hewlett-Packard Enterprise Development LP Integrated sub-wavelength grating system
US9064764B2 (en) 2012-03-22 2015-06-23 Sionyx, Inc. Pixel isolation elements, devices, and associated methods
JP6231741B2 (ja) 2012-12-10 2017-11-15 キヤノン株式会社 固体撮像装置およびその製造方法
JP6466346B2 (ja) 2013-02-15 2019-02-06 サイオニクス、エルエルシー アンチブルーミング特性を有するハイダイナミックレンジcmos画像センサおよび関連づけられた方法
CN105008969B (zh) * 2013-03-05 2019-03-19 拉姆伯斯公司 用于高分辨率无透镜光学传感的具有奇对称的相位光栅
US9110240B2 (en) 2013-03-05 2015-08-18 Rambus Inc. Phase gratings with odd symmetry for high-resolution lensed and lensless optical sensing
WO2014151093A1 (en) 2013-03-15 2014-09-25 Sionyx, Inc. Three dimensional imaging utilizing stacked imager devices and associated methods
US9209345B2 (en) 2013-06-29 2015-12-08 Sionyx, Inc. Shallow trench textured regions and associated methods
US9515113B2 (en) 2013-08-27 2016-12-06 Rambus Inc. Optical sensing of nearby scenes with tessellated phase anti-symmetric gratings
US10161788B2 (en) 2014-04-09 2018-12-25 Rambus Inc. Low-power image change detector
KR102219704B1 (ko) 2014-06-13 2021-02-24 삼성전자주식회사 색분리 소자 어레이, 상기 색분리 소자 어레이를 포함하는 이미지 센서, 및 상기 색분리 소자 어레이를 포함하는 촬상 장치
JP2016092413A (ja) 2014-10-29 2016-05-23 株式会社半導体エネルギー研究所 撮像装置および電子機器
US10163968B2 (en) 2015-01-23 2018-12-25 Dartmouth College Multi-junction pixel image sensor with dielectric reflector between photodetection layers
WO2016139769A1 (ja) 2015-03-04 2016-09-09 パイオニア株式会社 レンズアレイ及び映像投影装置
CN104867951B (zh) * 2015-04-23 2018-05-04 豪威科技(上海)有限公司 一种背照式传感器芯片及其制造方法
US10284825B2 (en) 2015-09-08 2019-05-07 Rambus Inc. Systems with integrated refractive and diffractive optics
KR102465995B1 (ko) * 2015-09-30 2022-11-25 삼성전자주식회사 색분할기 구조와 그 제조방법, 색분할기 구조를 포함하는 이미지센서 및 이미지센서를 포함하는 광학장치
FR3043495A1 (fr) 2015-11-09 2017-05-12 St Microelectronics Crolles 2 Sas Capteur d'images a obturation globale
CN105428377A (zh) * 2015-11-11 2016-03-23 武汉新芯集成电路制造有限公司 一种cmos影像传感器
CN109716176B (zh) 2016-06-07 2021-09-17 艾瑞3D 有限公司 用于深度采集和三维成像的光场成像装置和方法
KR102524400B1 (ko) * 2016-07-04 2023-04-24 에스케이하이닉스 주식회사 하나의 컬러 필터 및 하나의 마이크로렌즈를 공유하는 다수 개의 포토다이오드들을 갖는 이미지 센서
CN108174059B (zh) * 2016-12-08 2021-04-13 松下知识产权经营株式会社 摄像装置
JP6975897B2 (ja) * 2016-12-27 2021-12-01 パナソニックIpマネジメント株式会社 画像生成装置及び撮像装置
US10578870B2 (en) 2017-07-26 2020-03-03 Magic Leap, Inc. Exit pupil expander
US10468448B2 (en) * 2017-11-30 2019-11-05 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor image sensor and method for forming the same
US20210391693A1 (en) * 2018-10-22 2021-12-16 Ams Sensors Asia Pte. Ltd. Structured illumination devices
WO2020243828A1 (en) 2019-06-05 2020-12-10 Airy3D Inc. Light field imaging device and method for 3d sensing
CN111427107B (zh) * 2020-04-07 2022-02-15 上海冠众光学科技有限公司 一种衍射光学元件取值模型、衍射光学元件及其制作方法
CN112616008B (zh) * 2020-12-31 2022-08-30 维沃移动通信有限公司 电子设备及其摄像模组
CN113554578B (zh) * 2021-07-23 2024-05-31 奥比中光科技集团股份有限公司 一种光谱图像的确定方法、装置、终端和存储介质
WO2024147826A1 (en) * 2023-01-05 2024-07-11 Transformative Optics Corporation Color image sensors, methods and systems
KR20250166187A (ko) * 2023-03-02 2025-11-27 트랜스포머티브 옵틱스 코퍼레이션 컬러 이미지 센서들, 방법들 및 시스템들

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060145223A1 (en) * 2004-12-30 2006-07-06 Magnachip Semiconductor Ltd. Image sensor capable of adjusting focusing length for individual color and fabrication method thereof
CN101283453A (zh) * 2005-10-12 2008-10-08 住友电气工业株式会社 固态成像装置及其制造方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4506949A (en) 1983-05-27 1985-03-26 Rca Corporation Diffractive color separation filter
US5164831A (en) 1990-03-15 1992-11-17 Eastman Kodak Company Electronic still camera providing multi-format storage of full and reduced resolution images
JP2601148B2 (ja) * 1993-07-23 1997-04-16 日本電気株式会社 固体撮像装置
JP3620237B2 (ja) * 1997-09-29 2005-02-16 ソニー株式会社 固体撮像素子
US6300612B1 (en) 1998-02-02 2001-10-09 Uniax Corporation Image sensors made from organic semiconductors
JPH11284158A (ja) * 1998-03-27 1999-10-15 Sony Corp 固体撮像素子と固体撮像素子の製造方法
FR2781929B1 (fr) * 1998-07-28 2002-08-30 St Microelectronics Sa Capteur d'image a reseau de photodiodes
JP2001309395A (ja) * 2000-04-21 2001-11-02 Sony Corp 固体撮像素子及びその製造方法
US6556349B2 (en) 2000-12-27 2003-04-29 Honeywell International Inc. Variable focal length micro lens array field curvature corrector
JP3759435B2 (ja) * 2001-07-11 2006-03-22 ソニー株式会社 X−yアドレス型固体撮像素子
US7199931B2 (en) * 2003-10-09 2007-04-03 Micron Technology, Inc. Gapless microlens array and method of fabrication
CN100449764C (zh) * 2003-11-18 2009-01-07 松下电器产业株式会社 光电探测器
JP4181487B2 (ja) * 2003-11-28 2008-11-12 松下電器産業株式会社 固体撮像装置とその製造方法
KR100680386B1 (ko) 2004-01-15 2007-02-08 마츠시타 덴끼 산교 가부시키가이샤 고체촬상장치, 고체촬상장치의 제조방법 및 이를 이용한카메라
US7068432B2 (en) * 2004-07-27 2006-06-27 Micron Technology, Inc. Controlling lens shape in a microlens array
JP4507769B2 (ja) * 2004-08-31 2010-07-21 ソニー株式会社 固体撮像素子、カメラモジュール及び電子機器モジュール
KR100672699B1 (ko) * 2004-12-29 2007-01-22 동부일렉트로닉스 주식회사 씨모스 이미지 센서의 제조방법
US7560684B2 (en) * 2005-03-23 2009-07-14 Panasonic Corporation On-vehicle imaging device
JP4456040B2 (ja) 2005-06-17 2010-04-28 パナソニック株式会社 固体撮像素子
US7736939B2 (en) * 2005-07-07 2010-06-15 United Microelectronics Corp. Method for forming microlenses of different curvatures and fabricating process of solid-state image sensor
US7522341B2 (en) * 2005-07-12 2009-04-21 Micron Technology, Inc. Sharing of microlenses among pixels in image sensors
JP2007103401A (ja) * 2005-09-30 2007-04-19 Matsushita Electric Ind Co Ltd 撮像装置及び画像処理装置
JP2008005383A (ja) * 2006-06-26 2008-01-10 Matsushita Electric Ind Co Ltd 撮像装置及びイメージセンサ
US7505206B2 (en) * 2006-07-10 2009-03-17 Taiwan Semiconductor Manufacturing Company Microlens structure for improved CMOS image sensor sensitivity
FR2904432B1 (fr) 2006-07-25 2008-10-24 Commissariat Energie Atomique Structure matricielle de filtrage optique et capteur d'images associe
JP2008041779A (ja) * 2006-08-02 2008-02-21 Matsushita Electric Ind Co Ltd 固体撮像装置
WO2008017490A2 (de) 2006-08-09 2008-02-14 Opsolution Nanophotonics Gmbh Optisches filter und verfahren zur herstellung desselben, sowie vorrichtung zur untersuchung elektromagnetischer strahlung
US8610806B2 (en) * 2006-08-28 2013-12-17 Micron Technology, Inc. Color filter array, imagers and systems having same, and methods of fabrication and use thereof
KR20080049186A (ko) * 2006-11-30 2008-06-04 동부일렉트로닉스 주식회사 이미지 센서 및 그 제조방법
EP2269223B1 (en) 2008-04-18 2013-03-13 Nxp B.V. Integrated circuit manufacturing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060145223A1 (en) * 2004-12-30 2006-07-06 Magnachip Semiconductor Ltd. Image sensor capable of adjusting focusing length for individual color and fabrication method thereof
CN101283453A (zh) * 2005-10-12 2008-10-08 住友电气工业株式会社 固态成像装置及其制造方法

Also Published As

Publication number Publication date
KR101593258B1 (ko) 2016-02-11
TW201029166A (en) 2010-08-01
JP5676462B2 (ja) 2015-02-25
EP2347443A1 (en) 2011-07-27
US20100118172A1 (en) 2010-05-13
TWI476908B (zh) 2015-03-11
JP2012508977A (ja) 2012-04-12
CN102197486A (zh) 2011-09-21
US8400537B2 (en) 2013-03-19
WO2010056285A1 (en) 2010-05-20
KR20110082182A (ko) 2011-07-18
EP2347443B1 (en) 2017-04-12

Similar Documents

Publication Publication Date Title
CN102197486B (zh) 具有用于色彩分离的光栅的图像传感器
US8049256B2 (en) Active pixel sensor having a sensor wafer connected to a support circuit wafer
US20210272997A1 (en) Image sensor including partition patterns
TWI442555B (zh) 具有二晶圓之主動式像素感測器
EP2301074B1 (en) Image sensor with improved angle response
KR101438710B1 (ko) 넓은 애퍼처 이미지 센서 픽셀
CN120129327A (zh) 图像传感器像素单元、图像传感器和电子设备
KR20210124807A (ko) 이미지 센싱 장치
JP2009088289A (ja) 固体撮像素子およびその製造方法並びに撮像装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: American California

Patentee after: OmniVision Technologies, Inc.

Address before: American California

Patentee before: Omnivision Tech Inc.