CN102189611B - Equidensity mortar cutting method for linear cutting of solar wafer - Google Patents
Equidensity mortar cutting method for linear cutting of solar wafer Download PDFInfo
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- CN102189611B CN102189611B CN2011100950852A CN201110095085A CN102189611B CN 102189611 B CN102189611 B CN 102189611B CN 2011100950852 A CN2011100950852 A CN 2011100950852A CN 201110095085 A CN201110095085 A CN 201110095085A CN 102189611 B CN102189611 B CN 102189611B
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Abstract
The invention discloses an equidensity mortar cutting method and an equidensity mortar cutting device for linear cutting of a solar wafer. The device comprises a mortar cylinder (101), an equidensity mortar adjustment device (112), a cold-heat exchanger (102), a flow distribution nozzle (103), a linear roller (106), a cutting steel wire (107) and a mortar groove (109). The method comprises the following steps of: arranging the equidensity mortar cutting device on an NTC442 slicing machine; preparing equidensity cut mortar; collecting the density curves of first five quires of the NTC slicing machine along with the variation of slicing time before the device is used; adjusting a mortar density adjustment compensator according to the average variation curve of the first five quires so as to establish a referential variation curve; monitoring the mortar used during cutting by using a mortar density real-time detector; and replacing a new silicon rod material, performing cutting processes from a second quire to a fifth quire, and adding an equidensity mortar modifier. By the method and the device, the cutting efficiency is improved from the original 2.5 quires to 3.5 quires every day, namely the cutting efficiency is improved by 40 percent, and the utilization ratio of equipment is improved by 20 percent.
Description
Technical field
The present invention relates to a kind of isodensity mortar cutting method and device for the cutting of solar silicon wafers line.
Background technology
China's photovoltaic generation industry developed rapidly in recent years, and solar power silicon sheet cutting equipment quantity increased with 30% to 50% with every year, and the demand of wherein cutting mortar has reached approximately 1200-1500 tons/days.
In solar silicon wafers line cutting process, whole mechanism is to utilize the rigid characteristic of silicon-carbide particle and sharp water caltrop that silicon rod is progressively blocked, require in the cutting mortar silicon-carbide particle can uniform and stable dispersion in the cutting mortar, and keep continual and steady slurry density and mortar quantity delivered, make mortar be coated on equably the steel wire surface in high-speed motion, the silicon-carbide particles that make of uniform and stable act on the silicon rod surface, take away in time simultaneously cutting heat and crushed particles, guarantee the surface quality of silicon chip.
During the iron micro mist that the silicon material of nearly 35--45% is cut into micro mist and a small amount of steel wire wearing and tearing in solar silicon wafers line cutting enters the recirculation system sand slurry system with the cutting mortar together, and a large amount of micro mists stick to silicon carbide and participate in cutting with mortar, its result increases slurry density and viscosity thereupon, affected the mortar cutting power, and descend with increasing clipping time, the user changes the variation that new mortar is replaced waste mortar and compensation slurry density after can only adopting every partial application to shut down, cause a large amount of available mortars to become together waste mortar, increased the maintenance cost of changing mortar cost and equipment.In order to adapt to the competition of future market demand and price, whole industry is all ceaselessly being found new approach for how controlling the auxiliary material environment with the reduction cutting cost.
Summary of the invention
The objective of the invention is: a kind of isodensity mortar cutting method and device for the cutting of solar silicon wafers line is provided.
Realize that imagination of the present invention is: a set of isodensity cutting mortar (this paper is called for short isodensity mortar or mortar sometimes, has declared patent, and the patent No. is 2011100766426) feedway is installed on existing all kinds multi-wire cutting machine for silicon wafer platform.When the invention solves conventional silicon carbide mortar with the increase slurry density of clipping time and viscosity, increasing caused cutting thereupon in cutting process, mortar environment and technique change, and cause silicon chip slice thickness and surface roughness to change.The present invention takes full advantage of isodensity cutting mortar and the mortar feedway of special surface structure; carborundum cutting slurry density in cutting process is remained unchanged; make to cut mortar not with changing clipping time; real-time reunion of removing between iron micro mist and dispersed silicon micro mist, prevention micro mist and silicon carbide micro-powder simultaneously, and the automatic waste mortar mode of changing substitutes substitute mode of every cutter shutdown at regular time and quantity.Isodensity mortar cutting method and mortar feedway are cores of the present invention.
One. isodensity mortar cutting method and the explanation of mortar feedway
At solar silicon wafers wire cutting machine platform, cut slurry feeding device in slurry systems, having introduced the isodensity mortar.This device imports quantitative mechanism, slurry density real-Time Compensation device, mortar iron micro mist filter, pipeline and control valve by the isodensity mortar and is formed.Useless silicon powder in cutting process after a large amount of cuttings and iron micro mist are with proportional curve increase clipping time and are blended in mortar jar with the cutting mortar, cause slurry density with rising clipping time, the real-Time Compensation device can automatically be regulated slurry density is stabilized in the technique initialization control range.
Two. isodensity mortar cutter sweep using method
Isodensity cutting mortar device using method is: by 1) slurry density real time probe, 2) slurry density regulates compensator, 3) mortar iron micro mist filter, 4) isodensity mortar conditioning agent basin, 5) pipeline and control valve form.This device is arranged between random storage cylinder and slicer heat exchange with fast-assembling flange.When machine started to cut into slices, starting slurry density real time probe was monitored mortar, and controlled slurry density adjusting compensator isodensity mortar conditioning agent is sneaked in the cutting mortar in real time through pipeline and control valve.When isodensity mortar conditioning agent is blended into when a certain amount of, control system can extract a certain amount of waste mortar.Adopt this technique can not shut down real-time replacing mortar and keep mortar quality self-consistentency.
Technical scheme of the present invention is:
One, isodensity mortar cutter sweep, it is characterized in that: isodensity mortar cutter sweep comprises mortar jar 101, isodensity mortar adjusting device 112, cool-heat-exchanger 102, divide flow nozzle 103, line roller 106, cutting steel wire 107, mortar pin groove 109, agitator 111 is housed in mortar jar 101, Xun encircles pump 115, de-iron powder device 114 is housed in isodensity mortar adjusting device 112, density detector 117, Xun ring pump 115 in mortar jar 101 is connected with isodensity mortar adjusting device 112 by pipeline, isodensity mortar adjusting device 112 is connected with cool-heat-exchanger 102 by pipeline, cool-heat-exchanger 102 is connected with three minutes flow nozzles 103 by pipeline, divide flow nozzle 103 belows that cutting steel wire 107 and two line rollers 106 are housed, cutting steel wire 107 is around two line rollers 106, mortar pin groove 109 is equipped with in cutting steel wire 107 and two line roller 106 belows, mortar pin groove 109 is connected with mortar jar 101 by return duct 110, isodensity mortar adjusting device 112 also is connected with mortar jar 101 by conditioning agent pipeline 113, on isodensity mortar adjusting device 112 limits, upper end, conditioning agent inlet pipeline 116 is housed.
The isodensity mortar is stored in mortar jar 101, after with agitator 111, stirring, with Xun ring pump 115, mortar is squeezed into to isodensity mortar adjusting device 112, after processing, inner de-iron powder device 114 enters cool-heat-exchanger 102, obtain after the steady temperature of technique entering minute flow nozzle 103 by pipeline and spray to cutting steel wire 107, the silicon rod 1 of cutting steel wire 107 tops, silicon rod 2 105 moves down and enters the cutting steel wire 107 surface beginning cutting techniques that line roller 106 drives, mortar after cutting and silica flour, the mixed mortar 108 of iron powder enters in mortar pin groove 109 together, through return duct 110, enter in mortar storage tank 101, isodensity mortar conditioning agent enters isodensity mortar adjusting device 112 through 116, in real time isodensity mortar conditioning agent is sent in mortar storage tank 101 slurry density is regulated through pipeline 113 under built-in density detector 117 is controlled.
Two, isodensity mortar cutting method:
A. isodensity cutting mortar device is installed on the NTC442 slicer
Isodensity is cut to the mortar device to be arranged between random storage cylinder mortar outlet and slicer heat exchange import with fast-assembling flange;
B. isodensity cutting mortar preparation
Get 1000 parts of isodensity cutting mortars of weight as the cutting mortar, and get other isodensity that a certain amount of density is lower and cut mortar as isodensity mortar conditioning agent, mortar is adjusted to the condition of work be available on the machine, density: 1.625kg/l; Viscosity is between 280cp-300cp;
C. device is first collected the density of front 5 cuttves of NTC slicer with the section time changing curve before using, according to a tree name 5 cutter mean change curves, adjust slurry densities and regulate compensators and set up the benchmark change curve, the mortar by the slurry density real time probe during to cutting is monitored;
D. by tank in isodensity mortar conditioning agent adding apparatus, 240 parts of isodensity cutting mortars are added in the random mortar jar of NTC442, enter normal heat engine, start to enter starting slurry density real time probe after the section program, isodensity cutting mortar device enters normal operation, completes section; After completing first section program, newly add isodensity mortar conditioning agent consumption 12-14 part, slurry density is 1.627kg/l, and in mortar jar, the mortar total amount reaches 252-254 part;
E. after more renewing the silicon rod material, enter the second cutter cutting process, operation process repeats the normal heat engine that enters of d step, after starting to enter the section program, start the slurry density real time probe, isodensity cutting mortar device enters normal operation, after completing the section program, newly add isodensity mortar conditioning agent consumption 12-14 part, slurry density is 1.626kg/l, and in mortar jar, the mortar total amount is the same equally increases;
F. after more renewing the silicon rod material, enter the 3rd cutter cutting process, operation process repeats the normal heat engine that enters of d step, after starting to enter the section program, start the slurry density real time probe, isodensity cutting mortar device enters normal operation, after completing the section program, newly add isodensity mortar conditioning agent consumption 12-14 part, slurry density is 1.625kg/l, and in mortar jar, the mortar total amount is the same equally increases;
G. after more renewing the silicon rod material, enter the four blade cutting process, operation process repeats the normal heat engine that enters of d step, after starting to enter the section program, start the slurry density real time probe, isodensity cutting mortar device enters normal operation, after completing the section program, newly add isodensity mortar conditioning agent consumption 12-14 part, slurry density is 1.627kg/l, and in mortar jar, the mortar total amount is the same equally increases;
H. after more renewing the silicon rod material, enter the 5th cutter cutting process, operation process repeats the normal heat engine that enters of d step, after starting to enter the section program, start the slurry density real time probe, isodensity cutting mortar device enters normal operation, after completing the section program, newly add isodensity mortar conditioning agent consumption 12-14 part, slurry density is 1.628kg/l, and in mortar jar, the mortar total amount is the same equally increases.When mortar jar mortar total amount reached 300 parts, starting was automatically changed the waste mortar mode and is extracted 60 parts of waste mortars, and mortar jar returns to 240 parts;
I. install normal heat engine to the h step of entering of automatic cycle d step.
The present invention has positive effect: (1) the present invention replaces the shutdown substitute mode of conventional silicon carbide mortar; when isodensity mortar conditioning agent joins when a certain amount of in mortar jar; control system can extract a certain amount of waste mortar (2) slurry density real time probe mortar is monitored, and control slurry density adjusting compensator adds (3) real-Time Compensation device in the cutting mortar slurry density to be stabilized in the technique initialization control range automatic adjusting through pipeline and control valve isodensity mortar conditioning agent in real time.(4) use mortar iron micro mist filter to remove in real time iron powder and reduce the reunion generation between micro mist.(5) use with automatically changing at regular time and quantity the waste mortar mode clipping time and substitute substitute mode of every cutter shutdown.
The accompanying drawing explanation
Accompanying drawing 1 is isodensity mortar wire cutting technology flow chart of the present invention.
The specific embodiment
Below by by the 1000kg isodensity, cutting mortar and one, NTC442 slicer, section specification 125mm*125mm*0.180mm, silicon rod overall length: 600mm specifically sets forth all operations were process of the present invention:
Embodiment
One, isodensity mortar cutter sweep
Isodensity mortar cutter sweep comprises mortar jar 101, isodensity mortar adjusting device 112, cool-heat-exchanger 102, divide flow nozzle 103, line roller 106, cutting steel wire 107, mortar pin groove 109, agitator 111 is housed in mortar jar 101, Xun encircles pump 115, de-iron powder device 114 is housed in isodensity mortar adjusting device 112, density detector 117, Xun ring pump 115 in mortar jar 101 is connected with isodensity mortar adjusting device 112 by pipeline, isodensity mortar adjusting device 112 is connected with cool-heat-exchanger 102 by pipeline, cool-heat-exchanger 102 is connected with three minutes flow nozzles 103 by pipeline, divide flow nozzle 103 belows that cutting steel wire 107 and two line rollers 106 are housed, cutting steel wire 107 is around two line rollers 106, mortar pin groove 109 is equipped with in cutting steel wire 107 and two line roller 106 belows, mortar pin groove 109 is connected with mortar jar 101 by return duct 110, isodensity mortar adjusting device 112 also is connected with mortar jar 101 by conditioning agent pipeline 113, on isodensity mortar adjusting device 112 limits, upper end, conditioning agent inlet pipeline 116 is housed.
Two, isodensity mortar cutting method
A. isodensity cutting mortar device is installed on the NTC442 slicer
Isodensity is cut to the mortar device to be arranged between random storage cylinder mortar outlet and slicer heat exchange import with fast-assembling flange;
B. isodensity cutting mortar preparation
Get 1000kg isodensity cutting mortar as the cutting mortar, and get other isodensity that a certain amount of density is lower and cut mortar as isodensity mortar conditioning agent, mortar is adjusted to the condition of work be available on the machine, density: 1.625kg/l; Viscosity is between 280cp-300cp;
C. the device density of first collecting front 5 cuttves of NTC slicer before using with the section time changing curve, according to a tree name 5 cutter mean change curves, adjust slurry densities and regulate compensators and set up the benchmark change curve, the mortar by the slurry density real time probe when cutting is monitored;
D. by tank in isodensity mortar conditioning agent adding apparatus, 240kg isodensity cutting mortar is added in the random mortar jar of NTC442, enter normal heat engine, start to enter starting slurry density real time probe after the section program, isodensity cutting mortar device enters normal operation, completes section; After completing first section program, newly adding isodensity mortar conditioning agent consumption 12.5kg slurry density is 1.627kg/l, and in mortar jar, the mortar total amount reaches 252.5kg;
E. after more renewing the silicon rod material, enter the second cutter cutting process, operation process repeats the normal heat engine that enters of d step, after starting to enter the section program, start the slurry density real time probe, isodensity cutting mortar device enters normal operation, after completing the section program, newly add isodensity mortar conditioning agent consumption 12.3kg, slurry density is 1.626kg/l, and in mortar jar, the mortar total amount reaches 264.8kg;
F. after more renewing the silicon rod material, enter the 3rd cutter cutting process, operation process repeats the normal heat engine that enters of d step, after starting to enter the section program, start the slurry density real time probe, isodensity cutting mortar device enters normal operation, after completing the section program, newly add isodensity mortar conditioning agent consumption 12.0kg, slurry density is 1.625kg/l, and in mortar jar, the mortar total amount reaches 276.8kg;
G. after more renewing the silicon rod material, enter the four blade cutting process, operation process repeats the normal heat engine that enters of d step, after starting to enter the section program, start the slurry density real time probe, isodensity cutting mortar device enters normal operation, after completing the section program, newly add isodensity mortar conditioning agent consumption 13.5kg, slurry density is 1.627kg/l, and in mortar jar, the mortar total amount reaches 290.3kg;
H. after more renewing the silicon rod material, enter the 5th cutter cutting process, operation process repeats the normal heat engine that enters of d step, after starting to enter the section program, start the slurry density real time probe, isodensity cutting mortar device enters normal operation, after completing the section program, newly add isodensity mortar conditioning agent consumption 13.2kg, slurry density is 1.628kg/l, and in mortar jar, the mortar total amount reaches 303.5kg; Starting is automatically changed the waste mortar mode and is extracted the 63.5kg waste mortar, and mortar jar returns to 240kg;
I. install normal heat engine to the h step of entering of automatic cycle d step.
After having tested, the test data drawn: average slice qualification rate is 94.5%---95%, cutting efficiency from former every days 2.5 cutter be upgraded to 3.5 cuttves, raising efficiency 40%, utilization rate of equipment and installations promotes 20%, changes the mortar cycle to be increased to and with equipment, to change guide wheel and synchronize while safeguarding from 2 cuttves.
It is to be based upon after great many of experiments is counted a tree name and produced the section result to formulate to form that isodensity mortar cutting method and mortar feedway use, and the user can be by under its service routine interpretive guidelines, completing all operations were process.
Above-described specific embodiment; purpose of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (1)
1. isodensity mortar cutting method for solar silicon wafers line cutting is characterized in that comprising the following steps:
A. isodensity cutting mortar device is installed on the NTC442 slicer
Isodensity is cut to the mortar device to be arranged between random storage cylinder mortar outlet and slicer heat exchange import with fast-assembling flange;
B. isodensity cutting mortar preparation
Get 1000 parts of isodensity cutting mortars of weight as the cutting mortar, and get other isodensity that a certain amount of density is lower and cut mortar as isodensity mortar conditioning agent, mortar is adjusted to the condition of work be available on the machine, density: 1.625kg/l; Viscosity is between 280cp-300cp;
C. the device density of first collecting front 5 cuttves of NTC slicer before using with the section time changing curve, according to a tree name 5 cutter mean change curves, adjust slurry densities and regulate compensators and set up the benchmark change curve, the mortar by the slurry density real time probe when cutting is monitored;
D. by tank in isodensity mortar conditioning agent adding apparatus, 240 parts of isodensity cutting mortars are added in the random mortar jar of NTC442, enter normal heat engine, start to enter starting slurry density real time probe after the section program, isodensity cutting mortar device enters normal operation, completes section; After completing first section program, newly add isodensity mortar conditioning agent consumption 12-14 part;
E. after more renewing the silicon rod material, enter the second cutter cutting process, operation process repeats entering normal heat engine, starting to enter starting slurry density real time probe after the section program of d step, isodensity cutting mortar device enters normal operation, after completing the section program, newly add isodensity mortar conditioning agent consumption 12-14 part;
F. after more renewing the silicon rod material, enter the 3rd cutter cutting process, operation process repeats entering normal heat engine, starting to enter starting slurry density real time probe after the section program of d step, isodensity cutting mortar device enters normal operation, after completing the section program, newly add isodensity mortar conditioning agent consumption 12-14 part;
G. after more renewing the silicon rod material, enter the four blade cutting process, operation process repeats entering normal heat engine, starting to enter starting slurry density real time probe after the section program of d step, isodensity cutting mortar device enters normal operation, after completing the section program, newly add isodensity mortar conditioning agent consumption 12-14 part;
H. after more renewing the silicon rod material, enter the 5th cutter cutting process, operation process repeats entering normal heat engine, starting to enter starting slurry density real time probe after the section program of d step, isodensity cutting mortar device enters normal operation, after completing the section program, newly add isodensity mortar conditioning agent consumption 12-14 part, when mortar jar mortar total amount reached 300 parts, starting was automatically changed the waste mortar mode and is extracted 60 parts of waste mortars, and mortar jar returns to 240 parts;
I. install normal heat engine to the h step of entering of automatic cycle d step.
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| CN102626955A (en) * | 2012-02-14 | 2012-08-08 | 上海五同机械制造有限公司 | Double-guide roll linear silicon wafer cutting system |
| CN102626957A (en) * | 2012-02-14 | 2012-08-08 | 上海五同机械制造有限公司 | Silicon wafer linear cutting equipment with uniform slurry spraying device |
| CN102626954A (en) * | 2012-02-14 | 2012-08-08 | 上海五同机械制造有限公司 | Silicon wafer cutting method and cut scrap recycling method |
| CN103358413B (en) * | 2013-08-02 | 2015-07-15 | 英利集团有限公司 | Method for regulating use proportion of recycling sand in silicon wafer cutting |
| CN107932762B (en) * | 2017-12-11 | 2019-11-15 | 中国电子科技集团公司第四十六研究所 | A kind of mortar spraying device and realization cutting method for multi-line cutting machine |
| CN110883955B (en) * | 2019-11-28 | 2021-11-02 | 西安奕斯伟材料科技有限公司 | Wire cutting cleaning device and wire cutting system |
| CN110977730A (en) * | 2019-12-23 | 2020-04-10 | 无锡京运通科技有限公司 | Cutting fluid extraction system for multi-wire cutting machine |
| CN112008903B (en) * | 2020-09-03 | 2022-07-15 | 晶海洋半导体材料（东海）有限公司 | Cutting fluid supply device and silicon wafer cutting equipment |
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| JPH10180750A (en) * | 1996-12-25 | 1998-07-07 | Nippei Toyama Corp | Slurry temperature control device in wire saw |
| JP3647607B2 (en) * | 1997-06-20 | 2005-05-18 | 株式会社日平トヤマ | Slurry circulation device and wire saw |
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| MY153330A (en) * | 2008-12-20 | 2015-01-29 | Cabot Microelectronics Corp | Wiresaw cutting method |
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| JP3071108B2 (en) * | 1994-09-30 | 2000-07-31 | 株式会社日平トヤマ | Wire saw equipment |
| US6056031A (en) * | 1995-11-30 | 2000-05-02 | Nippei Toyama Corporation | System and method for processing ingots |
| EP1097782A1 (en) * | 1999-01-20 | 2001-05-09 | Shin-Etsu Handotai Co., Ltd | Wire saw and cutting method |
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