CN103358413B - Method for regulating use proportion of recycling sand in silicon wafer cutting - Google Patents
Method for regulating use proportion of recycling sand in silicon wafer cutting Download PDFInfo
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- CN103358413B CN103358413B CN201310334276.9A CN201310334276A CN103358413B CN 103358413 B CN103358413 B CN 103358413B CN 201310334276 A CN201310334276 A CN 201310334276A CN 103358413 B CN103358413 B CN 103358413B
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Abstract
Provided is a method for regulating a use proportion of recycling sand in silicon wafer cutting. The method comprises the following steps that the working platform speed, the wire speed, the steel wire tension, the slurry temperature , the slurry flow and the ditch of wheel guiding grooves of a cutting method are determined, the recycling sand and brand-new sand are mixed and used in proportion, and silicon wafer cutting is carried out; through multiple times of cutting experiments, the size distribution condition, the circular degree value, the fine powder content and the PH value of recycling silicon carbide in the recycling sand are verified, and an optimum value enabling a silicon wafer obtained by cutting to be qualified is found and used as the quality control point of the silicon carbide in the recycling sand; under the premise that the quality of the recycling sand reaches the quality control point and the use proportion of the recycling sand is improved, the quality of the cut silicon wafer is made to be qualified through the mode of reducing the parameters of the working platform speed, improving the parameters of the wire speed of a steel wire, improving the parameters of the steel wire tension, improving the parameters of the slurry flow and reducing the parameters of the slurry temperature. The method regulates process parameters by determining the quality control point of the recycling sand, and achieves the improvement of the use proportion of the recycling sand.
Description
Technical field
The present invention relates to silicon chip cutting field, particularly relate to the method reclaiming sand usage ratio in the cutting of a kind of commissioning silicon chip, the method, by determining the qualifying point reclaiming sand, adjusting process parameter, realizes improving and reclaims sand usage ratio.
Background technology
Because photovoltaic industry is increasingly competitive, the cost of any link reduces and is all reduced by the cost impelled by overall link, and the product produced could be used to have competitiveness.
For silicon chip cutting, applying maximum is multi-wire saw technology, and the monocrystalline bar after evolution process is fixed on stainless steel work-piece by glass plate by this technology, is then placed into the respective regions of cutting machine.Guide wheel is carved with accurate wire casing matched with used line of cut diameter through grooving processes process on wheel body, and steel wire is wrapped on the wire casing of guide wheel by order back and forth and forms upper and lower two parallel nets.Driven by engine guide wheel rotates, and guide wheel drives cutting steel wire to walk about at a high speed, and linear speed is generally 5 to 25 meters per second.At the sand mouth of workbench both sides, mortar is sprayed on gauze equably, the mixed liquor that mortar is made up of carborundum (SiC) particle and polyethylene glycol (PEG) suspension.Cutting operation is carried out along with line of cut enters crystal bar.Crystal bar slowly advances downwards with workbench simultaneously, and crystal bar is completely by gauze, and thousands of wafers has just cut.The cutting of solar silicon wafers is that steel wire is being cut with silicon carbide micro-powder in fact, so the grain type of micro mist and granularity are the bright and clean degree of silicon chip table sheet and the key of cutting power.Grain type rule, the silicon chip cut out show will fineness fine; Even particle size distribution, will improve the cutting power of silicon chip, and the micro mist in old sand slurry is made up of the silica flour produced in silicon chip cutting process, iron powder.Because brand-new mortar has cut once, in old sand slurry, the cutting power of carborundum is also stronger, the higher suspendability that have impact on overall mortar of powder content just in old sand slurry, and part micro mist meeting packaged silicon carbide surface, thus reduce the integral cutting ability of mortar.Generally adopt in current industry and improve the mortar manufacturing expense that mortar reclaims the usage ratio of product, the simple mode reducing new mortar renewal amount reduces silicon chip processing.
But along with the development of mortar recovery technique, old sand slurry achieves Separation of Solid and Liquid.Reclaiming carborundum, reclaiming polyethylene glycol by sieving worry step by step, and coordinate coupling cutting, cleaning, reclaim product and can meet need of production completely.Adopt the usage ratio reclaiming product lower in current industry, mainly lack owing to reclaiming product technology parameter and standard, therefore can not ensure the stability reclaiming carborundum quality.Also do not mate with silicon chip cutting technique with using the ratio reclaiming carborundum in addition, cause cutting qualification rate to reduce relevant, due to the lifting along with recovery sand ratio, the overall circularity of carborundum can increase.Use the prerequisite that mortar total amount, broaching load are constant in each cutting under, improve mortar recovery carborundum usage ratio and its integral cutting ability can be made to decline, if do not seek the silicon chip cutting technique matched, cutting qualification rate will be caused to reduce.
Therefore, how to determine old sand slurry qualifying point, and under this qualifying point, improve the usage ratio of old sand slurry, adjusting process parameter, greatly improve the utilization rate of old sand slurry, finally meet need of production, the raising realizing economic benefit becomes this area problem in the urgent need to address.
Summary of the invention
For solving the problems of the technologies described above, the object of this invention is to provide the method reclaiming sand usage ratio in the cutting of a kind of commissioning silicon chip.
For achieving the above object, technical scheme provided by the present invention is as follows:
Reclaim a method for sand usage ratio in the cutting of commissioning silicon chip, comprise the following steps:
Step one determines a kind of speed of table, linear velocity, steel wire tension force, slurry temperature, slurry flow, guided wheel slot distance of cutting method, reclaims sand and brand-new sand is used in combination in proportion carries out silicon chip cutting;
Step 2, by repeatedly cutting experiment, verifies the size distribution situation, circularities, powder content and the pH value that reclaim and reclaim carborundum in sand, and finds out the qualified optimum value of silicon chip that cutting is obtained, as the qualifying point reclaiming sand;
Step 3 is under recovery chiltern amount reaches the prerequisite of above-mentioned qualifying point, improve and reclaim sand usage ratio, and by the mode reducing speed of table parameter, improve the linear velocity parameter of steel wire, improve steel wire tension parameters, improve slurry flow parameter, reduce slurry temperature parameter, make the Si wafer quality that cuts out qualified.
Further, the recovery sand in described step one and brand-new sand ratio are 1: 1.
Further, in described step one, the speed of table is 290um/min, linear velocity is 13.4m/s, setting steel wire tension force is 23N, slurry temperature is 23 DEG C, slurry flow is 140kg/min, guided wheel slot is apart from being 355um.
Further, the qualifying point reclaiming carborundum in sand in described step 2 is: median diameter value controls to be less than 30% at 9.8 ± 0.5um, powder content, circularities is less than 0.92, pH value 6 ~ 7.
Further, reclaiming sand ratio in described step 3, to be promoted to the ratio reclaiming sand and brand-new sand be 7: 3.
Further, speed of table 280um/min, linear velocity 13.8m/s, setting steel wire tension force 24N, slurry temperature 21 DEG C, slurry flow 145kg/min, guided wheel slot distance 355um in described step 3.
Further, in the cutting method of described step one, each cutting elapsed time 10.3h, each cutting consume steel wire amount 500km.
Further, in the cutting method of described step 3, each cutting elapsed time 10.5h, each cutting consume steel wire amount 520km.
Adopt technique scheme, beneficial effect of the present invention has:
The present invention, by optimizing incision method, promotes modes such as reclaiming sand quality, realizes after sand usage ratio is reclaimed in raising, and silicon chip cutting qualification rate does not decline, and finally reaches the object reducing silicon chip cutting processing cost.
The present invention only need adjust cutting technique, the strict product standard controlling to reclaim sand can put into production, be applicable to industrial production in enormous quantities, can great economic benefit be produced, and reclaim the abundant application of product, in resources circulation, environmental friendliness, also play positive role.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The invention provides the method reclaiming sand usage ratio in the cutting of a kind of commissioning silicon chip, the method is: determine that a kind of speed of table of cutting method is 290um/min, linear velocity is 13.4m/s, setting steel wire tension force is 23N, slurry temperature is 23 DEG C, slurry flow is 140kg/min, guided wheel slot distance is 355um, recovery sand and brand-new sand volume ratio are under the condition of 1: 1, carry out silicon chip cutting, each cutting elapsed time 10.3h, each cutting consume steel wire amount 500km; By repeatedly cutting experiment, verify the size distribution situation, circularities, powder content and the pH value that reclaim and in sand, reclaim carborundum, and find out the qualified optimum value of silicon chip that cutting is obtained, as the qualifying point reclaiming carborundum in sand, be specially: median diameter value controls to be less than 30% at 9.8 ± 0.5um, powder content, circularities is less than 0.92, pH value 6 ~ 7; Under recovery chiltern amount reaches the prerequisite of above-mentioned qualifying point, improve and reclaim sand usage ratio, it is 7: 3 that recovery sand ratio is promoted to the volume ratio reclaiming sand and brand-new sand, and by the mode reducing speed of table parameter, improve the linear velocity parameter of steel wire, improve steel wire tension parameters, improve slurry flow parameter, reduce slurry temperature parameter, make the Si wafer quality that cuts out qualified.The parameters of cutting method is particularly: speed of table 280um/min, linear velocity 13.8m/s, setting steel wire tension force 24N, slurry temperature 21 DEG C, slurry flow 145kg/min, guided wheel slot are apart from 355um, and each cutting elapsed time 10.5h, each cutting consume steel wire amount 520km.
The present invention is on the basis increasing steel wire consumption, and with crossing, sand quality is reclaimed in raising, the mode of optimizing incision technique improves the usage ratio reclaiming sand, significantly reduces the manufacturing expense of silicon chip processing, and then significantly reduces cutting cost.Debug out the stable cutting technique for reclaiming carborundum or recovery cutting liquid, product is reclaimed in application to greatest extent.Specifically, by determining to reclaim silicon carbide products standard, as reclaimed carborundum granularity distribution situation, circularities, powder content, PH etc., realize reclaiming carborundum stay in grade, by reducing the speed of table parameter of saw blade cutting machine, improve the linear velocity parameter of the steel wire of saw blade cutting machine, thus improve steel wire silt carrying capacity, improve cutting power, improve the steel wire tension parameters of saw blade cutting machine, thus reduce steel wire line bow, improve the slurry flow parameter of saw blade cutting machine thus improve steel wire silt carrying capacity, improve cutting power, and the mode such as slurry temperature parameter reducing saw blade cutting machine carries out the technique adjustment of cutting method, that technological parameter and current recovery sand usage ratio adapt, make when the product quality of sand is reclaimed in strict control, the more usage ratio increasing recovery sand, be widely used in actual production, great economic benefit will be produced, and reclaim the application of product, in resources circulation, environmental friendliness aspect also plays positive role.
Embodiment 1
Reclaim sand quality standard (namely reclaiming sand qualifying point): median diameter value controls to be less than 30% at 9.8 ± 0.5um, powder content, circularities is less than 0.92, pH value 6 ~ 7.
Reclaim sand use amount 350L, brand-new sand use amount 150L, reclaim chiltern amount: median diameter value is 10.0um, powder content is 25%, circularities is 0.89, pH value 6.5, meet and reclaim sand and use standard; The parameters of cutting method is: speed of table 280um/min, linear velocity 13.8m/s, setting steel wire tension force 24N, slurry temperature 21 DEG C, slurry flow 145kg/min, guided wheel slot are apart from 355um, and each cutting elapsed time 10.5h, each cutting consume steel wire amount 520km.The silicon chip surface quality obtained after cutting is good, kerf value 10.2um, TTV value 15.5um, and silicon chip cutting qualification rate is 96.5%.
Embodiment 2
Reclaim sand quality standard (namely reclaiming sand qualifying point): median diameter value controls to be less than 30% at 9.8 ± 0.5um, powder content, circularities is less than 0.92, pH value 6 ~ 7.
Reclaim sand use amount 350L, brand-new sand use amount 150L, reclaim chiltern amount: median diameter value is 10.0um, powder content is 25%, circularities is 0.89, pH value 6.5, meet and reclaim sand and use standard; The parameters of cutting method is: speed of table 288um/min, linear velocity 13.5m/s, setting steel wire tension force 23.5N, slurry temperature 22 DEG C, slurry flow 142kg/min, guided wheel slot are apart from 355um, and each cutting elapsed time 10.35h, each cutting consume steel wire amount 505km.The silicon chip surface poor quality obtained after cutting, kerf value 11.5um, TTV value 16.8um, silicon chip cutting qualification rate is 95.5%.
Embodiment 3
Reclaim sand quality standard (namely reclaiming sand qualifying point): median diameter value controls to be less than 30% at 9.8 ± 0.5um, powder content, circularities is less than 0.92, pH value 6 ~ 7.
Reclaim sand use amount 350L, brand-new sand use amount 150L, reclaim chiltern amount: median diameter value is 10.0um, powder content is 25%, circularities is 0.89, pH value 6.5, meet and reclaim sand and use standard; The parameters of cutting method is: speed of table 285um/min, linear velocity 13.6m/s, setting steel wire tension force 23.8N, slurry temperature 22.5 DEG C, slurry flow 143kg/min, guided wheel slot are apart from 355um, and each cutting elapsed time 10.4h, each cutting consume steel wire amount 510km.The silicon chip surface poor quality obtained after cutting, kerf value 10.9um, TTV value 16.3um, silicon chip cutting qualification rate is 96.0%.
Embodiment 4
Reclaim sand quality standard (namely reclaiming sand qualifying point): median diameter value controls to be less than 30% at 9.8 ± 0.5um, powder content, circularities is less than 0.92, pH value 6 ~ 7.
Reclaim sand use amount 350L, brand-new sand use amount 150L, reclaim chiltern amount: median diameter value is 10.0um, powder content is 25%, circularities is 0.89, pH value 6.5, meet and reclaim sand and use standard; The parameters of cutting method is: speed of table 283um/min, linear velocity 13.7m/s, setting steel wire tension force 23.9N, slurry temperature 21.8 DEG C, slurry flow 144kg/min, guided wheel slot are apart from 355um, and each cutting elapsed time 10.45h, each cutting consume steel wire amount 515km.The silicon chip surface poor quality obtained after cutting, kerf value 10.5um, TTV value 15.8um, silicon chip cutting qualification rate is 96.3%.
Embodiment 5
Reclaim sand quality standard (namely reclaiming sand qualifying point): median diameter value controls to be less than 30% at 9.8 ± 0.5um, powder content, circularities is less than 0.92, pH value 6 ~ 7.
Reclaim sand use amount 350L, brand-new sand use amount 150L, reclaim chiltern amount: median diameter value is 10.2um, powder content is 27%, circularities is 0.90, pH value 6.3, meet and reclaim sand and use standard; The parameters of cutting method is: speed of table 280um/min, linear velocity 13.8m/s, setting steel wire tension force 24N, slurry temperature 21 DEG C, slurry flow 145kg/min, guided wheel slot are apart from 355um, and each cutting elapsed time 10.5h, each cutting consume steel wire amount 520km.The silicon chip surface quality obtained after cutting is good, kerf value 10.4um, TTV value 15.7um, and silicon chip cutting qualification rate is 96.4%.
Embodiment 6
Reclaim sand quality standard (namely reclaiming sand qualifying point): median diameter value controls to be less than 30% at 9.8 ± 0.5um, powder content, circularities is less than 0.92, pH value 6 ~ 7.
Reclaim sand use amount 350L, brand-new sand use amount 150L, reclaim chiltern amount: median diameter value is 9.3um, powder content is 23%, circularities is 0.85, pH value 6.8, meet and reclaim sand and use standard; The parameters of cutting method is: speed of table 280um/min, linear velocity 13.8m/s, setting steel wire tension force 24N, slurry temperature 21 DEG C, slurry flow 145kg/min, guided wheel slot are apart from 355um, and each cutting elapsed time 10.5h, each cutting consume steel wire amount 520km.The silicon chip surface quality obtained after cutting is good, kerf value 9.8um, TTV value 14.8um, and silicon chip cutting qualification rate is 96.7%.
The above embodiment only have expressed embodiments of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (8)
1. reclaim a method for sand usage ratio in the cutting of commissioning silicon chip, it is characterized in that, comprise the following steps:
Step one determines a kind of speed of table, linear velocity, steel wire tension force, slurry temperature, slurry flow, guided wheel slot distance of cutting method, reclaims sand and brand-new sand is used in combination in proportion carries out silicon chip cutting;
Step 2, by repeatedly cutting experiment, verifies the size distribution situation, circularities, powder content and the pH value that reclaim and reclaim carborundum in sand, and finds out the qualified optimum value of silicon chip that cutting is obtained, as the qualifying point reclaiming sand;
Step 3 is under recovery chiltern amount reaches the prerequisite of above-mentioned qualifying point, improve and reclaim sand usage ratio, and by the mode reducing speed of table parameter, improve the linear velocity parameter of steel wire, improve steel wire tension parameters, improve slurry flow parameter, reduce slurry temperature parameter, make the Si wafer quality that cuts out qualified.
2. reclaim the method for sand usage ratio in commissioning silicon chip cutting according to claim 1, it is characterized in that, the recovery sand in described step one and the volume ratio of brand-new sand are 1: 1.
3. in commissioning silicon chip cutting according to claim 2, reclaim the method for sand usage ratio, it is characterized in that, in described step one, the speed of table is 290um/min, linear velocity is 13.4m/s, setting steel wire tension force is 23N, slurry temperature is 23 DEG C, slurry flow is 140kg/min, guided wheel slot is apart from being 355um.
4. in commissioning silicon chip cutting according to claim 3, reclaim the method for sand usage ratio, it is characterized in that, the qualifying point reclaiming carborundum in sand in described step 2 is: median diameter value controls to be less than 30% at 9.8 ± 0.5um, powder content, circularities is less than 0.92, pH value 6 ~ 7.
5. reclaim the method for sand usage ratio in commissioning silicon chip according to claim 4 cutting, it is characterized in that, reclaiming sand ratio in described step 3, to be promoted to the volume ratio reclaiming sand and brand-new sand be 7: 3.
6. in commissioning silicon chip cutting according to claim 5, reclaim the method for sand usage ratio, it is characterized in that, in described step 3, speed of table 280um/min, linear velocity 13.8m/s, setting steel wire tension force 24N, slurry temperature 21 DEG C, slurry flow 145kg/min, guided wheel slot are apart from 355um.
7. reclaim the method for sand usage ratio in commissioning silicon chip cutting according to claim 6, it is characterized in that, in the cutting method of described step one, each cutting elapsed time 10.3h, each cutting consume steel wire amount 500km.
8. reclaim the method for sand usage ratio in commissioning silicon chip cutting according to claim 7, it is characterized in that, in the cutting method of described step 3, each cutting elapsed time 10.5h, each cutting consume steel wire amount 520km.
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| CN106444630A (en) * | 2016-11-24 | 2017-02-22 | 常州协鑫光伏科技有限公司 | On-line regulation method and apparatus of mortar |
| CN108000739B (en) * | 2017-11-28 | 2019-11-12 | 泉州台商投资区中达工业设计有限公司 | A kind of mortar cutting method |
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