CN102187429A - Methods and apparatus for recovering heat from processing systems - Google Patents
Methods and apparatus for recovering heat from processing systems Download PDFInfo
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- CN102187429A CN102187429A CN2009801413831A CN200980141383A CN102187429A CN 102187429 A CN102187429 A CN 102187429A CN 2009801413831 A CN2009801413831 A CN 2009801413831A CN 200980141383 A CN200980141383 A CN 200980141383A CN 102187429 A CN102187429 A CN 102187429A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
Methods and apparatus for recovering heat from disposed effluents are disclosed herein. In some embodiments, an apparatus may include a first process chamber configured for gaseous or liquid processes; a second process chamber configured for liquid processes; and a heat pump having a compressor and a first heat exchanger, wherein the compressor is configured to use a first effluent exhausted from the first process chamber and wherein the first heat exchanger having first and second sides configured to transfer heat therebetween, wherein the first side is configured to flow a liquid reagent therethrough and into the second process chamber, and wherein the second side is configured to flow the pressurized first effluent from the first process chamber therethrough.; In some embodiments, a heater may be disposed between the heat pump and the second process chamber to further heat the liquid reagent prior to entering the second process chamber.
Description
Technical field
Embodiments of the invention are general relates to semiconductor, flat panel, photoelectricity or other silicon and film treatment chamber and equipment, relates to the method and apparatus that is used to retrieve from the heat of above-mentioned treatment system especially.
Background technology
In semiconductor, flat panel, photoelectricity and other silicon or film processing system, be used for treatment system before, many processing procedures need pre-hot liquid or gaseous reagent.Reagent often with heater heats, for example used some heater or similar firing equipment before and then using.After the processing, handle and/or dispose effluent from effluent (as used or " dirty " water or chemicals, gaseous emissions etc.) the general orientation waste treatment system of treatment system.Usually, before using colder medium to dispose or diluting effluent, effluent need be cooled earlier or heat is dissipated to surrounding air, and then also need remove described effluent.
Because pre-thermal agent needs big energy, this can increase manufacturing cost, thus the present invention relates to be used to retrieve to dispose certainly the method and apparatus of the heat of effluent (disposed effluent), to help reducing manufacturing cost.
Summary of the invention
The method and apparatus that is used to retrieve to dispose certainly the heat of effluent is disclosed at this.In certain embodiments, equipment comprises: base plate processing system, and it comprises the treatment chamber that is disposed for liquid processing procedure; First heat exchanger with first and second side, and described first heat exchanger arrangement becomes in order to transmission heat between first and second side, wherein first side is configured to make liquid reagent to flow through wherein and flow in the treatment chamber, and wherein second side is configured to make from the effluent of treatment chamber and flows through wherein; And heater, it is arranged to be linked in sequence (in line with) with first side of first heat exchanger, before entering treatment chamber at liquid reagent, heats this liquid reagent.
In certain embodiments, base plate processing system can comprise: first waste fluid of used heat is provided in it is used to provide waste heat source; First treatment chamber, it has reagent source, and described reagent source and described first treatment chamber couple and are configured to reagent is provided to the internal capacity of first treatment chamber; And heat pump, it is coupled in waste heat source and sends between the reagent pipeline, the described reagent pipeline of sending into flows in the internal capacity of treatment chamber reagent, heat pump be configured to from the heat transfer of waste heat source to the reagent of sending in the reagent pipeline.In certain embodiments, heat pump can comprise the compressor and first heat exchanger, wherein first side that is coupled to waste heat source and heat exchanger of compressor is linked in sequence, and flow through at first waste fluid before first side of heat exchanger, first waste fluid that pressurizes, and wherein second side of first heat exchanger is configured to make reagent to flow through wherein.
In certain embodiments, system also comprises heater, and it is arranged to be linked in sequence with second side of first heat exchanger, to enter at reagent before first treatment chamber, heats this reagent.In certain embodiments, waste heat source can comprise following one or more: come self-configuring be used for the effluent, compress air system, air separation compressor of the treatment chamber of liquid state or gaseous state processing procedure, from the gaseous emissions of reducer or liquid coolant, from the hot-air of electronics and/or plant equipment or liquid coolant etc.
In certain embodiments, first treatment chamber system is disposed for liquid processing procedure, and wherein waste heat source comprises second treatment chamber that is disposed for the gaseous state processing procedure, and second treatment chamber provides first used heat to be used as the gaseous emissions that comes from second treatment chamber.
In certain embodiments, system also comprises second heat exchanger with first and second side, described second heat exchanger arrangement becomes in order to conduct heat between first and second side, wherein first side of second heat exchanger is configured to make reagent to flow through wherein and flow in first treatment chamber, and wherein second side of second heat exchanger is configured to make second waste fluid of discharging from first treatment chamber to flow through wherein.
In one aspect of the invention, the method that is used to retrieve to dispose certainly the heat of effluent is disclosed.In certain embodiments, the method of treatment substrate comprises that providing the treatment chamber that is disposed for liquid processing procedure and couples heat exchanger, heat exchanger to have is used to second side that first side that makes liquid reagent flow into treatment system and the effluent (directly or from middle storage part aspirating) that is used to make from treatment chamber flow; By heat is transferred to the reagent of heat exchanger first side of flowing through from the effluent of heat exchanger second side of flowing through, come this liquid reagent of preheating; And utilize the heater that is arranged between heat exchanger and the treatment chamber, being heated to preferred temperature through the liquid reagent of preheating.
In certain embodiments, the method for treatment substrate comprises: make liquid reagent flow through first side of heat exchanger, with the preheating liquid reagent; Utilize heater, being heated to preferred temperature through the liquid reagent of preheating; Make liquid reagent flow to the treatment chamber that is disposed for liquid processing procedure through heating; And second side that makes processing procedure effluent (directly or from the middle storage part aspirating) heat exchanger of flowing through from chamber, with the liquid reagent of pre-heated flow through heat exchanger first side.
In certain embodiments, the method for treatment substrate can comprise: reagent is flowed through be coupled to the heat pump of waste heat source, with by adding thermal agent to reagent from the heat transfer of waste heat source; And make reagent flow to treatment chamber through heating, with treatment substrate.In certain embodiments, the method for treatment substrate can comprise makes flow through first side of first heat exchanger of reagent, to come the heat of the self-pressurization waste heat fluid and heat exchanger second side of flowing through to add thermal agent by transmission; And make reagent flow to treatment chamber through heating, with treatment substrate.In certain embodiments, waste heat source or waste heat fluid can comprise following one or more: from liquid waste fluid, effluent or the liquid coolant of the treatment chamber that is disposed for the gaseous state processing procedure; Compress air system; The air separation compressor; Gaseous emissions or liquid coolant from reducer; From the hot-air of electronics and/or plant equipment or liquid coolant etc.
Other and further embodiment will be discussed in more detail below.
Description of drawings
For allowing above-mentioned feature of the present invention become apparent, but reference example is carried out more concrete description to the present invention of top concise and to the point elaboration, and part embodiment is shown in the drawings.Only show exemplary embodiments of the present invention though should be noted that accompanying drawing, can not therefore accompanying drawing be considered as limitation of the scope of the invention, the present invention can also have other equivalent embodiment.
Fig. 1 shows the treatment system according to some embodiments of the present invention.
Fig. 2 shows the semiconductor processing system according to some embodiments of the present invention.
Fig. 3-3A shows the semiconductor processing system according to some embodiments of the present invention.
Fig. 4 shows the treatment system according to some embodiments of the present invention.
Fig. 5 shows the treatment system according to some embodiments of the present invention.
Fig. 5 A shows the heat recovery equipment according to some embodiments of the present invention.
Fig. 6 shows and is used to retrieve the flow chart of method from the heat of disposing effluent according to some embodiments of the present invention.
Fig. 7 shows and is used to retrieve the flow chart of method from the heat of disposing effluent according to some embodiments of the present invention.
Fig. 8 shows and is used to retrieve the flow chart of method from the heat of disposing effluent according to some embodiments of the present invention.
For ease of understanding, under possible situation, identical Reference numeral is represented identical assembly shared among each figure.Above-mentioned accompanying drawing and not drawn on scale, and can be through simplifying so that explanation.
Embodiment
The method and apparatus that is used for reclaiming and being used to the heat of the disposal effluent (disposed effluent) from the processing system is disclosed at this.Method and apparatus of the present invention is by before using in identical and/or other treatment system, be used to come the preheating fluid, reduce energy consumption in the base plate processing system (as semiconductor, flat panel, photoelectricity or other silicon and film processing system) with favourable promotion from the used heat of handling system (Tathagata is from the disposal effluent of handling chamber and the used heat that produced by the miscellaneous part of treatment system).Reducing the heat of disposing effluent more is of value to the subsequent treatment of disposing effluent, for example utilizes and weakens (abatement) or other disposal means.
Fig. 1 shows the schematic process system according to some embodiments of the present invention.Treatment system 1 can action need the processing procedure of input (gas or liquid) of heating.In the example of Fig. 1, input 2 (as cold ultra-pure water (UPW)) supply with treatment chamber 3.Treatment system also comprises a plurality of waste heat source 4,5,6.Waste heat source can be treatment facility, attenuation apparatus, the apparatus of air conditioning etc., and it will be specified in down.In certain embodiments, waste heat source (as waste heat source 4) can be the disposal effluent (shown in the dotted line of connection processing chamber 3 and waste heat source 4) from treatment chamber 3 itself.Treatment system 1 comprises one or more heat pumps 7, in order to the heat of transmission waste heat source 5,6, and then before in effluent system 10, disposing, the input of heat treated chamber 3.If compatible, but accumulated waste thermal source 5,6 then, and use identical heat pump (as shown in the figure).Perhaps, incompatible used heat can use independent heat pump (not shown).Optionally, before preheater (as heat exchanger 8) is used in and disposes in the effluent system 11, in the future self-discharging thing/effluent and not with the heat transfer of heat pump 7 compatibilities to the input 2 of handling chamber 3.In certain embodiments, effluent system the 10, the 11st, identical effluent system.Optionally, heater 9 can be set and be heated to the expectation process temperatures further will import 2 where necessary.A lot of versions of this system will be described below.
Fig. 2 shows the base plate processing system 100 according to some embodiments of the present invention.Semiconductor processing system 100 comprises treatment chamber 102, and described treatment chamber 102 is configured to carry out wet process (as wet platform processing procedure (wet bench process)).Treatment chamber 102 can be any suitable treatment chamber that disposes for liquid processing procedure, and described liquid processing procedure has the disposal effluent of sending into liquid reagent and recyclable heat of the heating of needing.The treatment chamber that is fit to can comprise any single substrate or cleaning systems in batches, for example is used for the chamber of wet chemical etch or cleaning (as preheating or divest the back wet-cleaning) etc.The exemplary process chamber comprises can be from Santa Clara, the Applied Materials of California, the OASIS STRIP that Inc. buys
TMOr OASIS CLEAN
TMChamber.
As shown in Figure 1, treatment chamber 102 can comprise the substrate support 112 that is used for supporting substrate 114.Substrate 114 can be pending suitable materials, for example silicon metal (as Si＜100〉or Si＜111 〉), silica, strained silicon, SiGe, doping or undoped polycrystalline silicon, doping or undoped silicon wafer, patterning or not patterned wafer, silicon-on-insulator (silicon on insulator; SOI), carbon doped silicon oxide, silicon nitride, doped silicon, germanium, GaAs, glass, sapphire, display base plate (as LCD (LCD), plasma display, electroluminescence (EL) lamp display etc.), solar battery array substrate, light-emitting diode (LED) substrate etc.Substrate 114 can have various sizes, for example wafer and rectangle or the square panel of diameter 200 millimeters (mm) or 300mm.The front of substrate 114 can be hydrophily, hydrophobicity or its combination.The front can be patterned, or have one or more patterned layers placed on it (for example photomask).
Fluid feed mouth (not shown) can be arranged in the substrate support 112 and pass plate and come accommodating fluid, so in processing procedure supply fluid with the gap (not shown) of the about 3mm between infill panel and substrate 114 dorsal parts.Liquid can be worked as and acted on megasonic energy transfer to the carrier of substrate 114, for example as the means that stirring is provided during the cleaning processing procedure or as the mode of heating wafer.Substrate support 112 can also comprise lifting/rotating member (not shown), and it for example can be used for controllably reagent being dispersed in equably the front of whole base plate 114.The top of treatment chamber 102 can comprise the filter (not shown), flows in the treatment chamber and arrives air on substrate 114 front sides in order to cleaning.
Nozzle 118 can be couple at the wall place of treatment chamber 102 sends into fluid line (incoming fluid line) 104.Nozzle can be placed to the front that air-flow, steam or liquid is guided to substrate 114.In certain embodiments, nozzle 118 can distribute reagent to fill recess 116, thereby the front of substrate 114 is immersed in the reagent.In certain embodiments, nozzle can distribute and uniformly dispersing reagent in the front of whole base plate 114.For example, by being enough to allow the rotating speed in reagent covered substrate 114 fronts, can cover positive with reagent enough to allow the flow velocity in reagent covered substrate 114 fronts distribute reagent, to keep simultaneously from nozzle.
Heat stored in the effluent from treatment chamber 102 is transferred to the liquid reagent that offers treatment chamber 102 by heat exchanger 103.For example, in certain embodiments, the effluent that discharges from treatment chamber 102 after handling can be in the temperature between about 30 ℃ to about 180 ℃.Therefore stored heat can be used to the liquid reagent that offers treatment chamber 102 is carried out preheating in the effluent, thereby reduces the power that the liquid reagent place of heater 120 heating needs.In certain embodiments, utilize from the heat of effluent pipeline 106 transmission and come the preheating liquid reagent, the energy consumption that can reduce heater 120 is at least about 20%.
Although be illustrated as individual components, in certain embodiments, heat exchanger 103 can be integrated into the single device that above-mentioned two kinds of functions are provided with heater 120.In certain embodiments, heat exchanger 103 can be integrated with treatment chamber 102, thereby before being transported to treatment chamber by heat exchanger, liquid reagent only need be heated to lower temperature, and described heat exchanger can be with the liquid reagent temperature increase to expecting treatment temperature, maybe can having the outlet that is configured to connect heater.
Send into fluid line 104 and can include any suitable material that conducts heat steadily between the liquid reagent that helps in effluent pipeline 106 and fluid line.Effluent pipeline 106 can include help any suitable material that conducts heat steadily between effluent and fluid line 104.In certain embodiments, material can have high heat conductance (as more than or equal to about 300W/mK).In certain embodiments, thermal conductivity can be lower (for example need owing to material compatibility use under the situation of polymer).In certain embodiments, material can comprise copper, steel, stainless steel, galvanized steel, titanium, tungsten, high nickel content alloy, carbon, polymer, silicon, cover at least a in silicon metal, aluminium, carbon, quartz, pottery and glass and pottery and/or the vitreous coating material.In certain embodiments, can also be according to selecting to send into the material of fluid line 104 with the chemical compatibility of reagent.In certain embodiments, can also be according to selecting the material of effluent pipeline 106 with the chemical compatibility of disposing effluent.
As mentioned above, the part of effluent pipeline 106 (being second side of heat exchanger 103) heat is coupled to a part (being first side of heat exchanger 103) of sending into fluid line 104.Perhaps, effluent pipeline 106 can be coiled in around the fluid line 104 or be coupled to any suitable configuration heat sends into fluid line 104, so that the effluent that flows in effluent pipeline 106 flows in the fluid line 104 and flows to maximum heat transfer between the liquid reagent of treatment chamber 102 (for example, effluent pipeline 106 and send into the configuration essence formation heat exchanger of fluid line 104) with sending into.Optional or additional, the part of effluent pipeline 106 can heat be coupled to reagent source 108, to help the reagent that transmits heat in the fluid line 104.
During operation, at first, liquid reagent can flow into from reagent source 108 and send into fluid line 104, and is heated to preferred temperature by heater 120.Reagent then flows in the treatment chamber 102 and by nozzle 118 and arrives substrate 114.Reagent with from substrate 114 or be arranged at the material reaction on the substrate 114 and/or become pollutant, thereby form effluent.Effluent is discharged in the bases of chamber 102 by effluent pipeline 106.Effluent pipeline 106 will be from the heat transfer of the effluent liquid reagent in the fluid line 104 by heat exchanger 103.The liquid reagent that heats up owing to the heat that reclaims from effluent only needed to obtain less energy from heater 120 before entering treatment chamber 102.Therefore, the heat that reclaims from effluent can reduce treatment system 100 energy consumption of (some embodiment comprise heater 120).
Perhaps, outside waste heat source can replace above-mentioned inner loop used heat from the disposal effluent that used heat is provided.Adopt the exemplary process system of outside waste heat source will illustrate also shown in Figure 3 below.
Fig. 3 shows the base plate processing system according to some embodiments of the present invention.Semiconductor processing system comprises that semiconductor processing system 300 and used heat recaptures (recapture) system 301, and described used heat recovery systems 301 is configured to the reagent that preheating is used for system 300.Semiconductor processing system 300 essence are similar to treatment system 100.But unlike effluent pipeline 106 feed systems 100 used heat, the effluent pipeline 107 that intermediate storage part 105 is couple to effluent system 110 does not provide used heat to sending into fluid line 104 in the system 300.
Used heat recovery systems 301 comprises heat pump 124, and what this heat pump 124 was coupled to waste heat source 123 by used heat conduit 125 and was couple to system 300 sends into fluid line 104 (or other expects heated fluid line).Used heat recovery systems 301 is used to the reagent that used heat from waste heat source 123 comes pre-heated flow to cross to send into fluid line 104.
Waste heat source 123 can be any suitable waste heat source from liquid state or gaseous state processing procedure or other wafer factory (fab) equipment, for example come from heating bath liquid chemicals, come self-configuring be used for the liquid coolant of treatment chamber of gaseous state processing procedure or gaseous emissions, processing pump storehouse, other chamber equipment (as plasma source, heater, hot water emission's device etc.), compress air system, air separation compressor, air compressor, from the gaseous emissions of reducer or liquid coolant, from the hot-air of electronics and/or plant equipment or liquid coolant etc.Heat pump 124 is arranged to be linked in sequence with used heat conduit 125.Used heat conduit 125 also is couple to exhaust system 129 with waste heat source 123.Exhaust system 129 for example can be attenuation systems or other waste treatment system that is fit to.Used heat conduit 125 can be used for the gaseous effluent from waste heat source 123 dischargings is transported to exhaust system 129 usually.
In certain embodiments, heat pump 124 comprises compressor 126 and heat pump heat exchanger 128.Although be illustrated as individual components, in certain embodiments, heat pump 124 also comprises (as integrating) heater 120 or has different heaters.The operation of heat pump can be similar to the geothermal heat pump (liquid to water geothermic heat pump) of liquid to water.Perhaps, heater if desired, then heat pump 124 optionally is coupled to heater (for example heater 120).
In certain embodiments, compressor 126 can be arranged to and waste heat source 123 and heat pump heat exchanger 128 between used heat conduit 125 be linked in sequence.Compressor 126 can be any suitable device that is used for the compressed gaseous effluent.The pressure of increase gaseous effluent can improve the effluent temperature in the used heat conduit 125, and helps to improve the heat transfer in the heat pump heat exchanger 128.
Heat pump heat exchanger 128 can be any suitable heat exchanger that is used to exchange waste effluent and sends into the heat between the fluid, and can have any appropriate size according to actual space available.Heat pump heat exchanger 128 is arranged to be linked in sequence with the fluid line 104 of sending into of heater 120 (if having) upstream, to enter treatment chamber 102 (or using other positions that add thermal agent) at the reagent from reagent source 108 before, this reagent of preheating.Heat pump heat exchanger 128 generally comprises first side and second side, and its sane underground heat couples, and is used for conducting heat between the two.First side of heat pump heat exchanger 128 is coupled to and sends into fluid line 104 and is linked in sequence, so that the reagent of reagent source 108 supplies is flowed through wherein.Second side of heat pump heat exchanger 128 is coupled to used heat conduit 125 and is linked in sequence, so that the effluent of waste heat source 123 is flowed through wherein.
During operation, this reagent of sending into fluid line 104 of flowing through can be in heat pump heat exchanger 128 heat transfer by the heat of the waste effluent of the used heat conduit 125 of flowing through be heated.Waste effluent was compressed by compressor 126 before the heat pump heat exchanger 128 of flowing through, and the temperature that can promote by waste effluent improves the heat transfer that produces.
Heat stored in the waste effluent from waste heat source 123 is transferred to the reagent of supplying with treatment chamber 102 by heat pump heat exchanger 128.For example, in certain embodiments, from the gaseous effluent of waste heat source 123 discharging can be in about 30 ℃ to about 90 ℃ temperature.Therefore stored heat can be used for the reagent of pre-heat supply treatment chamber 102 in the gaseous effluent, thereby reduce or exempt heater 120 liquid reagent is heated to the required power of preferred temperature.In certain embodiments, utilize from the heat of used heat conduit 125 transmission and come pre-thermal agent, can reduce the energy consumption of heater 120.In certain embodiments, can exempt use heater 120 fully from the heat of used heat conduit 125 transmission further heats.
At least in heat pump heat exchanger 128, send into the suitable material that fluid line 104 and used heat conduit 125 can comprise any processing procedure compatibility, described material helps to conduct heat steadily between the fluid of used heat conduit 125 and fluid line.In certain embodiments, material tool high heat conductance (as more than or equal to about 300W/mK).In certain embodiments, thermal conductivity can be lower, for example needs to use the situation of polymer owing to material compatibility.In certain embodiments, material can comprise that the alloy, carbon, polymer of copper, steel, stainless steel, galvanized steel, titanium, tungsten, high nickel content are (as polymethylpentene (PMP, for example TPX
), polyphenylene sulfide (PPS), polytetrafluoroethylene (PTFE) and other fluoridize or non-limiting example such as crosslinked fluorinated polymer), silicon, cover at least a in silicon metal, aluminium, carbon (comprising crystallization, amorphous and glassy graphite), quartz, pottery, glass, compound and pottery and/or the vitreous coating material.In certain embodiments, can also be according to selecting to send into the material of fluid line 104 and/or used heat conduit 125 with the chemical compatibility of each gravity flow through-flow body.
As mentioned above, the part of used heat conduit 125 (as second side of heat pump heat exchanger 128) heat is coupled to a part (as first side of heat pump heat exchanger 128) of sending into fluid line 104.Used heat conduit 125 can coil around fluid line 104 or be coupled to any suitable configuration heat sends into fluid line 104, with strengthen or effluent that maximization is flowed in used heat conduit 125 with sending in the fluid line 104 mobile and flow to heat transfer between the reagent of treatment chamber 102.Optional or additional, the part of used heat conduit 125 can heat be coupled to reagent source 108, to help the reagent that transfers heat in the fluid line 104.
In certain embodiments, as shown in Figure 3A, heat pump 124 can adopt the inner conduit of heat pump 124 to include the closed circuit system of heat-transfer fluid.The part of inner conduit forms the part of the first heat pump heat exchanger 128A with used heat conduit 125.Another part of inner conduit forms has the part of the second heat pump heat exchanger 128B that sends into fluid line 104.During operation, heat pump 124 will arrive heat transfer fluid from the heat transfer of waste heat source by the first heat pump heat exchanger 128A, with the heat of evaporation transfer fluid.The heat transfer fluid of evaporation is followed 126 compressions of compressed machine and is sucked up to the second heat pump heat exchanger 128B, with will be from the heat transfer of heat transfer fluid to the fluid that flows in sending into fluid line 104.Heat pump configuration among Fig. 3 A can be used for any heat pump embodiment described herein.
Get back to treatment chamber 102, effluent pipeline 107 can be coupled to the substrate of treatment chamber 102.The substrate of treatment chamber 102 does not need to be level as shown in Figure 1, and can tilt usually, flows towards single position so that dispose effluent, for example is arranged in the substrate and the exhaust apparatus that links to each other with effluent pipeline 107.The effluent of treatment chamber 102 for example flows through effluent pipeline 107 and arrives and is used to handle and/or dispose the effluent system 110 of effluent.In certain embodiments, dispose effluent and for example can be collected in groove or intermediate storage part 105 (it is arranged in the effluent pipeline 107).In certain embodiments, disposing effluent can be from 105 suction of middle storage part and by heat exchanger (heat pump heat exchanger 128 or different heat exchangers), send into reagent in the fluid line 104 with further preheating, this illustrates below with reference to Fig. 4.
Treatment system 300 also comprises the controller 122 that is coupled to treatment chamber 102, in order to control one or more other parts of its running and/or control processing system 300 and/or used heat recovery systems 301.Controller 122 generally comprises CPU (CPU), internal memory and support circuit (not shown).Controller 122 directly or utilize the separate controller (not shown) relevant with each chamber part to come control and treatment chamber 102 and various chamber part.In certain embodiments, can use other control assembly, for example not contain the industrial control unit (ICU) of CPU.
During operation, reagent can flow into from reagent source 108 and send into fluid line 104 and reach preferred temperature through heat pump 124 heating.From compressed machine 126 pressurizations of the effluent of waste heat source 123 dischargings, therefore improve effluent temperature.The effluent of pressurization flows through second side of heat pump heat exchanger 128 and transfers heat to the reagent of sending in the fluid line 104.The reagent of preheating then can flow into treatment chamber 102 and arrive substrate 114 by nozzle 118.Reagent with from substrate 114 or be arranged at the material reaction on the substrate 114 and/or become pollutant, thereby form effluent.Effluent is discharged to effluent system 110 by effluent pipeline 106 in the bases of chamber 102.Optionally, if reagent needs extra heating, then can before entering treatment chamber 102, use heater 120 further pre-thermal agents.
Treatment system shown in Fig. 3 also has alternate embodiment.For example, system 300 is exemplary, and can dispose the processing procedure that is used for beyond the liquid processing procedure, for example gaseous state processing procedure (wherein reagent can be gaseous reagent).In addition, the configuration of used heat recovery systems 301 is exemplary, and can be configured to other suitable layout.For example, used heat recovery systems 301 need not dispose and dispose gaseous effluent.For example, used heat recovery systems 301 can be the closed circuit system that is used to remove heat, for example the closed circuit system of freezing unit (refrigeration unit) or other employing heat pump.For example, the thermal treatment side of closed circuit system can be coupled to and send into fluid line 104.
In addition, the embodiment of said system 100,300 can be combined into a treatment system.Example system makes up and will illustrate below, and shown in Fig. 4-5.
For example, Fig. 4 shows the semiconductor processing system according to some embodiments of the present invention.For example, semiconductor processing system 400 can comprise treatment system 100 and treatment system 450.Semiconductor processing system 400 can be the exemplary part of production line, and this production line can also comprise a plurality of interconnection treatment systems, and is not limited to described two systems.As shown in Figure 4, second treatment system 450 can be coupled to treatment system 100 sending into fluid line 104 places, to enter the preheating of assisting reagent before the treatment chamber 102 at reagent.Similar above-mentioned notion, treatment system 400 can help to retrieve the used heat from two treatment systems 100,450.
Be transferred to the reagent of supplying with treatment chamber 102 by heat pump 454 from heat stored in the gaseous effluent of treatment chamber 452 or the liquid coolant.For example, in certain embodiments, can be in temperature between about 30 ℃ to about 300 ℃ from the gaseous effluent of treatment chamber 452 dischargings or liquid coolant after handling.The gaseous effluent of discharging or liquid coolant can improve temperature after pressurizeing through compressor 456.Therefore stored heat can be used for the reagent of pre-heat supply treatment chamber 102 in the gaseous effluent of pressurization, thereby reduces the power that the liquid reagent place of heater 120 heating needs.In certain embodiments, utilize from the heat of gaseous effluent pipeline 460 transmission and come the preheating liquid reagent, can reduce the energy consumption of heater 120.When with the thermal that reclaims by heat exchanger 103, from gaseous effluent pipeline 460 and 106 transmission of effluent pipeline can further reduce the energy consumption of heater 120 in conjunction with heat, and can not need use heater 120.
As mentioned above, the part of effluent pipeline 460 (as second side of heat exchanger 458) heat is coupled to a part (as first side of heat pump heat exchanger 458) of sending into fluid line 104.For example, effluent pipeline 460 can coil around fluid line 104 or be coupled to any suitable configuration heat sends into fluid line 104 so that the effluent that in effluent pipeline 460, flows with sending in the fluid line 104 mobile and flow to maximum heat transfer between the reagent of treatment chamber 102.Optional or additional, the part of effluent pipeline 460 can heat be coupled to reagent source 108, to help the reagent that transfers heat in the fluid line 104.
During operation, reagent can flow into this from reagent source 108 and send into fluid line 104.In certain embodiments, reagent at first heater via 120 heating reach preferred temperature.Reagent then flows in the treatment chamber 102 and by nozzle 118 and arrives substrate 114.Reagent with from substrate 114 or be arranged at the material reaction on the substrate 114 and/or become pollutant, thereby form effluent (as: first effluent).Effluent is discharged in the bases of chamber 102 by effluent pipeline 106.Effluent pipeline 106 will be from the heat transfer of the effluent reagent in the fluid line 104 by heat exchanger 103.Similarly, second effluent is discharged chamber 452 and is arrived heat pump 454 by path by effluent pipeline 460.The liquid reagent of 456 pressurizations of the compressed machine of second effluent, effluent pipeline 460 heat transfer by second effluent of heat pump heat exchanger 458 self-pressurizations in the future in the fluid line 104.The reagent that heats up owing to the heat that reclaims from first and second effluent only need obtain less energy from heater 120 before entering treatment chamber 102.Therefore, the heat that reclaims from effluent can reduce the energy consumption of treatment system 400.
Fig. 5 shows the semiconductor processing system according to some embodiments of the present invention.For example, semiconductor processing system 500 can be similar to treatment system 100 and treatment system 450, except the used heat from two treatment systems all passes through the shared heat-exchange apparatus 502.Be similar to treatment system 400, semiconductor processing system 500 can be the exemplary part of production line, and this production line can also comprise a plurality of interconnection treatment systems, and is not limited to described two systems.As shown in Figure 5, heat-exchange apparatus 502 can couple treatment system 100,450 sending into fluid line 104 places, to enter at reagent before the treatment chamber 102, assists this reagent of preheating.Similar above-mentioned notion, treatment system 400 can help to retrieve the used heat from two treatment systems 100,450.
Heat-exchange apparatus 502 is shown specifically in Fig. 5 A.Heat-exchange apparatus 502 is included in basic all parts of the heat pump 454 of heat exchanger 103 in the single enclosed area and said system 400.Specifically, heat-exchange apparatus 502 comprises first side that comprises a part of sending into fluid line 104 and second side that comprises a plurality of heat exchange catheters (first heat exchange catheter 558 as shown in Figure 5 and second heat exchange catheter 503).A plurality of heat exchange catheters can be considered as other heat exchanger of branch, and it has consistent side feed flow attitude reagent separately flows through wherein, or is considered as single heat exchanger, and the one side has a plurality of conduits and flows through wherein for waste heat fluid.Compressor is arranged at (compressor 556 is shown as to be coupled to first heat exchange catheter 558 and is linked in sequence) at least one heat exchange catheter.As above-mentioned heat pump and heat exchanger, the sane underground heat of first side of heat-exchange apparatus 502 is coupled to all and is configured in heat exchange catheter on second side, to help as far as possible heat being transferred to first side (reagent) effectively from second side (waste effluent).
During operation, treatment system 500 is similar to the running of above-mentioned treatment system 400 substantially.But as mentioned above, along the common sparing of sending into fluid line 104 and heat is coupled to the reagent of sending into from reagent source 108, the common sparing of wherein sending into fluid line 104 forms first side of heat-exchange apparatus 502 from the used heat of the effluent of each system 100,450.Therefore, flow through each heat exchange catheter 503,558, the used heat from two systems 100,450 all can be transferred to and send into reagent by making effluent.Perhaps, according to the work period (duty cycle) of each treatment system, can by be used alternatingly each heat exchange catheter 503,558 with the used heat heat transfer to sending into reagent.Can comply with the specified any suitable scheme of work period of each treatment system 100,450, used heat is transferred to send into reagent.For example, if the work period of treatment system 450 is the twice of system 100, then use heat exchange catheter 558 preheatings to be about the twice of heat exchange catheter 503 from the number of times of sending into reagent of reagent source 108.In addition, any operation scheme of said system 500 can use with system 400.
Roughly be the embodiment that has described above-mentioned treatment system under the background of pre-thermal agent before entering treatment chamber.But miscellaneous equipment also can be benefited from the present invention.For example, ion-exchanger (as being used to produce ultra-pure water (as liquid reagent)) can be benefited from the present invention.For example, make before recycled water flows through ion-exchanger, the said equipment can be used to come the preheating recycled water from the heat of disposing effluent.For example, by removing the ionic species of collecting in the interchanger, recycled water can be used for cleaning or regenerant ions interchanger.In certain embodiments, the said equipment can be used for recapturing used heat driving halogen polymer (as incorporating the polymer of halogen atom with attached its main chain into) subatmospheric acid distillation/purification system and/or resin-based (resin based) inspissator, is used for processing procedure and is used as reagent or cleaning solution to reclaim spent acid (as hydrofluoric acid (HF), hydrochloric acid (HCl), nitric acid (HNO3) or other useless chemicals) and it is sent back to.
The method of treatment substrate will be described below.Method of the present invention can be used for above-mentioned treatment system of the present invention, but other treatment system also can be benefited from method of the present invention.
Fig. 6 is used to retrieve the flow chart of method 600 from the heat of disposing effluent according to some embodiments of the present invention.To be described below method 600 with reference to the system 100 shown in figure 2,4 and 5.Method 600 generally starts from step 602, by providing the treatment chamber that is coupled to heat exchanger, for example above-mentioned treatment chamber 102 and heat exchanger 103.As mentioned above, heat exchanger 103 have be used to make liquid reagent flow to treatment chamber 102 first side (as with send into fluid line 104 and be linked in sequence) and be used to second side (as being linked in sequence) that effluent is flowed out from treatment chamber 102 with effluent pipeline 106.Effluent pipeline 106 can adopt any suitable configuration to come heat to be coupled to fluid line 104, before disposing in effluent system 110, makes the heat maximization of reclaiming from effluent.In certain embodiments, effluent can flow into intermediate storage part 105, flows to second side of heat exchanger 103 then from middle storage part 105.
In step 604, come the preheating liquid reagent by heat exchanger 103.For example, by diffusing into the material of effluent pipeline 106, can retrieve heat from effluent.This material can comprise as the above-mentioned any material with high heat conductance.From effluent pipeline 106, heat can diffuse into fluid line 104 and finally flow to the part reagent that flow or that leave standstill that is coupled to effluent pipeline 106 along the heat of fluid line 104.
Liquid reagent for example can comprise water, ultra-pure water, deionized water etc., and it for example can be used for rinse substrate 114 during wet chemical etch or wet chemistry cleaning processing procedure.In addition, liquid reagent needs any suitable chemicals and/or the chemical solution of heating before can be included in and use in the treatment chamber 102.For example, chemicals that is fit to and/or chemical solution can comprise and be used for that wet type divests or the chemicals of wet etching processing procedure, for example hydrochloric acid (HCl), hydrofluoric acid (HF), ammonium hydroxide (NH
4OH), hydrogen peroxide (H
2O
2), phosphoric acid (H
3PO
4) or sulfuric acid (H
2SO
4) etc.
Though above-mentioned example relates to wet etching, wet type divests and wet chemistry cleaning processing procedure, it may be used on adopting any other silicon of described liquid reagent to handle.
The temperature of liquid reagent can be about room temperature or between about 15 ℃ to about 180 ℃ before conducting heat.The heat that reclaims from effluent can be preheating to liquid reagent the temperature between about 30 ℃ to about 180 ℃.
In step 606, utilize for example heater 120, liquid reagent is preheating to preferred temperature.For example, heater 120 can be heated to reagent up to about 180 ℃ or between about 35 ℃ to about 180 ℃.In case liquid reagent is heated to preferred temperature, flow into treatment chamber 102 by the liquid reagent that makes heating, promptly roughly finish as the method 600.
Perhaps, Fig. 7 is used to retrieve the flow chart of method 700 from the heat of disposing effluent according to some embodiments of the present invention.To come illustration method 700 with reference to figure 2, but method 700 can be used also with the system 400 shown in Fig. 4-5 and 500.In step 702, make liquid reagent flow through heat exchanger 103 first side (as with send into fluid line 104 and be linked in sequence), with the preheating liquid reagent.In step 704,, the liquid reagent of preheating is heated to preferred temperature by heater 120.In step 706, make the liquid reagent that heated flow into treatment chamber 102, the liquid reagent that has wherein heated can be used for liquid processing procedure, for example to the wet chemical etch of substrate 114.The liquid reagent that has heated becomes pollutant and/or reacts to form effluent with substrate 114.Effluent has kept from the portion of hot at least in the liquid reagent of heating.In step 708, make effluent flow through second side (as being linked in sequence) of heat exchanger 103, with the liquid reagent of first side (as shown in step 710) of pre-heated flow over-heat-exchanger 103 with effluent pipeline 106 from treatment chamber 102.In certain embodiments, the processing procedure effluent can flow into intermediate storage part 105, flows to second side of heat exchanger 103 then from middle storage part 105.
Fig. 8 shows and is used to retrieve the flow chart of method 800 from the heat of disposing effluent according to some embodiments of the present invention.Method 800 can be in Fig. 3-5 any use, and describe with reference to figure 4-5 haply.Method 800 generally starts from step 802, and it provides waste heat source, for example above-mentioned treatment chamber 452 with heat pump 454.As mentioned above, heat pump 454 can comprise compressor 456 and heat pump heat exchanger 458.Compressor 456 is used for pressurizeing from the effluent of treatment chamber 452 dischargings or the heat-transfer fluid that flows the inner conduit of heat pump 454.Effluent or heat-transfer fluid for discharging pressurize, and will improve the temperature of effluent or heat-transfer fluid according to the perfect gas law behavior.Heat pump heat exchanger 458 have first side that is used to make liquid reagent flow to second treatment chamber (as treatment chamber 102) (as with send into fluid line 104 and be linked in sequence) and second side (as being linked in sequence) that is used to make the effluent of pressurization to flow out with effluent pipeline 460 from treatment chamber 452.Effluent pipeline 460 can adopt any suitable configuration to come heat to be coupled to fluid line 104, before disposing in effluent system 462, makes the heat maximization of reclaiming from effluent.Perhaps, heat pump 454 can be equipped with the internal heat transfer loop, and described internal heat transfer loop is used for the heat-transfer fluid that circulates between the second portion (being used for heat is transferred to from heat-transfer fluid the reagent of fluid line) of first's (being used for heat is transferred to heat-transfer fluid from waste heat source) at heat pump and heat pump.
In step 804, make first effluent discharge waste heat source (as treatment chamber 452).First effluent can be a gaseous form, and for example is the process gas or the gaseous by-product of manufacture of semiconductor (for example etch process, deposition manufacture process or produce any suitable processing procedure of the effluent of recyclable used heat).Optional or additional, can obtain used heat, for example from pressurized gas system, air separation compressor, pump, electronics and/or plant equipment, reducer etc. from other source of treatment system.Perhaps, used heat can obtain by liquid coolant.
Optionally, in step 806, first effluent can pressurize.For example, compressor 456 can compress first effluent, improves the temperature of first effluent thus.Improve temperature by pressurization and can help to improve heat transfer between first effluent and the reagent to be heated.Perhaps, first effluent can pass through heat pump by path, and transmitting heat to heat-transfer fluid, it is then through pressurization and be drawn through heat pump and arrive the part of the reagent that is used for the heating fluid pipeline.
In step 808, by being transferred to reagent from the first-class used heat that goes out thing, thermal agent in advance.For example, reagent can be statically placed in or flow through the part that is coupled to treatment chamber (as treatment chamber 102) of sending into fluid line 104 (as first side of heat pump heat exchanger 458 or be coupled to the part of heat pump 454).By the used heat of transmission from the part that flows through or be statically placed in discharge pipe line 460 of first effluent (as second side of heat pump heat exchanger 458 or be coupled to the part of heat pump 454), thermal agent in advance.
Reagent for example comprises water, ultra-pure water, deionized water etc., and it for example can be used for rinse substrate 114 during wet chemical etch or wet chemistry cleaning processing procedure.In addition, liquid reagent needs any suitable chemicals and/or the chemical solution of heating before can be included in and use in the treatment chamber 102.For example, chemicals that is fit to and/or chemical solution can comprise and be used for that wet type divests or acid, alkali and/or the solvent of wet etching processing procedure or wet-cleaning processing procedure, for example hydrochloric acid (HCl), hydrofluoric acid (HF), ammonium hydroxide (NH
4OH), hydrogen peroxide (H
2O
2), phosphoric acid (H
3PO
4) or sulfuric acid (H
2SO
4) etc.Though above-mentioned example relates to wet etching, wet type divests and wet chemistry cleaning processing procedure, the present invention may be used on adopting other processing substrate of described liquid state or gaseous reagent.
In certain embodiments, for instance, the temperature of reagent can be about room temperature or between about 15 ℃ to about 30 ℃ before conducting heat.The used heat that reclaims from effluent reagent can be preheating to about 30 ℃ to about 180 ℃ temperature.
In certain embodiments, shown in step 814, then make the reagent that has heated flow into treatment chamber for use.In case the reagent of heating is provided to treatment chamber 102 or some other targets, and method 800 roughly finishes.But method 800 also has additional embodiment.For example, if come the used heat of first effluent of self-pressurization to be not enough to reagent is preheating to treatment temperature, then can use heater 120 further reagent to be preheating to the expectation treatment temperature.
In addition, used heat is recyclable from other source, and can combine pre-thermal agent with the used heat that reclaims from first effluent.For example, after treatment chamber 102 was handled, reagent changed into second effluent, and described second effluent is from treatment chamber 102 dischargings.For example, second effluent can comprise reagent and byproduct material, for example from the material of pending substrate.Second effluent that part is made up of heating reagent has recoverable waster heat.
In certain embodiments, as with dotted line as shown in the step 810, can make second effluent discharge treatment chamber 102.Second effluent can have recoverable waster heat and come preheating reagent to be used in treatment chamber 102.
Thus, in step 812, by being transferred to reagent from the used heat of second effluent, further preheating is used for the reagent of treatment chamber 102.In certain embodiments, by passing through heat pump, with pre-thermal agent from the used heat transmission of second effluent.In certain embodiments, by passing through heat exchanger, with pre-thermal agent from the used heat transmission of second effluent.In certain embodiments, reagent can be statically placed in or flow through the part that is coupled to treatment chamber (as treatment chamber 102) (as first side of heat exchanger 103) of sending into fluid line 104.By the used heat of transmission from the part that flows through or be statically placed in discharge pipe line 160 (as second side of heat exchanger 103) of second effluent, thermal agent in advance.
Do not need recirculation to heat to enter the reagent of same treatment chamber (as treatment chamber 102) (second effluent produces thus) from the used heat of second effluent.For example, can be used for preheating from the used heat of second effluent and be used for the reagent of different disposal chamber (similar Fig. 4-5).
Therefore, at this method and apparatus that is used to retrieve to dispose certainly the heat of effluent is disclosed.Method and apparatus of the present invention is by being used to come preheating to enter the reagent of treatment system from the heat of disposing effluent, and favourable help reduces the energy consumption of semiconductor or other treatment system.The minimizing of disposing the heat in the effluent also more helps disposing the subsequent treatment of effluent, for example weakens.
Though embodiments of the invention as previously mentioned, under the situation that does not break away from base region of the present invention, can obtain other and further embodiment.
Claims (15)
1. base plate processing system, it comprises:
Treatment chamber, it is disposed for liquid processing procedure;
First heat exchanger, it has first side and second side, described first heat exchanger arrangement becomes transmission heat between described first side and described second side, wherein, described first side is configured to make liquid reagent to flow through wherein and flow in the described treatment chamber, and wherein, described second side is configured to make from the effluent of described treatment chamber and flows through wherein; And
Heater, it is arranged to be linked in sequence with described first side of described first heat exchanger, before entering described treatment chamber at described liquid reagent, heats described liquid reagent.
2. system according to claim 1, it also comprises:
The intermediate storage part, it is arranged between described treatment chamber and described first heat exchanger, makes described effluent by described first heat exchanger in order to collect from the described effluent of described treatment chamber and to aspirate described effluent.
3. system according to claim 1, it also comprises:
First waste fluid of used heat is provided in it is used to provide first waste heat source; And
Heat pump, it is coupled in described first waste heat source and sends between the fluid line, the described fluid line of sending into flows in the described treatment chamber described liquid reagent, described heat pump be configured to from the heat transfer of described first waste heat source to the described described liquid reagent of sending in the fluid line.
4. system according to claim 3, it also comprises:
Second waste heat source, it offers described heat pump in order to second waste fluid that stores used heat in inciting somebody to action, and is transferred to the described described liquid reagent of sending in the fluid line with the used heat with interior storage.
5. system according to claim 1, it also comprises:
First waste heat source, it is in order to first waste fluid of used heat to be provided in providing; And
Heat pump, it has the compressor and second heat exchanger, wherein, first side that described compressor is coupled to described first waste heat source and described second heat exchanger is linked in sequence, and wherein, second side of described second heat exchanger is configured to make described liquid reagent to flow through wherein and flow in the described treatment chamber.
6. base plate processing system, it comprises:
First waste fluid of used heat is provided in it is used to provide waste heat source;
First treatment chamber, it has reagent source, and described reagent source and described first treatment chamber couple and are configured to reagent is provided to the internal capacity of described first treatment chamber; And
Heat pump, it is coupled in described waste heat source and sends between the reagent pipeline, the described reagent pipeline of sending into flows in the described internal capacity of described treatment chamber described reagent, described heat pump be configured to from the heat transfer of described waste heat source to the described described reagent of sending in the reagent pipeline.
7. system according to claim 6 also comprises:
Heater, it is arranged to be linked in sequence with described heat pump, to enter at described reagent before described first treatment chamber, further heats described reagent.
8. according to claim 3 or 6 described systems, wherein, described waste heat source comprises following one or multinomial: be disposed for the treatment chamber, compress air system, air separation compressor, air compressor of liquid state or gaseous state processing procedure, from the liquid coolant of reducer or gaseous emissions or from the liquid coolant or the hot-air of electronic equipment or plant equipment.
9. system according to claim 6, wherein, described first treatment chamber is disposed for liquid processing procedure, and wherein, described waste heat source comprises second treatment chamber that is disposed for the gaseous state processing procedure, and described second treatment chamber provides described first waste fluid to be used as gaseous emissions from described second treatment chamber.
10. system according to claim 6 also comprises:
Heat exchanger with first side and second side, described heat exchanger arrangement becomes transmission heat between described first side and described second side, wherein, described first side of described heat exchanger is configured to make described reagent to flow through wherein and flow in described first treatment chamber, and wherein, described second side of described heat exchanger is configured to make second waste fluid from described first treatment chamber discharge to flow through wherein.
11. system according to claim 10 also comprises:
Heater, it is arranged to be linked in sequence with described first side of described heat pump and described heat exchanger, to enter at described reagent before described first treatment chamber, heats described reagent.
12. the method for a treatment substrate, it comprises the steps:
Make flow through first side of heat exchanger of liquid reagent, with the described liquid reagent of preheating;
Utilize heater, being heated to preferred temperature through the described liquid reagent of preheating;
Make described liquid reagent flow to the treatment chamber that is disposed for liquid processing procedure through heating; And
Make processing procedure flow out second side of logistics, with the described liquid reagent of pre-heated flow through described first side of described heat exchanger through described heat exchanger from described treatment chamber.
13. the method for a treatment substrate, it comprises the steps:
Reagent is flowed through be coupled to the heat pump of waste heat source, with by heating described reagent to described reagent from the heat transfer of described waste heat source; And
Make described reagent flow to treatment chamber, to handle described substrate through heating.
14. method according to claim 13, wherein, described waste heat source comprises following one or multinomial: from the liquid state of same or the discharging of second treatment chamber or gaseous effluent, compress air system, air separation compressor, air compressor, from the liquid coolant of reducer or gaseous emissions or from the liquid coolant or the hot-air of electronic equipment or plant equipment.
15. method according to claim 13 also comprises by following one or both the described reagent through heating will be heated to preferred temperature:
Utilization is arranged on the heater between described heat pump and the described treatment chamber; Or
Make described reagent flow through first side of heat exchanger, described heat exchanger is arranged to be linked in sequence with described heat pump, and make from flow through second side of described heat exchanger of the effluent of described first treatment chamber discharging, with the flow through described reagent of described first side of described heat exchanger of heating.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10594908P | 2008-10-16 | 2008-10-16 | |
| US61/105,949 | 2008-10-16 | ||
| US22981209P | 2009-07-30 | 2009-07-30 | |
| US61/229,812 | 2009-07-30 | ||
| PCT/US2009/060857 WO2010045468A2 (en) | 2008-10-16 | 2009-10-15 | Methods and apparatus for recovering heat from processing systems |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102187429A true CN102187429A (en) | 2011-09-14 |
Family
ID=42107241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801413831A Pending CN102187429A (en) | 2008-10-16 | 2009-10-15 | Methods and apparatus for recovering heat from processing systems |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20100096110A1 (en) |
| JP (1) | JP2012506155A (en) |
| KR (1) | KR20110086052A (en) |
| CN (1) | CN102187429A (en) |
| TW (1) | TW201033570A (en) |
| WO (1) | WO2010045468A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108430223A (en) * | 2015-12-23 | 2018-08-21 | 特斯拉公司 | Furnace system based on recuperation of heat temperature gradient |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120091099A1 (en) * | 2010-10-18 | 2012-04-19 | Applied Materials, Inc. | Methods and apparatus for recovery and reuse of reagents |
| JP5766453B2 (en) * | 2011-01-31 | 2015-08-19 | 三菱重工業株式会社 | Hot water cleaning system and hot water cleaning method |
| KR101419440B1 (en) * | 2013-01-22 | 2014-07-14 | 주식회사 디엠에스 | System for treating substrate and evaporating unit of the system for chemical recovery |
| WO2016182648A1 (en) * | 2015-05-08 | 2016-11-17 | Applied Materials, Inc. | Method for controlling a processing system |
| KR101966648B1 (en) * | 2016-09-05 | 2019-08-14 | 주식회사 디엠에스 | Apparatus for cleaning a substrate |
| KR102239362B1 (en) * | 2019-07-01 | 2021-04-09 | 세메스 주식회사 | Substrate treatment apparatus |
| KR20220049476A (en) | 2020-10-14 | 2022-04-21 | 한국과학기술원 | Charge Trapping Non-volatile Organic Memory Device |
| US11984513B2 (en) | 2020-10-14 | 2024-05-14 | Korea Advanced Institute Of Science And Technology | Charge trapping non-volatile organic memory device |
| JP7504940B2 (en) | 2022-03-09 | 2024-06-24 | 芝浦メカトロニクス株式会社 | Substrate Processing Equipment |
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| DE4212336C1 (en) * | 1992-03-06 | 1993-09-02 | Gea Luftkuehler Gmbh, 4630 Bochum, De | |
| JP4428818B2 (en) * | 2000-06-05 | 2010-03-10 | 株式会社日本触媒 | Waste gas treatment equipment |
| JP2002081752A (en) * | 2000-09-01 | 2002-03-22 | Hitachi Ltd | Heat recovery type heat storage apparatus |
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2009
- 2009-10-15 WO PCT/US2009/060857 patent/WO2010045468A2/en active Application Filing
- 2009-10-15 KR KR1020117011123A patent/KR20110086052A/en not_active Application Discontinuation
- 2009-10-15 US US12/579,472 patent/US20100096110A1/en not_active Abandoned
- 2009-10-15 CN CN2009801413831A patent/CN102187429A/en active Pending
- 2009-10-15 JP JP2011532253A patent/JP2012506155A/en not_active Withdrawn
- 2009-10-16 TW TW098135139A patent/TW201033570A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050082278A1 (en) * | 2002-03-15 | 2005-04-21 | Boris Atlas | Semiconductor processing temperature control |
| CN1905950A (en) * | 2004-01-05 | 2007-01-31 | 布卢薄膜有限责任公司 | High frequency spraying device |
| US20080246930A1 (en) * | 2005-03-18 | 2008-10-09 | Canon Kabushiki Kaisha | Exposure Apparatus and Device Manufacturing Method |
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| CN108430223A (en) * | 2015-12-23 | 2018-08-21 | 特斯拉公司 | Furnace system based on recuperation of heat temperature gradient |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010045468A2 (en) | 2010-04-22 |
| KR20110086052A (en) | 2011-07-27 |
| TW201033570A (en) | 2010-09-16 |
| WO2010045468A3 (en) | 2010-07-15 |
| US20100096110A1 (en) | 2010-04-22 |
| JP2012506155A (en) | 2012-03-08 |
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Application publication date: 20110914 |