KR20180135173A - Fluid supply module using heat exchange and substrate cleaning system using the same - Google Patents

Abstract

According to the present invention, a fluid supply module using heat exchange comprises: a fluid heating unit supplied with a first fluid to heat and discharge the first fluid; a fluid supply unit supplying a second fluid; and a heat exchange unit connected to the fluid heating unit and the fluid supply unit to be supplied with the first fluid and the second fluid. The heat exchange unit discharges a liquid or a gas formed by heating the second fluid through heat exchange between the first fluid and the second fluid. According to at least one embodiment of the present invention, without additional electricity to generate steam, steam to clean a substrate can be generated by heat exchanging latent heat of the heated fluid by using heat exchange.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a fluid supply module using heat exchange and a substrate cleaning system including the fluid supply module,

The present invention relates to a fluid supply module using heat exchange and a substrate cleaning system including the fluid supply module. More particularly, the present invention relates to a fluid supply module using heat exchange capable of generating a heated fluid for substrate cleaning using heat exchange, To a substrate cleaning system comprising the same.

In order to manufacture a semiconductor device, a multilayer thin film is formed on a semiconductor substrate or a display substrate, and etching and cleaning processes are generally adopted for thin film formation. In the etching and cleaning processes, a thin film such as a nitride film deposited on the back surface of the substrate and particles act as a foreign substance in a subsequent process. Such unnecessary foreign matters such as thin films on the back surface of the substrate are removed using a substrate cleaning apparatus.

In particular, the cleaning process removes small particles, contaminants and unnecessary film remaining on the surface of the semiconductor substrate when performing these unit processes. In recent years, as the pattern formed on the semiconductor substrate has become finer, the importance of the cleaning process has increased.

Such a cleaning process includes a chemical solution treatment process for etching or removing contaminants on a semiconductor substrate by a chemical reaction, a rinsing process for cleaning a semiconductor wafer treated with a chemical solution by a chemical solution treatment process with deionizewater (DIW) And a drying step of drying the processed semiconductor wafer.

Generally, in the chemical solution treatment process, a nozzle for supplying a chemical liquid is disposed on an upper portion of a semiconductor substrate, and a nozzle cleans the semiconductor substrate by spraying a chemical solution on an upper surface of the semiconductor substrate. Such a chemical solution treatment process can cause environmental pollution in accordance with the used chemical solution, and a process for preventing environmental pollution is required, so that the cleaning cost is often high.

On the other hand, a technique for cleaning a semiconductor substrate without using such a chemical solution has been developed. For example, a technique has been developed in which a fluid containing pure water and steam is injected into a semiconductor substrate to clean the washing surface.

A fluid cleaning apparatus uses a nozzle to spray a fluid, particularly steam, onto a substrate to clean the substrate. At this time, the nozzle is a structure that linearly or rotates and moves over the substrate to eject the fluid.

Particularly, when cleaning a substrate having a large area, a large amount of electric power is required to generate adequate steam per cleaning apparatus. In order to operate a plurality of cleaning apparatuses, it is necessary to install electric power and install a distribution panel, thereby increasing the cost of constructing the manufacturing facility.

It is an object of the present invention to provide a fluid supply module using heat exchange capable of heating fluid by heat exchange to generate steam for substrate cleaning and a substrate cleaning system including the same.

According to an aspect of the present invention, there is provided a fluid supply module using heat exchange according to an embodiment of the present invention includes: a fluid heating unit that receives and discharges a first fluid; A fluid supply unit for supplying a second fluid; And a heat exchange unit connected to the fluid heating unit and the fluid supply unit and supplied with the first fluid and the second fluid, wherein the heat exchange unit exchanges heat between the first fluid and the second fluid , The second fluid discharges the heated liquid or gas.

In one embodiment, the first fluid discharged from the fluid heating section comprises a plant steam.

In one embodiment, the heat exchanging part includes: a first fluid injection port connected to the fluid heating part, into which the first fluid to be discharged from the fluid heating part is injected; A second fluid injection port connected to the fluid supply part, into which a second fluid supplied from the fluid supply part is injected; And a fluid outlet through which the liquid or gas heated by the second fluid is discharged in the heat exchange portion.

In one embodiment, the apparatus further includes a fluid flow pipe provided inside the heat exchange unit, connecting the second fluid inlet and the fluid outlet, and interrupting the inflow of the first fluid.

In one embodiment, the fluid flow tube is formed in a zigzag or spiral shape within the heat exchange portion.

In one embodiment, the second fluid includes pure water at room temperature, and the liquid or gas heated by the second fluid includes steam.

A substrate cleaning system including a fluid supply module using heat exchange according to one embodiment of the present invention includes a fluid supply module; At least one chamber having a substrate transfer module for supporting a substrate or transferring a substrate therein; And at least one or more nozzle portions for jetting a heated liquid or gas to the substrate from a second fluid supplied from the fluid supply module.

In one embodiment, the second fluid further comprises a compressed dry air supply for supplying compressed dry air (CDA) in which the second fluid is mixed with the heated liquid or gas, wherein the nozzle portion injects the mixed fluid into the substrate .

In one embodiment, the second fluid further comprises a pure supply portion for supplying pure water to be mixed with the heated liquid or gas, and the mixed fluid is injected into the substrate.

In one embodiment, the chamber further includes an exhaust port for discharging pollutants generated by the cleaning of the substrate to the outside, together with the liquid or gas sprayed onto the substrate.

Effects of the fluid supply module using the heat exchange and the substrate cleaning system including the fluid supply module according to the present invention will be described as follows.

According to at least one of the embodiments of the present invention, steam for substrate cleaning can be generated by heat-exchanging the latent heat of the heated fluid using heat exchange, without consuming extra power to generate steam.

Also, according to at least one of the embodiments of the present invention, it is possible to generate a large amount of steam (process steam) for substrate cleaning using the latent heat of the plant steam produced for heating.

Further, according to at least one of the embodiments of the present invention, it is possible to generate a large amount of steam while reducing power consumption. In addition, there is no need to install electric power and install a distribution panel to drive a plurality of cleaning devices.

1 is a diagram of a substrate cleaning system in accordance with an embodiment of the present invention.
2 is a view showing a heat exchanger included in a substrate cleaning system according to another embodiment of the present invention.
3 is a view showing another example of the heat exchanger included in the substrate cleaning system according to another embodiment of the present invention.
4 illustrates a substrate cleaning system in accordance with another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals are used to designate identical or similar elements, and redundant description thereof will be omitted. The suffix " module " and " part " for the components used in the following description are given or mixed in consideration of ease of specification, and do not have their own meaning or role. In the following description of the embodiments of the present invention, a detailed description of related arts will be omitted when it is determined that the gist of the embodiments disclosed herein may be blurred. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. , ≪ / RTI > equivalents, and alternatives.

Terms including ordinals, such as first, second, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It will be apparent to those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.

1 is a diagram of a substrate cleaning system in accordance with an embodiment of the present invention.

Referring to FIG. 1, a substrate cleaning system 100 may include a chamber 110, a nozzle portion 112, and a fluid supply module.

And a substrate transfer module 118 for transferring the substrate, which serves as a substrate support for supporting the substrate 116 in the chamber 110. [ The inside of the chamber 110 has a hollow space, and a cleaning process for cleaning the substrate 116 in the internal space can be performed. The substrate 116 may be a wafer or a large-area glass as an object for performing a cleaning process. The substrate transfer module 118 is configured to fix or move the substrate 116 inside the chamber 110. In the present invention, a method of transferring a substrate using a roller is shown. The chamber 110 includes an exhaust port 117 for discharging contaminants (particles) generated by the cleaning of the substrate 116 to the outside together with the liquid or gas injected into the chamber 110. A pump 119 is connected to the exhaust port 117 so that contaminants after cleaning the substrate 116 can be discharged to the outside.

The nozzle unit 112 is configured to receive the fluid from the fluid supply module and inject the fluid to the substrate 116. The nozzle unit 112 may be formed in a linear shape and may move in a lateral direction or a longitudinal direction of the substrate 116 and may spray the fluid to clean the substrate 116. Or the nozzle part 112 may be formed in a spot shape to move over the substrate 116 and spray the fluid to clean the substrate 116. [

The nozzle portion 112 may further include a suction portion 114 for sucking the particles separated by the fluid and the fluid injected into the substrate 116. The fluid and particles sucked through the suction portion 114 can be discarded or the fluid can be reused after removing the particles.

 The fluid supply module may include a fluid heating unit 130 that heats the first fluid using a heating device, a fluid supply unit 140 that supplies the second fluid, and a heat exchange unit 120.

The fluid heating unit 130 is a device for receiving and heating the first fluid. Fluid heating section 130 may be any of a variety of embodiments and may include any device capable of supplying heated fluid. The fluid heating unit 130 in the present invention exemplarily describes an apparatus for generating plant steam. Since the plant steam may be used for heating during the substrate processing process, the fluid heating unit 130 may be a device for producing steam for heating. Plant steam for heating is not used purely for the process of cleaning the substrate (116) because it is produced for heating and is not pure. However, since the plant steam includes latent heat, heat can be used to generate steam by using the heat exchange unit 120. A valve 132 may be provided between the heat exchanging unit 120 and the fluid heating unit 130.

The fluid supply unit 140 is configured to supply the second fluid to the heat exchange unit 120. The second fluid supplied from the fluid supply unit 140 may be supplied to the room temperature and may be generated as steam by absorbing heat through the heat exchange unit 120 and being heated. The generated steam is supplied to the nozzle unit 112. The second fluid may preferably comprise deionizewater (DIW). The pure water may include at least one of deionized water (DIW) and ultrapure water (UPW). The fluid supply unit 140 supplies the second fluid to the heat exchange unit 120. A valve 142 may be provided between the fluid supply unit 140 and the heat exchange unit 120.

The heat exchanging unit 120 is connected to the fluid heating unit 130 to receive plant steam as a first fluid, and is connected to the fluid supply unit 140 to receive pure water as a second fluid. Heat exchange takes place between the plant steam provided in the heat exchange unit 120 and the pure water, whereby the pure water can be heated and formed into a liquid or gas.

The heat exchanger 120 refers to a heat exchanger that performs heat exchange between two fluids. The heat exchanger has a kind of heater, preheater, superheater, reheater, cooler condenser, evaporator and the like. Types of heat exchangers include shell & tube heat exchanger, block type heat exchanger, jacketed type heat exchanger, air cooled heat exchanger, spiral heat exchanger Spiral Type Heat Exchanger, Plate Heat Exchanger, Plate Coil Heat Exchanger, etc. The heat exchanger in the present invention can be manufactured as one of the above-mentioned heat exchangers.

(A spiral heat exchanger), a plate heat exchanger (an inner evaporator), and a shell and tube heat exchanger (an outer evaporator). In the present invention, any heat exchanger may be used.

The fluid supply module according to the present invention is capable of supplying a large quantity of pure process steam through heat exchange to the latent heat of the plant steam. The pure water heated in the heat exchanging unit 120 is discharged to a fluid containing steam (hereinafter, referred to as steam) and supplied to the nozzle unit 112. A valve 122 may be provided between the heat exchanging part 120 and the nozzle part 112.

The compressed dry air supply unit 150 is connected to a supply pipe for supplying gas or liquid heated by the nozzle unit 112 or the nozzle unit 112 to supply compressed dry air (CDA). The heated gas or liquid supplied to the nozzle portion 112 may be mixed with the compressed dry air and sprayed onto the substrate 116. Compressed dry air is the optimum compressed air in which contaminants such as dust, oil, moisture contained in compressed air are removed to a reference value based on the required degree. A valve 152 may be provided between the nozzle unit 112 and the compressed dry air supply unit 150.

The pure water supply unit 160 is connected to the nozzle unit 112 to supply pure water. Pure water can be mixed with the steam supplied from the nozzle portion 112 to the spray. Or the heated gas or liquid supplied to the nozzle portion 112 may be mixed with the pure water and sprayed onto the substrate 116. The pure water may include at least one of deionized water (DIW) and ultrapure water (UPW). A valve 162 may be provided between the nozzle unit 112 and the pure water supply unit 160. The heated gas or liquid may be mixed with both compressed dry air and pure water and sprayed onto the substrate 116 through the nozzle portion 112.

The substrate cleaning system 100 according to the present invention does not consume any additional power to generate steam and the latent heat of the heated fluid can be heat exchanged in the heat exchange portion to generate steam for substrate cleaning. In addition, it is possible to generate a large amount of steam (process steam) for substrate cleaning by using the latent heat of the plant steam produced for heating. In addition, a large amount of steam can be generated while reducing power consumption. In addition, there is no need to install electric power and install a distribution panel to drive a plurality of cleaning devices.

2 is a view showing a heat exchanger included in a substrate cleaning system according to another embodiment of the present invention.

Referring to FIG. 2, the heat exchange unit 220 may include a first fluid inlet 223, a second fluid inlet 224, a fluid outlet 225, and a condensate outlet 225.

The first fluid injection port 223 may be provided at one side of the main body 221 and may be connected to the fluid heating unit 130 through the connection pipe 133. The plant steam supplied from the fluid heating unit 130 may be injected into the main body 221 through the first fluid injection port 223.

The second fluid injection port 224 may be provided at one side of the main body 221 and may be connected to the fluid supply unit 140 through the connection pipe 143. The fluid supplied from the fluid supply part 140 (preferably pure water at room temperature) can be injected into the body 221 through the second fluid injection port 224.

The fluid outlet 225 may be provided at one side of the main body 221 and may be connected to the nozzle unit 112 through a connection pipe 111. The fluid exchanging unit 220 may include a fluid transfer pipe 222 connecting the second fluid injecting unit 224 and the fluid outlet 225. The fluid transfer pipe 222 is formed in a tubular shape to block the inflow of the first fluid supplied to the heat exchange part 222. The fluid supplied from the fluid supply unit 140 through the second fluid injection port 224 moves along the fluid transfer tube 222. At this time, the fluid moving inside the fluid transfer pipe 222 can be heated by heat exchange with the plant steam supplied into the main body 221. The heated fluid moving inside the fluid moving pipe 222 may be formed of steam and may be discharged to the nozzle unit 112 through the fluid outlet 225.

The heat exchanger 22 in FIG. 2 of the present invention has a second fluid inlet 224 at the bottom and a fluid outlet 225 at the top. In addition, a zigzag shape may be repeatedly formed so that the fluid movement pipe 222 has a shape of 'X' in the horizontal axis direction. Repeated zigzag formation of the fluid transfer pipe 222 increases the area in which the plant steam and the fluid transfer pipe 222 are in contact with each other. Heat exchange between the second fluid moving in the fluid transfer pipe 222 and the plant steam can be more actively performed.

The condensed water discharge port 226 is formed at the lower end of the main body 221 and the heat exchanged first fluid can be discharged to the outside through the condensed water discharge port 226. The position of the first fluid inlet 223 in the main body 221 is preferably higher than the position of the condensed water outlet 226.

According to the present invention, when the steam is generated using the heat exchanging unit 220, since the heating plant steam is used, a heating device for generating steam is unnecessary. Therefore, the power consumed by the heating device can be reduced.

3 is a view showing another embodiment of the heat exchanger included in the substrate cleaning system according to another embodiment of the present invention.

Referring to FIG. 3 (a), a zigzag shape may be repeatedly formed so that the fluid movement pipe 322 of the heat exchange unit 320 has a shape of 'n' in the vertical axis direction. The heat exchanging part 320 may have a second fluid inlet 324 at one side and a fluid outlet 325 at the other side.

Referring to FIG. 3 (b), the fluid transfer tube 322 of the heat exchange unit 320 may be formed in a spiral shape. The fluid moving pipe 322 can increase the contact area with the plant steam by repeatedly forming the spiral.

It will be apparent to those skilled in the art that the shape of the fluid transfer tube 322 is not limited to the shape shown in the present invention and can be embodied in various shapes.

4 illustrates a substrate cleaning system in accordance with another embodiment of the present invention.

Referring to FIG. 4, the substrate cleaning system 400 may include a plurality of chambers 410. The plurality of chambers 410 are provided with a nozzle unit 412 and a pump 419, respectively, and the steam can be supplied to the respective nozzle units 412 through the fluid supply module described above. The fluid supply module may be more than one.

The fluid supply module includes a heat exchange unit 420, a fluid heating unit 430 and a fluid supply unit 440. The heat exchange unit 420, the fluid heating unit 430, and the fluid supply unit 440, 3, and therefore, overlapping explanations are omitted.

Further, since the compressed dry air supply unit 450, the pure water supply unit 460, and the pump 419 are the same as those described with reference to FIG. 1, redundant description will be omitted.

In the substrate cleaning system according to the present invention, steam of 0.25 MPa is generated by supplying 0.7 MPa of plant steam to the heat exchanger.

The amount of plant steam required to produce 1 kg of process steam can be determined by the following formula.

(Process Steam Calories - Water Calories) / (Supply Steam Calories - Calories in Condensed Water)

= (652.33 - 25.00) / (660.85 - 171.53)

= 627.33 / 489.32 = 1.28 Kg

Using the above formula, it can be seen that the amount of plant steam required to produce 1 kg of steam is 1.28 Kg.

The foregoing detailed description should not be construed in any way as being restrictive and should be considered illustrative. The scope of the present invention should be determined by rational interpretation of the appended claims, and all changes within the scope of equivalents of the present invention are included in the scope of the present invention.

Claims (10)

A fluid heating unit which receives the first fluid and heats and discharges the first fluid;
A fluid supply unit for supplying a second fluid; And
And a heat exchange unit connected to the fluid heating unit and the fluid supply unit to receive the first fluid and the second fluid,
The heat-
Wherein the second fluid discharges the heated liquid or gas through heat exchange between the first fluid and the second fluid.
The method according to claim 1,
Wherein the first fluid discharged from the fluid heating portion flows through the first fluid,
Fluid supply module with heat exchange, including plant steam (PLANT STEAM).
The method according to claim 1,
The heat-
A first fluid injection port connected to the fluid heating unit, the first fluid injection port for injecting the Be 1 fluid discharged from the fluid heating unit;
A second fluid injection port connected to the fluid supply part, into which a second fluid supplied from the fluid supply part is injected; And
And a fluid outlet through which the second fluid-heated liquid or gas is discharged in the heat exchange portion.
The method of claim 3,
Further comprising a fluid transfer tube provided inside the heat exchanging part, connecting the second fluid inlet and the fluid outlet, and blocking the inflow of the first fluid.
5. The method of claim 4,
The fluid flow pipe
A fluid supply module using heat exchange formed in a staggered fashion or spirally within the heat exchanger.
The method according to claim 1,
Wherein the second fluid comprises:
It contains pure water at room temperature,
The liquid or gas, in which the second fluid is heated,
Fluid supply module using heat exchange including steam.
A fluid supply module according to any one of claims 1 to 6;
At least one chamber having a substrate transfer module for supporting a substrate or transferring a substrate therein; And
Wherein the second fluid supplied from the fluid supply module includes at least one or more nozzle portions that inject heated liquid or gas into the substrate.
8. The method of claim 7,
Further comprising a compressed dry air supply unit for supplying compressed dry air (CDA) in which the second fluid is mixed with the heated liquid or gas,
In the nozzle unit,
And a fluid supply module using heat exchange to inject the mixed fluid to the substrate.
8. The method of claim 7,
Further comprising a pure water supply unit for supplying pure water in which the second fluid is mixed with the heated liquid or gas,
And a fluid supply module using heat exchange to inject the mixed fluid to the substrate.
8. The method of claim 7,
The chamber may comprise:
And a fluid supply module using heat exchange, further comprising an exhaust port for discharging the contaminants generated by the cleaning of the substrate together with the liquid or gas injected into the substrate.

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