CN102167505A - 切割脆性材料的方法 - Google Patents

切割脆性材料的方法 Download PDF

Info

Publication number
CN102167505A
CN102167505A CN2010106238617A CN201010623861A CN102167505A CN 102167505 A CN102167505 A CN 102167505A CN 2010106238617 A CN2010106238617 A CN 2010106238617A CN 201010623861 A CN201010623861 A CN 201010623861A CN 102167505 A CN102167505 A CN 102167505A
Authority
CN
China
Prior art keywords
brittle material
nozzle
perforate
hard brittle
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010106238617A
Other languages
English (en)
Chinese (zh)
Inventor
A·A·阿布拉莫夫
罗伟炜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of CN102167505A publication Critical patent/CN102167505A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0215—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the ribbon being in a substantially vertical plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/003—Cooling means for welding or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CN2010106238617A 2009-11-18 2010-11-17 切割脆性材料的方法 Pending CN102167505A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/621,068 2009-11-18
US12/621,068 US8171753B2 (en) 2009-11-18 2009-11-18 Method for cutting a brittle material

Publications (1)

Publication Number Publication Date
CN102167505A true CN102167505A (zh) 2011-08-31

Family

ID=43332619

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010106238617A Pending CN102167505A (zh) 2009-11-18 2010-11-17 切割脆性材料的方法

Country Status (6)

Country Link
US (1) US8171753B2 (https=)
EP (1) EP2332890B1 (https=)
JP (1) JP5563430B2 (https=)
KR (1) KR101605917B1 (https=)
CN (1) CN102167505A (https=)
TW (1) TWI417262B (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014186999A1 (zh) * 2013-05-20 2014-11-27 深圳市华星光电技术有限公司 玻璃基板的切割裂片装置及其切割裂片方法
CN107001106A (zh) * 2014-11-19 2017-08-01 康宁股份有限公司 玻璃板材的分离方法
CN108290766A (zh) * 2015-11-25 2018-07-17 康宁股份有限公司 分离玻璃网的方法
CN111014961A (zh) * 2019-12-25 2020-04-17 深圳市韵腾激光科技有限公司 一种激光切割裂片装置
CN114734153A (zh) * 2022-03-31 2022-07-12 武汉华日精密激光股份有限公司 一种用于激光器加工脆性材料的裂片方法及系统

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010048733A1 (en) * 2008-10-29 2010-05-06 Oerlikon Solar Ip Ag, Trübbach Method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
JP5696393B2 (ja) * 2010-08-02 2015-04-08 日本電気硝子株式会社 ガラスフィルムの割断方法
US8720228B2 (en) * 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
US8677783B2 (en) * 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
KR101948382B1 (ko) 2013-01-30 2019-02-14 코닝 인코포레이티드 가요성 유리의 연속 레이저 절단을 위한 장치 및 방법
US9260337B2 (en) 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
EP3107868B1 (en) 2014-02-20 2021-05-26 Corning Incorporated Methods for cutting radii in flexible thin glass
DE102019113635A1 (de) * 2019-05-22 2020-11-26 Schott Ag Verfahren und Vorrichtung zur Verarbeitung von Glaselementen

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080283509A1 (en) * 2007-05-15 2008-11-20 Anatoli Anatolyevich Abramov Method and apparatus for scoring and separating a brittle material with a single beam of radiation

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2589183A (en) * 1948-11-12 1952-03-11 Zielinski Joseph High-pressure jet nozzle
JPS4867145A (https=) * 1971-12-20 1973-09-13
DE2619415C2 (de) * 1976-05-03 1986-01-02 Dietz-Armaturen Gmbh, 5060 Bergisch Gladbach Schwallbrause zur Erzeugung eines freifallenden Flüssigkeitsflachstrahles
JPH0221955A (ja) * 1988-07-07 1990-01-24 Nippon Steel Corp 流体噴射ノズル
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
DE69315643T2 (de) 1992-09-01 1998-04-02 Corning Inc Zerteilen von Glasscheiben
JP3255479B2 (ja) 1993-02-26 2002-02-12 東芝テック株式会社 インクジェットプリンタ
US5622540A (en) 1994-09-19 1997-04-22 Corning Incorporated Method for breaking a glass sheet
EP0847317B1 (en) 1995-08-31 2003-08-27 Corning Incorporated Method and apparatus for breaking brittle materials
JP4396953B2 (ja) * 1998-08-26 2010-01-13 三星電子株式会社 レーザ切断装置および切断方法
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6252197B1 (en) * 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring
DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
EP1232038B1 (en) * 1999-11-24 2008-04-23 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
DE19959921C1 (de) * 1999-12-11 2001-10-18 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
DE19963939B4 (de) * 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
US6732952B2 (en) * 2001-06-08 2004-05-11 Carl L. C. Kah, Jr. Oscillating nozzle sprinkler with integrated adjustable arc, precipitation rate, flow rate, and range of coverage
KR100490048B1 (ko) * 2001-06-19 2005-05-17 삼성전자주식회사 액정 표시 장치 제조용 인라인 시스템 및 이를 이용하는 액정 표시 장치의 제조 방법
TW568809B (en) * 2001-09-21 2004-01-01 Mitsuboshi Diamond Ind Co Ltd Method for scribing substrate of brittle material and scriber
DE10148777B4 (de) * 2001-10-02 2019-01-24 Air Liquide Deutschland Gmbh Verfahren und Vorrichtung zum Kühlen einer Masse einer Substanz
US6744009B1 (en) * 2002-04-02 2004-06-01 Seagate Technology Llc Combined laser-scribing and laser-breaking for shaping of brittle substrates
AU2004294430B2 (en) 2003-12-05 2010-04-01 Asahi Glass Company, Limited Method and device for cutting plate glass
US7185833B2 (en) * 2004-03-18 2007-03-06 Ernest Geskin Method for fluid jet formation and apparatus for the same
US20060021977A1 (en) 2004-07-30 2006-02-02 Menegus Harry E Process and apparatus for scoring a brittle material incorporating moving optical assembly
US7820941B2 (en) 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
JP4457933B2 (ja) * 2005-03-18 2010-04-28 澁谷工業株式会社 ハイブリッドレーザ加工装置
US20070039990A1 (en) 2005-05-06 2007-02-22 Kemmerer Marvin W Impact induced crack propagation in a brittle material
DE102005024563B9 (de) * 2005-05-28 2006-12-14 Schott Ag Verfahren zum Trennen von Glas und Verwendung einer dafür geeigneten Flüssigkeit
WO2007018586A1 (en) 2005-07-28 2007-02-15 Gyrotron Technology, Inc. A method of separating non-metallic material using microwave radiation
GB0519111D0 (en) 2005-09-20 2005-10-26 Pilkington Deutschland Ag Glass cutting
US20070140311A1 (en) * 2005-12-20 2007-06-21 House Keith L Method and apparatus for characterizing a glass ribbon
DE102006024825A1 (de) * 2006-05-23 2007-11-29 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Randbeschneiden eines Floatglasbandes
JP2008044804A (ja) * 2006-08-11 2008-02-28 Shibaura Mechatronics Corp 割断装置および割断方法
US20080213978A1 (en) * 2007-03-03 2008-09-04 Dynatex Debris management for wafer singulation
DE202006016674U1 (de) * 2006-10-27 2007-02-22 Nordson Corporation, Westlake Auftragsvorrichtung zum Auftragen von flüssigem Material
JP2008229715A (ja) * 2007-03-23 2008-10-02 Toray Eng Co Ltd レーザスクライブ装置
WO2008133800A1 (en) 2007-04-30 2008-11-06 Corning Incorporated Apparatus, system, and method for scoring a moving glass ribbon
US7895861B2 (en) * 2007-05-09 2011-03-01 Corning Incorporated Conformable nosing device for reducing motion and stress within a glass sheet while manufacturing the glass sheet
US20080290077A1 (en) 2007-05-22 2008-11-27 Demeritt Jeffery Alan Separation of transparent glasses and systems and methods therefor
JP2010538476A (ja) 2007-08-31 2010-12-09 アプライド マテリアルズ インコーポレイテッド 光電池製造ライン
JP5192216B2 (ja) * 2007-11-09 2013-05-08 株式会社ディスコ レーザー加工装置
US8011207B2 (en) 2007-11-20 2011-09-06 Corning Incorporated Laser scoring of glass sheets at high speeds and with low residual stress
US20090178298A1 (en) 2008-01-15 2009-07-16 Anatoli Anatolyevich Abramov Device for fluid removal after laser scoring

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080283509A1 (en) * 2007-05-15 2008-11-20 Anatoli Anatolyevich Abramov Method and apparatus for scoring and separating a brittle material with a single beam of radiation

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014186999A1 (zh) * 2013-05-20 2014-11-27 深圳市华星光电技术有限公司 玻璃基板的切割裂片装置及其切割裂片方法
CN107001106A (zh) * 2014-11-19 2017-08-01 康宁股份有限公司 玻璃板材的分离方法
CN108290766A (zh) * 2015-11-25 2018-07-17 康宁股份有限公司 分离玻璃网的方法
TWI719081B (zh) * 2015-11-25 2021-02-21 美商康寧公司 分離玻璃網的方法
CN108290766B (zh) * 2015-11-25 2021-04-27 康宁股份有限公司 分离玻璃网的方法
US11008244B2 (en) 2015-11-25 2021-05-18 Corning Incorporated Methods of separating a glass web
CN111014961A (zh) * 2019-12-25 2020-04-17 深圳市韵腾激光科技有限公司 一种激光切割裂片装置
CN114734153A (zh) * 2022-03-31 2022-07-12 武汉华日精密激光股份有限公司 一种用于激光器加工脆性材料的裂片方法及系统
CN114734153B (zh) * 2022-03-31 2023-02-14 武汉华日精密激光股份有限公司 一种用于激光器加工脆性材料的裂片方法及系统

Also Published As

Publication number Publication date
EP2332890B1 (en) 2012-08-22
KR20110055406A (ko) 2011-05-25
EP2332890A1 (en) 2011-06-15
JP2011116638A (ja) 2011-06-16
US8171753B2 (en) 2012-05-08
US20110113830A1 (en) 2011-05-19
JP5563430B2 (ja) 2014-07-30
TW201127764A (en) 2011-08-16
KR101605917B1 (ko) 2016-04-01
TWI417262B (zh) 2013-12-01

Similar Documents

Publication Publication Date Title
CN102167505A (zh) 切割脆性材料的方法
JP5574747B2 (ja) 割れ易い材料からなるシートの罫書き方法
KR101948382B1 (ko) 가요성 유리의 연속 레이저 절단을 위한 장치 및 방법
CN101678501B (zh) 利用单束辐射划刻和分离易碎材料的方法和装置
TWI641567B (zh) 可撓性薄玻璃之自由外型切割的方法及設備
KR102421381B1 (ko) 얇은 가요성 유리에 반경을 절단하기 위한 방법 및 장치
CN102686354B (zh) 精密激光刻痕
CN103097313B (zh) 分离强化玻璃基材的方法
US10584054B2 (en) Method and device for continuous separation of glass
KR101223490B1 (ko) 취성 재료 기판의 할단 방법
KR101404250B1 (ko) 취성 재료의 분할 장치 및 할단 방법
WO2014077117A1 (ja) 板ガラスの製造方法、及び製造装置
KR20160101068A (ko) 디스플레이 유리 조성물의 레이저 절단
CN101535016A (zh) 通过流体冲击分离薄板
JP2016175834A (ja) ガラスリボンを分断する方法
US20090178298A1 (en) Device for fluid removal after laser scoring
WO2012075097A1 (en) Methods for separating a sheet of brittle material

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20110831