CN102159972B - 光学元件的制造方法,光学元件,显示装置的制造方法以及显示装置 - Google Patents
光学元件的制造方法,光学元件,显示装置的制造方法以及显示装置 Download PDFInfo
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- CN102159972B CN102159972B CN200980136688.3A CN200980136688A CN102159972B CN 102159972 B CN102159972 B CN 102159972B CN 200980136688 A CN200980136688 A CN 200980136688A CN 102159972 B CN102159972 B CN 102159972B
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- photomask
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- 230000003287 optical effect Effects 0.000 title claims abstract description 153
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims description 69
- 230000001678 irradiating effect Effects 0.000 claims 2
- 238000000605 extraction Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 60
- 239000000463 material Substances 0.000 description 27
- 239000010408 film Substances 0.000 description 18
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 230000005540 biological transmission Effects 0.000 description 12
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 239000012044 organic layer Substances 0.000 description 9
- 230000027756 respiratory electron transport chain Effects 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000010409 thin film Substances 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- DIVZFUBWFAOMCW-UHFFFAOYSA-N 4-n-(3-methylphenyl)-1-n,1-n-bis[4-(n-(3-methylphenyl)anilino)phenyl]-4-n-phenylbenzene-1,4-diamine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 DIVZFUBWFAOMCW-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- -1 phenolic aldehyde Chemical class 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920002577 polybenzoxazole Polymers 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 1
- HONWGFNQCPRRFM-UHFFFAOYSA-N 2-n-(3-methylphenyl)-1-n,1-n,2-n-triphenylbenzene-1,2-diamine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C(=CC=CC=2)N(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 HONWGFNQCPRRFM-UHFFFAOYSA-N 0.000 description 1
- XSUNFLLNZQIJJG-UHFFFAOYSA-N 2-n-naphthalen-2-yl-1-n,1-n,2-n-triphenylbenzene-1,2-diamine Chemical class C1=CC=CC=C1N(C=1C(=CC=CC=1)N(C=1C=CC=CC=1)C=1C=C2C=CC=CC2=CC=1)C1=CC=CC=C1 XSUNFLLNZQIJJG-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910017073 AlLi Inorganic materials 0.000 description 1
- 101100190806 Arabidopsis thaliana PLT3 gene Proteins 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 101150095879 PLT2 gene Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- VBVAVBCYMYWNOU-UHFFFAOYSA-N coumarin 6 Chemical compound C1=CC=C2SC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 VBVAVBCYMYWNOU-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000010339 dilation Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- AHLBNYSZXLDEJQ-FWEHEUNISA-N orlistat Chemical compound CCCCCCCCCCC[C@H](OC(=O)[C@H](CC(C)C)NC=O)C[C@@H]1OC(=O)[C@H]1CCCCCC AHLBNYSZXLDEJQ-FWEHEUNISA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
Abstract
Description
Claims (7)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008246416A JP2010080224A (ja) | 2008-09-25 | 2008-09-25 | 光学部品の製造方法および光学部品、並びに表示装置の製造方法および表示装置 |
JP2008-246416 | 2008-09-25 | ||
PCT/JP2009/066232 WO2010035678A1 (ja) | 2008-09-25 | 2009-09-17 | 光学部品の製造方法および光学部品、並びに表示装置の製造方法および表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102159972A CN102159972A (zh) | 2011-08-17 |
CN102159972B true CN102159972B (zh) | 2014-12-17 |
Family
ID=42059679
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980136688.3A Active CN102159972B (zh) | 2008-09-25 | 2009-09-17 | 光学元件的制造方法,光学元件,显示装置的制造方法以及显示装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8551804B2 (zh) |
JP (1) | JP2010080224A (zh) |
CN (1) | CN102159972B (zh) |
WO (1) | WO2010035678A1 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2554193B1 (en) | 2010-03-31 | 2023-08-30 | Terumo Kabushiki Kaisha | Integrated circuit and medical instrument using same |
JP5601025B2 (ja) * | 2010-05-21 | 2014-10-08 | セイコーエプソン株式会社 | 電気光学装置及び電気光学装置の製造方法、並びに電子機器 |
KR101401177B1 (ko) | 2010-07-23 | 2014-05-29 | 파나소닉 주식회사 | 표시 패널 및 그 제조 방법 |
KR101773087B1 (ko) * | 2011-06-17 | 2017-08-31 | 삼성디스플레이 주식회사 | 블랙 매트릭스 함유 nd 필름을 구비한 유기 발광 표시 장치 |
KR20150019620A (ko) * | 2013-08-14 | 2015-02-25 | 삼성디스플레이 주식회사 | 유기발광 표시 장치 |
JP2015069700A (ja) * | 2013-09-26 | 2015-04-13 | 株式会社ジャパンディスプレイ | 表示装置 |
KR102138906B1 (ko) * | 2013-12-30 | 2020-07-28 | 엘지디스플레이 주식회사 | 백색 유기발광 소자 및 컬러 필터를 이용한 유기발광 표시장치 |
KR102344331B1 (ko) | 2015-01-15 | 2021-12-28 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
CN110199572B (zh) * | 2017-01-20 | 2024-01-26 | 索尼半导体解决方案公司 | 显示装置、电子设备及制造显示装置的方法 |
KR102588082B1 (ko) * | 2018-09-06 | 2023-10-11 | 엘지디스플레이 주식회사 | 유기발광표시장치 및 이의 제조 방법 |
KR20210103037A (ko) * | 2020-02-12 | 2021-08-23 | 삼성디스플레이 주식회사 | 표시 장치 및 전자 기기 |
CN111697037B (zh) * | 2020-06-04 | 2024-04-09 | 武汉天马微电子有限公司 | 一种有机发光显示面板及显示装置 |
CN111969125B (zh) * | 2020-08-26 | 2022-11-11 | 京东方科技集团股份有限公司 | 一种显示面板及其制作方法、车载显示器 |
CN112687748A (zh) * | 2020-12-29 | 2021-04-20 | 佛山市国星光电股份有限公司 | 一种背光模块及其制作方法 |
WO2023031718A1 (ja) * | 2021-08-31 | 2023-03-09 | 株式会社半導体エネルギー研究所 | 表示装置、および電子機器 |
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CN1364246A (zh) * | 1999-06-30 | 2002-08-14 | 株式会社日立制作所 | 半导体集成电路器件制备方法,其光掩膜和它的制备方法及掩膜胚 |
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CA1313792C (en) * | 1986-02-28 | 1993-02-23 | Junji Hirokane | Method of manufacturing photo-mask and photo-mask manufactured thereby |
JPH07294725A (ja) * | 1994-03-01 | 1995-11-10 | Seiko Instr Inc | カラーフィルター及び多色液晶表示装置の製造方法 |
JP2002049326A (ja) | 2000-08-02 | 2002-02-15 | Fuji Photo Film Co Ltd | 平面光源およびそれを用いた表示素子 |
JP3724725B2 (ja) | 2001-11-01 | 2005-12-07 | ソニー株式会社 | 表示装置の製造方法 |
JP4183427B2 (ja) | 2002-03-11 | 2008-11-19 | 三洋電機株式会社 | エレクトロルミネッセンス素子 |
JP3865762B2 (ja) * | 2002-10-15 | 2007-01-10 | シャープ株式会社 | パララックスバリア素子、その製造方法および表示装置 |
JP4329514B2 (ja) | 2003-12-02 | 2009-09-09 | 富士ゼロックス株式会社 | マイクロレンズアレイ及びその製造方法 |
JP4453385B2 (ja) | 2004-02-13 | 2010-04-21 | ソニー株式会社 | 表示装置の製造方法 |
JP2005275142A (ja) | 2004-03-25 | 2005-10-06 | Sharp Corp | 表示パネルおよびその製造方法 |
TW200628921A (en) | 2004-09-17 | 2006-08-16 | Hitachi Maxell | Microlens array, method of fabricating microlens array, and liquid crystal display apparatus with microlens array |
JP2006323328A (ja) | 2004-09-17 | 2006-11-30 | Hitachi Maxell Ltd | マイクロレンズアレイ及びマイクロレンズアレイの製造方法並びに当該マイクロレンズアレイを搭載した液晶表示装置 |
US7385911B2 (en) * | 2004-11-10 | 2008-06-10 | Tdk Corporation | Optical recording medium having multiple layers of different thermal conductivities |
US7985677B2 (en) * | 2004-11-30 | 2011-07-26 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
JP4456040B2 (ja) * | 2005-06-17 | 2010-04-28 | パナソニック株式会社 | 固体撮像素子 |
JP2007183363A (ja) | 2006-01-05 | 2007-07-19 | Hitachi Maxell Ltd | マザー基板、このマザー基板の製造方法およびマイクロレンズアレイ基板の製造方法 |
TW200710018A (en) | 2005-08-30 | 2007-03-16 | Hitachi Maxell | Microlens array substrate and method of manufacturing microlens array substrate |
WO2007086137A1 (ja) * | 2006-01-27 | 2007-08-02 | Tohoku Pioneer Corporation | 光デバイス、および光デバイスの製造方法 |
JP2007248484A (ja) | 2006-03-13 | 2007-09-27 | Sony Corp | 表示装置 |
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2008
- 2008-09-25 JP JP2008246416A patent/JP2010080224A/ja active Pending
-
2009
- 2009-09-17 WO PCT/JP2009/066232 patent/WO2010035678A1/ja active Application Filing
- 2009-09-17 CN CN200980136688.3A patent/CN102159972B/zh active Active
- 2009-09-17 US US13/120,999 patent/US8551804B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1364246A (zh) * | 1999-06-30 | 2002-08-14 | 株式会社日立制作所 | 半导体集成电路器件制备方法,其光掩膜和它的制备方法及掩膜胚 |
Also Published As
Publication number | Publication date |
---|---|
CN102159972A (zh) | 2011-08-17 |
WO2010035678A1 (ja) | 2010-04-01 |
US8551804B2 (en) | 2013-10-08 |
JP2010080224A (ja) | 2010-04-08 |
US20110175118A1 (en) | 2011-07-21 |
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