CN102159032A - Process for manufacturing flexible printed circuit board by adopting die cutting machine - Google Patents
Process for manufacturing flexible printed circuit board by adopting die cutting machine Download PDFInfo
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- CN102159032A CN102159032A CN201110074253XA CN201110074253A CN102159032A CN 102159032 A CN102159032 A CN 102159032A CN 201110074253X A CN201110074253X A CN 201110074253XA CN 201110074253 A CN201110074253 A CN 201110074253A CN 102159032 A CN102159032 A CN 102159032A
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- printed circuit
- circuit board
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- metal forming
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- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a process for manufacturing a flexible printed circuit board by adopting a die cutting machine, which comprises the following steps of: 1, processing a die cutting tool according to a printed circuit; 2, die-cutting to form the printed circuit by using the printed circuit die-cutting tool on a metal foil adhesive tape by adopting the die-cutting machine, eliminating metal foil waste of a non-printed circuit; 3, compounding a weak-viscosity film layer on the metal foil adhesive tape where the printed circuit is die-cut; 4, removing a metal foil adhesive tape bonding layer, transferring the die-cut printed circuit on a flexible substrate; and 5, punching the shape of the printed circuit board and a circuit through hole according to the printed circuit to obtain the flexible printed circuit board. By adopting the process for manufacturing the flexible printed circuit board by adopting the die cutting machine, an etching manufacturing technology adopted by the traditional printed circuit board is changed to ensure that the manufacture cost and the manufacture period of the printed circuit board are greatly reduced, and the problem of environment pollution brought by electrolyte emission treatment by adopting an etching technology in the traditional pretend circuit board is solved.
Description
Technical field
The invention belongs to printed substrate manufacturing technology field, relate to a kind of flexibility circuit board fabrication method, be specifically related to a kind of process that adopts die-cutting machine to make flexibility printed circuit board.
Background technology
Common printed substrate, be that rigidity or flexibility printed circuit board generally all adopt etching technique to erode away printed wire on the Copper Foil that insulating substrate pastes, owing to adopt etching technique, the used discarded electrolyte of etch printing circuit must just can discharge through recycling.However, the waste liquid of discharging still makes environment that certain pollution is arranged, and is still not little to the destruction that environment caused.And printed substrate causes cost high because of the rise of silver-colored valency, and the high voltage withstanding poor-performing of the printed substrate of making.
Summary of the invention
The purpose of this invention is to provide a kind of process that adopts die-cutting machine to make flexibility printed circuit board, it makes printed wire the cross cutting fixture of hollow out earlier, utilize die-cutting machine to go out needed printed wire metal forming at metal forming adhesive tape cross cutting, unwanted expense material is partly excluded, then at multiple last layer on the good printed wire metal forming of cross cutting slightly behind the adhesive membrane, make printed substrate on the flexible substrate removing in the shape layer, again the printed wire metal forming to be changeed to be attached to, changed the problem that has environmental protection in the traditional printing wiring board manufacturing technology.
The technical solution adopted in the present invention is, a kind of process that adopts die-cutting machine to make flexibility printed circuit board, and this process is made up of following steps:
Step 5 is gone out printed substrate profile and line conduction hole according to printed wire, obtains flexibility printed circuit board.
Employing die-cutting machine of the present invention is made the process of flexibility printed circuit board, and its feature also is,
Described flexibility printed circuit board or be double sided board by silk screen printing, adopts electrically conductive ink to pour in the line conduction hole that connects the two sides, is communicated with the circuit on printed substrate two sides.
A kind of process that adopts die-cutting machine to make flexibility printed circuit board of the present invention, it makes the cross cutting fixture of the hollow out of cross cutting printed wire earlier according to printed wire, utilize die-cutting machine to go out needed printed wire metal forming at metal forming adhesive tape cross cutting, the metal forming expense material part eliminating of non-printed wire is taken off, then at multiple last layer on the adhesive tape of the good printed wire metal forming of cross cutting slightly behind the adhesive membrane, make printed substrate on the flexible substrate removing in the shape layer, again the printed wire metal forming to be changeed to be attached to.The present invention has changed existing traditional printing wiring board and has adopted etched manufacturing technology, has also solved the environmental issue that existing printed substrate adopts the used electrolyte emission treatment of etching technique to bring simultaneously.
Description of drawings
Fig. 1 is the flexibility printed circuit board schematic diagram that adopts die-cutting machine of the present invention to make;
Fig. 2 is that step 4 of the present invention is removed the metal forming adhesive tape from the shape layer, changes the process schematic diagram of printed wire on flexible substrate that pastes cross cutting.
Among the figure, 1. flexible substrate, 2. printed wire metal forming, 3. from the shape layer, 4. adhesive membrane slightly.
Embodiment
The present invention is described in detail below in conjunction with the drawings and specific embodiments.
A kind of process that adopts die-cutting machine to make flexibility printed circuit board, this process is made up of following steps:
Step 5 is gone out printed substrate profile and line conduction hole according to printed wire, obtains flexibility printed circuit board.
Flexibility printed circuit board of the present invention or be double sided board by silk screen printing, adopts electrically conductive ink to pour in the line conduction hole that connects the two sides, is communicated with the circuit on printed substrate two sides.
The present invention is a kind of technology that existing traditional printing wiring board employing etching erodes away printed wire that is different from, be to adopt die-cutting machine to make a kind of process of flexibility printed circuit board, it removes to make the hollow out cross cutting fixture of cross cutting printed wire earlier according to printed wire, utilize die-cutting machine to go out needed printed wire metal forming 2 at metal forming adhesive tape cross cutting, take the metal forming expense material part of non-printed wire on the metal forming adhesive tape off recycling, only stay the good printed wire metal forming 2 of cross cutting, on the good printed wire metal forming 2 of cross cutting, answer last layer adhesive membrane 4 slightly then, remove again in the time of shape layer 3, printed wire metal forming 2 is changeed being attached on the flexible substrate 1.At last go out printed substrate profile and line conduction hole, take adhesive membrane 4 slightly off, just make flexibility printed circuit board according to different printed wires.
If the flexibility printed circuit board double sided board with the present invention makes then by silk screen printing, adopts electrically conductive ink to pour in the line conduction hole on connection line plate two sides, be communicated with the circuit on printed substrate two sides.
The present invention adopts die-cutting machine to make the process of flexibility printed circuit board, and used printed substrate flexible substrate 1 is the PET plate, or is PVC plate, PE, PP plate.
The present invention has changed the traditional printing wiring board and has adopted etched manufacturing technology, when the manufacturing cost of printed substrate and manufacturing cycle are reduced greatly, also solved the environmental issue that existing printed substrate adopts the used electrolyte emission treatment of etching technique to bring.
Above-mentioned execution mode is an an example of the present invention, is not to be used for limiting enforcement of the present invention and interest field, and all equivalences of making according to the described content of the present patent application scope of patent protection change and modify, and all should be included in the present patent application claim.
Claims (2)
1. process that adopts die-cutting machine to make flexibility printed circuit board is characterized in that this process is made up of following steps:
Step 1, be processed into the cross cutting fixture according to printed wire;
Step 2, employing die-cutting machine go out printed wire with printed wire cross cutting fixture cross cutting on the metal forming adhesive tape, and get rid of the metal forming expense material of non-printed wire;
Step 3, on the adhesive tape of the good printed wire metal forming of cross cutting, the weak adhesive membrane of multiple last layer;
Step 4, in the shape layer, changes the printed wire metal forming of subsides cross cutting on flexible substrate removing the metal forming adhesive tape;
Step 5 is gone out printed substrate profile and line conduction hole according to printed wire, obtains flexibility printed circuit board.
2. employing die-cutting machine according to claim 1 is made the process of flexibility printed circuit board, it is characterized in that, described flexibility printed circuit board or be double sided board, by silk screen printing, adopt electrically conductive ink to pour in the line conduction hole that connects the two sides, be communicated with the circuit on printed substrate two sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110074253 CN102159032B (en) | 2011-03-25 | 2011-03-25 | Process for manufacturing flexible printed circuit board by adopting die cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110074253 CN102159032B (en) | 2011-03-25 | 2011-03-25 | Process for manufacturing flexible printed circuit board by adopting die cutting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102159032A true CN102159032A (en) | 2011-08-17 |
| CN102159032B CN102159032B (en) | 2013-06-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110074253 Expired - Fee Related CN102159032B (en) | 2011-03-25 | 2011-03-25 | Process for manufacturing flexible printed circuit board by adopting die cutting machine |
Country Status (1)
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| CN (1) | CN102159032B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102421254A (en) * | 2011-08-19 | 2012-04-18 | 深南电路有限公司 | Method for adhering island adhesive tape to flexible printed circuit |
| CN106793540A (en) * | 2016-12-02 | 2017-05-31 | 北京启创驿讯科技有限公司 | A kind of printed circuit board (PCB) processing method, system and processing Copper Foil |
| CN108323026A (en) * | 2018-04-03 | 2018-07-24 | 王玉昌 | A kind of process for manufacturing circuit board |
| WO2021073402A1 (en) | 2019-10-15 | 2021-04-22 | 康希诺生物股份公司 | Carrier protein with site-directed mutation and use thereof in preparation of vaccine |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004111729A1 (en) * | 2003-06-19 | 2004-12-23 | Avantone Oy | A method and an apparatus for manufacturing an electronic thin-film component and an electronic thin-film component |
| CN101087861A (en) * | 2004-12-23 | 2007-12-12 | 蒂萨股份公司 | Heat-activable adhesive used for gluing flexible printed circuit boards (FPCB) |
| CN101295811A (en) * | 2007-04-23 | 2008-10-29 | 福州兆科智能卡有限公司 | Production method of electronic label radio frequency antenna |
| CN101296562A (en) * | 2007-04-24 | 2008-10-29 | 亚洲电材股份有限公司 | Copper foil substrates and method for making flexible printed circuit board of the same |
-
2011
- 2011-03-25 CN CN 201110074253 patent/CN102159032B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004111729A1 (en) * | 2003-06-19 | 2004-12-23 | Avantone Oy | A method and an apparatus for manufacturing an electronic thin-film component and an electronic thin-film component |
| CN101087861A (en) * | 2004-12-23 | 2007-12-12 | 蒂萨股份公司 | Heat-activable adhesive used for gluing flexible printed circuit boards (FPCB) |
| CN101295811A (en) * | 2007-04-23 | 2008-10-29 | 福州兆科智能卡有限公司 | Production method of electronic label radio frequency antenna |
| CN101296562A (en) * | 2007-04-24 | 2008-10-29 | 亚洲电材股份有限公司 | Copper foil substrates and method for making flexible printed circuit board of the same |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102421254A (en) * | 2011-08-19 | 2012-04-18 | 深南电路有限公司 | Method for adhering island adhesive tape to flexible printed circuit |
| CN102421254B (en) * | 2011-08-19 | 2013-05-22 | 深南电路有限公司 | Method for adhering island adhesive tape to flexible printed circuit |
| CN106793540A (en) * | 2016-12-02 | 2017-05-31 | 北京启创驿讯科技有限公司 | A kind of printed circuit board (PCB) processing method, system and processing Copper Foil |
| CN106793540B (en) * | 2016-12-02 | 2018-10-26 | 北京启创驿讯科技有限公司 | A kind of printed circuit board processing method, system and processing copper foil |
| CN108323026A (en) * | 2018-04-03 | 2018-07-24 | 王玉昌 | A kind of process for manufacturing circuit board |
| WO2021073402A1 (en) | 2019-10-15 | 2021-04-22 | 康希诺生物股份公司 | Carrier protein with site-directed mutation and use thereof in preparation of vaccine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102159032B (en) | 2013-06-19 |
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Granted publication date: 20130619 Termination date: 20140325 |