CN102130064B - Eeprom中调节隔离结构高度的方法 - Google Patents
Eeprom中调节隔离结构高度的方法 Download PDFInfo
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- CN102130064B CN102130064B CN 201010027283 CN201010027283A CN102130064B CN 102130064 B CN102130064 B CN 102130064B CN 201010027283 CN201010027283 CN 201010027283 CN 201010027283 A CN201010027283 A CN 201010027283A CN 102130064 B CN102130064 B CN 102130064B
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CN 201010027283 CN102130064B (zh) | 2010-01-18 | 2010-01-18 | Eeprom中调节隔离结构高度的方法 |
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CN 201010027283 CN102130064B (zh) | 2010-01-18 | 2010-01-18 | Eeprom中调节隔离结构高度的方法 |
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CN102130064A CN102130064A (zh) | 2011-07-20 |
CN102130064B true CN102130064B (zh) | 2013-03-13 |
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CN114784009B (zh) * | 2022-06-20 | 2022-09-09 | 广州粤芯半导体技术有限公司 | 嵌入式闪存的制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1591835A (zh) * | 2003-08-29 | 2005-03-09 | 中芯国际集成电路制造(上海)有限公司 | 一种电可擦除可编程只读存储器单元的制造方法 |
CN101207064A (zh) * | 2006-12-22 | 2008-06-25 | 中芯国际集成电路制造(上海)有限公司 | 器件隔离区的形成方法 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1591835A (zh) * | 2003-08-29 | 2005-03-09 | 中芯国际集成电路制造(上海)有限公司 | 一种电可擦除可编程只读存储器单元的制造方法 |
CN101207064A (zh) * | 2006-12-22 | 2008-06-25 | 中芯国际集成电路制造(上海)有限公司 | 器件隔离区的形成方法 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20131218 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20131218 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |