CN102097577A - Buffer with high heat conducting quantity - Google Patents
Buffer with high heat conducting quantity Download PDFInfo
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- CN102097577A CN102097577A CN201010614126XA CN201010614126A CN102097577A CN 102097577 A CN102097577 A CN 102097577A CN 201010614126X A CN201010614126X A CN 201010614126XA CN 201010614126 A CN201010614126 A CN 201010614126A CN 102097577 A CN102097577 A CN 102097577A
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- high heat
- heat conduction
- conduction amount
- amount buffer
- pedestal
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Abstract
The invention relates to a buffer with high heat conducting quantity, which is designed aiming at an illumination LED (Light Emitting Diode) packaging structure. The buffer with high heat conducting quantity is a hollow metal base body with the upper surface being a concave surface, and the base body is provided with a wiring terminal. An inner cavity of the buffer with high heat conducting quantity can be tightly bonded with an LED-bearing metal support to absorb the heat of the metal support and reduce the working temperature of the packaging structure. The buffer with high heat conducting quantity is high in radiating efficiency, simple in structure and easy in processing, and provides excellent protection for the operation of electrical lines under high-temperature environments, in addition, a standardized design scheme for electrical interfaces of the LED packaging structure is provided.
Description
Technical field
The present invention relates to a kind of high heat conduction amount buffer, particularly a kind of high heat conduction amount buffer that is applied to the illumination level package structure for LED.
Background technology
In recent years, the development of light-emitting diode receives much concern.LED source has progressively penetrated into bigger illumination market, as indoor and outdoor lighting and automotive luminaire etc.Along with the expansion of LED source range of application, the power of package structure for LED constantly promotes, and large-power light-emitting diodes and encapsulation thereof have become the focus areas of photovoltaic industry.Along with LED power promotes and the high heating problem that comes, brought such as the LED life-span reduce, a series of problems such as the shortening of light decay phase, failure rate rising.For this reason, people have designed diversified high power LED package structure and radiator structure.
But various construction and devices are protected deficiency to electric wiring under high-temperature work environment, more do not realize to each other unification being unfavorable for the standardization of products and modularization on electric interfaces, hamper the universal fast of LED source.
Summary of the invention
In order to overcome the above problems, the invention provides a kind of high heat conduction amount buffer.Described high heat conduction amount buffer by the electric binding terminal that inlay high heat conduction amount buffer bottom, has been protected electric wiring as a vitals in the high power LED package structure, has realized the electric interfaces standardization.
Realize that technical scheme of the present invention is: high heat conduction amount buffer design is the metal material hollow base frame, and electric binding terminal is left in the pedestal lower end, and the pedestal upper surface is a concave surface.Described high heat conduction amount buffer inner chamber fits tightly with the metallic support of carrying light-emitting diode, absorbs the heat of metallic support, reduces the working temperature of encapsulating structure.
The major technique effect that the present invention produces is: the electric wiring that LED draws, by the insulator of electric binding terminal parcel, the standard interface by electric binding terminal provides links to each other with external electrical equipment.The supply line of LED, driver circuit can be integrated in the electric binding terminal.Described electric binding terminal is simple in structure firm, and is safe and reliable, and the integrated level height is easy to connect, high temperature resistant, and waterproof realizes package structure for LED external electrical nuclear interface standardizing.
Described high heat conduction amount buffer box figure modelling is for being round platform, cylinder, oval cylinder or polygon cylinder.When using the identical material of equivalent weight, above-mentioned moulding has big area of dissipation.
Described high heat conduction amount buffer box body and function aluminium alloy is made, and the aluminium alloy thermal resistance is lower, can conduct heat fast, helps the encapsulating structure heat radiation.
Described high heat conduction amount buffer inner chamber is taper or back taper, to increase and the metallic support contact area, improves radiating effect.
Described high heat conduction amount buffer electric binding terminal external interface is butterfly-like hole, direct current supply.
Described high heat conduction amount buffer upper surface is concave surface, reflection ray and heat.
Described high heat conduction amount buffer upper surface periphery has seal groove, and behind filling gel or the packing ring, led chip is protected in combinations such as described seal groove and other structural member lens, collar, plays antivibration, waterproof, fire-retardant, resistant to elevated temperatures effect in the seal groove.
Week is a reflective areas in the described high heat conduction amount buffer upper surface, and reflective areas improves reflecting rate through blasting treatment.Through experiment, described reflective areas is a cambered surface, and during in particular for the cambered surface at 0.1 ° at R angle, under the identical lens condition, emergent light refractive index maximum effectively reduces the emergent light scattering.
Description of drawings
Shown in Figure 1 is structural representation of the present invention;
Shown in Figure 2 is vertical view of the present invention;
Shown in Figure 3 is upward view of the present invention;
Shown in Figure 4 is end view of the present invention;
Shown in Figure 5 is cutaway view of the present invention.
Member among the figure is:
1, high heat conduction amount buffer pedestal;
1-1, high heat conduction amount buffer upper surface;
1-1-1, seal groove;
1-1-2, reflective areas;
1-2, high heat conduction amount buffer inner chamber;
1-3, electric binding terminal;
1-4, collar stationary plane;
Embodiment
Below in conjunction with drawings and Examples the present invention is done specific descriptions:
Embodiment 1: high heat conduction amount buffer main body is a round table-like pedestal 1.Pedestal 1 hollow, its hollow space are back taper inner chamber 1-2.From pedestal 1 bottom center, as shown in Figure 3, radially embed insulator electric binding terminal 1-3.The bottom surface of electric binding terminal 1-3 is concordant with pedestal 1 bottom surface, and electric binding terminal 1-3 has internal interface at the extension of inner chamber 1-2, and electric binding terminal 1-3 has external interface in pedestal 1 side.By providing standardized electric binding terminal 1-3, the electric interfaces standard of standard LED encapsulation.In addition, electric binding terminal 1-3 has the good high-temperature insulating properties, the high heat when being enough to resist great power LED work, the electrical wiring in the protection terminal.
Embodiment 2: high heat conduction amount buffer main body is a round table-like pedestal 1.Pedestal 1 hollow, its hollow space are back taper inner chamber 1-2.The support of carrying LED is among the inner chamber 1-2, closely contacts with inner chamber 1-2 wall, heat is transmitted on the pedestal 1 of aluminum alloy material 1 heat cushioning effect of pedestal by the chamber wall.Experiment shows, as long as the surface of support and inner chamber 1-2 is enough smooth, need not to smear silicone grease and also can obtain best radiating effect.From pedestal 1 bottom center, as shown in Figure 3, radially embed insulator electric binding terminal 1-3.The bottom surface of electric binding terminal 1-3 is concordant with pedestal 1 bottom surface, and electric binding terminal 1-3 has internal interface at the extension of inner chamber 1-2, and electric binding terminal 1-3 has external interface in pedestal 1 side.
Embodiment 3: high heat conduction amount buffer main body is a round table-like pedestal 1.Pedestal 1 hollow, its hollow space are back taper inner chamber 1-2.The support of carrying LED is among the inner chamber 1-2, closely contacts with inner chamber 1-2 wall, heat is transmitted on the pedestal 1 of aluminum alloy material 1 heat cushioning effect of pedestal by the chamber wall.From pedestal 1 bottom center, as shown in Figure 3, radially embed insulator electric binding terminal 1-3.The bottom surface of electric binding terminal 1-3 is concordant with pedestal 1 bottom surface, and electric binding terminal 1-3 has internal interface at the extension of inner chamber 1-2, and electric binding terminal 1-3 has external interface in pedestal 1 side.During LED work, electric wiring from support is drawn is connected with the extension of electric binding terminal 1-3 in inner chamber 1-2, conducts through electric binding terminal 1-3, lead to the butterfly shape electrical outlet of pedestal 1 side, butterfly shape electrical outlet has certain water-proof function.
Embodiment 4: high heat conduction amount buffer main body is a round table-like pedestal 1.Pedestal 1 hollow, its hollow space are back taper inner chamber 1-2.The support of carrying LED is among the inner chamber 1-2, closely contacts with inner chamber 1-2 wall, heat is transmitted on the pedestal 1 of aluminum alloy material 1 heat cushioning effect of pedestal by the chamber wall.From pedestal 1 bottom center, as shown in Figure 3, radially embed insulator electric binding terminal 1-3.The bottom surface of electric binding terminal 1-3 is concordant with pedestal 1 bottom surface, and electric binding terminal 1-3 has internal interface at the extension of inner chamber 1-2, and electric binding terminal 1-3 has external interface in pedestal 1 side.During LED work, the electric wiring from support is drawn is connected with the extension of electric binding terminal 1-3 in inner chamber 1-2, through electric binding terminal 1-3 conduction, leads to the butterfly shape electrical outlet of pedestal 1 side.The concave upper surface 1-1 of pedestal 1 is made up of seal groove 1-1-1 and reflective areas 1-1-2.Lens and collar are pressed on the seal groove 1-1-1, fix sealing LED by the screw on the collar stationary plane 1-4.Inject silica gel in the seal groove 1-1-1, utilize silica gel to reach as high as 200 ℃ working temperature, do not influence the seal of seal groove, vibration resistance and water proofing property because of LED distributes Gao Re.The luminous light that shines upper surface 1-1 of led chip is reflected by reflective areas 1-1-2.Reflective areas 1-1-2 is processed as the cambered surface at 0.1 ° of R angle, and through the blasting treatment of Sa3 level, experiment shows can obtain best reflecting effect this moment, improves the refractive index of emergent light.
The above; it only is preferred embodiment of the present invention; be not to be qualification to protection range of the present invention; so long as adopt technical scheme of the present invention; perhaps only be any conventional the modification or equivalent variations that to make by those of ordinary skill in the art, all fall among the present invention's scope required for protection.
Claims (9)
1. one kind high heat conduction amount buffer comprises pedestal (1), upper surface (1-1), inner chamber (1-2), collar stationary plane (1-4), it is characterized in that: described high heat conduction amount buffer has electric binding terminal (1-3).
2. high heat conduction amount buffer according to claim 1 is characterized in that: pedestal (1) is a round platform, perhaps cylinder, perhaps oval cylinder, perhaps polygon cylinder.
3. high heat conduction amount buffer according to claim 1 is characterized in that: inner chamber (1-2) is taper or back taper.
4. high heat conduction amount buffer according to claim 1 is characterized in that: electric binding terminal (1-3) external interface is butterfly-like hole.
5. high heat conduction amount buffer according to claim 1 is characterized in that: upper surface (1-1) is a concave surface.
6. high heat conduction amount buffer according to claim 1 is characterized in that: the periphery of upper surface (1-1) has seal groove (1-1-1).
7. high heat conduction amount buffer according to claim 1 is characterized in that: in the interior week of upper surface (1-1), be reflective areas (1-1-2).
8. high heat conduction amount buffer according to claim 7 is characterized in that: reflective areas (1-1-2) is a cambered surface.
9. high heat conduction amount buffer according to claim 8 is characterized in that: reflective areas (1-1-2) cambered surface R angle is 0.1 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010614126 CN102097577B (en) | 2010-12-30 | 2010-12-30 | Buffer with high heat conducting quantity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010614126 CN102097577B (en) | 2010-12-30 | 2010-12-30 | Buffer with high heat conducting quantity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102097577A true CN102097577A (en) | 2011-06-15 |
| CN102097577B CN102097577B (en) | 2013-07-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010614126 Expired - Fee Related CN102097577B (en) | 2010-12-30 | 2010-12-30 | Buffer with high heat conducting quantity |
Country Status (1)
| Country | Link |
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| CN (1) | CN102097577B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200940816Y (en) * | 2006-03-28 | 2007-08-29 | 钟李杏枝 | Heat radiator for lamp |
| US20090010011A1 (en) * | 2007-07-05 | 2009-01-08 | Bright Led Electronic Corp. | Solid state lighting device with heat-dissipating capability |
| KR20100003000A (en) * | 2008-06-30 | 2010-01-07 | 서울반도체 주식회사 | Light emitting diode package having multi-face lead terminal and lead frame structure for surface mount thereof |
| CN201487895U (en) * | 2009-08-06 | 2010-05-26 | 联立电子有限公司 | Heat dissipation seat of LED lamp |
| CN201966242U (en) * | 2010-12-30 | 2011-09-07 | 江苏欣力光电有限公司 | High-conductivity heat buffer |
-
2010
- 2010-12-30 CN CN 201010614126 patent/CN102097577B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200940816Y (en) * | 2006-03-28 | 2007-08-29 | 钟李杏枝 | Heat radiator for lamp |
| US20090010011A1 (en) * | 2007-07-05 | 2009-01-08 | Bright Led Electronic Corp. | Solid state lighting device with heat-dissipating capability |
| KR20100003000A (en) * | 2008-06-30 | 2010-01-07 | 서울반도체 주식회사 | Light emitting diode package having multi-face lead terminal and lead frame structure for surface mount thereof |
| CN201487895U (en) * | 2009-08-06 | 2010-05-26 | 联立电子有限公司 | Heat dissipation seat of LED lamp |
| CN201966242U (en) * | 2010-12-30 | 2011-09-07 | 江苏欣力光电有限公司 | High-conductivity heat buffer |
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| Publication number | Publication date |
|---|---|
| CN102097577B (en) | 2013-07-10 |
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