CN102092002B - 单晶硅片液体抛光方法 - Google Patents
单晶硅片液体抛光方法 Download PDFInfo
- Publication number
- CN102092002B CN102092002B CN2010105795914A CN201010579591A CN102092002B CN 102092002 B CN102092002 B CN 102092002B CN 2010105795914 A CN2010105795914 A CN 2010105795914A CN 201010579591 A CN201010579591 A CN 201010579591A CN 102092002 B CN102092002 B CN 102092002B
- Authority
- CN
- China
- Prior art keywords
- silicon piece
- monocrystalline silicon
- hours
- vacuum cup
- diamond abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 51
- 238000005498 polishing Methods 0.000 title claims abstract description 23
- 239000007788 liquid Substances 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000012530 fluid Substances 0.000 claims abstract description 27
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 25
- 239000010432 diamond Substances 0.000 claims abstract description 25
- 238000004140 cleaning Methods 0.000 claims abstract description 9
- 238000001035 drying Methods 0.000 claims abstract description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 26
- 238000012986 modification Methods 0.000 claims description 9
- 230000004048 modification Effects 0.000 claims description 9
- 235000019441 ethanol Nutrition 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 21
- 239000010703 silicon Substances 0.000 abstract description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 20
- 239000003082 abrasive agent Substances 0.000 abstract description 7
- 238000009461 vacuum packaging Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000011259 mixed solution Substances 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105795914A CN102092002B (zh) | 2010-12-09 | 2010-12-09 | 单晶硅片液体抛光方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105795914A CN102092002B (zh) | 2010-12-09 | 2010-12-09 | 单晶硅片液体抛光方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102092002A CN102092002A (zh) | 2011-06-15 |
CN102092002B true CN102092002B (zh) | 2012-04-25 |
Family
ID=44125365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2010105795914A Expired - Fee Related CN102092002B (zh) | 2010-12-09 | 2010-12-09 | 单晶硅片液体抛光方法 |
Country Status (1)
Country | Link |
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CN (1) | CN102092002B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103471899B (zh) * | 2013-08-28 | 2016-01-20 | 西安隆基硅材料股份有限公司 | 硅片加工装置 |
CN107633997B (zh) | 2017-08-10 | 2019-01-29 | 长江存储科技有限责任公司 | 一种晶圆键合方法 |
CN108192566A (zh) * | 2018-01-15 | 2018-06-22 | 合肥师范学院 | 金刚石复合磨料及其制备方法 |
CN109940503B (zh) * | 2019-03-12 | 2021-07-20 | 常熟风范电力设备股份有限公司 | 一种钢结构件脱脂除锈方法 |
CN112658976B (zh) * | 2019-12-17 | 2022-07-22 | 深圳硅基仿生科技有限公司 | 用于对陶瓷的表面进行研磨的方法 |
CN113967872A (zh) * | 2021-09-16 | 2022-01-25 | 北京航空航天大学 | 一种用于单晶硅晶圆的激光辅助抛光方法 |
CN115383534A (zh) * | 2022-09-13 | 2022-11-25 | 成都青洋电子材料有限公司 | 一种单晶硅片的生产工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1357585A (zh) * | 2000-12-04 | 2002-07-10 | 拜尔公司 | 用于金属和电介质结构化学机械抛光的抛光膏 |
CN1560161A (zh) * | 2004-03-01 | 2005-01-05 | 长沙矿冶研究院 | 一种水基纳米金刚石抛光液及其制造方法 |
JP2008000867A (ja) * | 2006-06-26 | 2008-01-10 | Sumitomo Metal Fine Technology Co Ltd | 研磨液、その製造方法、および研磨方法 |
KR20090109328A (ko) * | 2008-04-15 | 2009-10-20 | 네오세미테크 주식회사 | 연마용 슬러리 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010105240A2 (en) * | 2009-03-13 | 2010-09-16 | Saint-Gobain Ceramics & Plastics, Inc. | Chemical mechanical planarization using nanodiamond |
-
2010
- 2010-12-09 CN CN2010105795914A patent/CN102092002B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1357585A (zh) * | 2000-12-04 | 2002-07-10 | 拜尔公司 | 用于金属和电介质结构化学机械抛光的抛光膏 |
CN1560161A (zh) * | 2004-03-01 | 2005-01-05 | 长沙矿冶研究院 | 一种水基纳米金刚石抛光液及其制造方法 |
JP2008000867A (ja) * | 2006-06-26 | 2008-01-10 | Sumitomo Metal Fine Technology Co Ltd | 研磨液、その製造方法、および研磨方法 |
KR20090109328A (ko) * | 2008-04-15 | 2009-10-20 | 네오세미테크 주식회사 | 연마용 슬러리 |
Also Published As
Publication number | Publication date |
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CN102092002A (zh) | 2011-06-15 |
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Owner name: ZHEJIANG COWIN ELECTRONICS CO., LTD. Free format text: FORMER OWNER: GUO BINGJIAN Effective date: 20120704 |
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Free format text: CORRECT: ADDRESS; FROM: 313000 ZHANGXINGZHONGDIANZI CO.LTD, NO.1299, QIAN STREET, CHANGXING COUNTY ECONOMIC DEVELOPMENT ZONE COUNTY, HUZHOU CITY, ZHEJIANG PROVINCE TO: 313100 NO.1299, QIAN STREET(EAST), CHANGXING COUNTY ECONOMIC DEVELOPMENT ZONE COUNTY, HUZHOU CITY, ZHEJIANG PROVINCE |
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Effective date of registration: 20120704 Address after: 313100, No. 1299, front East Street, Changxing County Economic Development Zone, Zhejiang, Huzhou Patentee after: Zhejiang Cowin Electronics Co., Ltd. Address before: 313000, Huzhou, Zhejiang, Changxing County Economic Development District No. 1299 Changxin Zhong Zhong Electronics Co., Ltd. Patentee before: Guo Bingjian |
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C56 | Change in the name or address of the patentee |
Owner name: ZHEJIANG ZHONGJING TECHNOLOGY CO., LTD. Free format text: FORMER NAME: ZHEJIANG COWIN ELECTRONICS CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: 313100, No. 1299, front East Street, Changxing County Economic Development Zone, Zhejiang, Huzhou Patentee after: ZHEJIANG ZHONGJING TECHNOLOGY CO., LTD. Address before: 313100, No. 1299, front East Street, Changxing County Economic Development Zone, Zhejiang, Huzhou Patentee before: Zhejiang Cowin Electronics Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120425 Termination date: 20161209 |
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CF01 | Termination of patent right due to non-payment of annual fee |