CN102082017A - Manufacturing method of surface mounted device resistor - Google Patents
Manufacturing method of surface mounted device resistor Download PDFInfo
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- CN102082017A CN102082017A CN2009102331370A CN200910233137A CN102082017A CN 102082017 A CN102082017 A CN 102082017A CN 2009102331370 A CN2009102331370 A CN 2009102331370A CN 200910233137 A CN200910233137 A CN 200910233137A CN 102082017 A CN102082017 A CN 102082017A
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Abstract
The invention discloses a manufacturing method of a surface mounted device (SMD) resistor. The method for manufacturing a positive electrode of the SMD resistor comprises the following steps: firstly, printing a resistive layer; secondly, printing and covering a positive auxiliary electrode at both sides of a position in which the resistive layer is close to the positive electrode; and thirdly, sputtering to form the positive electrode, thus ensuring the connectivity between the positive electrode and the resistive layer and strengthening the stability of a product. The positive electrode is used for sputtering a conductive material which takes silver as a main composition in a vacuum sputtering mode. The sputtered conductive material can be sputtered uniformly to a substrate surface. A sputtered electrode layer has the advantages of thin film and excellent uniformity, thus ensuring the uniformity of the film thickness of the positive electrode and overcoming the shortcoming that the initial value of the resistor is easy-dispersed. Besides, the cost of the conductive material taking the silver as the main component is lower than that of silver paste, and the amount of the conductive materials is less, thus effectively reducing the production cost of products, improving the market competitiveness of the products and being suitable for batch production.
Description
Technical field
The present invention relates to a kind of manufacture method of resistor, especially a kind of manufacture method of patch resistor.
Background technology
Patch resistor is widely used in the electronic circuit.
The manufacturing way of typical patch resistor is as described below:
1. adopt silk screen printing to form front electrode in the front of large stretch of insulated substrate, and carry out drying;
2. adopt silk screen printing to form backplate at the back side of above-mentioned insulated substrate, carry out drying and burn till;
3. adopt silk screen printing to form resistive layer in the inboard of above-mentioned front electrode, carry out drying and burn till: the two ends of this resistive layer are connected in above-mentioned front electrode;
4. on above-mentioned resistive layer, form first protective layer (being glassivation), and carry out drying and burn till;
5. for above-mentioned resistive layer, carry out accurate resistance trimming, make its resistance value reach setting by laser;
6. on above-mentioned glassivation, adopt screen printing mode to form second protective layer (being resin protective layer) and label layer once more, and carry out drying and burn till;
7. adopt special equipment that above-mentioned big plate base is rolled over the bar line longitudinally along each in regular turn substrate is converted into strip, and be stacked in the special fixture automatically;
8. it is granular to adopt special equipment that above-mentioned strip product is converted into the strip product along each horizontal folding grain line in regular turn, forms a plurality of single Chip-Rs;
9. above-mentioned Chip-R is passed through the barrel plating mode, forming by metallic nickel and tin on above-mentioned front electrode, backplate and side electrode is the nickel coating and the tin coating of main component.
Yet shortcoming in the above-mentioned Chip-R manufacture method:
1. because front electrode adopts silver-colored oar material, realize front electrode by screen printing mode, its thicknesses of layers is easily inhomogeneous, and after the resistive layer printing, the resistance initial value easily disperses, and causes the production control difficulty to increase bad rising.
2. Chip-R adopts printed silver oar material when forming front electrode, and it is thicker to burn till back thickness, large usage quantity, and the raw material of printing is to be the slug type slurry of main component with silver, and its price is higher, causes production cost of products higher, and the market competitiveness weakens.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of manufacture method of patch resistor, can guarantee the uniformity of front electrode thicknesses of layers, and reduce production cost of products effectively, increased the stability of product.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of manufacture method of patch resistor is benchmark to use direction, and its manufacturing step is as follows:
A. prepare an insulated substrate, form some horizontal folding bar lines and some vertical folding grain lines on the upper surface and the even corresponding clathrate of the lower surface ground of this insulated substrate;
B. by silk screen printing silver paste is printed on the lower surface of insulated substrate by setting at interval, carry out forming each backplate behind drying and the sintering, and the position of each backplate is that cross central line and each backplate are positioned at adjacent two vertically in the middle of the folding grain lines for the horizontal folding bar line with correspondence;
C. by silk screen printing resistance slurry is printed on and carries out on the upper surface of insulated substrate forming each resistive layer behind drying and the sintering, and the position of each resistive layer is to be positioned at horizontal folding bar line and vertically in the middle of folding grain each grid that line defined;
D. by silk screen printing silver-colored palladium slurry is printed on described each resistive layer near on the both sides of laterally rolling over the bar line and towards zone, horizontal folding bar line extension, simultaneously silver-colored palladium slurry being printed on horizontal folding bar line is on the position between each resistive layer, and each printed position of silver-colored palladium slurry all is positioned at the backplate position range of insulated substrate upper surface over against the insulated substrate lower surface, after carrying out drying and burning till, form each front auxiliary electrode;
E. dielectric paste is printed on the upper surface of insulated substrate by silk screen printing, this printing position is carried out the drying back and is formed mask layer except the part (should form desired location for the follow-up front electrode of reserving except part) of insulated substrate upper surface over against the backplate position of insulated substrate lower surface;
F. by sputter the upper surface that electric conducting material sputters at insulated substrate is formed the sputtering electrode layer, and wear out;
G. adopt the ultrasonic waves for cleaning mode that mask layer is washed together with the sputtering electrode layer on this mask layer, the sputtering electrode layer that stays carry out air-dry back with its each front auxiliary electrode of corresponding covering connect to one and form each front electrode;
H. form radium-shine tangent line by laser on each resistive layer and carry out accurate resistance trimming, accurately the resistance value of each resistive layer behind the resistance trimming is required resistance;
I. by silk screen printing resin slurry is printed on the insulated substrate upper surface each adjacent two laterally in the middle of folding bar lines and cover each corresponding resistive layer fully, carries out each protective layer of formation behind drying and the sintering;
J. by silk screen printing printing mark layer on each protective layer, carry out drying after this label layer carry out sintering with protective layer;
K. insulated substrate is laterally rolled over the bar line along each and be converted into each strip substrate;
L. adopt the vacuum sputtering machine that the long side face of each strip substrate is carried out sputter, form the side electrode that is communicated with front electrode and backplate;
M. each strip substrate is vertically rolled over a grain line along each and be converted into pelletized product;
N. forming by metallic nickel by the barrel plating mode on the surface of the front electrode that exposes on the pelletized product, backplate and side electrode is the nickel coating of Main Ingredients and Appearance;
O. form final products in formation on the nickel coating surface of pelletized product after by metallic tin being the tin coating of Main Ingredients and Appearance by the barrel plating mode.
As a further improvement on the present invention, used electric conducting material is Main Ingredients and Appearance with silver among the described step e.
The invention has the beneficial effects as follows: front electrode of the present invention is that sputter is the electric conducting material of Main Ingredients and Appearance with silver, and by the vacuum sputtering mode, the electric conducting material of sputter can be splashed to substrate surface uniformly, the sputtering electrode layer has the thin and excellent characteristics of uniformity of rete, guaranteed the uniformity of front electrode thicknesses of layers, and sputter forms front electrode behind the first printed resistor layer, overcome the shortcoming that the resistance initial value easily disperses, sputter is printed the front auxiliary electrode earlier before forming front electrode, guarantee the conducting connectivity of front electrode and resistive layer, increased the stability of product; The electric conducting material cost that with silver is Main Ingredients and Appearance again will be lower than the silver slurry, and consumption is less, has reduced production cost of products effectively, and can strengthen the competitiveness of product in market, can be applicable to property production in batches simultaneously again.
Description of drawings
Fig. 1 is the product section structural representation behind the step a of the present invention;
Fig. 2 is the product section structural representation behind the step b of the present invention;
Fig. 3 is the product section structural representation behind the step c of the present invention;
Fig. 4 is the product section structural representation after the steps d of the present invention;
Fig. 5 is the product section structural representation behind the step e of the present invention;
Fig. 6 is the product section structural representation behind the step f of the present invention;
Fig. 7 is the product section structural representation after the step g of the present invention;
Fig. 8 is the product section structural representation behind the step h of the present invention;
Fig. 9 is the product section structural representation after the step I of the present invention;
Figure 10 is the product section structural representation behind the step j of the present invention;
Figure 11 is the product section structural representation behind the step k of the present invention;
Figure 12 is the product section structural representation behind the step l of the present invention;
Figure 13 is the product section structural representation behind the step m of the present invention;
Figure 14 is the product section structural representation behind the step n of the present invention;
Figure 15 is the final products part-structure schematic diagram after the step 0 of the present invention;
Figure 16 is a final products generalized section of the present invention.
Embodiment
Embodiment: a kind of manufacture method of patch resistor, be benchmark to use direction, its manufacturing step is as follows:
A. prepare an insulated substrate 1, form some horizontal folding bar lines 2 and some vertical folding grain lines 3 on the upper surface 11 and the lower surface 12 even corresponding clathrate ground of this insulated substrate;
B. by silk screen printing silver paste is printed on the lower surface 12 of insulated substrate 1 by setting at interval, carry out forming each backplate 30 behind drying and the sintering, and the position of each backplate 30 be that cross central line and each backplate 30 are positioned at adjacent two vertically folding grain lines 3 are middle for the horizontal folding bar line 2 with correspondence;
C. by silk screen printing resistance slurry is printed on and carries out on the upper surface 11 of insulated substrate 1 forming each resistive layer 4 behind drying and the sintering, and the position of each resistive layer 4 is to be positioned in the middle of horizontal folding bar line 2 and each grid that vertically folding grain line 3 is defined;
D. by silk screen printing silver-colored palladium slurry is printed on described each resistive layer 4 near on the both sides of laterally rolling over bar line 2 and towards zone, horizontal folding bar line 2 extension, simultaneously silver-colored palladium slurry is printed on the position that horizontal folding bar line 2 is between each resistive layer, and each printed position of silver-colored palladium slurry all is positioned at backplate 30 position ranges of insulated substrate 1 upper surface 11 over against insulated substrate lower surface 12, after carrying out drying and burning till, form each front auxiliary electrode 18;
E. dielectric paste is printed on the upper surface 11 of insulated substrate 1 by silk screen printing, this printing position is carried out the drying back and is formed mask layer 5 except the part (should form desired location for the follow-up front electrode of reserving except part) of insulated substrate 1 upper surface 11 over against backplate 30 positions of insulated substrate lower surface 12;
F. by sputter the upper surface 11 that electric conducting material sputters at insulated substrate 1 is formed sputtering electrode layer 6, and wear out;
G. adopt the ultrasonic waves for cleaning mode that mask layer 5 is washed together with the sputtering electrode layer 6 on this mask layer 5, the sputtering electrode layer 6 that stays carry out air-dry back with its each front auxiliary electrode 18 of corresponding covering connect to one and form each front electrode 7;
H. form radium-shine tangent line 8 by laser on each resistive layer 4 and carry out accurate resistance trimming, accurately the resistance value of each resistive layer 4 behind the resistance trimming is required resistance;
I. by silk screen printing resin slurry is printed on insulated substrate 1 upper surface 11 each adjacent two laterally in the middle of folding bar lines 2 and cover each corresponding resistive layer 4 fully, carries out each protective layer 9 of formation behind drying and the sintering;
J. by silk screen printing printing mark layer 10 on each protective layer 9, carry out drying after this label layer 10 carry out sintering with protective layer 9;
K. insulated substrate 1 is laterally rolled over bar line 2 along each and be converted into each strip substrate 13;
L. adopt the vacuum sputtering machine that the long side face of each strip substrate 13 is carried out sputter, form the side electrode 14 that is communicated with front electrode 7 and backplate 30;
M. each strip substrate 13 is vertically rolled over a grain line 3 along each and be converted into pelletized product 15;
N. forming by metallic nickel by the barrel plating mode on the surface of the front electrode 7 that exposes on the pelletized product 15, backplate 30 and side electrode 14 is the nickel coating 16 of Main Ingredients and Appearance;
O. forming on the nickel coating surface of pelletized product 15 by metallic tin by the barrel plating mode is the tin coating 17 back final products 20 that form of Main Ingredients and Appearance.
Used electric conducting material is Main Ingredients and Appearance with silver among the described step e.
Front electrode of the present invention is that sputter is the electric conducting material of Main Ingredients and Appearance with silver, and by the vacuum sputtering mode, the electric conducting material of sputter can be splashed to substrate surface uniformly, the sputtering electrode layer has the thin and excellent characteristics of uniformity of rete, guaranteed the uniformity of front electrode thicknesses of layers, and sputter forms front electrode behind the first printed resistor layer, overcome the shortcoming that the resistance initial value easily disperses, sputter is printed the front auxiliary electrode earlier before forming front electrode, guarantee the conducting connectivity of front electrode and resistive layer, increased the stability of product; The electric conducting material cost that with silver is Main Ingredients and Appearance again will be lower than the silver slurry, and consumption is less, has reduced production cost of products effectively, and can strengthen the competitiveness of product in market, can be applicable to property production in batches simultaneously again.
Claims (2)
1. the manufacture method of a patch resistor, it is characterized in that: be benchmark to use direction, its manufacturing step is as follows:
A. prepare an insulated substrate (1), form some horizontal folding bar lines (2) and some vertical folding grain lines (3) on the upper surface (11) and the even corresponding clathrate of lower surface (12) ground of this insulated substrate;
B. by silk screen printing silver paste is printed on the lower surface (12) of insulated substrate (1) by setting at interval, carry out forming each backplate (30) behind drying and the sintering, and the position of each backplate (30) be that cross central line and each backplate (30) are positioned at adjacent two vertically folding grain lines (3) are middle for the horizontal folding bar line (2) with correspondence;
C. by silk screen printing resistance slurry is printed on and carries out on the upper surface (11) of insulated substrate (1) forming each resistive layer (4) behind drying and the sintering, and the position of each resistive layer (4) is for being positioned at horizontal folding bar line (2) and vertically in the middle of folding each grid that line (3) is defined;
D. by silk screen printing silver-colored palladium slurry is printed on described each resistive layer (4) near on the both sides of laterally rolling over bar line (2) and towards horizontal folding bar line (2) zone, extension, simultaneously silver-colored palladium slurry being printed on horizontal folding bar line (2) is on the position between each resistive layer, and each printed position of silver-colored palladium slurry all is positioned at backplate (30) position range of insulated substrate (1) upper surface (11) over against insulated substrate lower surface (12), after carrying out drying and burning till, form each front auxiliary electrode (18);
E. dielectric paste is printed on the upper surface (11) of insulated substrate (1) by silk screen printing, this printing position is carried out the drying back and is formed mask layer (5) except the part of insulated substrate (1) upper surface (11) over against backplate (30) position of insulated substrate lower surface (12);
F. by sputter the upper surface (11) that electric conducting material sputters at insulated substrate (1) is formed sputtering electrode layer (6), and wear out;
G. adopt the ultrasonic waves for cleaning mode that mask layer (5) is washed together with the sputtering electrode layer (6) on this mask layer (5), the sputtering electrode layer (6) that stays carry out air-dry back with its each front auxiliary electrode (18) of corresponding covering connect to one and form each front electrode (7);
H. go up the radium-shine tangent line of formation (8) by laser at each resistive layer (4) and carry out accurate resistance trimming, accurately the resistance value of each resistive layer (4) behind the resistance trimming is required resistance;
I. by silk screen printing resin slurry is printed on insulated substrate (1) upper surface (11) each adjacent two laterally in the middle of folding bar lines (2) and cover corresponding each resistive layer (4) fully, carries out formation each protective layer (9) behind drying and the sintering;
J. go up printing mark layer (10) by silk screen printing at each protective layer (9), carry out drying after this label layer (10) carry out sintering with protective layer (9);
K. insulated substrate (1) is laterally rolled over bar line (2) along each and be converted into each strip substrate (13);
L. adopt the vacuum sputtering machine that the long side face of each strip substrate (13) is carried out sputter, form the side electrode (14) that is communicated with front electrode (7) and backplate (30);
M. each strip substrate (13) is vertically rolled over a grain line (3) along each and be converted into pelletized product (15);
N. forming by metallic nickel by the barrel plating mode on the surface of the front electrode (7) that exposes on the pelletized product (15), backplate (30) and side electrode (14) is the nickel coating (16) of Main Ingredients and Appearance;
O. forming on the nickel coating surface of pelletized product (15) by metallic tin by the barrel plating mode is the back final products (20) that form of tin coating (17) of Main Ingredients and Appearance.
2. the manufacture method of patch resistor according to claim 1, it is characterized in that: used electric conducting material is Main Ingredients and Appearance with silver among the described step e.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910233137A CN102082017B (en) | 2009-11-26 | 2009-11-26 | Manufacturing method of surface mounted device resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910233137A CN102082017B (en) | 2009-11-26 | 2009-11-26 | Manufacturing method of surface mounted device resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102082017A true CN102082017A (en) | 2011-06-01 |
| CN102082017B CN102082017B (en) | 2012-10-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200910233137A Active CN102082017B (en) | 2009-11-26 | 2009-11-26 | Manufacturing method of surface mounted device resistor |
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| CN (1) | CN102082017B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730222A (en) * | 2014-01-10 | 2014-04-16 | 旺诠科技(昆山)有限公司 | Reverse-side printing process for resistor protruding electrode |
| CN106384634A (en) * | 2016-10-11 | 2017-02-08 | 西安宏星电子浆料科技有限责任公司 | Lead-free mask slurry for chip resistor |
| CN107887090A (en) * | 2017-11-06 | 2018-04-06 | 中国振华集团云科电子有限公司 | Glass-fiber-plate cutting process method |
| CN109830351A (en) * | 2019-03-29 | 2019-05-31 | 昆山厚声电子工业有限公司 | A kind of patch resistor and its processing method |
| CN106910583B (en) * | 2015-12-23 | 2020-02-18 | 三星电机株式会社 | Resistor element and board having the same mounted thereon |
| CN112701433A (en) * | 2020-12-21 | 2021-04-23 | 深圳顺络电子股份有限公司 | Load sheet and preparation method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200534296A (en) * | 2004-02-09 | 2005-10-16 | Rohm Co Ltd | Method of making thin-film chip resistor |
| WO2005081271A1 (en) * | 2004-02-19 | 2005-09-01 | Koa Kabushikikaisha | Process for fabricating chip resistor |
-
2009
- 2009-11-26 CN CN200910233137A patent/CN102082017B/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730222A (en) * | 2014-01-10 | 2014-04-16 | 旺诠科技(昆山)有限公司 | Reverse-side printing process for resistor protruding electrode |
| CN103730222B (en) * | 2014-01-10 | 2014-10-15 | 旺诠科技(昆山)有限公司 | Reverse-side printing process for resistor protruding electrode |
| CN106910583B (en) * | 2015-12-23 | 2020-02-18 | 三星电机株式会社 | Resistor element and board having the same mounted thereon |
| CN106384634A (en) * | 2016-10-11 | 2017-02-08 | 西安宏星电子浆料科技有限责任公司 | Lead-free mask slurry for chip resistor |
| CN107887090A (en) * | 2017-11-06 | 2018-04-06 | 中国振华集团云科电子有限公司 | Glass-fiber-plate cutting process method |
| CN109830351A (en) * | 2019-03-29 | 2019-05-31 | 昆山厚声电子工业有限公司 | A kind of patch resistor and its processing method |
| CN112701433A (en) * | 2020-12-21 | 2021-04-23 | 深圳顺络电子股份有限公司 | Load sheet and preparation method thereof |
| CN112701433B (en) * | 2020-12-21 | 2022-07-15 | 深圳顺络电子股份有限公司 | Load sheet and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102082017B (en) | 2012-10-24 |
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