CN208873560U - Sputter copper 0R resistor - Google Patents

Abstract

A kind of sputtering copper 0R resistor; insulating substrate (1) front has layers of copper (3); the middle side part matcoveredn (4) on layers of copper (3); at insulating substrate (1) back side, left and right outer ledge has rear electrode (2); there are lateral conduction layer (7) respectively on insulating substrate (1) left and right side outer wall; lateral conduction layer (7) connects layers of copper (3) and rear electrode (2), has nickel layer (9) in layers of copper (3), rear electrode (2) and lateral conduction layer (7) outer surface.Structure is improved using in insulating substrate front full wafer sputtering layers of copper, surface electrode and resistive layer is set to be connected to become entirety, it is more suitable for bulk production, it is good to sputter the vacuum coating surface uniformity formed, film layer structure is fine and close, and capability and performance is more stable and manufacturing cost is lower, and resistive surface heat-sinking capability is strong, small product size is small, effectively improves prouctiveness and significantly reduces manufacturing cost.

Description

Sputter copper 0R resistor

Technical field

The utility model relates to resistor electronic device and its structure improved technologies of manufacturing method, especially sputtering copper 0R Resistor.

Background technique

0R resistor Zero-ohm resistor.The resistance that resistance value is 0, there is no the practical significances of circuit, it is therefore an objective to put on PCB One resistance position when so as to post debugging, facilitates change resistance value.Two o'clock cannot be connected with printed circuit in board design It connects, is often connected in front with cross-line, this is frequently seen in common plate, in order to make automatic placement machine and automatism card machine normal Work, replaces cross-line with zero resistance.

The resistance in 0 Europe probably has following function: 1. using as wire jumper.Both beautiful in this way, installation also facilitates.2. In the hybrid circuits such as number and simulation, often require that two ground separate, and single-point connects.We can use the electricity in 0 Europe It hinders to connect the two ground, rather than is directly connected together.

It is less that Patents documents are disclosed.

Fudan University discloses a kind of CuSiO electricity standby based on sputtering copper in Chinese patent application 200910197210.3 Resistance type memory and preparation method thereof.The resistor-type memory include under top electrode, copper electrode and be arranged in the top electrode And the CuSiO storage medium under the copper between electrode, wherein, electrode is electrode under sputtering copper, the sputtering copper under the copper Lower electrode surface layer is silicified processing to form CuSi compound buffer layer, and the CuSi compound buffer layer is oxidized processing with shape At the CuSiO storage medium.The CuSiO storage medium it is functional, can especially make memory have low resistance state resistance more Consistency is more preferable between high, each unit, and the memory is easy to integrated with copper-connection backend process, reduces preparation cost.

Vishay Dale Electronics Inc. provides a kind of metal beam-type resistance in Chinese patent application 201210472650.7 Device (10).This metal strip resistor includes metal strip (18), forms resistive element and without using independent substrate In the case of for metal strip resistor provide bearing.First terminal and the second opposite end are coated with metal strip.First terminal and Each of second opposite end is upper to have coating (28).There are also be coated with metal strip between first terminal and the second opposite end Insulating materials (20).The utility model provides a kind of method for forming metal strip resistor, and wherein metal strip exists Bearing is not provided to metal strip resistor using in the case where independent substrate.This method includes being applied to insulating materials Metal strip；Application image maps technique to form the conductive pattern for being coated with resistance material, and wherein conductive pattern includes first whole End and the second opposite end；Conductive pattern is electroplated；And adjust the resistance of metal strip.

In the prior art, silver paste is used to carry out the printing of front side conductive layer and resistive layer for raw material, firing is thicker, Dosage is bigger, and cost of material is also high, will certainly bring the increase of manufacturing cost in this way.

Utility model content

The purpose of the utility model is to provide sputtering copper 0R resistors, are efficiently modified structure design, are guaranteeing product quality Under the premise of, be conducive to improve production efficiency and reduce manufacturing cost.

The purpose of this utility model will be realized by following technical measures: including insulating substrate, rear electrode, layers of copper, Protective layer, label layer, lateral conduction layer, nickel layer and tin layers；

There is layers of copper in insulating substrate front, the middle side part matcoveredn in layers of copper, in the left and right outer ledge in the insulating substrate back side There is rear electrode, there is lateral conduction layer respectively on insulating substrate left and right side outer wall, lateral conduction layer connects layers of copper and back side electricity There is nickel layer in pole in layers of copper, rear electrode and lateral conduction layer outer surface.

Especially, there is label layer in side on the protection layer.

Especially, there are tin layers on the surface of nickel layer.

The advantages of the utility model and effect: structure is improved using in insulating substrate front full wafer sputtering layers of copper, makes surface Electrode and resistive layer are connected to become entirety, are more suitable for bulk production, sputter the vacuum coating surface uniformity of formation Good, film layer structure is fine and close, and capability and performance is more stable and manufacturing cost is lower, and resistive surface heat-sinking capability is strong, and small product size is small, It effectively improves prouctiveness and significantly reduces manufacturing cost.

Detailed description of the invention

Fig. 1 is the sectional view of 0R resistance described in embodiment 1.

Appended drawing reference includes:

Insulating substrate 1, rear electrode 2, layers of copper 3, protective layer 4, label layer 5, lateral conduction layer 7, nickel layer 9, tin layers 10.

Specific embodiment

Sputtering copper 0R resistor structure in the utility model includes: insulating substrate 1, rear electrode 2, layers of copper 3, protection Layer 4, label layer 5, lateral conduction layer 7, nickel layer 9 and tin layers 10.

In the utility model, as shown in Figure 1, there is layers of copper 3 in 1 front of insulating substrate, the middle side part matcoveredn in layers of copper 3 4, there is label layer 5 on the upside of protective layer 4, left and right outer ledge has rear electrode 2 at 1 back side of insulating substrate, in insulating substrate 1 There is lateral conduction layer 7 on left and right side outer wall respectively, lateral conduction layer 7 connects layers of copper 3 and rear electrode 2, in layers of copper 3, back side electricity Pole 2 and 7 outer surface of lateral conduction layer have nickel layer 9, have tin layers 10 on the surface of nickel layer 9.

The utility model is described in further detail with reference to the accompanying drawings and examples.

Embodiment 1: on the basis of use direction, as shown in Fig. 1, sputtering copper 0R resistor specifically includes following step It is rapid:

A. an insulating substrate 1 is prepared, longitudinal direction is carved with being uniformly correspondingly formed clathrate in the front and back of the insulating substrate 1 Trace line and transverse scribes line；

B. in the back up rear electrode 2 of insulating substrate, which is located on longitudinal line of weakness, and is burnt At；

C. the front of insulating substrate 1 is cleaned with pure water, and be dried；

D. one layer of layers of copper 3 is plated in the mode of the front sputtering of insulating substrate 1；

E. the 3 printed thereon protective layer 4 of layers of copper generated in sputtering, after protective layer 4 is dried, then is being protected A label layer 5 is printed on layer 4, then is dried and is burnt into；

F. the transverse scribes line on insulating substrate 1 fractures insulating substrate 1 substrate 6 into strips, and by each strip substrate 6 It is stacked in jig by dedicated board；

G. side sputtering is carried out to each strip substrate 6 using vacuum sputtering furnace, forms lateral conduction layer 7；

H. by each strip substrate 6, line of weakness fractures to form independent 0R resistance semi-finished product 8 along longitudinal direction；

I. 0R resistance semi-finished product 8 are put into the electro-plating roller of electroplating bath, rotate electro-plating roller with setting speed, set Fixed electric current and under the conditions of the time, makes on 3 electrode of positive layers of copper, rear electrode 2 and the lateral conduction layer 7 of 0R resistance semi-finished product 8 Plating forms one layer of nickel layer 9, then again in one layer of tin layers 10 of the electroplating surface of nickel layer 9, and is formed after over cleaning and drying Finished product sputters copper 0R resistance.

Claims (3)

1. a kind of sputtering copper 0R resistor, including insulating substrate (1), rear electrode (2), layers of copper (3), protective layer (4), label layer (5), lateral conduction layer (7), nickel layer (9) and tin layers (10), which is characterized in that insulating substrate (1) front has layers of copper (3), in copper Middle side part matcoveredn (4) on layer (3), at insulating substrate (1) back side, left and right outer ledge has rear electrode (2), in insulation base Having respectively lateral conduction layer (7) on plate (1) left and right side outer wall, lateral conduction layer (7) connects layers of copper (3) and rear electrode (2), There are nickel layer (9) in layers of copper (3), rear electrode (2) and lateral conduction layer (7) outer surface.

2. sputtering copper 0R resistor as described in claim 1, which is characterized in that have label layer (5) on the upside of protective layer (4).

3. sputtering copper 0R resistor as described in claim 1, which is characterized in that have tin layers (10) on the surface of nickel layer (9).