CN102065649A - 印刷电路板的制造方法 - Google Patents

印刷电路板的制造方法 Download PDF

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Publication number
CN102065649A
CN102065649A CN2010101734451A CN201010173445A CN102065649A CN 102065649 A CN102065649 A CN 102065649A CN 2010101734451 A CN2010101734451 A CN 2010101734451A CN 201010173445 A CN201010173445 A CN 201010173445A CN 102065649 A CN102065649 A CN 102065649A
Authority
CN
China
Prior art keywords
hole
crystal layer
inculating crystal
base substrate
obturator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010101734451A
Other languages
English (en)
Chinese (zh)
Inventor
李宇镇
李珍旭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN102065649A publication Critical patent/CN102065649A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN2010101734451A 2009-11-16 2010-05-05 印刷电路板的制造方法 Pending CN102065649A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090110254A KR101069890B1 (ko) 2009-11-16 2009-11-16 인쇄회로기판 제조방법
KR10-2009-0110254 2009-11-16

Publications (1)

Publication Number Publication Date
CN102065649A true CN102065649A (zh) 2011-05-18

Family

ID=44000661

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010101734451A Pending CN102065649A (zh) 2009-11-16 2010-05-05 印刷电路板的制造方法

Country Status (2)

Country Link
KR (1) KR101069890B1 (ko)
CN (1) CN102065649A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103596383A (zh) * 2013-11-08 2014-02-19 溧阳市江大技术转移中心有限公司 一种具有交错间隔的合金柱的印刷电路板的制造方法
CN103596381A (zh) * 2013-11-08 2014-02-19 溧阳市江大技术转移中心有限公司 一种印刷电路板的制造方法
WO2018000494A1 (zh) * 2016-06-27 2018-01-04 中兴通讯股份有限公司 Pcb及其制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101286454A (zh) * 2007-04-10 2008-10-15 上海美维科技有限公司 印制电路板和集成电路封装基板的制作方法
US20090095508A1 (en) * 2007-10-16 2009-04-16 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100740436B1 (ko) * 2005-10-28 2007-07-19 주식회사 코미코 전해 도금 방식을 이용한 세라믹 소자의 전극 형성 방법
KR100722742B1 (ko) 2005-12-12 2007-05-30 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR100796524B1 (ko) * 2006-09-20 2008-01-21 삼성전기주식회사 다층 인쇄회로기판 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101286454A (zh) * 2007-04-10 2008-10-15 上海美维科技有限公司 印制电路板和集成电路封装基板的制作方法
US20090095508A1 (en) * 2007-10-16 2009-04-16 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103596383A (zh) * 2013-11-08 2014-02-19 溧阳市江大技术转移中心有限公司 一种具有交错间隔的合金柱的印刷电路板的制造方法
CN103596381A (zh) * 2013-11-08 2014-02-19 溧阳市江大技术转移中心有限公司 一种印刷电路板的制造方法
CN103596381B (zh) * 2013-11-08 2016-04-27 溧阳市江大技术转移中心有限公司 一种印刷电路板的制造方法
CN103596383B (zh) * 2013-11-08 2016-08-17 溧阳市江大技术转移中心有限公司 一种具有交错间隔的合金柱的印刷电路板的制造方法
WO2018000494A1 (zh) * 2016-06-27 2018-01-04 中兴通讯股份有限公司 Pcb及其制造方法

Also Published As

Publication number Publication date
KR101069890B1 (ko) 2011-10-05
KR20110053638A (ko) 2011-05-24

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20110518