CN102065649A - Printed circuit board manufacturing method - Google Patents
Printed circuit board manufacturing method Download PDFInfo
- Publication number
- CN102065649A CN102065649A CN2010101734451A CN201010173445A CN102065649A CN 102065649 A CN102065649 A CN 102065649A CN 2010101734451 A CN2010101734451 A CN 2010101734451A CN 201010173445 A CN201010173445 A CN 201010173445A CN 102065649 A CN102065649 A CN 102065649A
- Authority
- CN
- China
- Prior art keywords
- hole
- crystal layer
- inculating crystal
- base substrate
- obturator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a printed circuit board manufacturing method. According to an embodiment of the invention, the method comprises forming a seed crystal layer on a surface of a base substrate; providing a through hole in the base substrate, wherein the through hole penetrates through the seed crystal layer; filling conductive materials in the through hole to form via hole fillings connected to the seed crystal layer; and using the seed crystal layer as an electrode and forming circuit patterns by electroplating. In this way, as the via hole forming process is separated from the electroplating process where the circuit patterns are formed, uniform circuit patterns can be formed by electroplating.
Description
The cross reference of related application
The application requires the rights and interests to the 10-2009-0110254 korean patent application of Korea S Department of Intellectual Property submission on November 16th, 2009, and its disclosed full content is hereby expressly incorporated by reference.
Technical field
The present invention relates to make the method for printed circuit board (PCB).
Background technology
Usually, in the process of making printed circuit board (PCB), form via so that multilayer circuit is interconnected.The method of well-known formation via is to form the via obturator by the inwall that utilization is used for electroplating solution (that is the electroplating solution that, has the additive that the is used for the via obturator) electroplating ventilating hole of via obturator.
Yet, in this method, even circuit pattern on the upper surface and via form simultaneously, also may be because via filling is excessive or lack of fill departs from, this depends on the shape and the plating condition of via.Therefore, when forming circuit pattern, may be difficult to form consistent circuit pattern by plating.
Summary of the invention
The invention provides a kind of method of making printed circuit board (PCB), no matter it can form consistent circuit pattern and the size and the shape of via (via) by electroplating.
One aspect of the present invention provides a kind of method of making printed circuit board (PCB).According to one embodiment of present invention, this method is included on the surface of base substrate and forms inculating crystal layer; Form through hole (via hole) in base substrate, wherein this through hole passes inculating crystal layer; Form the via obturator by filled conductive material in this through hole, wherein this via obturator is connected to inculating crystal layer; And utilize inculating crystal layer to form circuit pattern by electroplating as electrode.
Forming the via obturator can comprise by ink jet printing filling liquid electric conducting material and make the electrically conductive liquid material of being filled solidify (harden) in through hole.
Via pad (via land) can be formed on the inside or another surface of base substrate, and the formation through hole can comprise that forming an end is switched on the through hole that the eyelet welding dish covers.
Another aspect of the present invention provides a kind of method of making printed circuit board (PCB).According to one embodiment of present invention, this method is included in the surface of base substrate and forms through hole; Form the via obturator by filled conductive material in through hole; Form inculating crystal layer on a surface of base substrate, wherein this inculating crystal layer is connected to the via obturator; And utilize inculating crystal layer to form circuit pattern by electroplating as electrode.
Forming the via obturator can comprise by ink jet printing filling liquid electric conducting material and this electrically conductive liquid material is solidified in through hole.
The via pad can be formed on the inside or another surface of base substrate, and the formation through hole can comprise that forming an end is switched on the through hole that the eyelet welding dish covers.
Other aspect of the present invention and advantage will partly be illustrated in the following description, and partly apparent from specification, perhaps can know by practice of the present invention.
Description of drawings
Fig. 1 shows the flow chart of the method for manufacturing printed circuit board (PCB) according to an embodiment of the invention.
Fig. 2 to Fig. 6 shows the sectional view of the method for manufacturing printed circuit board (PCB) according to an embodiment of the invention.
Fig. 7 to Fig. 9 shows the sectional view of the method for manufacturing printed circuit board (PCB) according to another embodiment of the invention.
Embodiment
By following accompanying drawing and description, the features and advantages of the present invention will become apparent.
Fig. 1 shows the flow chart of the method for manufacturing printed circuit board (PCB) according to an embodiment of the invention, and Fig. 2 to Fig. 6 shows the sectional view of the method for manufacturing printed circuit board (PCB) according to an embodiment of the invention.
The method of manufacturing printed circuit board (PCB) according to an embodiment of the invention comprises formation inculating crystal layer (S110), forms through hole (S120), forms via obturator (S130) and forms circuit pattern (S140).
In the step (S110) that forms inculating crystal layer, on a surface of base substrate 10, form inculating crystal layer 20.Particularly, inculating crystal layer 20 (will with the electrode that acts on plating) is stacked on the base substrate 10 by this way: can form circuit pattern 25 by electroplating in the step (S140) that forms circuit pattern, it will described subsequently.
In the present embodiment, as shown in Figure 2, provide the base substrate 10 of circuit in being formed with therein.Then, inculating crystal layer 20 is stacked on the surface of base substrate 10.
In the step (S120) that forms through hole, on base substrate 10, form the through hole 14 that passes inculating crystal layer 20.In order to make the circuit pattern 25 that will in forming the step (S140) of circuit pattern, form (its will in description subsequently) by via and another circuit layer (promptly, interior circuit or opposite side circuit layer) circuit pattern be connected to each other, the through hole 14 that passes inculating crystal layer 20 is connected to this another layer of base substrate 10.
Here, if be formed on the inside or another lip-deep circuit pattern that is formed at base substrate 10 corresponding to the via pad 12 of through hole 14, then through hole 14 can form the one end and be switched on 12 coverings of eyelet welding dish.Therefore, the via obturator 15 that forms in through hole 14 can be connected to this via pad 12.
In the present embodiment, as shown in Figure 3, formed the through hole 14 (that is the through hole of blind hole shape) that is connected with the via pad 12 of interior circuit.
In the step (S130) that forms the via obturator, form the via obturator 15 that is connected to inculating crystal layer 20 by filled conductive material 6 in through hole 14.By with through hole 14 that another circuit layer is connected in form the via obturator 15 of conduction, the circuit pattern 25 that form in the step (S140) that forms circuit pattern (its will in description subsequently) and this circuit layer can be electrically connected to each other.
Particularly, form via obturator 15, make that inculating crystal layer 20 is consistent with the height of via obturator 15 to become more easy by filled conductive material 6 in through hole 14.Therefore, can have consistent inculating crystal layer 20 (that is plane inculating crystal layer) highly by utilization and carry out the circuit pattern 25 that plating forms unanimity.
Here, as shown in Figure 4 and Figure 5, after being filled into electrically conductive liquid material 6 in the through hole 14, the electrically conductive liquid material 6 of filling is solidified, to form via obturator 15 corresponding to the height of inculating crystal layer 20 by ink jet printing.By using ink-jet printer 5 to form via obturator 15, can fast and accurately electrically conductive liquid material 6 be filled in the preformed through hole 14.In addition, solidify, can easily form a plurality of via obturators 15 by making the electric conducting material 6 that is filled in a plurality of through holes 14 simultaneously.
Yet apparently, the method that forms via obturator 15 is not limited to present embodiment, can use the various additive methods such as silk screen print method to form via obturator 15.
In the step (S140) that forms circuit pattern, form circuit pattern 25 by utilizing inculating crystal layer 20 to carry out to electroplate as electrode.As mentioned above, in the present embodiment, use inculating crystal layer 20 to carry out and electroplate, therefore can obtain consistent circuit pattern 25, as shown in Figure 6 with consistent height.Here, can be by forming circuit pattern 25 such as additive process and the various known method that removes method.
The embodiments of the invention of describing before being different from also can form consistent inculating crystal layer 20 after forming via obturator 15.
Fig. 7 to Fig. 9 shows the sectional view of the method for manufacturing printed circuit board (PCB) according to another embodiment of the invention.
In the present embodiment, in a surface of base substrate 10, form through hole 14, then in through hole 14 filled conductive material 6 to form via obturator 15.Then, be formed with therein and form the inculating crystal layer 20 that is connected to via obturator 15 on the base substrate 10 of via obturator 15.
Utilization also can have consistent inculating crystal layer 20 (that is plane inculating crystal layer) highly by use and carry out the circuit pattern 25 that plating forms unanimity according to the method for the manufacturing printed circuit board (PCB) of present embodiment.
In a possibility embodiment of the present invention, owing to the via forming process is separated with the electroplating process that forms circuit pattern, so can form consistent circuit pattern by electroplating.
In addition, can form via simply by ink jet printing.
Though described spirit of the present invention in detail with reference to specific embodiment, these embodiment only are used for the example purpose, and should not limit the present invention.Be appreciated that under the situation that does not deviate from scope and spirit of the present invention, those skilled in the art can change these embodiments or revise.
Equally, in claims, can find to be different from a plurality of embodiment of those embodiment described above.
Claims (6)
1. method of making printed circuit board (PCB), described method comprises:
On a surface of base substrate, form inculating crystal layer;
Form through hole in described base substrate, described through hole passes described inculating crystal layer;
Form the via obturator by filled conductive material in described through hole, described via obturator is connected to described inculating crystal layer; And
Utilize described inculating crystal layer to form circuit pattern by electroplating as electrode.
2. method according to claim 1, wherein, described formation via obturator comprises:
By ink jet printing filling liquid electric conducting material in described through hole; And
The electrically conductive liquid material of being filled is solidified.
3. method according to claim 1, wherein, the via pad is formed on the inside or another surface of described base substrate, and
Described formation through hole comprises the through hole that formation one end is covered by described via pad.
4. method of making printed circuit board (PCB), described method comprises:
In a surface of base substrate, form through hole;
Form the via obturator by filled conductive material in described through hole;
Form inculating crystal layer on a surface of described base substrate, described inculating crystal layer is connected to described via obturator; And
Utilize described inculating crystal layer to form circuit pattern by electroplating as electrode.
5. according to the method shown in the claim 4, wherein, described formation via obturator comprises:
By ink jet printing filling liquid electric conducting material in described through hole; And
Described electrically conductive liquid material is solidified.
6. method according to claim 4, wherein, the via pad is formed on the inside or another surface of described base substrate, and
Described formation through hole comprises the through hole that formation one end is covered by described via pad.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2009-0110254 | 2009-11-16 | ||
| KR1020090110254A KR101069890B1 (en) | 2009-11-16 | 2009-11-16 | Manufacturing method for Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102065649A true CN102065649A (en) | 2011-05-18 |
Family
ID=44000661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101734451A Pending CN102065649A (en) | 2009-11-16 | 2010-05-05 | Printed circuit board manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101069890B1 (en) |
| CN (1) | CN102065649A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103596381A (en) * | 2013-11-08 | 2014-02-19 | 溧阳市江大技术转移中心有限公司 | Method for manufacturing printed circuit board |
| CN103596383A (en) * | 2013-11-08 | 2014-02-19 | 溧阳市江大技术转移中心有限公司 | Method for manufacturing printed circuit board provided with alloy posts spaced in staggered mode |
| WO2018000494A1 (en) * | 2016-06-27 | 2018-01-04 | 中兴通讯股份有限公司 | Pcb and manufacturing method therefor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101286454A (en) * | 2007-04-10 | 2008-10-15 | 上海美维科技有限公司 | Printed circuit board and producing method of encapsulation base of integrated circuit |
| US20090095508A1 (en) * | 2007-10-16 | 2009-04-16 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method for manufacturing the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100740436B1 (en) * | 2005-10-28 | 2007-07-19 | 주식회사 코미코 | Method for forming electrode of ceramic device using electrolytic plating |
| KR100722742B1 (en) | 2005-12-12 | 2007-05-30 | 삼성전기주식회사 | Printed circuit board and the manufacturing method thereof |
| KR100796524B1 (en) * | 2006-09-20 | 2008-01-21 | 삼성전기주식회사 | Method for manufacturing multi-layer printed circuit board |
-
2009
- 2009-11-16 KR KR1020090110254A patent/KR101069890B1/en not_active IP Right Cessation
-
2010
- 2010-05-05 CN CN2010101734451A patent/CN102065649A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101286454A (en) * | 2007-04-10 | 2008-10-15 | 上海美维科技有限公司 | Printed circuit board and producing method of encapsulation base of integrated circuit |
| US20090095508A1 (en) * | 2007-10-16 | 2009-04-16 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method for manufacturing the same |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103596381A (en) * | 2013-11-08 | 2014-02-19 | 溧阳市江大技术转移中心有限公司 | Method for manufacturing printed circuit board |
| CN103596383A (en) * | 2013-11-08 | 2014-02-19 | 溧阳市江大技术转移中心有限公司 | Method for manufacturing printed circuit board provided with alloy posts spaced in staggered mode |
| CN103596381B (en) * | 2013-11-08 | 2016-04-27 | 溧阳市江大技术转移中心有限公司 | A kind of manufacture method of printed circuit board (PCB) |
| CN103596383B (en) * | 2013-11-08 | 2016-08-17 | 溧阳市江大技术转移中心有限公司 | A kind of manufacture method of the printed circuit board (PCB) of the alloy column with staggered interval |
| WO2018000494A1 (en) * | 2016-06-27 | 2018-01-04 | 中兴通讯股份有限公司 | Pcb and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110053638A (en) | 2011-05-24 |
| KR101069890B1 (en) | 2011-10-05 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110518 |