CN103596383B - A kind of manufacture method of the printed circuit board (PCB) of the alloy column with staggered interval - Google Patents
A kind of manufacture method of the printed circuit board (PCB) of the alloy column with staggered interval Download PDFInfo
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- CN103596383B CN103596383B CN201310555173.5A CN201310555173A CN103596383B CN 103596383 B CN103596383 B CN 103596383B CN 201310555173 A CN201310555173 A CN 201310555173A CN 103596383 B CN103596383 B CN 103596383B
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- core layer
- pcb
- circuit board
- printed circuit
- insulative core
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Abstract
The present invention discloses the manufacture method of a kind of printed circuit board (PCB), including: metal tin layers (3) is provided；Formation which is embedded the insulative core layer (1) of metal tin layers (3)；Form multiple signal bronze post (4)；The copper foil layer of formation on the front and back (2) at insulative core layer (1).The printed circuit board (PCB) of the present invention can improve the bond strength between insulative core layer (1) and copper foil layer (2), prevents stripping between the two, thus improves reliability and the product yield of printed circuit board (PCB).
Description
Technical field
The invention belongs to circuit board technology field, particularly to a kind of alloy with staggered interval
The manufacture method of the printed circuit board (PCB) of post.
Background technology
Printed circuit board (PCB) is the carrier that electronic device connects, and it is cheap for manufacturing cost, commonly referred to
PCB or PWB, i.e. printed circuit board (PCB) or printed wiring board, its structure generally includes insulative core layer,
It is formed at the copper foil layer on insulative core layer two sides, according to the connection needs of subsequent electronics, can be right
Copper foil layer patterns, and forms the interconnected pores such as through hole, blind hole in the printed circuit boards.
Electronic device can be concurrently formed on the two sides of printed circuit board (PCB), thus improves integration density.
Copper-clad plate (CCL) at insulative core layer two sides stacking copper foil layer is used as the lining of PCB successively
The end, copper-clad plate can according to application be divided into glass/epoxy CCL, heat stable resin CCL, paper/
Phenol CCL, high frequency CCL, flexible CCL(Kapton), compound CCL etc..Wherein
Glass/epoxy CCL is the most frequently used manufactures two-sided PCB or multi-layer PCB.
First chemical-copper-plating process is carried out to form the thin conduction carried out needed for copper plating process
Film.Carry out copper plating process afterwards and form copper foil layer.It is consequently formed copper-clad plate.But, Copper Foil
Bond strength between layer and insulative core layer may be low, thus causes copper foil layer easily from insulation
Peel off on sandwich layer, so that product has major defect.In recent years, also attempt to by roughening
The surface that insulative core layer contacts with copper foil layer to increase surface roughness, thus improve above-mentioned both
Bond strength.But its complex process, relatively costly, and thick to the coarse surface formed
Rugosity there are certain requirements, it is thus possible to realize strengthening the purpose of adhesiveness.
Summary of the invention
In view of this, the present invention is directed to problem of the prior art, it is proposed that one have staggered between
Every the manufacture method of printed circuit board (PCB) of alloy column.By to the Copper Foil of this printed circuit board (PCB) and
Bond strength between insulative core layer improves, it is possible to increase the reliability of printed circuit board (PCB),
Thus strengthen bond strength and improve product yield.
What the present invention proposed has the manufacture method of the printed circuit board (PCB) of the alloy column at staggered interval
Including:
Metal tin layers (3) is provided；
Metal tin layers (3) is placed in mould, casting insulation material in mould, thus shape
Become to which is embedded the insulative core layer (1) of metal tin layers (3)；
Laser drill or etching is utilized to initially form directly from the front and back of insulative core layer (1)
Multiple through holes to metal tin layers (3)；
Multiple signal bronze post (4), multiple signal bronze posts (4) are formed in multiple through holes
In each signal bronze post (4) of initially forming from the front of insulative core layer (1) with from insulation
Staggered interval, the position of each signal bronze post (4) that the back side of sandwich layer (1) initially forms；
And heating so that metal tin layers (3) melts, and thus makes formation in multiple through hole
Signal bronze post (4) embeds in metal tin layers (3)；And multiple signal bronze post (4) shape
Become its top and protrude from the front and back of insulative core layer (1), thus form multiple projection
Structure；
Utilize multiple bulge-structure as copper facing seed crystal structure, in the front of insulative core layer (1)
The copper foil layer (2) of multiple bulge-structure is completely covered with formation on the back side.
Accompanying drawing explanation
Fig. 1 is the sectional view of the printed circuit board (PCB) that the present invention proposes；
Fig. 2 is that the printed circuit board (PCB) that the present invention proposes is forming the sectional view before copper foil layer.
Detailed description of the invention
Embodiment 1
Describe in detail below with reference to Fig. 1 and Fig. 2 the printed circuit board (PCB) of the present invention structure and
Manufacture method.For clarity sake, the equal not drawn on scale of each structure shown in accompanying drawing, and
The present invention is not limited to structure shown in figure.
As shown in fig. 1, the printed circuit board (PCB) of the present invention includes: insulative core layer 1, embedding are absolutely
Metal tin layers 3 within edge sandwich layer 1, it is formed at the copper on the front and back of insulative core layer 1
Layers of foil 2 and the multiple signal bronze posts 4 being formed between metal tin layers 3 and copper foil layer 2.
The manufacture method of the printed circuit board (PCB) of the following description present invention.
First, it is provided that metal tin layers 3.Metallic tin is a kind of soft metal, and its fusing point is about
231 degrees Celsius.
Subsequently, metal tin layers 3 is placed in mould, casting insulation material in mould, thus
Forming the insulative core layer 1 which is embedded metal tin layers 3, the material of insulative core layer is high temperature resistant
Resin material, such as polyflon (PTFE), organic siliconresin, epoxy novolac tree
Fat (EPN), polyimide resin etc..Insulative core layer 1 should be high temperature resistant, and it melts temperature
Degree or decomposition temperature should be more than the fusing points of the metal tin layers 3 wherein embedded.
Subsequently, laser drill or etching is utilized to initially form from the front and back of insulative core layer 1
Until multiple through holes of metal tin layers 3, the position of the corresponding through hole between multiple through holes interlocks
Interval, the position of each through hole i.e. initially formed from the front of insulative core layer 1 with from insulating core
Staggered interval, the position of each through hole that the back side of layer 1 initially forms, and spacing distance is 1 micro-
-10 microns of rice, preferably 2 microns, 4 microns, 6 microns, 8 microns, 10 microns.
Subsequently, as shown in Figure 2, multiple through holes form multiple signal bronze post 4, many
Each signal bronze post 4 initially formed from the front of insulative core layer 1 in individual signal bronze post 4
And staggered interval, the position of each signal bronze post 4 initially formed from the back side of insulative core layer 1,
And spacing distance is 1 micron-10 microns, preferably 2 microns, 4 microns, 6 microns, 8 is micro-
Rice, 10 microns.And said structure is heated, heating-up temperature makes metal tin layers 3
Melt but do not make insulative core layer 1 soften and decompose, i.e. temperature range is about 230 degrees Celsius
-250 degrees Celsius, preferably 231 degrees Celsius, 235 degrees Celsius, 240 degrees Celsius, 246 Celsius
Degree.This temperature range will not produce impact to the fire resistant resin material in insulative core layer 1, because of
This can keep the chemical stability of insulative core layer 1.Owing to heating-up temperature makes metal tin layers 3 melt
Changing, the signal bronze post 4 therefore formed in multiple through holes embeds in metal tin layers 3, and copper
It is 20nm-40nm that ashbury metal post 4 embeds the degree of depth in metal tin layers 3, preferably 25nm, 30nm,
35nm, 40nm, thus make the bond strength between signal bronze post 4 and metal tin layers 3 increase
By force.And multiple signal bronze post 4 is formed as its top and protrudes from front and the back of the body of insulative core layer 1
Face, thus form multiple bulge-structure.Bulge-structure protrudes from front and the back of the body of insulative core layer 1
The height in face is 5nm-15nm, preferably 6nm, 8nm, 10nm, 13nm, 15nm.
Subsequently, utilize multiple bulge-structure as copper facing seed crystal structure, at insulative core layer 1 just
The copper foil layer 2 that multiple bulge-structure is completely covered is formed on face and the back side.So far the present invention is formed
Printed circuit board (PCB).
So far, foregoing description the most specifically understands printed circuit board (PCB) and the manufacture of the present invention
Method, the printed circuit board (PCB) prepared relative to existing method, the method that the present invention proposes prepares
Printed circuit board (PCB) can increase substantially the bond strength between copper foil layer 2 and insulative core layer 1,
Thus improve reliability and the product yield of whole printed circuit board (PCB).Embodiment described above
Only being merely the preferred embodiments of the present invention, it is not intended to limit the present invention.Art technology
The present invention without departing from the spirit of the invention, can be made any amendment by personnel, and this
The protection domain of invention is limited to the appended claims.
Claims (6)
1. there is a manufacture method for the printed circuit board (PCB) of the alloy column at staggered interval, including:
Metal tin layers (3) is provided；
Metal tin layers (3) is placed in mould, casting insulation material in mould, thus is formed and which is embedded metal tin layers (3)
Insulative core layer (1)；
Laser drill or etching is utilized to initially form from the front and back of insulative core layer (1) until multiple through holes of metal tin layers (3)；
In multiple through holes, form multiple signal bronze post (4), multiple signal bronze posts (4) are opened from the front of insulative core layer (1)
Begin each signal bronze post (4) formed and each signal bronze post (4) initially formed from the back side of insulative core layer (1)
Staggered interval, position；
And heating so that metal tin layers (3) melts, and thus makes the signal bronze post (4) formed in multiple through hole embed metallic tin
In layer (3)；And multiple signal bronze post (4) is formed as its top and protrudes from the front and back of insulative core layer (1), thus
Form multiple bulge-structure；
Multiple bulge-structure is utilized to be completely covered multiple convex as copper facing seed crystal structure, the formation on the front and back at insulative core layer (1)
Play the copper foil layer (2) of structure.
The manufacture method of printed circuit board (PCB) the most according to claim 1, is characterised by:
Heating is so that the temperature range that metal tin layers (3) melts is 230 degrees Celsius-250 degrees Celsius, and this temperature range does not make insulative core layer
(1) decomposition is softened.
The manufacture method of printed circuit board (PCB) the most according to claim 2, is characterised by:
Wherein the material of insulative core layer (1) is fire resistant resin material, and described fire resistant resin material is: polyflon
(PTFE), organic siliconresin, novolac epoxy resin (EPN) or polyimide resin.
The manufacture method of printed circuit board (PCB) the most according to claim 3, is characterised by:
The spacing distance at staggered interval is 1 micron-10 microns.
The manufacture method of printed circuit board (PCB) the most according to claim 4, is characterised by:
Multiple signal bronze posts (4) embed in metal tin layers (3), and multiple signal bronze post (4) embeds in metal tin layers (3)
The degree of depth be 20nm-40nm.
The manufacture method of printed circuit board (PCB) the most according to claim 5, is characterised by:
The height of the front and back that multiple bulge-structures protrude from insulative core layer (1) is 5nm-15nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310555173.5A CN103596383B (en) | 2013-11-08 | 2013-11-08 | A kind of manufacture method of the printed circuit board (PCB) of the alloy column with staggered interval |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310555173.5A CN103596383B (en) | 2013-11-08 | 2013-11-08 | A kind of manufacture method of the printed circuit board (PCB) of the alloy column with staggered interval |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103596383A CN103596383A (en) | 2014-02-19 |
| CN103596383B true CN103596383B (en) | 2016-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310555173.5A Active CN103596383B (en) | 2013-11-08 | 2013-11-08 | A kind of manufacture method of the printed circuit board (PCB) of the alloy column with staggered interval |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101873770A (en) * | 2009-04-21 | 2010-10-27 | 中山市兴达电路板有限公司 | Electroplating copper plughole process of circuit board |
| CN201639855U (en) * | 2010-04-09 | 2010-11-17 | 聚鼎科技股份有限公司 | Radiating printed circuit board structure |
| CN102065649A (en) * | 2009-11-16 | 2011-05-18 | 三星电机株式会社 | Printed circuit board manufacturing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004288748A (en) * | 2003-03-19 | 2004-10-14 | Sumitomo Bakelite Co Ltd | Method of manufacturing wiring board |
| US7029761B2 (en) * | 2003-04-30 | 2006-04-18 | Mec Company Ltd. | Bonding layer for bonding resin on copper surface |
-
2013
- 2013-11-08 CN CN201310555173.5A patent/CN103596383B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101873770A (en) * | 2009-04-21 | 2010-10-27 | 中山市兴达电路板有限公司 | Electroplating copper plughole process of circuit board |
| CN102065649A (en) * | 2009-11-16 | 2011-05-18 | 三星电机株式会社 | Printed circuit board manufacturing method |
| CN201639855U (en) * | 2010-04-09 | 2010-11-17 | 聚鼎科技股份有限公司 | Radiating printed circuit board structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103596383A (en) | 2014-02-19 |
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Effective date of registration: 20170726 Address after: Licheng Town East Street Liyang city 213300 Jiangsu city of Changzhou province No. 182 Patentee after: Liyang Technology Development Center Address before: Li Town of Liyang City, Jiangsu province 213300 Changzhou City Dongmen Street No. 67 Patentee before: LIYANG JIANGDA TECHNOLOGY TRANSFER CENTER CO., LTD. |
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