JP2014192354A - Method for manufacturing component mounting printed-wiring board and component mounting printed-wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve connection reliability of a via electrically connecting an electronic component and a wiring layer by stabilizing a shape of the via.SOLUTION: A method for manufacturing a component mounting printed-wiring board according to an embodiment comprises the steps of: preparing a metal-clad laminate 3 including an insulating base material 4 having principal surfaces 4a and 4b and a metal foil 5 provided on the principal surface 4b of the insulating base material 4; forming an adhesive layer 6 having a larger plane size than an electronic component 2 on the principal surface 4a of the insulating base material 4; increasing the viscosity of the adhesive layer 6 till the adhesive layer reaches the viscosity of a prescribed range; mounting the electronic component 2 on the adhesive layer 6 with the increased viscosity; hardening the adhesive layer 6 so that the electronic component 2 is fixed to the insulating base material 4 via the adhesive layer 6; forming a through hole 7 which penetrates the insulating base material 4 and the adhesive layer 6 in a thickness direction and in which a terminal part 2a of the electronic component 2 is exposed on a bottom surface thereof by laser processing; and forming a via 8 electrically connecting the metal foil 5 and the terminal part 2a of the electronic component 2.

Description

  The present invention relates to a method for manufacturing a component-mounted printed wiring board, more specifically, a surface-mount type electronic component is mounted on one main surface of an insulating substrate, and a wiring layer is formed on the other main surface. TECHNICAL FIELD The present invention relates to a method for manufacturing a component-mounted printed wiring board provided with vias that electrically connect the wiring layer, and a component-mounted printed wiring board.

  Along with the recent downsizing, thinning, and high functionality of electronic devices, there has been an increasing trend to increase the functionality of printed wiring boards by mounting electronic components on printed wiring boards at high density. Under such circumstances, a component built-in multilayer printed wiring board in which an electronic component is embedded is known.

  According to this component built-in multilayer printed wiring board, since the electronic components (semiconductor chip, capacitor, etc.) are embedded inside, the area of the printed wiring board can be reduced. In addition, since the degree of freedom for arranging electronic components is higher than in the case of a normal printed wiring board, a plurality of components can be connected at the shortest distance. As a result, parasitic inductance and the like are reduced, and high-frequency characteristics can be improved.

  In a component built-in multilayer printed wiring board, securing the connection reliability of vias that electrically connect a built-in component and an outer wiring layer is important in improving the yield.

  In Patent Document 1, for a component built-in multilayer printed wiring board in which a plurality of electronic components having different thicknesses are embedded, the heights of the electronic components are made uniform by using concave portions and spacer members provided on the substrate, and the via depth is made uniform. Thus, a technique for improving the yield is described.

JP 2004-128002 A

  However, when the method of Patent Document 1 is adopted, it is necessary to provide a recess in the substrate or fix a spacer, so that the manufacturing process becomes complicated and there is a concern about an increase in manufacturing cost.

  Even if the depth of the via is made constant, unless the mounting position accuracy of the electronic component is ensured, the via connection reliability cannot be ensured and the yield cannot be improved. This will be described in detail with reference to FIG. FIG. 4 is a process cross-sectional view of a conventional multilayer printed wiring board with built-in components.

  First, a single-sided copper clad laminate 103 having an insulating base 104 made of polyimide, glass epoxy, or the like and a copper foil 105 provided on one side of the insulating base 104 is prepared. Then, by etching the copper foil 105, a conformal mask 105a for forming vias is formed as shown in FIG.

  Next, using an alignment target mark formed simultaneously with the conformal mask 105a, as shown in FIG. 4A, an adhesive is printed at a predetermined position of the insulating base 104, and the adhesive layer 106 is formed. Form. The adhesive layer 106 has a larger planar size than the electronic component 102 mounted on the adhesive layer 106. The planar size of the electronic component 102 is, for example, 0.6 mm × 0.3 mm. The planar size of the terminal part (electrode) 102a of the electronic component 102 is about 0.2 mm × 0.3 mm.

  Next, as shown in FIG. 4A, the surface-mount type electronic component 102 is mounted on the adhesive layer 106 with a mounter, and the adhesive layer 106 is thermally cured until the electronic component 102 is fixed. When the adhesive layer 106 is thermally cured, the mounting position of the electronic component 103 may be shifted as can be seen from FIGS. 4 (1) and 4 (2). This misalignment is considered to occur when the adhesive layer 106 is once reduced in viscosity before the start of curing and then cured unevenly.

  Next, a component filler 109 and a single-sided copper clad laminate 110 are prepared. The single-sided copper-clad laminate 110 has an insulating base 110a and a copper foil 110b provided on one side of the insulating base 110a. 4 (2), a single-sided copper-clad laminate 103 on which electronic components 102 are mounted, a component filler 109, and a single-sided copper-clad laminate 110 are laminated to form a laminate. The laminate is heated and pressed to integrate.

Next, as shown in FIG. 4C, a through hole 107 for forming a via is formed by CO ₂ laser processing using a conformal mask 105a. Further, a through hole 112 for forming a plated through hole is formed by a drill. Since the mounting position of the electronic component 102 is shifted from the initial position in the process of curing the adhesive layer 106 as described above, a portion other than the terminal portion 102a of the electronic component 102 (adhesive) Layer 106, component filler 109, main body of electronic component 102, etc.) are exposed.

  Next, as shown in FIG. 4 (4), after the desmear process using permanganic acid or the like is performed on the through holes 107 and 112, the conductive process and the subsequent electrolytic copper plating process are performed. A film 113 is formed. Thereafter, a conductive layer made of a copper foil and a copper plating film is patterned using a known photofabrication technique to form a wiring layer (not shown).

  When the component built-in multilayer printed wiring board is manufactured by the above manufacturing method, the mounting position of the electronic component 102 is shifted when the adhesive layer 106 is thermally cured, so that the adhesive layer is formed on the inner wall of the through hole 107 for forming the via. 106, component filler 109, etc. may be exposed. In such a case, since the shape of the via 108 is not stable, the connection reliability of the via 108 is lowered, leading to a reduction in the yield of the component built-in multilayer printed wiring board.

  If the electronic component 102 is mounted immediately above the adhesive layer 106 after making the plane size of the adhesive layer 106 exactly the same as that of the electronic component 102, the positional deviation of the electronic component 102 is reduced. However, this is practically difficult from the viewpoint of the printing accuracy of the adhesive and the mounting accuracy of the electronic components.

  Further, it is conceivable that the planar size of the adhesive layer 106 is made smaller than that of the electronic component 102 so that the adhesive layer 106 is in contact with the main body between the terminal portions 102 a and 102 a of the electronic component 102. By doing in this way, when the adhesive layer 106 is lowered in viscosity, it is difficult for the electronic component 102 to be displaced. However, in consideration of the printing accuracy of the adhesive and the mounting accuracy of the electronic component, it is necessary to make the plane size of the printed adhesive layer 106 extremely small compared to the electronic component 102, and such a small area adhesive layer It is practically difficult to form 106 stably.

  The present invention has been made based on the above technical recognition, and aims to stabilize the shape of a via that electrically connects an electronic component and a wiring layer, and to improve the connection reliability of the via. .

A method for manufacturing a component-mounted printed wiring board according to an aspect of the present invention includes:
A method for manufacturing a component-mounted printed wiring board on which surface-mounted electronic components are mounted,
A metal-clad having an insulating base material having a first main surface and a second main surface opposite to the first main surface, and a metal foil provided on the second main surface of the insulating base material Preparing a laminate, and
An adhesive layer forming step of forming an adhesive layer having a larger plane size than the electronic component on the first main surface of the insulating base;
A viscosity increasing step for increasing the viscosity of the adhesive layer until a predetermined range of viscosity is achieved;
An electronic component mounting step of mounting the electronic component on the adhesive layer having a high viscosity;
A curing step of curing the adhesive layer so that the electronic component is fixed to the insulating substrate via the adhesive layer;
A laser processing step of forming a through hole through the insulating base material and the adhesive layer in the thickness direction and exposing the terminal portion of the electronic component on the bottom surface by laser processing;
Forming a via for electrically connecting the metal foil and the terminal portion of the electronic component;
It is characterized by providing.

The component-mounted printed wiring board according to one aspect of the present invention is
An insulating substrate having a first main surface and a second main surface opposite to the first main surface;
An adhesive layer formed on the first main surface of the insulating substrate;
A surface-mounted electronic component having a smaller planar size than the adhesive layer and fixed to the insulating substrate via the adhesive layer;
A wiring layer provided on the second main surface of the insulating base;
A via that penetrates the insulating base material and the adhesive layer in the thickness direction and is provided in a through hole in which the terminal portion of the electronic component is exposed on the bottom surface, and electrically connects the terminal portion and the wiring layer. When,
With
The adhesive layer has a viscosity increased to a predetermined range before the electronic component is mounted, and is solidified after the electronic component is mounted.

  In the present invention, the viscosity of the adhesive layer is increased before mounting the electronic component, and the adhesive layer is solidified after mounting the electronic component. Thereby, when the electronic component is fixed to the metal-clad laminate via the adhesive layer, it is possible to prevent the electronic component from being displaced and improve the mounting accuracy of the electronic component. Therefore, according to the present invention, the via shape can be stabilized and the connection reliability of the via can be improved.

It is process sectional drawing for demonstrating the manufacturing method of the component mounting printed wiring board which concerns on one Embodiment of this invention. It is process sectional drawing for demonstrating the manufacturing method of the component mounting printed wiring board which concerns on one Embodiment of this invention following FIG. (A) is sectional drawing of the component mounting printed wiring board which concerns on one Embodiment of this invention, (b) is a top view of the metal-clad laminated board in the electronic component mounting state of FIG. 1 (2). It is process sectional drawing for demonstrating the manufacturing method of the conventional component mounting printed wiring board.

  Embodiments of the present invention will be described below with reference to the drawings. In addition, in each figure, the component which has an equivalent function is attached | subjected the same code | symbol, and detailed description of the component of the same code | symbol is not repeated. Further, the drawings are schematic and show mainly the characteristic portions according to the embodiment, and the relationship between the thickness and the planar dimension, the ratio of the thickness of each layer, and the like are different from the actual ones.

  With reference to FIGS. 1-3, the manufacturing method of the component mounting printed wiring board 1 which concerns on one Embodiment of this invention is demonstrated. FIG. 1 is a process cross-sectional view for explaining a method for manufacturing the component-mounted printed wiring board 1. FIG. 2 is a process cross-sectional view for explaining the manufacturing method of the component-mounted printed wiring board 1 following FIG. FIG. 3A is a cross-sectional view of the component-mounted printed wiring board 1. FIG.3 (b) has shown the top view of the metal-clad laminated board in the electronic component mounting state of FIG.1 (2).

  First, as shown in FIG. 1 (1), an insulating base 4 having a main surface 4a and a main surface 4b opposite to the main surface 4a, and a metal foil 5 provided on the main surface 4b of the insulating base 4, A metal-clad laminate 3 having is prepared. Here, a single-sided copper clad laminate having a 25 μm-thick polyimide film as the insulating base material 4 and a 12 μm-thick electrolytic copper foil as the metal foil 5 was prepared.

  The insulating base 4 may be made of a flexible substrate material such as polyimide, or a hard substrate material such as glass epoxy or aramid material.

  Next, as shown in FIG. 1A, a conformal mask 5 a (for example, φ70 μm) for forming vias is formed on the metal foil 5 of the metal-clad laminate 3. At this time, it is preferable to form target marks (component mounting targets and the like) for various alignments. Note that the patterning of the metal foil 5 in this step is performed by, for example, a photofabrication technique.

  Next, as shown in FIG. 1A, an adhesive layer 6 is formed on the main surface 4a of the insulating base 4 (adhesive layer forming step). The adhesive layer 6 is formed by printing an adhesive on the main surface 4a of the insulating substrate 4 using various printing methods such as screen printing, ink jet printing, dispensing method, transfer method and the like. Here, the epoxy layer thermosetting adhesive (EW2083) manufactured by 3M was screen printed on the insulating substrate 4 to form the adhesive layer 6. Further, the opening of the printing plate (plate opening) was set to 0.4 mm × 0.1 mm with respect to the surface-mount type electronic component 2 having a planar size of 0.6 mm × 0.3 mm. Moreover, the thickness of the adhesive bond layer 6 is 30 micrometers, for example.

  The adhesive layer 6 has a larger planar size than the electronic component 2 mounted on the metal-clad laminate 3. Here, the adhesive layer 6 having a planar size of 0.8 mm × 0.5 mm was formed on the electronic component 2 having the planar size.

  The adhesive layer 6 is not limited to being formed by a printing method. For example, the adhesive layer 6 may be formed by patterning the adhesive sheet after bonding the adhesive sheet to the insulating substrate 4 so as to cover the main surface 4a.

  Next, the adhesive layer 6 is increased in viscosity until reaching a predetermined range of viscosity (high viscosity step). This predetermined range is preferably 8500 mPa · s to 20000 mPa · s. When the pressure is 8500 mPa · s or less, the electronic component 2 may be displaced after mounting due to insufficient viscosity of the adhesive layer 6. On the other hand, in the case of 20000 mPa · s or more, since the curing of the adhesive layer 6 has progressed, there is a possibility that the adhesive strength between the electronic component 2 and the adhesive layer 6 is not sufficiently ensured.

  When the adhesive layer 6 is made of a thermosetting adhesive, the adhesive layer 6 is made highly viscous by heating under a predetermined condition (for example, 50 ° C./10 minutes).

  As described above, by increasing the viscosity of the adhesive layer 6 before mounting the electronic component 2, it is possible to prevent positional displacement of the electronic component 2 after mounting and improve mounting accuracy.

  Next, as shown in FIG. 1 (2), the electronic component 2 is mounted on the adhesive layer 6 having a high viscosity. At this time, as shown in FIG. 3B, the electronic component 2 is mounted so that the conformal mask 5 a is included in the terminal portion (electrode) 2 a of the electronic component 2 when viewed in the thickness direction of the metal-clad laminate 3. To do. Preferably, the electronic component 2 is mounted so that the conformal mask 5a overlaps the central portion of the terminal portion 2a when viewed in the thickness direction of the metal-clad laminate 3.

  The electronic component 2 is mounted based on the position of the target mark by recognizing the target mark (component mounting target) formed simultaneously with the conformal mask 5a.

  Next, the adhesive layer 6 is cured so that the electronic component 2 is fixed to the insulating substrate 4 via the adhesive layer 6. When the adhesive layer 6 is made of a thermosetting adhesive, the adhesive layer 6 is cured by heating under a predetermined condition (for example, 120 ° C./30 minutes). The heating temperature in the main curing step is higher than the heating temperature in the high viscosity step. Further, the heating time in the main curing step is longer than the heating time in the high viscosity step.

  That is, in the viscosity increasing step, the adhesive layer 6 is increased in viscosity by heating under the conditions of the first temperature and the first time, and in the curing step, the second temperature higher than the first temperature and The adhesive layer 6 is heated under the condition of a second time longer than the first time.

  Next, the component filler 9 and the metal-clad laminate 10 are prepared. The component filler 9 is an adhesive in a cured intermediate state (B stage), and is preferably made of a material having the same composition as the adhesive layer 6. However, in order to ensure flatness as a component built-in multilayer printed wiring board, the component filler 9 preferably contains a filler. The metal-clad laminate 10 includes an insulating base 10a and a metal foil 10b provided on the insulating base 10a. As the metal-clad laminate 10, the same metal-clad laminate 3 may be used.

  Then, as shown in FIG. 1 (3) and FIG. 2 (4), a component filler 9 is laminated on the metal-clad laminate 1 so as to embed the electronic component 2, and on this component filler 9 The metal-clad laminate 10 is laminated. Thereby, a laminated body is formed, and this laminated body is integrated by heating and pressing. Here, the lamination temperature (heating temperature) was 175 ° C., the lamination pressure (pressurization pressure) was 2.0 MPa, and the lamination time was 60 minutes.

  Next, as shown in FIG. 2 (5), through holes 7 are formed by laser processing (laser processing step). The through hole 7 is a conduction hole for forming a via, penetrates the insulating base material 4 and the adhesive layer 6 in the thickness direction, and the terminal portion 2a of the electronic component 2 is exposed on the bottom surface. .

  In this laser processing step, the through-hole 7 is formed by removing the insulating base material 4 and the adhesive layer 6 exposed to the conformal mask 5a by a so-called conformal laser processing method.

Although the CO ₂ laser is used here, the present invention is not limited to this, and other lasers (UV-YAG laser, excimer laser, etc.) may be used.

  As shown in FIG. 2 (5), a through-hole 12 that penetrates the metal-clad laminate 3, the component filler 9, and the metal-clad laminate 10 in the thickness direction may be formed using a drill or the like. .

  Next, as shown in FIG. 2 (6), a via 8 that electrically connects the metal foil 5 and the terminal portion 2 a of the electronic component 2 is formed. Specifically, a desmear process is performed to remove resin residues in the through holes 7 and 12, and then a conductive process and a subsequent plating process (for example, electrolytic copper plating process) are performed. Thereby, the plating film 13 is formed on the inner walls of the through holes 7 and 12 and the metal foils 5 and 10b. Here, the thickness of the plating film 13 was 20 μm. The plating film 13 formed on the inner wall of the through hole 7 constitutes a via 8 that electrically connects the electronic component 2 and the metal foil 5. Further, the plating film 13 formed on the inner wall of the through hole 12 constitutes a plated through hole 14 that electrically connects the metal foil 5 and the metal foil 10b.

  Next, as shown in FIG. 3A, the wiring layer 11A is formed by patterning the conductive film composed of the metal foil 5 and the plating film 13 using a photofabrication technique. Similarly, the conductive layer made of the metal foil 10b and the plating film 13 is patterned to form the wiring layer 11B.

  Through the above steps, the component-mounted printed wiring board 1 shown in FIG. This component mounting printed wiring board 1 has an insulating base 4, an adhesive layer 6 formed on the main surface 4 a of the insulating base 4, and a planar size smaller than the adhesive layer 6. The surface-mount type electronic component 2 fixed to the insulating base 4 via the wiring layer 11A provided on the main surface 4b of the insulating base 4, the insulating base 4 and the adhesive layer 6 in the thickness direction. It is provided in the through hole 7 that penetrates and the terminal portion 2a of the electronic component 2 is exposed on the bottom surface, and includes a via 8 that electrically connects the terminal portion 2a and the wiring layer 11, and the adhesive layer 6 is The viscosity is increased until the viscosity reaches a predetermined range before the electronic component 2 is mounted, and is solidified after the electronic component 2 is mounted.

  As shown in FIG. 3A, the electronic component 2 is embedded in a component filler 9 provided on the main surface 4a of the insulating substrate 4, and the component-mounted printed wiring board 1 has a built-in component. It is a multilayer printed wiring board. However, the present invention is not limited to a component built-in multilayer printed wiring board, but can be applied to a component mounting printed wiring board provided with a via for electrically connecting an electronic component and a wiring layer.

  As described above, in this embodiment, the viscosity of the adhesive layer 6 is increased before the electronic component 2 is mounted, and the adhesive layer 6 is solidified after the electronic component 2 is mounted. Thereby, when the electronic component 2 is fixed to the metal-clad laminate 3 via the adhesive layer 6, it is possible to prevent the electronic component 2 from being displaced and improve the mounting accuracy of the electronic component 2. . For this reason, only the terminal portion 2a of the electronic component 2 is exposed on the bottom surface of the through hole 7 for forming the via 8, and other portions (such as the adhesive layer 6) can be prevented from being exposed.

  Therefore, according to the present embodiment, the shape of the via 8 can be stabilized and the connection reliability of the via 8 can be improved. As a result, the yield of the component mounting printed wiring board 1 can be improved.

  In addition, it is preferable that the adhesive bond layer 6 consists of an adhesive agent which does not contain a filler. As a result, when the electronic component 2 is mounted on the adhesive layer 6, the electronic component 2 is mounted inclined with respect to the insulating substrate 4 with a filler sandwiched between the adhesive layer 6 and the electronic component 2. Nothing will happen. That is, the film thickness of the adhesive layer 6 is made uniform by not containing the filler, and the electronic component 2 is mounted substantially parallel to the insulating base 4. Therefore, the shape of the via 8 is stabilized, and the connection reliability of the via 8 can be further improved.

  Further, the metal-clad laminate 3 is not limited to a single-sided metal-clad laminate, and may be a double-sided metal-clad laminate in which a metal foil is also provided on the main surface 4a of the insulating base 4. Similarly, the metal-clad laminate 10 is not limited to a single-sided metal-clad laminate, and may be a double-sided metal-clad laminate in which metal foils are provided on both sides of the insulating substrate 10a.

  In the description of the above embodiment, the through hole 7 for forming the via 8 is formed by a conformal processing method using the metal foil 5 as a metal mask. However, the present invention is not limited to this, for example, a direct laser processing method. The through hole 7 may be formed by the above.

  When the direct laser processing method is used, in the laser processing step, the metal foil 5 of the metal-clad laminate 3 is directly irradiated with laser light to form the through hole 7. More specifically, using a target mark (laser target) formed by patterning the metal foil 5, a predetermined position of the metal foil 5 is irradiated with laser light, and the metal foil 5, the insulating base material 4, and the adhesive layer. By removing 6, a through hole 7 is formed.

  In the description of the above embodiment, the thermosetting adhesive is used as the adhesive, but the present invention is not limited to this. For example, a UV curable adhesive may be used. In this case, first, in the adhesive layer forming step, the adhesive layer 6 is formed by printing or applying a UV curable adhesive on the main surface 4 a of the insulating substrate 4. Thereafter, in the viscosity increasing step, the adhesive layer 6 is increased in viscosity by irradiating UV light under the conditions of the first light amount and the first time, and in the curing step, the second amount that is larger than the first light amount. The adhesive layer 6 is solidified by irradiating with UV light under the condition of the amount of light and the second time longer than the first time, and the electronic component 2 is fixed to the insulating substrate 4.

  Based on the above description, those skilled in the art may be able to conceive additional effects and various modifications of the present invention, but the aspects of the present invention are not limited to the above-described embodiments. Various additions, modifications, and partial deletions can be made without departing from the concept and spirit of the present invention derived from the contents defined in the claims and equivalents thereof.

DESCRIPTION OF SYMBOLS 1 Component mounting printed wiring board 2 Electronic component 2a Terminal part 3 Metal-clad laminated board 4 Insulation base material 4a, 4b Main surface 5 Metal foil 5a Conformal mask 6 Adhesive layer 7 Through-hole 8 Via 9 Component filler 10 ) Metal-clad laminate 10a Insulating substrate 10b Metal foils 11A, 11B Wiring layer 12 Through hole 13 Plating film 14 Plating through hole 102 Electronic component 102a Terminal portion 103 Single-sided copper-clad laminate 104 Insulating substrate 105 Copper foil 105a Conformal mask 106 Adhesive layer 107 Through hole 108 Via 109 Component filler 110 Single-sided copper clad laminate 110a Insulating substrate 110b Copper foil 112 Through hole 113 Copper plating film 114 Plating through hole

Claims (11)

A method for manufacturing a component-mounted printed wiring board on which surface-mounted electronic components are mounted,
A metal-clad having an insulating base material having a first main surface and a second main surface opposite to the first main surface, and a metal foil provided on the second main surface of the insulating base material Preparing a laminate, and
An adhesive layer forming step of forming an adhesive layer having a larger plane size than the electronic component on the first main surface of the insulating base;
A viscosity increasing step for increasing the viscosity of the adhesive layer until a predetermined range of viscosity is achieved;
An electronic component mounting step of mounting the electronic component on the adhesive layer having a high viscosity;
A curing step of curing the adhesive layer so that the electronic component is fixed to the insulating substrate via the adhesive layer;
A laser processing step of forming a through hole through the insulating base material and the adhesive layer in the thickness direction and exposing the terminal portion of the electronic component on the bottom surface by laser processing;
Forming a via for electrically connecting the metal foil and the terminal portion of the electronic component;
A method for manufacturing a component-mounted printed wiring board, comprising:   The said adhesive bond layer consists of an adhesive agent which does not contain a filler, The manufacturing method of the component mounting printed wiring board of Claim 1 characterized by the above-mentioned.   The method for manufacturing a component-mounted printed wiring board according to claim 1, wherein the predetermined range is 8500 mPa · s to 20000 mPa · s. In the adhesive layer forming step, the adhesive layer is formed by printing a thermosetting adhesive on the first main surface of the insulating base,
In the viscosity increasing step, the adhesive layer is increased in viscosity by heating at a first temperature and a first time condition,
In the curing step, the electronic component is fixed by heating at a second temperature higher than the first temperature and a second time longer than the first time. Item 4. A method for manufacturing a component-mounted printed wiring board according to any one of Items 1 to 3. In the adhesive layer forming step, the adhesive layer is formed by printing a UV curable adhesive on the first main surface of the insulating base,
In the step of increasing the viscosity, the adhesive layer is increased in viscosity by irradiating with UV light under the conditions of the first light amount and the first time,
In the curing step, the electronic component is fixed by irradiating UV light under a condition of a second light amount larger than the first light amount and a second time longer than the first time. The manufacturing method of the component mounting printed wiring board in any one of Claims 1-3. After the curing step,
A laminate is formed by laminating a component filler on the metal-clad laminate so as to embed the electronic component, and laminating another metal-clad laminate on the component filler, and the laminate The method for producing a component-mounting printed wiring board according to claim 1, further comprising a step of heating and pressing to integrate the components. Further comprising forming a conformal mask on the metal foil of the metal-clad laminate,
In the electronic component mounting step, the electronic component is mounted on the adhesive layer so that the conformal mask is included in the terminal portion of the electronic component when viewed in the thickness direction of the metal-clad laminate. ,
The said laser processing process WHEREIN: The said through-hole is formed by removing the said insulation base material and the said adhesive bond layer which were exposed to the said conformal mask. Manufacturing method of component mounting printed wiring board.   In the laser processing step, the through-hole is formed by irradiating the metal foil of the metal-clad laminate with laser light to remove the metal foil, the insulating base material, and the adhesive layer. The manufacturing method of the component mounting printed wiring board in any one of Claims 1-6. An insulating substrate having a first main surface and a second main surface opposite to the first main surface;
An adhesive layer formed on the first main surface of the insulating substrate;
A surface-mounted electronic component having a smaller planar size than the adhesive layer and fixed to the insulating substrate via the adhesive layer;
A wiring layer provided on the second main surface of the insulating base;
A via that penetrates the insulating base material and the adhesive layer in the thickness direction and is provided in a through hole in which the terminal portion of the electronic component is exposed on the bottom surface, and electrically connects the terminal portion and the wiring layer. When,
With
The component mounting print, wherein the adhesive layer has a viscosity increased to a predetermined range before the electronic component is mounted, and is solidified after the electronic component is mounted. Wiring board.   The component-mounting printed wiring board according to claim 9, wherein the adhesive layer is made of an adhesive containing no filler.   11. The component-mounted printed wiring board according to claim 9, wherein the electronic component is embedded in a component filler provided on the first main surface of the insulating substrate.

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