CN102046344A - 处理多基底的装置和方法 - Google Patents

处理多基底的装置和方法 Download PDF

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Publication number
CN102046344A
CN102046344A CN2009801165598A CN200980116559A CN102046344A CN 102046344 A CN102046344 A CN 102046344A CN 2009801165598 A CN2009801165598 A CN 2009801165598A CN 200980116559 A CN200980116559 A CN 200980116559A CN 102046344 A CN102046344 A CN 102046344A
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CN
China
Prior art keywords
substrate
table top
station
cutting
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801165598A
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English (en)
Chinese (zh)
Inventor
丁锺才
张德春
河昌焕
林仲振
白承昊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rokko Ventures Pte Ltd
Original Assignee
Rokko Ventures Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Ventures Pte Ltd filed Critical Rokko Ventures Pte Ltd
Publication of CN102046344A publication Critical patent/CN102046344A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
CN2009801165598A 2008-05-02 2009-05-04 处理多基底的装置和方法 Pending CN102046344A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SG200803452-2A SG142402A1 (en) 2008-05-02 2008-05-02 Apparatus and method for multiple substrate processing
SG200803452-2 2008-05-02
PCT/SG2009/000158 WO2009134212A1 (en) 2008-05-02 2009-05-04 Apparatus and method for multiple substrate processing

Publications (1)

Publication Number Publication Date
CN102046344A true CN102046344A (zh) 2011-05-04

Family

ID=41255265

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801165598A Pending CN102046344A (zh) 2008-05-02 2009-05-04 处理多基底的装置和方法

Country Status (6)

Country Link
US (1) US20110036339A1 (https=)
JP (1) JP5420640B2 (https=)
KR (1) KR20110013440A (https=)
CN (1) CN102046344A (https=)
SG (1) SG142402A1 (https=)
WO (1) WO2009134212A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310765B1 (ko) * 2012-02-29 2013-09-25 주식회사 에스에프에이 가요성 기판 절단장치
KR200472836Y1 (ko) * 2012-07-06 2014-05-27 프로브 테크놀로지 코포레이션 절삭 유닛 및 그 응용설비
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0186201A2 (en) * 1984-12-27 1986-07-02 Disco Abrasive Systems, Ltd. Semiconductor wafer dicing machine
CN1411963A (zh) * 2001-10-12 2003-04-23 株式会社迪斯科 切割机
CN1422791A (zh) * 2001-12-03 2003-06-11 日东电工株式会社 半导体晶片传输方法及采用该方法的半导体晶片传输装置
KR20040087524A (ko) * 2003-04-08 2004-10-14 한미반도체 주식회사 반도체 스트립 소잉장치 및 이를 구비한 반도체 패키지의싱귤레이션 장치
CN101001730A (zh) * 2001-05-05 2007-07-18 派美卡私人有限公司 双向分割锯及其方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6826986B2 (en) * 2001-05-05 2004-12-07 Ah Beng Lim Bi-directional singulation system and method
JP3765265B2 (ja) * 2001-11-28 2006-04-12 株式会社東京精密 ダイシング装置
JP4315788B2 (ja) * 2003-11-26 2009-08-19 アピックヤマダ株式会社 半導体装置の製造方法及び製造装置
JP2005347421A (ja) * 2004-06-01 2005-12-15 Apic Yamada Corp 半導体装置の製造方法及び装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0186201A2 (en) * 1984-12-27 1986-07-02 Disco Abrasive Systems, Ltd. Semiconductor wafer dicing machine
CN101001730A (zh) * 2001-05-05 2007-07-18 派美卡私人有限公司 双向分割锯及其方法
CN1411963A (zh) * 2001-10-12 2003-04-23 株式会社迪斯科 切割机
CN1422791A (zh) * 2001-12-03 2003-06-11 日东电工株式会社 半导体晶片传输方法及采用该方法的半导体晶片传输装置
KR20040087524A (ko) * 2003-04-08 2004-10-14 한미반도체 주식회사 반도체 스트립 소잉장치 및 이를 구비한 반도체 패키지의싱귤레이션 장치

Also Published As

Publication number Publication date
JP5420640B2 (ja) 2014-02-19
JP2011520256A (ja) 2011-07-14
US20110036339A1 (en) 2011-02-17
SG142402A1 (en) 2009-11-26
WO2009134212A1 (en) 2009-11-05
KR20110013440A (ko) 2011-02-09

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20110504