CN102045961A - 等长金手指的镀金方法 - Google Patents
等长金手指的镀金方法 Download PDFInfo
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- CN102045961A CN102045961A CN 201010609053 CN201010609053A CN102045961A CN 102045961 A CN102045961 A CN 102045961A CN 201010609053 CN201010609053 CN 201010609053 CN 201010609053 A CN201010609053 A CN 201010609053A CN 102045961 A CN102045961 A CN 102045961A
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- gold
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CN2010106090535A CN102045961B (zh) | 2010-12-28 | 2010-12-28 | 等长金手指的镀金方法 |
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CN2010106090535A CN102045961B (zh) | 2010-12-28 | 2010-12-28 | 等长金手指的镀金方法 |
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CN102045961A true CN102045961A (zh) | 2011-05-04 |
CN102045961B CN102045961B (zh) | 2012-07-18 |
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CN2010106090535A Expired - Fee Related CN102045961B (zh) | 2010-12-28 | 2010-12-28 | 等长金手指的镀金方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102522342A (zh) * | 2011-12-27 | 2012-06-27 | 日月光半导体制造股份有限公司 | 半导体结构及其制造方法 |
CN104427789A (zh) * | 2013-08-22 | 2015-03-18 | 富葵精密组件(深圳)有限公司 | 多层电路板及其制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080302468A1 (en) * | 2007-06-06 | 2008-12-11 | Rajwant Singh Sidhu | Multilayer printed wiring boards with holes requiring copper wrap plate |
CN101594743A (zh) * | 2008-05-28 | 2009-12-02 | 江苏苏杭电子有限公司 | 用掩盖法制作电子线路板外层图形的方法 |
CN101624715A (zh) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | 无镀金引线选择性电镀厚金工艺流程 |
CN101699940A (zh) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | 一种金手指印制板的制作方法 |
CN101702869A (zh) * | 2009-10-30 | 2010-05-05 | 陈国富 | 由无覆铜的绝缘基板直接制作线路板的方法 |
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2010
- 2010-12-28 CN CN2010106090535A patent/CN102045961B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080302468A1 (en) * | 2007-06-06 | 2008-12-11 | Rajwant Singh Sidhu | Multilayer printed wiring boards with holes requiring copper wrap plate |
CN101594743A (zh) * | 2008-05-28 | 2009-12-02 | 江苏苏杭电子有限公司 | 用掩盖法制作电子线路板外层图形的方法 |
CN101624715A (zh) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | 无镀金引线选择性电镀厚金工艺流程 |
CN101702869A (zh) * | 2009-10-30 | 2010-05-05 | 陈国富 | 由无覆铜的绝缘基板直接制作线路板的方法 |
CN101699940A (zh) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | 一种金手指印制板的制作方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102522342A (zh) * | 2011-12-27 | 2012-06-27 | 日月光半导体制造股份有限公司 | 半导体结构及其制造方法 |
CN104427789A (zh) * | 2013-08-22 | 2015-03-18 | 富葵精密组件(深圳)有限公司 | 多层电路板及其制作方法 |
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Publication number | Publication date |
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CN102045961B (zh) | 2012-07-18 |
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Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120718 Termination date: 20151228 |
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