CN102044437B - 用于制造半导体器件的方法 - Google Patents
用于制造半导体器件的方法 Download PDFInfo
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- CN102044437B CN102044437B CN 200910197579 CN200910197579A CN102044437B CN 102044437 B CN102044437 B CN 102044437B CN 200910197579 CN200910197579 CN 200910197579 CN 200910197579 A CN200910197579 A CN 200910197579A CN 102044437 B CN102044437 B CN 102044437B
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- 125000006850 spacer group Chemical group 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000005530 etching Methods 0.000 claims abstract description 18
- 238000001312 dry etching Methods 0.000 claims abstract description 14
- 230000001939 inductive effect Effects 0.000 claims description 43
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 229910052681 coesite Inorganic materials 0.000 claims description 3
- 229910052906 cristobalite Inorganic materials 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910052682 stishovite Inorganic materials 0.000 claims description 3
- 229910052905 tridymite Inorganic materials 0.000 claims description 3
- 230000035882 stress Effects 0.000 description 61
- 238000005229 chemical vapour deposition Methods 0.000 description 10
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- 230000006378 damage Effects 0.000 description 8
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229920005591 polysilicon Polymers 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000004151 rapid thermal annealing Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 4
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- 238000013459 approach Methods 0.000 description 3
- 238000004380 ashing Methods 0.000 description 3
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
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- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 108091006149 Electron carriers Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000003917 TEM image Methods 0.000 description 1
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- 238000005389 semiconductor device fabrication Methods 0.000 description 1
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Application Number | Priority Date | Filing Date | Title |
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CN 200910197579 CN102044437B (zh) | 2009-10-21 | 2009-10-21 | 用于制造半导体器件的方法 |
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CN 200910197579 CN102044437B (zh) | 2009-10-21 | 2009-10-21 | 用于制造半导体器件的方法 |
Publications (2)
Publication Number | Publication Date |
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CN102044437A CN102044437A (zh) | 2011-05-04 |
CN102044437B true CN102044437B (zh) | 2012-12-05 |
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CN 200910197579 Expired - Fee Related CN102044437B (zh) | 2009-10-21 | 2009-10-21 | 用于制造半导体器件的方法 |
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CN (1) | CN102044437B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103928310B (zh) * | 2014-04-28 | 2018-04-06 | 上海集成电路研发中心有限公司 | 打开多晶硅栅极的方法 |
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2009
- 2009-10-21 CN CN 200910197579 patent/CN102044437B/zh not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
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JP特开平10-326837A 1998.12.08 |
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CN102044437A (zh) | 2011-05-04 |
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ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20130105 |
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Effective date of registration: 20130105 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121205 Termination date: 20191021 |
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CF01 | Termination of patent right due to non-payment of annual fee |