CN101996906A - 凹槽中焊接实现焊料倒扣焊的工艺方法 - Google Patents
凹槽中焊接实现焊料倒扣焊的工艺方法 Download PDFInfo
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- CN101996906A CN101996906A CN2010102759672A CN201010275967A CN101996906A CN 101996906 A CN101996906 A CN 101996906A CN 2010102759672 A CN2010102759672 A CN 2010102759672A CN 201010275967 A CN201010275967 A CN 201010275967A CN 101996906 A CN101996906 A CN 101996906A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010102759672A CN101996906B (zh) | 2010-09-08 | 2010-09-08 | 凹槽中焊接实现焊料倒扣焊的工艺方法 |
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CN2010102759672A CN101996906B (zh) | 2010-09-08 | 2010-09-08 | 凹槽中焊接实现焊料倒扣焊的工艺方法 |
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CN101996906A true CN101996906A (zh) | 2011-03-30 |
CN101996906B CN101996906B (zh) | 2012-06-13 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103281858A (zh) * | 2013-05-28 | 2013-09-04 | 三星半导体(中国)研究开发有限公司 | 印刷电路板及其制造方法、倒装芯片封装件及其制造方法 |
CN107424971A (zh) * | 2016-04-29 | 2017-12-01 | 英飞凌科技股份有限公司 | 芯片载体上基于腔体的特征 |
CN109037187A (zh) * | 2018-06-29 | 2018-12-18 | 中国电子科技集团公司第二十九研究所 | 一种用于陶瓷电路基板bga垂直互联的焊盘及制作方法 |
CN112045329A (zh) * | 2020-09-07 | 2020-12-08 | 中国电子科技集团公司第二十四研究所 | 一种金属基板上植球的倒装焊工艺方法 |
CN113707785A (zh) * | 2020-05-20 | 2021-11-26 | 佛山市国星光电股份有限公司 | 一种led发光器件的制备方法、led发光器件及显示面板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000208675A (ja) * | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | 半導体装置およびその製造方法 |
US20020063319A1 (en) * | 2000-11-30 | 2002-05-30 | Siliconware Precision Industries Co.,Ltd. | Direct-downset flip-chip package assembly and method of fabricating the same |
US20090102048A1 (en) * | 2007-10-23 | 2009-04-23 | Eiji Hori | Electronic device and manufacturing method thereof |
CN101527271A (zh) * | 2009-04-17 | 2009-09-09 | 中南大学 | 一种使用锥面焊盘进行热超声倒装焊的芯片封装方法 |
-
2010
- 2010-09-08 CN CN2010102759672A patent/CN101996906B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000208675A (ja) * | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | 半導体装置およびその製造方法 |
US20020063319A1 (en) * | 2000-11-30 | 2002-05-30 | Siliconware Precision Industries Co.,Ltd. | Direct-downset flip-chip package assembly and method of fabricating the same |
US20090102048A1 (en) * | 2007-10-23 | 2009-04-23 | Eiji Hori | Electronic device and manufacturing method thereof |
CN101527271A (zh) * | 2009-04-17 | 2009-09-09 | 中南大学 | 一种使用锥面焊盘进行热超声倒装焊的芯片封装方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103281858A (zh) * | 2013-05-28 | 2013-09-04 | 三星半导体(中国)研究开发有限公司 | 印刷电路板及其制造方法、倒装芯片封装件及其制造方法 |
CN107424971A (zh) * | 2016-04-29 | 2017-12-01 | 英飞凌科技股份有限公司 | 芯片载体上基于腔体的特征 |
CN109037187A (zh) * | 2018-06-29 | 2018-12-18 | 中国电子科技集团公司第二十九研究所 | 一种用于陶瓷电路基板bga垂直互联的焊盘及制作方法 |
CN113707785A (zh) * | 2020-05-20 | 2021-11-26 | 佛山市国星光电股份有限公司 | 一种led发光器件的制备方法、led发光器件及显示面板 |
CN113707785B (zh) * | 2020-05-20 | 2024-04-09 | 佛山市国星光电股份有限公司 | 一种led发光器件的制备方法、led发光器件及显示面板 |
CN112045329A (zh) * | 2020-09-07 | 2020-12-08 | 中国电子科技集团公司第二十四研究所 | 一种金属基板上植球的倒装焊工艺方法 |
CN112045329B (zh) * | 2020-09-07 | 2022-03-11 | 中国电子科技集团公司第二十四研究所 | 一种金属基板上植球的倒装焊工艺方法 |
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Publication number | Publication date |
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CN101996906B (zh) | 2012-06-13 |
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Owner name: SHANGHAI XINWEI TECHNOLOGY DEVELOPMENT CENTER CO., Free format text: FORMER OWNER: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES Effective date: 20140905 |
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Effective date of registration: 20140905 Address after: 201800 Shanghai city Jiading District Pingcheng Road No. 811 room 1228 Patentee after: Shanghai Industrial UTechnology Research Institute Address before: 200050 Changning Road, Shanghai, No. 865, No. Patentee before: Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences |