CN101978081B - 电气电子零件用铜合金材料 - Google Patents
电气电子零件用铜合金材料 Download PDFInfo
- Publication number
- CN101978081B CN101978081B CN200980110059.3A CN200980110059A CN101978081B CN 101978081 B CN101978081 B CN 101978081B CN 200980110059 A CN200980110059 A CN 200980110059A CN 101978081 B CN101978081 B CN 101978081B
- Authority
- CN
- China
- Prior art keywords
- quality
- alloy material
- sample
- electric
- bendability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008074650 | 2008-03-21 | ||
JP2008-074650 | 2008-03-21 | ||
PCT/JP2009/055531 WO2009116649A1 (ja) | 2008-03-21 | 2009-03-19 | 電気電子部品用銅合金材 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101978081A CN101978081A (zh) | 2011-02-16 |
CN101978081B true CN101978081B (zh) | 2014-09-10 |
Family
ID=41091047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980110059.3A Expired - Fee Related CN101978081B (zh) | 2008-03-21 | 2009-03-19 | 电气电子零件用铜合金材料 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110005644A1 (ja) |
EP (1) | EP2267172A1 (ja) |
JP (1) | JP5065478B2 (ja) |
CN (1) | CN101978081B (ja) |
WO (1) | WO2009116649A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4672804B1 (ja) * | 2010-05-31 | 2011-04-20 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Co−Si系銅合金及びその製造方法 |
JP4834781B1 (ja) * | 2010-08-24 | 2011-12-14 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Co−Si系合金 |
JP2012144789A (ja) * | 2011-01-13 | 2012-08-02 | Jx Nippon Mining & Metals Corp | Cu−Co−Si−Zr合金材 |
JP5544316B2 (ja) * | 2011-02-14 | 2014-07-09 | Jx日鉱日石金属株式会社 | Cu−Co−Si系合金、伸銅品、電子部品、及びコネクタ |
JP5514762B2 (ja) * | 2011-03-29 | 2014-06-04 | Jx日鉱日石金属株式会社 | 曲げ加工性に優れたCu−Co−Si系合金 |
US9159985B2 (en) * | 2011-05-27 | 2015-10-13 | Ostuka Techno Corporation | Circuit breaker and battery pack including the same |
JP5802150B2 (ja) * | 2012-02-24 | 2015-10-28 | 株式会社神戸製鋼所 | 銅合金 |
CN105734337A (zh) * | 2016-05-05 | 2016-07-06 | 太仓小小精密模具有限公司 | 一种耐磨型铜合金模具材料 |
CN108133765A (zh) * | 2018-01-15 | 2018-06-08 | 郑家法 | 一种电缆用铜合金导电材料及其制备方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101522927A (zh) * | 2006-10-03 | 2009-09-02 | 日矿金属株式会社 | 电子材料用铜合金的制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63307232A (ja) | 1987-06-04 | 1988-12-14 | Sumitomo Metal Mining Co Ltd | 銅合金 |
JPH02277735A (ja) * | 1989-04-20 | 1990-11-14 | Sumitomo Metal Mining Co Ltd | リードフレーム用銅合金 |
US7182823B2 (en) * | 2002-07-05 | 2007-02-27 | Olin Corporation | Copper alloy containing cobalt, nickel and silicon |
JP4068626B2 (ja) * | 2005-03-31 | 2008-03-26 | 日鉱金属株式会社 | 電子材料用Cu−Ni−Si−Co−Cr系銅合金及びその製造方法 |
JP2007169765A (ja) * | 2005-12-26 | 2007-07-05 | Furukawa Electric Co Ltd:The | 銅合金とその製造方法 |
JP4943095B2 (ja) * | 2006-08-30 | 2012-05-30 | 三菱電機株式会社 | 銅合金及びその製造方法 |
JP2008074650A (ja) | 2006-09-20 | 2008-04-03 | Covalent Materials Corp | 単結晶製造装置および単結晶製造装置の制御方法 |
-
2009
- 2009-03-19 JP JP2010503942A patent/JP5065478B2/ja not_active Expired - Fee Related
- 2009-03-19 EP EP09722228A patent/EP2267172A1/en not_active Withdrawn
- 2009-03-19 CN CN200980110059.3A patent/CN101978081B/zh not_active Expired - Fee Related
- 2009-03-19 WO PCT/JP2009/055531 patent/WO2009116649A1/ja active Application Filing
-
2010
- 2010-09-20 US US12/886,268 patent/US20110005644A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101522927A (zh) * | 2006-10-03 | 2009-09-02 | 日矿金属株式会社 | 电子材料用铜合金的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009116649A1 (ja) | 2011-07-21 |
WO2009116649A1 (ja) | 2009-09-24 |
JP5065478B2 (ja) | 2012-10-31 |
CN101978081A (zh) | 2011-02-16 |
US20110005644A1 (en) | 2011-01-13 |
EP2267172A1 (en) | 2010-12-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140910 Termination date: 20180319 |
|
CF01 | Termination of patent right due to non-payment of annual fee |