CN101971313A - 导线环以及形成导线环的方法 - Google Patents

导线环以及形成导线环的方法 Download PDF

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Publication number
CN101971313A
CN101971313A CN2008801280765A CN200880128076A CN101971313A CN 101971313 A CN101971313 A CN 101971313A CN 2008801280765 A CN2008801280765 A CN 2008801280765A CN 200880128076 A CN200880128076 A CN 200880128076A CN 101971313 A CN101971313 A CN 101971313A
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China
Prior art keywords
welding
lead
welding position
wire
conductor loop
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CN101971313B (zh
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多德吉·雷·M·卡尔皮托
权五达
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Kulicke and Soffa Industries Inc
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Kulicke and Soffa Industries Inc
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Abstract

提供了一种形成导线环的方法。所述方法包括：(1)形成第一导线折叠；(2)将所述第一导线折叠焊接至第一焊接位置以形成第一焊接；(3)在(a)所述第一焊接和(b)第二焊接位置之间延伸与所述第一焊接相连的一段导线；(4)将所述导线的一部分焊接至所述第二焊接位置以形成第二焊接。

Description

导线环以及形成导线环的方法
技术领域
本发明涉及使用线焊机形成导线环(wire loop)，尤其涉及形成导线的改进方法。
背景技术
在半导体器件的加工和封装中，线焊仍然是在封装件内的两个位置之间(例如，在半导体管芯的管芯衬垫和引线框架的引线之间)提供电互连的主要方法。尤其是，使用线焊器(也称为线焊机)，在将要电互连的相应位置之间形成导线环。形成导线环的主要方法是球焊接和楔焊，而球焊接是优选的技术。如下所述，Kikuchi等人的美国专利第5,945,065号示出了传统的球焊接和楔焊方法。
在美国专利第5,945,065号的图2A-2D中示出了示例性传统楔焊顺序，其中顺序包括：(1)布置导线12穿过楔焊工具11的下端，IC芯片16的电极15位于楔焊工具11的下方；(2)通过将超声波应用于楔焊工具11，将导线12焊接到电极15，其中楔焊工具11将导线12压向电极15；(3)使用钳位器12释放导线，然后将导线引导至外部导线18，然后将导线12降低至外部导线18；(4)通过应用超声波，将导线12焊接至外部导线18；以及(5)当固定导线12时抬升钳位器17，从而剪断导线12。不幸的是，相比于球焊接，楔焊具有一些缺陷(例如，与焊接头的方向问题，该问题导致了操作慢和不准确问题等)。这些缺陷使得球焊接成为优选的线焊技术。
现在参照美国专利第5,945,065号的图1A-1D，示例性传统球焊接顺序包括：(1)使用放电在从毛细管焊接工具1延伸的导线2的一段形成露空球4；(2)降低毛细管1，并将球4压向IC芯片6的电极5，并通过毛细管1将超声波应用于球，以在球和电极5(其中IC芯片5包括由加热部件加热的电极5)之间形成焊接；(3)将导线2引导(通过毛细管1的运动)至外部导线8的上方，并将导线2降低至外部导线8；(4)通过应用超声波，将导线2焊接至外部导线8；以及(5)通过闭合并抬升阻尼器7来切断导线2。当然，在(a)导线环的一端和(b)焊接位置(例如管芯衬垫、导线等)之间形成焊接的过程中，可使用不同类型的焊接能量，其中例如包括超声波能量、热声波能量、热压缩能量等。球焊接技术的其他示例例如公开于：Fujisawa的美国专利第6,933,608号、Ano等人的美国专利第6,815,836号、Imai等人的美国专利第6,715,666号、Wong等人的美国专利申请第2005/0072833号、Qin等人的美国专利申请第2005/0109819号中。
虽然球焊接(相比于楔焊)具有很多优点，但是球焊接也具有一些缺点，例如：具有用于形成露空球的电子打火组件(即，EFO组件)；与EFO组件的操作相关的球焊接工艺很复杂；以及由于形成露空球而引起相邻焊接之间的增加的间隔(相比于楔焊中导线宽度要求)
因此，期望提供一种具有球焊接和楔焊的一些优点的线焊改进方法。
发明内容
根据本发明的示例性实施方式，提供了一种形成导线环的方法。该方法包括：(1)形成第一导线折叠；(2)将第一导线折叠焊接至第一焊接位置以形成第一焊接；(3)在(a)第一焊接和(b)第二焊接位置之间延伸与第一焊接相连的一段导线；(4)将导线的一部分焊接至第二焊接位置以形成第二焊接。
本发明的方法还可以实施为一种装置(例如，作为线焊机的智能部分)，或者实施为计算机可读载体(例如，与线焊机结合使用的计算机可读载体)上的计算机程序指令。
根据本发明的另一个示例性实施方式，提供了焊接在第一焊接位置和第二焊接位置之间的导线环。该导线环包括：(1)焊接至第一焊接位置的第一焊接，该第一焊接包括直接焊接至第一焊接位置的第一导线折叠；(2)焊接至第二焊接位置的第二焊接；以及(3)在第一焊接位置和第二焊接位置之间延伸的一段导线，该段导线与第一焊接和第二焊接相连。
附图说明
当结合附图阅读下面的详细描述时，通过下面的详细描述可最好地理解本发明。需要强调的是，根据习惯做法，附图的各种特征不是成比例绘制的。相反地，为了清晰显示，各种特征的尺寸可任意的扩大或缩小。附图中包含下列图：
图1A是包括在半导体管芯和衬底之间延伸的线焊的传统半导体器件的一部分的侧视图；
图1B是类似于图1A中所示器件的传统半导体器件的俯视图；
图1C是图1A的包含导线环的一部分的详细视图；
图2A-2I是示出根据本发明的一个示例性实施方式形成导线环的方法的框图；
图2J-2L是示出根据本发明的另一个示例性实施方式，针对图2A-2I中形成导线环的方法的一部分的可选步骤的框图；
图3A-3J是示出根据本发明的另一个示例性实施方式形成导线环的方法的框图；
图4A-4J是示出根据本发明的又一个示例性实施方式形成导线环的方法的框图；
图5是根据本发明的一个示例性实施方式的导线环的侧视图；
图6A-6J是示出根据本发明的又一个示例性实施方式形成导线环的方法的框图；
图7A是根据本发明的一个示例性实施方式的焊接工具的立体图；
图7B是图7A的一部分的详细视图；
图8A-8B分别是使用传统焊接工具所形成的第二焊接的侧视图和俯视图；
图9A-9B分别是根据本发明的一个示例性实施方式使用焊接工具所形成的第二焊接的侧视图和俯视图；
图10A是根据本发明的另一个实施方式的焊接工具的一部分的详细视图；
图10B是使用图10A的焊接工具所形成的第二焊接的侧视图；以及
图11是示出根据本发明的一个示例性实施方式形成导线环的方法的流程图。
具体实施方式
根据本发明的某些示例性实施方式，提供了线焊技术，由此基本可以减少甚至省略露空球结构。然而，本发明不存在与传统楔焊相关联的方向问题。例如，在本发明的某些示例性实施方式中，在第一焊接位置使用一个导线折叠(或多个导线折叠)来代替露空球。这种导线折叠可以在焊接位置形成，或者可选地，可以在其他位置(即，形成位置)形成导线折叠，然后将导线折叠带到第一焊接位置进行焊接。下面将更加详细地描述本发明的各种示例性实施方式的这些和其他方面。
图1A-1C示出了安装在衬底102(例如引线框架102)上的半导体管芯104。线焊106在(1)半导体管芯104的管芯衬垫104a和(2)引线框架102的导线102a之间提供电互连。线焊106各自包括焊接至相应管芯衬垫104a的第一焊接106a，和焊接至相应导线102a的第二焊接106b。使用传统球焊接技术形成第一焊接106a，即，在一段导线的一端形成露空球，并且将露空球沉积并焊接至焊接位置(例如，管芯衬垫104a)，以形成导线环的第一焊接(例如，导线环106的第一焊接106a)。
图2A-2I是示出根据本发明的一个示例性实施方式形成导线环的方法的框图。图2A示出了毛细管焊接工具200的下部，其终止于在引线框架260(在图2H-2I中示出了示例性引线框架260，但是没有在图2A中示出)的引线260a上的完成的导线环(没有示出导线环的剩余部分，仅仅示出了第二焊接202)的第二焊接202(例如，针脚式焊接202)。导线204接合在延伸毛细管焊接工具200的长度的孔中，并且导线204用于形成导线环。在把导线供应线204从以前所形成的导线环的第二焊接202切断后，毛细管焊接工具200经受运动(例如，向上运动，该运动之后为图2B中所示的向右和向下运动)，以将第一导线部分206放置在引线206a上(为了简化，相邻的第二焊接202已经从图2B中移除)。接着，在图2C中，毛细管焊接工具200经受运动以将第二导线部分208放置在第一导线部分206的上面。通过将部分208放置在部分206的上面(并且通过施加任何期望的力、能量等)，形成了导线折叠210。在图2D中，将焊接工具200抬升至引线260a的表面上方，从而从引线260a移除导线折叠210。
在图2E中，从引线260a移开的导线折叠210沉积在第一焊接位置。在示出的示例中，第一焊接位置是半导体管芯250的管芯衬垫250a。在图2F中，将导线折叠210焊接至管芯衬垫250a以创建图2G中所示的第一焊接212。使用传统技术，如应用超声波能量、热声波能量、热压缩能量等，可以将导线折叠210焊接至管芯衬垫250a。与图2G-2H中所示的运动结合，一段导线214(标记在图2I中)在第一焊接位置(即，管芯衬垫250a)和第二焊接位置(在示出的示例中，第二焊接位置是引线框架260的另一个引线260a)之间延伸。在图2H中，第二焊接(例如，针脚式焊接)形成在另一个引线260a上，而在图2I中，导线被切断，使得接合在毛细管焊接工具200中的导线204与刚刚形成的导线环218分离。如图2I所示，导线环218在管芯衬垫250a和另一个引线260a之间延伸。导线环218包括第一焊接212、一段导线214、以及第二焊接216。毛细管焊接工具200(与刚刚从导线环218分离的导线204接合)可能已经经受了图2A-2D中所示的同样运动，以在图2H-2I中所示的另一个引线260a上形成导线折叠，以便为下一个导线环的下一个第一焊接作准备；然而，为了简化，在图2H-2I中没有示出该操作。
在图2A-2I所示的本发明的一个示例性实施方式中，单个导线折叠(例如导线折叠210)用于形成代替传统球焊接中露空球的第一焊接。更具体的，将导线折叠210直接沉积在第一焊接位置上(例如，图2E中所示的管芯衬垫250a，在导线折叠210和管芯衬垫250a之间没有任何介入的露空球)。然而，关于本发明，应该理解可能没有导线折叠已经被使用，即，导线部分206(图2B中所示)可能已经被用于在管芯衬垫250a上形成第一焊接，而第二导线部分208没有折叠在导线部分506的上面。
此外，应该理解，对于这里所公开的本发明的各种示例性实施方式，可以形成一个以上的导线折叠，并将其用于形成第一焊接(或第二焊接)。现在参照图2J-2L，这些图将依次代替图2D-2E。也就是说，在本发明的另一个示例性实施方式中，可以将图2A-2C、图2J-2L、以及图2F-2I组合。更具体地，图2J示出了放置在第二导线部分208上的导线的第三部分209(在将导线的第三部分209放置在第二导线部分208上时，也可以应用任何期望的力、能量等)。这样，提供了两个导线折叠(例如，导线折叠210和导线折叠210a)来替代形成单个导线折叠(即导线折叠210)。当然，也可以形成另外的导线折叠(例如，三个导线折叠、四个导线折叠，以及更多)。在图2K中，包括导线折叠210和导线折叠210a的已形成的“球”被抬升至引线260a的上方(类似于之前在图2D中所描述的运动)。在图2L中，包括导线折叠210和导线折叠210a的已形成的“球”沉积在管芯衬垫250a上(类似于之前在图2E中所描述的运动)。如上所述，对于图2F-2I，可以继续进行随后的步骤(例如，形成第一焊接、将一段导线延伸至第二焊接位置、形成第二焊接、以及切断导线以将与毛细管接合的导线供应线与刚刚形成的导线环分离)。
为何期望“球”中存在多个导线折叠，是有各种原因的。例如，附加材料可允许更好的焊接而不损害半导体管芯的敏感区。此外，为了克服形成导线环中出现的方向问题，可以将另外的导线折叠添加到“球”上。更进一步地，另外的折叠有助于减小不期望的导线旋转的可能性。当然，也考虑了其他的原因。
这样，在上述关于图2A-2I的示例中(以及在上述关于图2A-2C、图2J-2L、以及图2F-2I的示例中)，在引线框架的导线上进行第二焊接操作后，立即形成导线折叠。接着，将包括导线折叠的“球”抬升(即，抬升至以前所形成的导线环的第二焊接位置的上方)，并移动至下一个导线环的第一焊接位置。然而，这仅仅是示例性(非限制性)顺序。图3A-3J示出了使用可选顺序形成导线环的另一个示例性方法。作为如图2A-2I中在以前所形成的导线环的第二焊接位置上形成具有导线折叠的“球”的替代，在形成导线环的时候在第一焊接位置上形成图3A-3J中的“球”：即，“球”不是在形成位置形成然后移动至第一焊接位置的。
现在参照图3A，在第一焊接位置350a的上方，导线供应线304的导线尾部304a悬挂在焊接工具300的下方(在这个示例中，第一焊接位置是半导体管芯350的管芯衬垫350a)。然后，将导线尾部304a向着图3B-3D中的管芯衬垫350a降低，并放置在管芯衬垫350a上。在将导线尾部304a放置在管芯衬垫350a上后，导线尾部304a被称为第一导线部分306(与图2B中的第一导线部分206相似)。在图3E中，第二导线部分308放置在第一导线部分306上。其上放置有第二导线部分308的第一导线部分306被称为导线折叠310。在图3F-3G中，将导线折叠310焊接至管芯衬垫350a以创建图3H中所示的第一焊接312。结合图3H-3I中所示的运动，一段导线314(标记在图3J中)在第一焊接位置(即，管芯衬垫350a)和第二焊接位置(在示出的示例中，第二焊接位置是引线框架360的另一个引线360a)之间延伸。在图3I中，第二焊接(例如，针脚式焊接)形成在另一个引线360a上，而在图3J中，导线被切断，使得接合在毛细管焊接工具300中的导线304与刚刚形成的导线环318分离。如图3J所示，导线环318在管芯衬垫350a和引线360a之间延伸。导线环318包括第一焊接312、一段导线314、以及第二焊接316。
图4A-4J示出了本发明的又一个示例性实施方式。相比于在一个位置形成具有导线折叠的“球”然后将所形成的“球”移动至第一焊接位置(如图2A-2I中)，在图4A-4J中示出的示例类似于图3A-3J中示出的示例，即在形成导线环的时候在第一焊接位置上形成“球”。然而，图4A-4J与图3A-3J不同，例如，与图3A-3J中的在半导体管芯的管芯衬垫上形成“球”相比，在图4A-4J中是在衬底的焊接位置(例如，引线框架的导线)上形成“球”。该工艺(例如，在引线框架/衬底上而不是在半导体管芯的管芯衬垫上形成第一焊接)有时被称为“逆向焊接”。现在参照图4A，在第一焊接位置460a的上方，导线供应线404的导线尾部404a悬挂在焊接工具400的下方(在这个示例中，第一焊接位置是半导体管芯460的管芯衬垫460a)。然后，将导线尾部404a向着图4B-4D中的引线460a降低，并将其放置在引线460a上。在将导线尾部404a放置在引线460a上后，导线尾部404a被称为第一导线部分406(与图2B中的第一导线部分206相似)。在图4E中，第二导线部分408放置在第一导线部分406上。其上放置有第二导线部分408的第一导线部分406被称为导线折叠410。在图4F-4G中，将导线折叠410焊接至引线460a以创建图4H中所示的第一焊接412。与图4H-4I中所示的运动结合，一段导线414(标记在图4J中)在第一焊接位置(即，引线460a)和第二焊接位置(在示出的示例中，第二焊接位置是半导体管芯450的管芯衬垫450a)之间延伸。在图4I中，在以前已经形成于管芯衬垫450a上的导电凸块420上形成第二焊接(例如，针脚式焊接)。如本领域技术人员所了解的，可以使用多种技术来形成导电凸块，其中包括使用线焊机的“凸块”法或“柱状凸块(stud bumping)”法。这样，在形成导线环之前就形成了凸块420。导电凸块可以用于，例如，提供增加的材料以避免在半导体管芯上形成针脚式焊接时对半导体管芯的损害。这种导电凸块的另一个示例性使用可以是如在给定的应用中期望的那样增加第二焊接位置的高度。现在参照图4J，导线被切断，使得接合在毛细管焊接工具400中的导线404与刚刚形成的导线环418分离。如图4J所示，导线环418在引线460a和导电凸块420(在管芯衬垫450a上)之间延伸。导线环418包括第一焊接412、一段导线414、以及第二焊接416。当然，第二焊接416可以直接焊接至管芯衬垫450a，而不介入导电凸块420。
图5是根据本发明的另一个示例性实施方式形成的导线环518的侧视图。没有具体地示出用于形成导线环518的各个步骤。图5的关键教导是通过在第一焊接和第二焊接的每一个处形成导线折叠来形成导线环518。导线环518包括第一焊接512(在半导体管芯550的管芯衬垫550a上)、一段导线514、以及第二焊接516(在引线框架560的引线560a上)。第一焊接512的形成方法基本类似于图2I中所示的形成导线环218的第一焊接212的方法。第二焊接516也是通过使用将部分导线放置在另一个的上面并形成导线折叠的技术形成的。虽然图5示出了在管芯衬垫550a上的第一焊接和在引线560a上的第二焊接，但这是示例，当然，顺序可以颠倒，使得第一焊接512形成在引线560a上，而第二焊接516形成在管芯衬垫550a上。
图6A-6J示出了根据本发明的又一个示例性实施方式形成导线环的另一个方法。实际上，图6A-6J中形成导线环的方法与图2A-2I所示的方法非常相似。也就是说，两个方法(即图2A-2I所示的方法和图6A-6J所示的方法)说明了在第一表面上形成具有导线折叠的“球”，然后将所形成的“球”移动至第一焊接位置。图2A-2I说明在形成以前所形成的导线环的针脚式焊接后，立即在第二焊接位置形成“球”。相比之下，图6A-6J说明了在不同于以前所形成的导线环的第二焊接位置的形成位置形成“球”。形成位置可以是任何表面(例如，正在焊接的装置的一部分或相邻表面)，该表面将接纳用于形成导线折叠的部分导线，并允许移走“球”(包括导线折叠)，以被移动至第一焊接位置。例如，形成位置可以是引线框架的另一个引线、衬底/引线框架的表面、管芯衬垫、半导体管芯的表面、为暂时粘合并随后移除而提供的镀银表面等。现在参照图6A，在形成位置640的上方，导线供应线604的导线尾部604a悬挂在焊接工具600的下方。然后，向着图6B-6D中的形成位置640降低导线尾部604a，并将其与形成位置640交叉放置。在导线尾部604a与形成位置640交叉放置后，导线尾部604a被称为第一导线部分606(与图2B中的第一导线部分206相似)。在图6E中，第二导线部分608放置在第一导线部分606上(可以应用任何期望的力和/或能量将第二部分608固定至第一部分606)。其上放置有第二导线部分608的第一导线部分606被称为导线折叠610。在图6F，导线折叠610上升至形成位置640的上方，在图6G-6H中，将导线折叠610移向并焊接至半导体管芯650的管芯衬垫650a以创建图6I中所示的第一焊接612。与图6I-6J中所示的运动结合，一段导线614在第一焊接位置(即，管芯衬垫650a)和第二焊接位置(在示出的示例中，第二焊接位置是引线框架660的引线660a)之间延伸。在图6J中，第二焊接(例如，针脚式焊接)形成在引线660a上，随后(未示出)导线被切断，使得接合在毛细管焊接工具600中的导线604与导线环618分离。如图6J所示，导线环618在管芯衬垫650a和引线660a之间延伸。导线环618包括第一焊接612、一段导线614、以及第二焊接616(未标记在图6J中)。
根据本发明，可以使用很多不同类型的焊接工具形成导线环，所述焊接工具可具有不同的形状、不同的端部配置等。很多传统焊接工具非常适合于形成本发明的导线环。图7A-7B和图9A-9B示出了根据本发明的、也适用于形成导线环的示例性发明工具。图7A是毛细管焊接工具700的立体图，如在传统球焊接毛细管工具中一样，该毛细管焊接工具700沿着它的长度限定了一个孔(具有图7B中所示的内直径700e)，该孔被配置为接纳焊接导线。图7B是图7A的毛细管焊接工具700的尾端部分700a的详细视图。毛细管焊接工具700的面端部分700b具有基本是零度的面角。即，毛细管焊接工具700的面端部分700b基本平行于焊接表面(例如，半导体管芯表面等)，并基本垂直于毛细管焊接工具700的长度方向轴线710。这与具有例如大约8-15度的面角的传统毛细管焊接工具形成对比。
在尾端部分700a的一端还示出外半径700c和内半径700d。在图7B中示出的示例中，外半径700c和内半径700d二者都具有相同的形状/曲度。这是所期望的，例如，因为它趋向于允许产生的焊接(例如，第一焊接、第二焊接)的形状具有同样的形状，而与焊接形成的方向无关。这与传统毛细管焊接工具形成对比，传统毛细管焊接工具可包括具有第一形状的外半径和具有不同(例如，斜面)形状的内半径。当然，示出的外半径700c和内半径700d的形状实际上是示例性的。可以考虑可选的形状(例如，可选形状的内部与外部相比是相同的，可选形状的内部与外部相比是不同的)。
图8A-8B分别是使用传统焊接工具形成的第二焊接800的侧视图和俯视图。相比之下，图9A-9B分别是使用焊接工具700形成的第二焊接900的侧视图和俯视图。图8A-8B和图9A-9B清楚地表明，第二焊接900长于第二焊接800，并提供更牢固的第二焊接。面角基本为零度的面端部分700b允许更多的导线被焊接，这减小了短尾误差、不粘误差、和/或其他焊接问题的可能性。
图10A是根据本发明的另一个示例性实施方式的焊接工具的尾端部分1000a的立体图。尾端部分1000a类似于毛细管焊接工具700的尾端部分700a(而该工具剩余部分类似于毛细管焊接工具700)，而尾端部分1000a终止于面端部分1000b。与图7B中的面端部分700b一样，面端部分1000b具有基本为零度的面角。面端部分1000b限定了凹陷1000c。图10B是使用如图10A所示的具有尾端部分的焊接工具所形成的第二焊接1010的侧视图。第二焊接1010包括凸块1010a。由于凹陷1000c，凸块1010a被设置在第二焊接1010上。通过在面端部分1000b中限定凹陷1000c，可以使用焊接工具来夹住附加的导线材料，允许在形成导线折叠和导线环的剩余部分时，更好的夹住导线(并且在形成导线折叠和导线环的剩余部分时，减小导线滑动的可能性)。
图11是示出根据本发明的某些示例性实施方式的流程图。如本领域的技术人员所理解的，可以省略包含在流程图中的某些步骤；可以增加某些另外的步骤；并且可以根据示出的顺序而改变步骤的顺序。
图11是示出根据本发明的一个示例性实施方式形成导线环的方法的流程图。在步骤1100，形成第一导线折叠。例如，在刚刚完成的导线环的以前所形成的第二焊接的第二焊接位置处，可以形成所述导线折叠，然后可以将所述导线折叠从以前所形成的导线环的第二焊接位置移向第一焊接位置(如图2A-2I中示出的示例性实施方式中那样)。在另一个实施方式中，可以在第一焊接位置(如图3A-3J和图4A-4J中示出的示例性实施方式中那样)形成导线折叠。在又一个实施方式中，可以在形成位置(例如，形成位置不同于以前所形成的导线环的第二焊接位置)形成导线折叠，然后将导线折叠从形成位置移向第一焊接位置(如图6A-6J中示出的示例性实施方式中那样)。当然，可以考虑其他变体。在步骤1102，将第一导线折叠焊接至第一焊接位置以形成第一焊接。在步骤1104，在(a)第一焊接和(b)第二焊接位置之间延伸与第一焊接相连的一段导线。在步骤1106，将导线的一部分焊接至第二焊接位置以形成第二焊接。
这样，根据本发明的各种示例性实施方式，已经公开了一种技术，用于通过提供具有至少一个导线折叠的“球”来代替形成露空球，以形成导线环。因此，在某些应用中，可以从线焊机中省去用于形成露空球的EFO组件，从而节约成本，并降低形成和使用露空球所固有的复杂性(例如，在导线中热影响区可能导致不期望的导线倾斜、导线缩颈、导线断开、导线下垂、导线摇摆等)。当然，省去EFO组件不是必须的，如本发明可以与这样一种机器结合使用，该机器对某种应用(或对成环处理的一部分)使用露空球，然后对其他应用(或对成环工艺的其他部分)使用本发明的技术。
本发明还可以产生另外的好处，例如，减小导线环的高度、减小导线环的间距、灵活的环形状、增长在线焊机上辅助之间的平均时间等。
各种附图包括示出焊接工具的示例性运动的箭头。例如，图2A包括指向下方的箭头，表示焊接工具200向下运动；然而，应该理解，提供这些箭头只是作为向导，并且实际上是示例性的。如本领域的技术人员所知，根据本发明在导线环的形成过程中，可以提供另外的或不同的运动。此外，如本领域的技术人员所了解的，在成环工艺期间，期望提供力和能量(例如，超声波能量、热声波能量、热压缩能量等)，从而例如将导线的一部分固定(临时地或永久地)至一个位置、通过将导线的第一位置固定至导线的第二位置来形成导线折叠等。
在某些图中，只示出了焊接工具的尾端部分和一小段导线。例如，图2A只示出了焊接工具的尾端部分200，以及一小段导线204。如本领域技术人员所理解的，导线(例如，在图2A中所示的导线204)穿过焊接工具的剩余部分(未示出)向上延伸至线焊系统的其他元件上(例如，用于形成导线环的导线钳位器、空气系统、导线线轴等)。此外，如本领域技术人员所理解的，在导线折叠和导线环的剩余部分形成期间，导线钳位器等(未示出)按照需要打开和关闭，以放出导线。
虽然主要关于在(1)半导体管芯的管芯衬垫和(2)引线框架的导线之间所形成的导线环描述了本发明，但是本发明并不限于此。本发明的教导可以应用于多个线焊应用中的任意一个，所述线焊应用包括，例如，管芯与管芯的焊接，以及任何其他线焊应用。
本发明的线焊技术可以在多个可选介质中实现。例如，该技术能够作为软件安装在现有的计算机系统/服务器上(用于连接或集成线焊机的计算机系统)。此外，该技术可以从计算机可读载体(例如，固体存储器、光盘、磁盘、射频载波介质、音频载波介质等)操作，该计算机可读载体包括与线焊技术相关的计算机指令(例如，计算机程序指令)。
虽然在这里关于具体实施方式示出并描述了本发明，但是不能认为本发明被限制在示出的细节中。相反，在本权利要求书的等效内容和范围内，以及在不脱离本发明的情况下，可以在细节上进行各种改进。

Claims (22)

1.一种形成导线环的方法，所述方法包括以下步骤：
(1)形成第一导线折叠；
(2)将所述第一导线折叠焊接至第一焊接位置以形成第一焊接；
(3)在(a)所述第一焊接和(b)第二焊接位置之间延伸与所述第一焊接相连的一段导线；
(4)将所述导线的一部分焊接至所述第二焊接位置以形成第二焊接。
2.如权利要求1所述的方法，其中，步骤(1)包括在所述第一焊接位置形成所述第一导线折叠。
3.如权利要求1所述的方法，其中，步骤(1)包括在形成位置形成所述第一导线折叠，所述形成位置不同于所述第一焊接位置。
4.如权利要求3所述的方法，还包括在步骤(2)之前的以下步骤：将所形成的第一导线折叠从(1)所述形成位置移动至(2)所述第一焊接位置。
5.如权利要求1所述的方法，还包括在所述第一导线折叠上形成至少一个附加的导线折叠的步骤。
6.如权利要求5所述的方法，其中，在步骤(2)之前完成以下步骤：在所述第一导线折叠上形成至少一个附加的导线折叠，其中步骤(2)包括将所述第一导线折叠和所述至少一个附加的导线折叠焊接至所述第一焊接位置以形成所述第一焊接。
7.如权利要求1所述的方法，其中，步骤(4)包括在所述第二焊接位置形成至少一个导线折叠，然后将所述至少一个导线折叠焊接至所述第二焊接位置以形成所述第二焊接。
8.如权利要求1所述的方法，其中，步骤(2)包括将所述第一导线折叠焊接至所述第一焊接位置以形成所述第一焊接，所述第一焊接位置是半导体管芯的管芯衬垫。
9.如权利要求1所述的方法，其中，步骤(2)包括将所述第一导线折叠焊接至所述第一焊接位置以形成所述第一焊接，所述第一焊接位置是衬底的导电区域。
10.如权利要求9所述的方法，其中，所述衬底的所述导电区域是引线框架的引线。
11.如权利要求9所述的方法，其中，步骤(4)包括将所述导线的所述部分焊接至所述第二焊接位置以形成第二焊接，所述第二焊接位置是半导体管芯的管芯衬垫。
12.如权利要求11所述的方法，还包括在步骤(4)之前的以下步骤：在所述半导体管芯的所述管芯衬垫上形成与所述导线环分离的导电凸块，使得步骤(4)包括将所述导线的所述部分焊接至在所述管芯衬垫上形成的所述导电凸块以形成第二焊接。
13.如权利要求1所述的方法，其中，使用焊接工具形成所述导线环，所述焊接工具沿着所述焊接工具的长度限定了一个孔，所述孔被配置为接纳一段导线，所述孔终止于所述焊接工具的工作端，其中所述工作端的表面在其中限定了至少一个凹陷。
14.一种计算机可读载体，包括使计算机执行形成导线环的方法的计算机指令，所述方法包括所述步骤：
(1)形成第一导线折叠；
(2)将所述第一导线折叠焊接至第一焊接位置以形成第一焊接；
(3)在(a)所述第一焊接和(b)第二焊接位置之间延伸与所述第一焊接相连的一段导线；
(4)将所述导线的一部分焊接至所述第二焊接位置以形成第二焊接。
15.一种焊接在第一焊接位置和第二焊接位置之间的导线环，所述导线环包括：
(1)第一焊接，焊接至第一焊接部分，所述第一焊接包括直接焊接至所述第一焊接位置的第一导线折叠；
(2)第二焊接，焊接至第二焊接位置；以及
(3)一段导线，在所述第一焊接位置和所述第二焊接位置之间延伸，所述一段导线与所述第一焊接和所述第二焊接相连。
16.如权利要求15所述的导线环，其中，所述第一焊接包括在所述第一导线折叠上的至少一个附加的导线折叠。
17.如权利要求15所述的导线环，其中，所述第二焊接包括焊接至所述第二焊接位置的至少一个导线折叠。
18.如权利要求15所述的导线环，其中，所述第一焊接位置是半导体管芯的管芯衬垫。
19.如权利要求15所述的导线环，其中，所述第一焊接位置是衬底的导电区域。
20.如权利要求19所述的导线环，其中，所述衬底的所述导电区域是引线框架的引线。
21.如权利要求15所述的导线环，其中，所述第二焊接位置是半导体管芯的管芯衬垫。
22.如权利要求21所述的导线环，还包括在所述管芯衬垫上形成的导电凸块，所述导线环的所述第二焊接被焊接至所述导电凸块。
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