CN101937021A - Online measurement method of contact resistance of probe - Google Patents
Online measurement method of contact resistance of probe Download PDFInfo
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- CN101937021A CN101937021A CN2010102164845A CN201010216484A CN101937021A CN 101937021 A CN101937021 A CN 101937021A CN 2010102164845 A CN2010102164845 A CN 2010102164845A CN 201010216484 A CN201010216484 A CN 201010216484A CN 101937021 A CN101937021 A CN 101937021A
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Abstract
The invention provides an online measurement method of the contact resistance of a probe, which comprises the following steps of: connecting a probe card with a chip to be tested and a testing machine, directly connecting a measuring probe on the probe card with a bonding pad on the chip to be tested, and connecting the bonding pad with a first wire and a second wire; adding a testing probe, and connecting the testing probe with the first wire; applying a voltage to the second wire, and measuring the current value on the second wire; measuring the voltage value of the terminal of the first wire as the voltage value on the testing probe; dividing the difference between the voltage value applied to the second wire and the voltage value on the testing probe by the current value on the second wire to obtain the resistance on the measuring probe; calculating the voltage correction value on the bonding pad of the tested chip according to the resistance; and applying a corrected voltage to the bonding pad of the tested chip. The measurement method provided by the invention can be used for measuring the resistance on the measuring probe in real time so as to provide the corrected voltage, measurement error caused by a change in the resistance of the probe is reduced, and the accuracy of measurement is increased.
Description
Technical field
The present invention relates to a kind of integrated circuit (IC) chip measuring method, be specifically related to a kind of contact resistance of probe On-line Measuring Method.
Background technology
In the wafer sort of integrated circuit, must use probe and be used as interface between chip under test and the test machine.In the common test, known signal is imported chip under test, measure of the reflection of this chip then to input signal, the path of this signal is: arrive measuring head at test machine by cable, arrive probe by measuring head again, return then by the pad (PAD) of probe, and by original route to chip under test.Probe on the probe directly is connected with the pad of chip under test, in existing wafer sort, it is arranged is the high temperature wafers test, increase along with the pinprick number of times, probe is slowly oxidized and stain, the contact resistance of probe can become greatly gradually, and the contact resistance of probe depends on the material of probe and shape, the material of PAD, the pressure of contact to a great extent, and the situation of the wearing and tearing of probe and pollution etc.It is big that probe resistance becomes, and can have influence on precision of test result, and general way commonly used is to set the about hundreds of of every acupuncture treatment just to carry out clearly pin once, but resource is not only wasted in operation like this, and probe use more backward, and its resistance will be big more.
For accuracy and the consistance that guarantees to test, it is accurately consistent to be applied to parameters such as voltage on the PAD, electric current when each test, and that is to say needs to guarantee that the variation of contact resistance of probe is the smaller the better.Usually, the stronger probe of a kind of anti-oxidant anti-contamination ability can be sought from the angle of probe by pin card company, just at present, the probe of this material also exists really, still, expense and costliness thereof, coming some cheap consumer products are tested with this probe loses more than gain.
Summary of the invention
Easily change the problem that influences measuring accuracy in order to overcome the test probe resistance that exists in the prior art, the invention provides a kind of measuring method that increases measuring accuracy.
To achieve these goals, the present invention proposes a kind of contact resistance of probe On-line Measuring Method, may further comprise the steps: probe connects chip under test and test machine, measuring probe on the described probe directly links to each other with pad on the described chip under test, connect first electric wire and second electric wire on the described pad, described first electric wire is the high resistant line, and described second electric wire is the low-resistance line, and described measuring probe links to each other with described second electric wire; Increase by a test probe, described test probe links to each other with described first electric wire; On described second electric wire, apply voltage, and record the current value on described second electric wire; Measure the magnitude of voltage of described first wire ends, be the magnitude of voltage on the described test probe; The difference of the magnitude of voltage that applies on described second electric wire and the magnitude of voltage on the described test probe divided by the current value on described second electric wire, is obtained the resistance on the described measuring probe; According to the voltage modified value on the pad of the described chip under test of described resistance calculations; On the pad of described chip under test, apply through revised voltage.
Optionally, the material of described measuring probe and described test probe is copper.
Optionally, described voltage modified value equals to multiply by by the electric current of described measuring probe the resistance of the measuring probe that is calculated.
The beneficial effect of a kind of contact resistance of probe On-line Measuring Method of the present invention mainly shows: contact resistance of probe On-line Measuring Method provided by the invention is in measuring process, the resistance of while measuring probe, and correction in real time is applied to the voltage on the probe, counteracting becomes the measuring error that causes greatly because of probe resistance, thereby has improved the precision of measuring.
Description of drawings
Fig. 1 is the schematic flow sheet of contact resistance of probe On-line Measuring Method of the present invention.
Fig. 2 is the practical application synoptic diagram of contact resistance of probe On-line Measuring Method of the present invention.
Embodiment
The present invention is described further below in conjunction with accompanying drawing.
At first, please refer to Fig. 1, Fig. 1 is the schematic flow sheet of contact resistance of probe On-line Measuring Method of the present invention, and as can be seen from the figure, contact resistance of probe On-line Measuring Method of the present invention may further comprise the steps:
Step 20: probe connects chip under test and test machine, measuring probe on the described probe directly links to each other with pad on the described chip under test, connect first electric wire and second electric wire on the described pad, described first electric wire is the high resistant line, described second electric wire is the low-resistance line, described measuring probe links to each other with described second electric wire, the basic step of this step for measuring;
Step 21: increase by a test probe, described test probe links to each other with described first electric wire, this test probe and measuring probe are to belong to same batch probe, material is also identical, adopt copper in the present embodiment, because material is identical, batch identical, so the resistance of test probe and measuring probe is also identical;
According to the voltage modified value on the pad of the described chip under test of described resistance calculations; On the pad of described chip under test, apply through revised voltage.
Step 22: apply voltage on described second electric wire, and record the electric current on described second electric wire, surveying electric current generally is reometer of series connection in circuit, and this current value that records is just by the current value on the measuring probe;
Step 23: measure the magnitude of voltage of described first wire ends, be the magnitude of voltage on the described test probe, surveying magnitude of voltage is voltage table in parallel on test probe, measures the magnitude of voltage on the test probe, is for calculated resistance;
Step 24: the difference of the magnitude of voltage that applies on described second electric wire and the magnitude of voltage on the described test probe divided by the current value on described second electric wire, is obtained the resistance on the described measuring probe;
Step 25: according to the voltage modified value on the pad of the described chip under test of described resistance calculations, promptly originally on measuring probe, can apply certain voltage, by certain electric current, to test, the voltage modified value equals to multiply by by the electric current of measuring probe the resistance of the measuring probe that is calculated, and revised voltage equals original magnitude of voltage and adds the voltage modified value;
Step 26: on the pad of described chip under test, apply through revised voltage.
Then, please refer to Fig. 2, Fig. 2 is the practical application synoptic diagram of contact resistance of probe On-line Measuring Method of the present invention, can see among the figure, first electric wire 11 and second electric wire 12 all are connected on the pad 10, and described first electric wire is the high resistant line, and described second electric wire is the low-resistance line, test probe is connected in first electric wire, and measuring probe is connected on second electric wire.
Contact resistance of probe On-line Measuring Method provided by the invention is in measuring process, and the resistance of measuring probe, and correction in real time simultaneously is applied to the voltage on the probe, offsets because of probe resistance becomes the measuring error that causes greatly, thereby has improved the precision of measuring.
Though the present invention discloses as above with preferred embodiment, so it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (3)
1. contact resistance of probe On-line Measuring Method may further comprise the steps:
Probe connects chip under test and test machine, measuring probe on the described probe directly links to each other with pad on the described chip under test, connect first electric wire and second electric wire on the described pad, described first electric wire is the high resistant line, described second electric wire is the low-resistance line, and described measuring probe links to each other with described second electric wire;
It is characterized in that: described measuring method also comprises:
Increase by a test probe, described test probe links to each other with described first electric wire;
On described second electric wire, apply voltage, and record the current value on described second electric wire;
Measure the magnitude of voltage of described first wire ends, be the magnitude of voltage on the described test probe;
The difference of the magnitude of voltage that applies on described second electric wire and the magnitude of voltage on the described test probe divided by the current value on described second electric wire, is obtained the resistance on the described measuring probe;
According to the voltage modified value on the pad of the described chip under test of described resistance calculations;
On the pad of described chip under test, apply through revised voltage.
2. contact resistance of probe On-line Measuring Method according to claim 1 is characterized in that: the material of described measuring probe and described test probe is copper.
3. contact resistance of probe On-line Measuring Method according to claim 1 is characterized in that: described voltage modified value equals to multiply by by the electric current of described measuring probe the resistance of the measuring probe that is calculated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102164845A CN101937021A (en) | 2010-06-30 | 2010-06-30 | Online measurement method of contact resistance of probe |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010102164845A CN101937021A (en) | 2010-06-30 | 2010-06-30 | Online measurement method of contact resistance of probe |
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| CN101937021A true CN101937021A (en) | 2011-01-05 |
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| CN2010102164845A Pending CN101937021A (en) | 2010-06-30 | 2010-06-30 | Online measurement method of contact resistance of probe |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102062847A (en) * | 2010-11-08 | 2011-05-18 | 上海集成电路研发中心有限公司 | Method for detecting semiconductor parameter measurement system |
| CN102157415A (en) * | 2011-03-15 | 2011-08-17 | 上海宏力半导体制造有限公司 | Method for testing wafer parameters of bare chips |
| CN102156271A (en) * | 2011-03-15 | 2011-08-17 | 上海宏力半导体制造有限公司 | Method for detecting semiconductor parameter measuring system |
| CN102565538A (en) * | 2012-02-28 | 2012-07-11 | 上海华力微电子有限公司 | Method for enhancing resistance testing accuracy |
| CN102590630A (en) * | 2012-03-01 | 2012-07-18 | 上海宏力半导体制造有限公司 | Resistance test method for test probe of semiconductor parameter tester |
| CN103063921A (en) * | 2011-10-18 | 2013-04-24 | 应用材料意大利有限公司 | Testing device for testing wafers for electronic circuits and related method |
| CN103293503A (en) * | 2013-05-24 | 2013-09-11 | 上海宏力半导体制造有限公司 | Probe card detecting method |
| CN105092976A (en) * | 2014-05-08 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | Contact resistance measuring method and structure |
| CN108010861A (en) * | 2017-12-01 | 2018-05-08 | 上海华岭集成电路技术股份有限公司 | The method of wafer test monitoring contact resistance clear pin on demand |
| CN108089054A (en) * | 2016-11-22 | 2018-05-29 | 北京铁路信号有限公司 | A kind of method for the contact resistance for measuring the forced connection of solderless |
| CN108519519A (en) * | 2018-04-11 | 2018-09-11 | 京东方科技集团股份有限公司 | A kind of resistance measurement method and electric resistance measuring apparatus |
| CN110190468A (en) * | 2018-11-30 | 2019-08-30 | 中航光电科技股份有限公司 | A kind of connector of contact resistance on-line checking |
| CN110187255A (en) * | 2019-04-15 | 2019-08-30 | 上海华力集成电路制造有限公司 | A method of amount of overdrive is determined when establishing probe test formula |
| CN111007319A (en) * | 2019-12-05 | 2020-04-14 | 上海华力集成电路制造有限公司 | Detection circuit and method for socket probe yield |
| CN113359008A (en) * | 2021-06-01 | 2021-09-07 | 长鑫存储技术有限公司 | Test protection circuit and control method thereof, test circuit and chip test circuit |
| CN113514758A (en) * | 2021-09-15 | 2021-10-19 | 绅克半导体科技(苏州)有限公司 | Chip testing method, tester and storage medium |
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Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102062847B (en) * | 2010-11-08 | 2016-04-27 | 上海集成电路研发中心有限公司 | The detection method of semiconductor parameter measuring system |
| CN102062847A (en) * | 2010-11-08 | 2011-05-18 | 上海集成电路研发中心有限公司 | Method for detecting semiconductor parameter measurement system |
| CN102157415B (en) * | 2011-03-15 | 2015-05-20 | 上海华虹宏力半导体制造有限公司 | Method for testing wafer parameters of bare chips |
| CN102157415A (en) * | 2011-03-15 | 2011-08-17 | 上海宏力半导体制造有限公司 | Method for testing wafer parameters of bare chips |
| CN102156271A (en) * | 2011-03-15 | 2011-08-17 | 上海宏力半导体制造有限公司 | Method for detecting semiconductor parameter measuring system |
| CN102156271B (en) * | 2011-03-15 | 2015-11-04 | 上海华虹宏力半导体制造有限公司 | The detection method of semiconductor parameter measuring system |
| CN103063921A (en) * | 2011-10-18 | 2013-04-24 | 应用材料意大利有限公司 | Testing device for testing wafers for electronic circuits and related method |
| CN102565538A (en) * | 2012-02-28 | 2012-07-11 | 上海华力微电子有限公司 | Method for enhancing resistance testing accuracy |
| CN102590630A (en) * | 2012-03-01 | 2012-07-18 | 上海宏力半导体制造有限公司 | Resistance test method for test probe of semiconductor parameter tester |
| CN103293503B (en) * | 2013-05-24 | 2017-02-08 | 上海华虹宏力半导体制造有限公司 | Probe card detecting method |
| CN103293503A (en) * | 2013-05-24 | 2013-09-11 | 上海宏力半导体制造有限公司 | Probe card detecting method |
| CN105092976A (en) * | 2014-05-08 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | Contact resistance measuring method and structure |
| CN108089054B (en) * | 2016-11-22 | 2020-04-24 | 北京铁路信号有限公司 | Method for measuring contact resistance of solderless press-in connection |
| CN108089054A (en) * | 2016-11-22 | 2018-05-29 | 北京铁路信号有限公司 | A kind of method for the contact resistance for measuring the forced connection of solderless |
| CN108010861A (en) * | 2017-12-01 | 2018-05-08 | 上海华岭集成电路技术股份有限公司 | The method of wafer test monitoring contact resistance clear pin on demand |
| CN108519519A (en) * | 2018-04-11 | 2018-09-11 | 京东方科技集团股份有限公司 | A kind of resistance measurement method and electric resistance measuring apparatus |
| CN108519519B (en) * | 2018-04-11 | 2022-06-03 | 京东方科技集团股份有限公司 | Resistance measuring method and resistance measuring device |
| CN110190468A (en) * | 2018-11-30 | 2019-08-30 | 中航光电科技股份有限公司 | A kind of connector of contact resistance on-line checking |
| CN110187255B (en) * | 2019-04-15 | 2021-10-15 | 上海华力集成电路制造有限公司 | Method for determining overdrive amount during probe test program establishment |
| CN110187255A (en) * | 2019-04-15 | 2019-08-30 | 上海华力集成电路制造有限公司 | A method of amount of overdrive is determined when establishing probe test formula |
| CN111007319A (en) * | 2019-12-05 | 2020-04-14 | 上海华力集成电路制造有限公司 | Detection circuit and method for socket probe yield |
| CN113359008A (en) * | 2021-06-01 | 2021-09-07 | 长鑫存储技术有限公司 | Test protection circuit and control method thereof, test circuit and chip test circuit |
| CN113514758A (en) * | 2021-09-15 | 2021-10-19 | 绅克半导体科技(苏州)有限公司 | Chip testing method, tester and storage medium |
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Address after: 201203 Shanghai Zhangjiang road 351 GuoShouJing No. 2 No. 1 floor Applicant after: Shanghai Hualing Integrated Circuit Technology Co., Ltd. Address before: 201203 Shanghai Zhangjiang road 351 GuoShouJing No. 2 No. 1 floor Applicant before: Shanghai Hualing Integrated Circuit Co., Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: SHANGHAI HUALING INTEGRATED CIRCUIT CO., LTD. TO: SHANGHAI HUALING INTEGRATED CIRCUIT TECHNOLOGY CO., LTD. |
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Application publication date: 20110105 |