CN204257597U - A kind of sensing apparatus for semiconductor die package pressing - Google Patents
A kind of sensing apparatus for semiconductor die package pressing Download PDFInfo
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- CN204257597U CN204257597U CN201420783188.7U CN201420783188U CN204257597U CN 204257597 U CN204257597 U CN 204257597U CN 201420783188 U CN201420783188 U CN 201420783188U CN 204257597 U CN204257597 U CN 204257597U
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Abstract
The utility model provides a kind of sensing apparatus for semiconductor die package pressing, comprising: the MEMS pressure sensor being located at the pressure head for described pressing, gathers the pressure signal of stitching surface each point; Connect the A/D change-over circuit of MEMS pressure sensor, transfer described pressure signal to digital level value; Connect the comparator of described A/D change-over circuit, the relatively corresponding digital level value of the pressure signal of stitching surface each point, having compared output abnormality signal of telecommunication when difference between digital level value is greater than threshold value, thus can the slight change of pressure force that brings due to stitching surface injustice of Timeliness coverage, thus prevent batch accident, improve qualification rate.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, particularly relates to a kind of sensing apparatus for semiconductor die package pressing.
Background technology
Because wafer can produce a large amount of chips when cutting, although also at chip key remaining department chip, can carry outside through DA engineering through rinsing.These debris volume are little, generally tens or less micron.They stick on combining pressing head or SUB.Can cause CRACK in DA engineering, by the effect of HTHP, these chips can stain continuously on combining pressing head, cause continuous print product bad.Low based on current MEMS pressure sensor resolving power, cannot effectively identify these problems.
Summary of the invention
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of sensing apparatus for semiconductor die package pressing, solves the problem that in above-mentioned prior art, semiconductor chip stitching surface injustice cannot detect.
For realizing above-mentioned target and other related objectives, the utility model provides a kind of sensing apparatus for semiconductor die package pressing, comprising: the MEMS pressure sensor being located at the pressure head for described pressing, gathers the pressure signal of stitching surface each point; Connect the A/D change-over circuit of MEMS pressure sensor, transfer described pressure signal to digital level value; Connect the comparator of described A/D change-over circuit, compare the corresponding digital level value of pressure signal of stitching surface each point, having compared output abnormality signal of telecommunication when difference between digital level value is greater than threshold value.
Optionally, device also comprises: the process chip connecting described comparator, receives described aberrant electrical signals.
Further alternative, process chip comprises the amplifying circuit amplified described difference.
Further alternative, described process chip connects host computer.
Further alternative, described process chip is single-chip microcomputer.
Optionally, described device connects 5V Power supply.
As mentioned above, the utility model provides a kind of sensing apparatus for semiconductor die package pressing, comprising: the MEMS pressure sensor being located at the pressure head for described pressing, gathers the pressure signal of stitching surface each point; Connect the A/D change-over circuit of MEMS pressure sensor, transfer described pressure signal to digital level value; Connect the comparator of described A/D change-over circuit, the relatively corresponding digital level value of the pressure signal of stitching surface each point, having compared output abnormality signal of telecommunication when difference between digital level value is greater than threshold value, thus can the slight change of pressure force that brings due to stitching surface injustice of Timeliness coverage, thus prevent batch accident, improve qualification rate.
Accompanying drawing explanation
Fig. 1 is shown as the structural representation of an embodiment of the sensing apparatus for semiconductor die package pressing of the present utility model.
Element numbers illustrates: 1-is used for the sensing apparatus of semiconductor die package pressing, 11-MEMS pressure sensor, 12-A/D change-over circuit, 13-comparator, 14-process chip, 2-host computer.
Embodiment
Below by way of specific instantiation, execution mode of the present utility model is described, those skilled in the art the content disclosed by this specification can understand other advantages of the present utility model and effect easily.The utility model can also be implemented or be applied by embodiments different in addition, and the every details in this specification also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present utility model.It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.
As shown in Figure 1, the utility model provides a kind of sensing apparatus 1 for semiconductor die package pressing, comprising: be located at the MEMS pressure sensor 11 for the pressure head of described pressing, gathers the pressure signal of stitching surface each point; Connect the A/D change-over circuit 12 of MEMS pressure sensor 11, transfer described pressure signal to digital level value; Connect the comparator 13 of described A/D change-over circuit 12, compare the corresponding digital level value of pressure signal of stitching surface each point, having compared output abnormality signal of telecommunication when difference between digital level value is greater than threshold value.Optionally, the process chip 14 of the described comparator 13 of described connection, receive described aberrant electrical signals, such as the signal of voltage, current forms, is generally voltage; Further, described process chip is single-chip microcomputer (MCU), and process chip also can comprise the amplifying circuit amplified described difference; Optionally, described process chip connects host computer 2, such as PC, and host computer to receive after aberrant electrical signals the control commands such as transmission work stopping to process chip 14; Whole device can connect 5V Power supply, and such as, described process chip 14, MEMS pressure sensor 11 etc. all can be powered by 5V.Preferably, measuring its precision by the MEMS pressure sensor of ST brand can reach 0.2MBAR, its; System provides zero shift, low noise (0.010MBAR RMS); Be applicable to DA high temperature and dust, electromagnetic radiation vibrations operational environment; Because certainty of measurement is high, the impurity F M being greater than 10 microns can be detected.
By comparing after the test of ST MEMS pressure sensor rom transducer stitching surface, judge semiconductor chip whether pressure imbalance in pressing, due to its zero shift, though its measured value is stablized in high temperature, classification that can be different according to product, the thickness of semiconductor chip, the thickness etc. of glue, the change avoided multiple different model system of rectifying a deviation in time, decreases device upgrade investment.
In sum, the utility model provides a kind of sensing apparatus for semiconductor die package pressing, comprising: the MEMS pressure sensor being located at the pressure head for described pressing, gathers the pressure signal of stitching surface each point; Connect the A/D change-over circuit of MEMS pressure sensor, transfer described pressure signal to digital level value; Connect the comparator of described A/D change-over circuit, the relatively corresponding digital level value of the pressure signal of stitching surface each point, having compared output abnormality signal of telecommunication when difference between digital level value is greater than threshold value, thus can the slight change of pressure force that brings due to stitching surface injustice of Timeliness coverage, thus prevent batch accident, improve qualification rate.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all without prejudice under spirit of the present utility model and category, can modify above-described embodiment or changes.Therefore, such as have in art and usually know that the knowledgeable modifies or changes not departing from all equivalences completed under the spirit and technological thought that the utility model discloses, must be contained by claim of the present utility model.
Claims (6)
1. for a sensing apparatus for semiconductor die package pressing, it is characterized in that, comprising:
Be located at the MEMS pressure sensor of the pressure head for described pressing, gather the pressure signal of stitching surface each point;
Connect the A/D change-over circuit of MEMS pressure sensor, transfer described pressure signal to digital level value;
Connect the comparator of described A/D change-over circuit, compare the corresponding digital level value of pressure signal of stitching surface each point, having compared output abnormality signal of telecommunication when difference between digital level value is greater than threshold value.
2. the sensing apparatus for semiconductor die package pressing according to claim 1, is characterized in that, comprising: the process chip connecting described comparator, receive described aberrant electrical signals.
3. the sensing apparatus for semiconductor die package pressing according to claim 2, is characterized in that, process chip comprises the amplifying circuit amplified described difference.
4. the sensing apparatus for semiconductor die package pressing according to claim 2, is characterized in that, described process chip connects host computer.
5. the sensing apparatus for semiconductor die package pressing according to claim 2, is characterized in that, described process chip is single-chip microcomputer.
6. the sensing apparatus for semiconductor die package pressing according to claim 1, is characterized in that, it connects 5V Power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420783188.7U CN204257597U (en) | 2014-12-12 | 2014-12-12 | A kind of sensing apparatus for semiconductor die package pressing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420783188.7U CN204257597U (en) | 2014-12-12 | 2014-12-12 | A kind of sensing apparatus for semiconductor die package pressing |
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| Publication Number | Publication Date |
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| CN204257597U true CN204257597U (en) | 2015-04-08 |
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| CN201420783188.7U Active CN204257597U (en) | 2014-12-12 | 2014-12-12 | A kind of sensing apparatus for semiconductor die package pressing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106197769A (en) * | 2016-08-12 | 2016-12-07 | 京东方科技集团股份有限公司 | Excess pressure monitoring device, method and polaroid attaching device |
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2014
- 2014-12-12 CN CN201420783188.7U patent/CN204257597U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106197769A (en) * | 2016-08-12 | 2016-12-07 | 京东方科技集团股份有限公司 | Excess pressure monitoring device, method and polaroid attaching device |
| CN106197769B (en) * | 2016-08-12 | 2019-08-09 | 京东方科技集团股份有限公司 | Excess pressure monitoring device, method and polaroid attaching device |
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