CN207730893U - A kind of cantalever type probe card for testing CIS imaging sensor class chips - Google Patents
A kind of cantalever type probe card for testing CIS imaging sensor class chips Download PDFInfo
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- CN207730893U CN207730893U CN201721648151.3U CN201721648151U CN207730893U CN 207730893 U CN207730893 U CN 207730893U CN 201721648151 U CN201721648151 U CN 201721648151U CN 207730893 U CN207730893 U CN 207730893U
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- probe card
- pcb substrate
- card unit
- imaging sensor
- slot
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- 239000000523 sample Substances 0.000 title claims abstract description 68
- 238000012360 testing method Methods 0.000 title claims abstract description 25
- 238000003384 imaging method Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 29
- 239000000919 ceramic Substances 0.000 claims abstract description 14
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- 239000004593 Epoxy Substances 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000003351 stiffener Substances 0.000 claims abstract description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 5
- 239000010432 diamond Substances 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The utility model discloses a kind of cantalever type probe cards for testing CIS imaging sensor class chips, it is made of multiple probe card unit grafting, the probe card unit includes multiple measuring heads that PCB substrate and PCB substrate are uniformly arranged, the measuring head includes ceramic substrate, probe and resin epoxy fixing glue, the PCB substrate is equipped with reinforcing mechanisms, the reinforcing mechanisms are the ring-like reinforcing frames by all measuring head positions for corresponding to the reinforcing plate being equipped at measuring head position or PCB substrate in PCB substrate and being equipped with, it is equipped with stiffener on the diagonal line of the reinforcing frame, each side of PCB substrate is equipped with cutting and slot in the probe card unit.For the probe card unit by the cutting of side and slot respectively with the slot of another probe card unit and cutting grafting, the cutting and slot size, which are agreed with, can coordinate grafting.Multiple probe card units can arbitrarily be spliced according to actually detected needs, it is efficient applied widely；Reinforcing mechanisms are comprehensively effective.
Description
Technical field
The utility model belongs to chip testing product scope, and in particular to one kind is for testing CIS imaging sensor class cores
The cantalever type probe card of piece.
Background technology
Probe card is a kind of test interface, is mainly tested naked core, by connecting test machine and chip, passes through transmission
Signal tests chip parameter.Be by the probe in probe card directly on chip weld pad or convex block be in direct contact, draw
Go out chip signal, then coordinates peripheral test instrument to be controlled with software and achieve the purpose that automatic measurement.Probe card apply IC still
Before unencapsulated, functional test is done with probe for bare crystalline system, filter out defective products, carry out again after encapsulation engineering.Therefore, it visits
Needle card is to influence one of sizable critical processes to manufacturing cost in IC manufactures.It is existing to be used to test CIS imaging sensors
The cantilever probe card of such sheets, including measuring head and PCB substrate.Test the cantalever type probe card needle of CIS imaging sensor class chips
Point is contacted with test wafer, and PCB substrate connects to form a test loop in tester table, existing test CIS imaging sensors
The cantalever type probe card of class chip all makes measuring head with the single diamond shape matrix arrangement of 1X8 formulas, more than 1X8 formulas with surveying, all can
It is tested using Vertrical probe clasp.The cantalever type probe card of existing test CIS imaging sensor class chips, can only be with single diamond shape
Matrix arrangement makes measuring head, can not be needed voluntarily to splice and combine according to detection, efficiency is low and has limitation, and reinforcing mechanisms are inadequate
Comprehensively effectively.
Utility model content
The purpose of this utility model is to provide a kind of cantalever type probes for testing CIS imaging sensor class chips
Card, can arbitrarily splice multiple probe card units according to actually detected needs, efficient applied widely；Reinforcing mechanisms are comprehensive
Effectively.
In order to achieve the above object, the major technique solution of the utility model is to provide one kind for testing CIS images biography
The cantalever type probe card of sensor class chip is made of multiple probe card unit grafting, the probe card unit include PCB substrate and
Multiple measuring heads that PCB substrate is uniformly arranged, the measuring head include ceramic substrate, probe and resin epoxy fixing glue, described
PCB substrate is equipped with reinforcing mechanisms, and the reinforcing mechanisms are that the reinforcing plate being equipped at measuring head position is corresponded in PCB substrate
Or the ring-like reinforcing frame by all measuring head positions that PCB substrate is equipped with, it is equipped on the diagonal line of the reinforcing frame
Stiffener, the probe card unit are polygonal shape, and each side of PCB substrate is equipped with cutting in the probe card unit
And slot.
The probe card unit is inserted with the slot of another probe card unit and cutting respectively by the cutting of side and slot
It connects, the random splicing according to actually detected needs of multiple probe card units may be implemented.
The reinforcing plate is the area that rectangular shape and its area are more than ceramic substrate, can bear the weight of measuring head.
The cutting and slot size, which are agreed with, can coordinate grafting.
The probe card cell configuration is rectangle, triangle or regular hexagon.
The ceramic substrate is fixed in PCB substrate, and the probe is fixed on ceramic substrate by resin epoxy fixing glue
On.
Multiple measuring heads in the probe card unit are by double diamond shape matrix arrangement in PCB substrate.
PCB substrate 2 forms, and measuring head is made by, ceramic substrate 3, probe 4,5 fixing glue of resin epoxy composition according to Fig. 2
Measuring head.
The utility model has the beneficial effects that：Multiple probe card units can arbitrarily be spliced according to actually detected needs,
It is efficient applied widely；Reinforcing mechanisms are comprehensively effective.
Description of the drawings
Fig. 1 is the structural schematic diagram of one embodiment of the utility model,
Fig. 2 is the structural schematic diagram of the measuring head and PCB substrate in Fig. 1 embodiments,
In figure：Reinforcing plate 1, PCB substrate 2, ceramic substrate 3, probe 4, resin epoxy fixing glue 5, are inserted probe card unit 6
Item 7, slot 8.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, the every other embodiment that those of ordinary skill in the art are obtained all belongs to
In the range of the utility model protection.
As depicted in figs. 1 and 2, a kind of cantilever for testing CIS imaging sensor class chips described in the present embodiment
Formula probe 4 blocks, and is made of multiple 6 grafting of probe card unit, and the probe card unit 6 includes that PCB substrate 2 and PCB substrate 2 are equal
Multiple measuring heads of even setting, the measuring head include ceramic substrate 3, probe 4 and resin epoxy fixing glue 5, the PCB substrate
2 be equipped with reinforcing mechanisms, the reinforcing mechanisms be corresponded in PCB substrate 2 reinforcing plate 1 being equipped at measuring head position or
The ring-like reinforcing frame by all measuring head positions that PCB substrate 2 is equipped with is equipped with reinforcement on the diagonal line of the reinforcing frame
Item, the probe card unit 6 are polygonal shape, and each side of PCB substrate 2 is equipped with cutting 7 in the probe card unit 6
With slot 8.
The probe card unit 6 by the cutting 7 of side and slot 8 respectively with the slot 8 of another probe card unit 6 and insert
The random splicing according to actually detected needs of multiple probe card units 6 may be implemented in 7 grafting of item.
The reinforcing plate 1 is the area that rectangular shape and its area are more than ceramic substrate 3, can bear the weight of measuring head
Amount.
The cutting 7 and 8 size of slot, which are agreed with, can coordinate grafting.
6 shape of probe card unit is rectangle, triangle or regular hexagon.
The ceramic substrate 3 is fixed in PCB substrate 2, and the probe 4 is fixed on ceramics by resin epoxy fixing glue 5
On substrate 3.
Multiple measuring heads in the probe card unit 6 are by double diamond shape matrix arrangement in PCB substrate 2.
PCB substrate 2 forms, and measuring head is made by, ceramic substrate 3, probe 4,5 fixing glue of resin epoxy composition according to Fig. 2
Measuring head.
The utility model can arbitrarily splice multiple probe card units, the efficient scope of application according to actually detected needs
Extensively；Reinforcing mechanisms are comprehensively effective.
The utility model is not limited to above-mentioned preferred forms, anyone can obtain under the enlightenment of the utility model
Other various forms of products, however, make any variation in its shape or structure, it is every that there is same as the present application or phase
Approximate technical solution, all falls within the scope of protection of the utility model.
Claims (6)
1. a kind of cantalever type probe card for testing CIS imaging sensor class chips, which is characterized in that by multiple probe card lists
First (6) grafting composition, the probe card unit (6) includes multiple tests that PCB substrate (2) and PCB substrate (2) are uniformly arranged
Head, the measuring head include ceramic substrate (3), probe (4) and resin epoxy fixing glue (5), and the PCB substrate (2) is equipped with
Reinforcing mechanisms, the reinforcing mechanisms are that the reinforcing plate (1) being equipped at measuring head position or PCB bases are corresponded in PCB substrate (2)
The ring-like reinforcing frame by all measuring head positions that plate (2) is equipped with is equipped with stiffener on the diagonal line of the reinforcing frame,
The probe card unit (6) is polygonal shape, and each side of PCB substrate (2) is equipped with slotting in the probe card unit (6)
Item (7) and slot (8).
2. the cantalever type probe card according to claim 1 for testing CIS imaging sensor class chips, it is characterised in that
The probe card unit (6) by the cutting (7) of side and slot (8) respectively with the slot (8) of another probe card unit (6) and
Cutting (7) grafting.
3. the cantalever type probe card according to claim 1 for testing CIS imaging sensor class chips, it is characterised in that
The reinforcing plate (1) is the area that rectangular shape and its area are more than ceramic substrate (3).
4. the cantalever type probe card according to claim 1 for testing CIS imaging sensor class chips, it is characterised in that
The cutting (7) and slot (8) size, which are agreed with, can coordinate grafting.
5. the cantalever type probe card according to claim 1 for testing CIS imaging sensor class chips, it is characterised in that
Probe card unit (6) shape is rectangle, triangle or regular hexagon.
6. the cantalever type probe card according to claim 1 for testing CIS imaging sensor class chips, it is characterised in that
Multiple measuring heads in the probe card unit (6) are by double diamond shape matrix arrangement in PCB substrate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721648151.3U CN207730893U (en) | 2017-12-01 | 2017-12-01 | A kind of cantalever type probe card for testing CIS imaging sensor class chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721648151.3U CN207730893U (en) | 2017-12-01 | 2017-12-01 | A kind of cantalever type probe card for testing CIS imaging sensor class chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207730893U true CN207730893U (en) | 2018-08-14 |
Family
ID=63088834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721648151.3U Active CN207730893U (en) | 2017-12-01 | 2017-12-01 | A kind of cantalever type probe card for testing CIS imaging sensor class chips |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207730893U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109724638A (en) * | 2018-12-26 | 2019-05-07 | 珠海市爱能电子有限公司 | A kind of sensor detector and its application method |
| CN110165729A (en) * | 2019-04-30 | 2019-08-23 | 珠海创宝电子科技有限公司 | Probe substrate, battery charging module and battery charger |
| CN112739062A (en) * | 2020-11-18 | 2021-04-30 | 江门诺华精密电子有限公司 | Circuit board for CMOS image sensing element and manufacturing method thereof |
| CN113504397A (en) * | 2021-07-15 | 2021-10-15 | 合肥市华达半导体有限公司 | Intelligent probe card based on 32-bit MCU chip test |
| CN113589140A (en) * | 2021-07-16 | 2021-11-02 | 苏州芯迈智能科技有限公司 | Wafer test system and method of TOF chip |
-
2017
- 2017-12-01 CN CN201721648151.3U patent/CN207730893U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109724638A (en) * | 2018-12-26 | 2019-05-07 | 珠海市爱能电子有限公司 | A kind of sensor detector and its application method |
| CN110165729A (en) * | 2019-04-30 | 2019-08-23 | 珠海创宝电子科技有限公司 | Probe substrate, battery charging module and battery charger |
| CN112739062A (en) * | 2020-11-18 | 2021-04-30 | 江门诺华精密电子有限公司 | Circuit board for CMOS image sensing element and manufacturing method thereof |
| CN113504397A (en) * | 2021-07-15 | 2021-10-15 | 合肥市华达半导体有限公司 | Intelligent probe card based on 32-bit MCU chip test |
| CN113589140A (en) * | 2021-07-16 | 2021-11-02 | 苏州芯迈智能科技有限公司 | Wafer test system and method of TOF chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 2 / F, building 39, 18 Dongchang Road, Suzhou Industrial Park, 215000 Patentee after: Strong Half Conductor (Suzhou) Co.,Ltd. Address before: 2 / F, building 39, 18 Dongchang Road, Suzhou Industrial Park, 215000 Patentee before: MAXONE SEMICONDUCTOR (SUZHOU) Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240904 Address after: 230000 North and South Floors of Building C3, Integrated Circuit Technology Park, Qinglongtan Road, Economic and Technological Development Zone, Hefei City, Anhui Province Patentee after: Qiang Half Conductor (Hefei) Co.,Ltd. Country or region after: China Address before: 2 / F, building 39, 18 Dongchang Road, Suzhou Industrial Park, 215000 Patentee before: Strong Half Conductor (Suzhou) Co.,Ltd. Country or region before: China |
|
| TR01 | Transfer of patent right |