CN112739062A - Circuit board for CMOS image sensing element and manufacturing method thereof - Google Patents
Circuit board for CMOS image sensing element and manufacturing method thereof Download PDFInfo
- Publication number
- CN112739062A CN112739062A CN202011300016.6A CN202011300016A CN112739062A CN 112739062 A CN112739062 A CN 112739062A CN 202011300016 A CN202011300016 A CN 202011300016A CN 112739062 A CN112739062 A CN 112739062A
- Authority
- CN
- China
- Prior art keywords
- cover plate
- plate
- cmos image
- bottom plate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a circuit board for a CMOS image sensing element and a manufacturing method thereof, wherein the circuit board comprises a cover plate and a bottom plate with positioning holes, and the manufacturing method comprises the following steps: etching the cover plate raw material into a light plate and carrying out sand blasting; baking the cover plate subjected to sand blasting; adhering pure glue to one side of the baked cover plate and performing hot-pressing treatment; drilling the cover plate subjected to the hot pressing treatment to form a positioning hole of the cover plate; routing a groove on a cover plate with a positioning hole; and positioning the cover plate after the groove is milled and the bottom plate through the positioning hole, fixing and pressing the cover plate and the bottom plate to form a combined plate, wherein the pure glue is positioned between the cover plate and the bottom plate. The circuit board of the invention is convenient for batch, quick and accurate test of the CMOS image sensing element.
Description
Technical Field
The present invention relates to the field of testing CMOS image sensing devices, and more particularly, to a circuit board for a CMOS image sensing device and a method for manufacturing the same.
Background
The CMOS image sensor is an image sensor manufactured by using the principle of the photoelectric correlation technique, and is mainly applied to low-order image products such as security monitoring, digital cameras, PC cameras, toys, mobile phones, PDAs, video phones, fingerprint identifiers, and the like.
The CMOS image sensor has a small size, and the conventional detection efficiency and accuracy are low, and the CMOS image sensor has a large demand, and the conventional detection method of the CMOS image sensor is difficult to meet the demand for productivity.
Therefore, it is desirable to provide a circuit board for a CMOS image sensor device, which facilitates efficient and accurate detection of the CMOS image sensor device.
Disclosure of Invention
The invention aims to provide a circuit board for a CMOS image sensing element and a manufacturing method thereof, so as to solve the problem that the accuracy and efficiency of the traditional testing method are difficult to meet the requirement.
A method for manufacturing a circuit board used for a CMOS image sensing element comprises a cover plate and a bottom plate with positioning holes, and comprises the following steps:
etching the cover plate raw material into a light plate and carrying out sand blasting;
baking the cover plate subjected to sand blasting;
adhering pure glue to one side of the baked cover plate and performing hot-pressing treatment;
drilling the cover plate subjected to the hot pressing treatment to form a positioning hole of the cover plate;
routing a groove on a cover plate with a positioning hole;
and positioning the cover plate after the groove is milled and the bottom plate through the positioning hole, fixing and pressing the cover plate and the bottom plate to form a combined plate, wherein the pure glue is positioned between the cover plate and the bottom plate.
Furthermore, the baking device also comprises a cover plate for adhering dust after baking, so that bubbles can be reduced conveniently, and the pure glue can be adhered to the cover plate more closely. Preferably, the dust-binding roller is used for binding dust on the cover plate.
Further, still including carrying out surface cleaning to the apron behind the gong groove, gong groove back shroud surface adheres to there is the dust piece, needs clear up the follow-up further group board of being convenient for to the apron to the dust piece.
Furthermore, the baking temperature of the cover plate after sand blasting is set to be 120-160 ℃, and the baking time is set to be 50-80 minutes, so that the expansion and contraction coefficient of the cover plate is in the best state.
Further, before the pure glue is attached to one side of the baked cover plate, the pure glue is firstly kept stand for a period of time, so that the pure glue can be conveniently and more fittingly adhered to the cover plate.
Further, when carrying out the gong groove to the apron after drilling, carry out the gong groove in apron one side of pure relatively gluing, cause the damage to pure glue when preventing the gong groove, its hardness of apron one side of pure relatively gluing is convenient for gong groove simultaneously.
In one embodiment, the bottom plate is a PCB, the PCB is provided with leads uniformly arranged, and the circuit arrangement of the leads corresponds to the pins of the CMOS image sensor one-to-one.
Further, still including from type paper, apron, bottom plate and from the type membrane of laminating in proper order from top to bottom, it is fixed through heat-resistant glue from type paper and from the type membrane.
A circuit board for CMOS image sensing element comprises a cover plate, a base plate and a bonding sheet for bonding the cover plate and the base plate;
the cover plate is a hollow cover plate, and pin lines on the hollow area on the bottom plate correspond to pins on the CMOS image sensing element one by one.
The bonding mode of the cover plate and the bottom plate adopts the method.
The invention has the beneficial effects that: the cover plate and the bottom plate are bonded together through the positioning holes which are in one-to-one correspondence on the cover plate and the bottom plate, so that the regularly arranged hollow areas formed by the cover plate and the bottom plate are in relatively fixed positions after being assembled, the CMOS image sensing elements can be accurately placed on the hollow areas in batches through mechanical arms and other mechanical equipment, pins of the CMOS image sensing elements correspond to the pin lines on the bottom plate one to one, and the circuit board is convenient for quickly and accurately testing the CMOS image sensing elements in batches.
Drawings
FIG. 1 is a schematic diagram of a circuit board of the present invention;
FIG. 2 is a cross-sectional view of FIG. 1;
FIG. 3 is a schematic view of a cover plate manufacturing process according to the present invention;
FIG. 4 is a schematic view of a bottom plate manufacturing process according to the present invention;
FIG. 5 is a schematic view of the process of assembling and packaging the panels of the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the drawings and the embodiments.
As shown in fig. 1 and 2, a circuit board for a CMOS image sensor device includes a cover plate 1, a bottom plate 2, and a bonding sheet 3 for bonding the cover plate and the bottom plate, wherein the cover plate is a hollow cover plate, and a CMOS image sensor device 4 can be effectively placed in the hollow area.
As shown in fig. 3 and 4, the method for manufacturing the circuit board for the CMOS image sensor device includes a cover plate Process (DAM Process), a Substrate Process (Substrate Process) and a bonding Process (plating Process);
the cover plate manufacturing process comprises the following steps:
the raw material of the cover plate is baked,
etching the cover plate raw material into a light plate and carrying out sand blasting; wherein, copper pot foil can not be remained on the etched light plate;
baking the cover plate subjected to sand blasting; in the embodiment, the baking temperature is set to be 120-160 ℃, and the baking time is set to be 50-80 minutes;
carrying out dust sticking treatment on the baked cover plate through a dust sticking roller;
standing the pure glue for a period of time in advance, and then attaching the pure glue to one side of the baked cover plate and carrying out hot pressing treatment; so that the pure glue is adhered to one side of the cover plate;
drilling the cover plate subjected to the hot pressing treatment to form a positioning hole of the cover plate; the positioning hole of the cover plate is used for positioning with the positioning hole of the bottom plate.
Carry out gong groove with the apron of locating hole, in this embodiment, carry out gong groove in apron one side of pure relatively, be about to the lower surface of pure relatively lapping of gluing and place, carry out gong groove at the upper surface of apron.
Carry out surface cleaning to the apron behind the gong groove and handle, gong groove back shroud surface adheres to there is the dust piece, clears up the dust piece through instruments such as brush, air gun and is convenient for further processing.
The bottom plate process comprises baking the bottom plate raw material; carrying out thin copper on the base plate after baking; drilling the bottom plate to form a through hole and a positioning hole of the bottom plate, wherein the positioning hole of the bottom plate corresponds to the positioning hole of the cover plate; further plating copper on the bottom plate; etching the circuit of the bottom plate after copper plating; performing AOI on the bottom plate after the circuit is etched; carrying out green paint treatment on the base plate subjected to AOI; then, the through holes on the bottom plate are tinned, formed, etched in copper and stripped in tin; and carrying out surface treatment on the bottom plate, and finally forming the PCB which can be in one-to-one correspondence with the pins of the CMOS image sensing element.
The bonding process comprises the following steps:
the apron behind the gong groove is fixed a position through the locating hole with the bottom plate, and in this embodiment, the locating hole is the rivet hole. The rivet holes of the cover plate correspond to the rivet holes of the bottom plate one by one, the pure glue is located between the cover plate and the bottom plate through the fixed pressing of the riveting machine, and a fixed and bonded circuit board is formed and used by the CMOS image sensing element.
In another embodiment, the release paper 5, the cover plate 1, the bottom plate 2, the pure glue 3 and the release film 6 are sequentially attached from top to bottom, the release paper 5 and the release film 6 are fixed by hot pressing through heat-resistant glue, in one embodiment, the hot pressing temperature is set to be 120-180 ℃, the hot pressing time is set to be 40-80 minutes, and the hot pressing pressure is set to be 2kg/cm2～8kg/cm2In the meantime.
The above disclosure is only for the specific embodiments of the present invention, but the present invention is not limited thereto, and those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. It is to be understood that such changes and modifications are intended to be included within the scope of the appended claims. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
Claims (10)
1. A method for manufacturing a circuit board used for a CMOS image sensing element is characterized by comprising a cover plate and a bottom plate with positioning holes, and the method comprises the following steps:
etching the cover plate raw material into a light plate and carrying out sand blasting;
baking the cover plate subjected to sand blasting;
adhering pure glue to one side of the baked cover plate and performing hot-pressing treatment;
drilling the cover plate subjected to the hot pressing treatment to form a positioning hole of the cover plate;
routing a groove on a cover plate with a positioning hole;
and positioning the cover plate after the groove is milled and the bottom plate through the positioning hole, fixing and pressing the cover plate and the bottom plate to form a combined plate, wherein the pure glue is positioned between the cover plate and the bottom plate.
2. The method of claim 1, further comprising dusting the baked cover sheet.
3. The method of manufacturing according to claim 1, further comprising subjecting the cover plate after routing to a surface cleaning process.
4. The method according to claim 1, wherein the baking temperature of the sandblasted cover sheet is set to 120 to 160 degrees, and the baking time is set to 50 to 80 minutes.
5. The method of claim 1, wherein the glue is left for a period of time before being applied to the baked cover plate.
6. A method of manufacturing according to claim 1, characterized in that the routing of the drilled cover plate is performed on the side of the cover plate opposite to the side of the pure glue.
7. The method of manufacturing of claim 1, wherein the base plate is a PCB board.
8. The manufacturing method of claim 1, further comprising a release paper, a cover plate, a bottom plate and a release film sequentially attached from top to bottom, wherein the release paper and the release film are fixed by a heat-resistant adhesive.
9. A circuit board for CMOS image sensing element comprises a cover plate, a base plate and a bonding sheet for bonding the cover plate and the base plate;
the cover plate is a hollow cover plate, and pin lines on the hollow area on the bottom plate correspond to pins on the CMOS image sensing element one by one.
10. The circuit board for a CMOS image sensor device according to claim 9, wherein the cover plate and the base plate are bonded by the method according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011300016.6A CN112739062A (en) | 2020-11-18 | 2020-11-18 | Circuit board for CMOS image sensing element and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011300016.6A CN112739062A (en) | 2020-11-18 | 2020-11-18 | Circuit board for CMOS image sensing element and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112739062A true CN112739062A (en) | 2021-04-30 |
Family
ID=75597574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011300016.6A Pending CN112739062A (en) | 2020-11-18 | 2020-11-18 | Circuit board for CMOS image sensing element and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112739062A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020050591A1 (en) * | 1999-04-15 | 2002-05-02 | Tandy Patrick W. | Apparatus and method for marking defective sections of laminate substrates |
| CN2603523Y (en) * | 2003-01-17 | 2004-02-11 | 胜开科技股份有限公司 | Simplified image sensor module set |
| CN105517356A (en) * | 2015-12-10 | 2016-04-20 | 深圳崇达多层线路板有限公司 | Technical method for improving pressing glue spilling at window position of stepped plate |
| CN207730893U (en) * | 2017-12-01 | 2018-08-14 | 强一半导体（苏州）有限公司 | A kind of cantalever type probe card for testing CIS imaging sensor class chips |
| CN210720643U (en) * | 2019-07-26 | 2020-06-09 | 厦门市原子通电子科技有限公司 | Chip testing device |
-
2020
- 2020-11-18 CN CN202011300016.6A patent/CN112739062A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020050591A1 (en) * | 1999-04-15 | 2002-05-02 | Tandy Patrick W. | Apparatus and method for marking defective sections of laminate substrates |
| CN2603523Y (en) * | 2003-01-17 | 2004-02-11 | 胜开科技股份有限公司 | Simplified image sensor module set |
| CN105517356A (en) * | 2015-12-10 | 2016-04-20 | 深圳崇达多层线路板有限公司 | Technical method for improving pressing glue spilling at window position of stepped plate |
| CN207730893U (en) * | 2017-12-01 | 2018-08-14 | 强一半导体（苏州）有限公司 | A kind of cantalever type probe card for testing CIS imaging sensor class chips |
| CN210720643U (en) * | 2019-07-26 | 2020-06-09 | 厦门市原子通电子科技有限公司 | Chip testing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI643753B (en) | Curved surface bonding device and method | |
| TWI681697B (en) | Apparatus and method for attaching led chip | |
| CN101384136B (en) | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh | |
| TWI546708B (en) | Manufacture method of touch and display device | |
| CN108284665B (en) | Positioning device and method for processing surface of mobile phone camera lens by using same | |
| JPH09105896A (en) | Jig for manufacturing liquid crystal display element and manufacture of liquid crystal display element using the jig | |
| CN101140347A (en) | card of pattern camera lens and method of producing the same | |
| CN104020919A (en) | Graphene capacitive type touch screen and production and manufacturing method thereof | |
| CN103889162A (en) | Method for surface mounting of elements and devices on flexible printed circuit, system and magnetic fixture | |
| TW202042416A (en) | Element transfer method and transfer plate used for same | |
| TW201801257A (en) | Fingerprint recognition apparatus | |
| EP1372192A3 (en) | Method of manufacturing micro-semiconductor element | |
| CN101196605A (en) | Lens two-sided glue assembly technology for mobile phone camera shooting module group of flexible circuit board | |
| CN112739062A (en) | Circuit board for CMOS image sensing element and manufacturing method thereof | |
| CN108391387A (en) | A kind of processing technology of printed circuit board electroplating finger | |
| CN110228949B (en) | Small-size cover plate manufacturing process | |
| CN111391295B (en) | Film pasting device | |
| JP2013025373A (en) | Electrostatic sensor manufacturing method and electrostatic sensor with protective film | |
| CN108196707B (en) | Touch display assembly and attaching method thereof | |
| CN101303443A (en) | Camera module group and assembling method thereof | |
| CN113223989A (en) | Method for transferring micro LED to display panel in huge amount | |
| CN109211778A (en) | A kind of viscous force test method of double faced adhesive tape | |
| CN211982136U (en) | Structure of dustproof and waterproof sound-transmitting film of matrix type micro-electromechanical sensor | |
| CN112750711B (en) | Method and device for huge amount of die bonding | |
| CN111276434A (en) | Coating jig rubberizing process of semiconductor chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210430 |
|
| RJ01 | Rejection of invention patent application after publication |